A semiconductor device discharge apparatus

Abstract

The utility model relates to technical field of semiconductor device processing device, specifically disclose a semiconductor device discharge device is provided with the gap in the discharge end of helical material channel, and the gap position is equipped with the blowing mechanism, effectively solved the problem that the traditional helical material channel is difficult to screen the similar semiconductor device of positive and negative surface structure and leads to mixed output, increased camera and light source, and the camera combines light source and realizes positive and negative attitude real -time identification, and cooperates the air hole row and blowing action of partition control, only the unqualified semiconductor device that identified is blown off back the vibration disc efficiently and accurately, and the qualified semiconductor device can smoothly pass the supporting plate and enter the subsequent arc track component and linear feeding component. Can ensure that the posture of final output semiconductor device is consistent, provides reliable material basis for the subsequent detection or packing procedure.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device processing equipment technology, and in particular to a semiconductor device unloading device. Background Technology

[0002] After semiconductor devices are manufactured, they are usually transferred to a vibratory feeder. The vibratory feeder uses this method to neatly and orderly deliver the disordered semiconductor devices one by one, so that they can be used for subsequent testing, packaging and other processes.

[0003] For some types of semiconductor devices, the difference between the front and back structures is not obvious. After being conveyed by the spiral feeder, the spiral feeder has difficulty separating these semiconductor devices that are placed in opposite directions. As a result, the end of the spiral feeder is mixed with semiconductor devices that are either facing up or facing down. If the mixed semiconductor devices are directly conveyed out, it will cause errors in subsequent testing, packaging and other processes. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a semiconductor device discharging device to solve the above problems.

[0005] A semiconductor device discharge device includes a base, a vibratory feeder mounted on the base, an arc-shaped track assembly connected to the discharge end of the vibratory feeder, and a linear feeding assembly connected to the discharge end of the arc-shaped track assembly. The vibratory feeder has a spiral material channel, and the discharge end of the spiral material channel has a notch. A blowing mechanism is located at the notch. The blowing mechanism includes a support plate that moves radially along the vibratory feeder and is flush with the spiral material channel. One end of the support plate facing the inner cavity of the vibratory feeder has a downward-sloping material guide surface. The support surface has several sets of upward-sloping air holes facing the inner cavity of the vibratory feeder. Each set of air holes is connected to an air channel located inside the support plate. Each air channel is connected to an air guide pipe equipped with an electric valve. The base also has a mounting frame with a camera and a light source facing the support surface.

[0006] Specifically, the vibratory feeder is equipped with a telescopic drive mechanism, which includes a mounting base fixed to the vibratory feeder, a first telescopic driver disposed on the mounting base, and a push plate connected to the output shaft of the first telescopic driver; a vertical plate is connected to the end of the support plate away from the vibratory feeder, and the push plate is fixedly connected to the vertical plate.

[0007] Specifically, the first telescopic actuator is a cylinder.

[0008] Specifically, the arc-shaped track assembly includes a vertical plate and a meniscus. The vertical plate is fixed to the base, and a meniscus groove is provided on the vertical plate. The meniscus is installed in the meniscus groove and is detachably connected to the vertical plate. An arc-shaped track is formed on the outer edge of the meniscus, and the feed end of the arc-shaped track is connected to the discharge end of the spiral material channel.

[0009] Specifically, the linear feeding assembly includes a lower track plate fixed to the base and an upper cover detachably fixed to the upper end of the lower track plate; a linear track along the x-direction is formed between the lower track plate and the upper cover, and the feeding end of the linear track is connected to the discharging end of the arc-shaped track.

[0010] Specifically, the linear feeding assembly also includes a base support located at the bottom of the lower track plate.

[0011] Specifically, the linear feeding assembly also includes a photoelectric sensor; the transmitting end and the receiving end of the photoelectric sensor are respectively located on both sides of the linear track in the y direction; the lower track plate is provided with a through hole through the linear track, through which the sensing light of the photoelectric sensor passes.

[0012] Specifically, a receiving assembly is provided on one side of the discharge end of the linear track; the receiving assembly includes a mounting plate fixed to the base, a second telescopic actuator disposed on the mounting plate and driven along the x-direction, and a carrier connected to the output end of the second telescopic actuator; a carrier plate is provided on the carrier plate, and the second telescopic actuator drives the carrier plate to below the discharge end of the linear track to receive semiconductor devices.

[0013] Specifically, the second telescopic actuator is a cylinder.

[0014] The beneficial effects of this utility model are:

[0015] 1. The semiconductor device discharging device of this application has a notch at the discharging end of the spiral material channel, and a blowing mechanism is provided at the notch position, which effectively solves the problem that the traditional spiral material channel is difficult to screen semiconductor devices with similar front and back structures, resulting in mixed output;

[0016] 2. A camera and light source have been added. The camera, combined with the light source, enables real-time recognition of forward and reverse posture. Coupled with zoned controllable air vents and blowing actions, only identified defective semiconductor devices are efficiently and accurately blown back to the vibratory feeder, while qualified semiconductor devices can smoothly pass through the tray into the subsequent curved track assembly and linear feeding assembly. This ensures that the final output semiconductor devices have consistent posture, providing a reliable material basis for subsequent testing or packaging processes. Attached Figure Description

[0017] Figure 1 Three-dimensional semiconductor device unloading apparatus of this application Figure 1 ;

[0018] Figure 2 for Figure 1 Enlarged view of section A;

[0019] Figure 3 for Figure 1 Enlarged view of section B;

[0020] Figure 4 Three-dimensional semiconductor device unloading apparatus of this application Figure 2 ;

[0021] Figure 5 for Figure 4 Enlarged view of section C;

[0022] Figure 6 for Figure 4 Enlarged view of section D;

[0023] Figure 7 The three-dimensional representation of the blowing mechanism and telescopic drive mechanism of this application Figure 1 ;

[0024] Figure 8 The three-dimensional representation of the blowing mechanism and telescopic drive mechanism of this application Figure 2 ;

[0025] Figure 9 This is a top view of the blowing mechanism of this application;

[0026] Figure 10 for Figure 9 A cross-sectional view along the EE line.

[0027] The attached figures are labeled as follows: base 10, vibratory feeder 20, arc track assembly 30, linear feeding assembly 40, spiral feed channel 21, notch 22, blowing mechanism 50, pallet 51, support surface 52, material drop guide surface 53, air hole row 54, air channel 55, electric valve 56, air guide pipe 57, mounting bracket 11, camera 12, light source 13, telescopic drive mechanism 60, mounting base 61, first telescopic driver 62, push plate 63, vertical plate 58, upright plate 31, meniscus 32, arc track 33, lower track plate 41, upper cover 42, linear track 43, base 44, photoelectric sensor 45, transmitter 451, receiver 452, receiving assembly 70, mounting plate 71, second telescopic driver 72, support base 73, carrier plate 74, semiconductor device 80. Detailed Implementation

[0028] This utility model provides a semiconductor device discharging device. To make the purpose, technical solution, and effects of this utility model clearer and more explicit, the following describes this utility model in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0029] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0030] Please refer to Figures 1 to 10 This embodiment discloses a semiconductor device discharge device, including a base 10, a vibratory feeder 20 disposed on the base 10, an arc-shaped track assembly 30 connected to the discharge end of the vibratory feeder 20, and a linear feeding assembly 40 connected to the discharge end of the arc-shaped track assembly 30; the vibratory feeder 20 is provided with a spiral material channel 21, the discharge end of the spiral material channel 21 is provided with a notch 22, and a blowing mechanism 50 is provided at the notch 22; the blowing mechanism 50 includes a support plate 51 that moves radially along the vibratory feeder 20 around the notch 22, and the support plate 51 has a supporting surface 52 flush with the spiral material channel 21; the support plate 51... 1. One end of the vibratory feeder 20 facing the inner cavity is provided with a downward inclined material guide surface 53; the support surface 52 is provided with several sets of air holes 54 that are inclined upward towards the inner cavity of the vibratory feeder 20. Each set of air holes 54 is connected to an air channel 55. The air channel 55 is located inside the support plate 51. Each air channel 55 is connected to an air guide pipe 57 with an electric valve 56; the base 10 is also provided with a mounting frame 11. The mounting frame 11 is provided with a camera 12 and a light source 13 facing the support surface 52. The camera 12 can be a CCD camera, and the light source 13 can be an LED light source.

[0031] Semiconductor device 80 is conveyed upwards to its discharge end via a spiral feed channel 21 within the vibratory feeder 20. When semiconductor device 80 passes the notch 22 at the discharge end of the spiral feed channel 21, it moves to the support surface 52 of the pallet 51 movably mounted there. At this time, the camera 12 on the mounting bracket 11, aided by the light source 13, captures real-time images of the semiconductor device 80 on the support surface 52 and identifies its front and back orientation. Based on the identification result, the control system opens the electric valve 56 at a specific position, and compressed air is ejected from the upward-sloping air holes 54 on the support surface 52 of the pallet 51 at that position through the corresponding air guide pipe 57 and air channel 55. This airflow acts on the bottom of semiconductor device 80 with an unqualified orientation (e.g., front-facing devices that need to be rejected), pushing it towards the inner cavity of the vibratory feeder 20. The ejected semiconductor device 80 then slides down along the drop guide surface 53 at the end of the pallet 52 and falls back to the bottom of the vibratory feeder 20 to await reloading. By utilizing multiple independently controlled air vents 54, air can be precisely positioned for blowing, avoiding accidental spraying onto nearby qualified semiconductor devices 80.

[0032] The semiconductor device discharging device in this embodiment utilizes air-blowing sorting at the discharging end of the vibratory feeder 20, effectively solving the problem of mixed output caused by the difficulty of screening semiconductor devices 80 with similar front and back structures in the traditional spiral feed channel 21. The camera 12, combined with the light source 13, achieves real-time identification of front and back postures. Combined with the zone-controllable air vents 54 and the air-blowing action, only the identified unqualified semiconductor devices 80 are efficiently and accurately blown back to the vibratory feeder 20, while qualified semiconductor devices 80 can smoothly pass through the tray 51 into the subsequent arc-shaped track assembly 30 and linear feeding assembly 40. This ensures that the final output semiconductor devices 80 have a consistent posture, providing a reliable material basis for subsequent testing or packaging processes.

[0033] The vibratory feeder 20 is equipped with a telescopic drive mechanism 60, which includes a mounting base 61 fixed to the vibratory feeder 20, a first telescopic driver 62 mounted on the mounting base 61, and a push plate 63 connected to the output shaft of the first telescopic driver 62. A vertical plate 58 is connected to the end of the support plate 51 away from the vibratory feeder 20, and the push plate 63 is fixedly connected to the vertical plate 58. The position of the support plate 51 can be adjusted by the telescopic drive mechanism 60 to accommodate semiconductor devices 80 of different sizes. The first telescopic driver 62 can be a cylinder, which drives the push plate 63 to move. The push plate 63, via the vertical plate 58, drives the support plate 51 to extend and retract radially along the vibratory feeder 20, thereby changing the overlap width between the supporting surface 52 and the spiral feed channel 21. This design ensures that the air vents 54 cover the width of the semiconductor device 80 to improve air blowing efficiency, avoids airflow waste, and shortens the pushing distance, reducing sorting energy consumption.

[0034] The arc track assembly 30 includes a vertical plate 31 and a semi-circular plate 32. The vertical plate 31 is fixed on the base 10. A semi-circular groove 311 is provided on the vertical plate 31. The semi-circular plate 32 is installed in the semi-circular groove 311 and is detachably connected to the vertical plate 31. An arc track 33 is formed on the outer edge of the semi-circular plate 32. The feed end of the arc track 33 is connected to the discharge end of the spiral material channel 21. When the semiconductor device 80 is conveyed to the discharge end by the spiral feed channel 21 of the vibratory feeder 20, it moves to the support surface 52 of the tray 51 at the notch 22. At this time, the camera 12 on the mounting frame 11 identifies the front and back posture of the device in real time with the assistance of the light source 13. If a posture that needs to be screened is detected (such as front facing up), the control system activates the electric valve 56 of the corresponding air hole row 54. Compressed air is sprayed out from the inclined air hole row 54 through the air guide pipe 57 and the air channel 55, pushing the unqualified semiconductor device 80 into the inner cavity of the vibratory feeder 20, so that it slides down and is recycled along the dropping guide surface 53. The qualified semiconductor device 80 passes stably through the support surface 52 and enters the arc track 33 of the arc track assembly 30. In the arc track 33, the semiconductor device 80 moves down the arc surface under the action of gravity. Its posture is uniformly corrected to the standard state of front or back facing down. At the same time, it gains directional kinetic energy. Finally, the device smoothly enters the straight track 43 of the straight feeding assembly 40.

[0035] The linear feeding assembly 40 includes a lower track plate 41 fixed to the base 10 and an upper cover 42 detachably fixed to the upper end of the lower track plate 41; a linear track 43 along the x-direction is formed between the lower track plate 41 and the upper cover 42, and the feed end of the linear track 43 is connected to the discharge end of the arc track 33. Due to the detachable installation structure, the upper cover 42 can be removed when material jamming occurs or during periodic maintenance, reducing maintenance difficulty.

[0036] The linear feeding assembly 40 also includes a base support 44 located at the bottom of the lower track plate 41 to improve the stability of the lower track plate 41 and prevent shaking.

[0037] The linear feeding assembly 40 also includes a photoelectric sensor 45; the transmitting end 451 and the receiving end 452 of the photoelectric sensor 45 are respectively located on both sides of the linear track 43y; the lower track plate 41 is provided with a through hole 411 penetrating the linear track 43, through which the sensing light of the photoelectric sensor 45 passes. When the semiconductor device 80 moves along the linear track 43 to the detection position of the photoelectric sensor 45, it will instantly cut off the sensing light emitted by the transmitting end 451 through the through hole 411 of the lower track plate 41 towards the receiving end 452. Each time the light is blocked, an electrical signal is generated, and the system automatically accumulates the number of semiconductor devices 80 accordingly; this counting action is completed in real time with the passage of each semiconductor device 80.

[0038] A receiving assembly 70 is provided on one side of the discharge end of the linear track 43. The receiving assembly 70 includes a mounting plate 71 fixed to the base 10, a second telescopic actuator 72 mounted on the mounting plate 71 and driven along the x-direction, and a carrier 73 connected to the output end of the second telescopic actuator 72. A carrier plate 74 is provided on the carrier 73. The second telescopic actuator 72 is a cylinder that drives the carrier plate 74 to a position below the discharge end of the linear track 43 to receive the semiconductor device 80. When the semiconductor device 80 with a qualified posture moves to the discharge end after being conveyed and counted by the linear track 43, the second telescopic actuator 72 of the receiving assembly 70 immediately drives the carrier 73 to move along the x-direction, so that the carrier plate 74 is precisely positioned directly below the discharge end of the linear track 43. The semiconductor device 80 then falls into the carrier plate 74 and is received. Then, the rotatable suction device above picks up the semiconductor device 80 from the carrier plate 74 and efficiently transfers it to the next inspection station or packaging station.

[0039] The preferred embodiments of this utility model have been described in detail above. However, this invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this invention.

Claims

1. A semiconductor device discharging device, comprising a base (10), a vibratory feeder (20) disposed on the base (10), an arc-shaped track assembly (30) connected to the discharging end of the vibratory feeder (20), and a linear feeding assembly (40) connected to the discharging end of the arc-shaped track assembly (30); wherein the vibratory feeder (20) is provided with a spiral material channel (21), characterized in that, The spiral feed channel (21) has a notch (22) at its discharge end, and a blowing mechanism (50) is provided at the notch (22). The blowing mechanism (50) includes a support plate (51) that moves radially along the vibrating plate (20) and is located at the notch (22). The support plate (51) has a supporting surface (52) that is flush with the spiral feed channel (21). One end of the support plate (51) facing the inner cavity of the vibrating plate (20) has a downwardly inclined material guide surface (53). The supporting surface (52) The base (10) is provided with several sets of air holes (54) that are inclined upward toward the inner cavity of the vibrating plate (20). Each set of air holes (54) is connected to an air channel (55). The air channel (55) is located inside the support plate (51). Each air channel (55) is connected to an air guide pipe (57) with an electric valve (56). The base (10) is also provided with a mounting frame (11). The mounting frame (11) is provided with a camera (12) and a light source (13) facing the support surface (52).

2. The semiconductor device discharge apparatus according to claim 1, wherein The vibratory feeder (20) is provided with a telescopic drive mechanism (60), which includes a mounting base (61) fixed to the vibratory feeder (20), a first telescopic driver (62) provided on the mounting base (61), and a push plate (63) connected to the output shaft of the first telescopic driver (62). A vertical plate (58) is connected to one end of the support plate (51) away from the vibratory feeder (20), and the push plate (63) is fixedly connected to the vertical plate (58).

3. The semiconductor device discharge apparatus according to claim 2, wherein The first telescopic actuator (62) is a cylinder.

4. The semiconductor device discharge apparatus according to claim 1, wherein The arc-shaped track assembly (30) includes a vertical plate (31) and a semi-circular plate (32). The vertical plate (31) is fixed on the base (10). The vertical plate (31) is provided with a semi-circular groove (311). The semi-circular plate (32) is installed in the semi-circular groove (311) and is detachably connected to the vertical plate (31). An arc-shaped track (33) is formed on the outer edge of the semi-circular plate (32). The feed end of the arc-shaped track (33) is connected to the discharge end of the spiral material channel (21).

5. The semiconductor device discharge apparatus according to claim 1, wherein The linear feeding assembly (40) includes a lower track plate (41) fixed to the base (10) and an upper cover (42) detachably fixed to the upper end of the lower track plate (41); a linear track (43) is formed between the lower track plate (41) and the upper cover (42) along the x direction, and the feeding end of the linear track (43) is connected to the discharging end of the arc track (33).

6. The semiconductor device discharge apparatus according to claim 5, wherein The linear feeding assembly (40) also includes a base support (44) located at the bottom of the lower track plate (41).

7. The semiconductor device discharge apparatus according to claim 5, wherein The linear feeding assembly (40) also includes a photoelectric sensor (45); the transmitting end (451) and the receiving end (452) of the photoelectric sensor (45) are respectively located on both sides of the linear track (43) in the y direction; the lower track plate (41) is provided with a through hole (411) through the linear track (43), and the through hole (411) allows the sensing light of the photoelectric sensor (45) to pass through.

8. The semiconductor device discharge apparatus according to claim 5, wherein A receiving assembly (70) is provided on one side of the discharge end of the linear track (43); the receiving assembly (70) includes a mounting plate (71) fixed to the base (10), a second telescopic actuator (72) provided on the mounting plate (71) and driven along the x direction, and a carrier (73) connected to the output end of the second telescopic actuator (72); a carrier plate (74) is provided on the carrier plate (73), and the second telescopic actuator (72) drives the carrier plate (74) to below the discharge end of the linear track (43) to receive the semiconductor device (80).

9. The semiconductor device discharge apparatus according to claim 8, wherein The second telescopic actuator (72) is a cylinder.

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