A handling robot of an OHT system

Abstract

The utility model relates to a kind of handling mechanical arm of OHT system, including pedestal, suction cup and backing plate, mobile frame is horizontally slidably arranged on pedestal, flat plate is set on mobile frame by lifting assembly, suction cup is set in the bottom of flat plate, backing plate is horizontally slidably set on flat plate by sliding assembly, and backing plate is below suction cup, negative pressure assembly is set on flat plate, negative pressure assembly is respectively matched with suction cup and backing plate, the utility model, by the horizontal sliding of mobile frame on pedestal and the vertical movement control of flat plate by lifting assembly, so that mechanical arm can accurately reach target position, realize the accurate handling of wafer box, the cooperation of negative pressure assembly and suction cup and backing plate, so that suction cup can firmly adsorb the top of wafer box, backing plate can be translated to the just below wafer box and support simultaneously, the stability of wafer box in handling process is enhanced, wafer damage caused by shaking or collision is avoided.

Description

Technical Field

[0001] This utility model relates to the field of material handling technology, specifically a material handling robotic arm for an OHT system. Background Technology

[0002] In the semiconductor manufacturing field, photoresist coating systems are key equipment for photoresist coating and transport during wafer fabrication. With the continuous advancement of semiconductor manufacturing processes, higher demands are placed on the precision, stability, and efficiency of wafer handling. However, existing OHT systems have numerous problems in handling wafer cassettes and cannot meet the needs of modern semiconductor manufacturing.

[0003] Traditional OHT systems typically employ simple mechanical clamping or vacuum adsorption devices to move wafer cassettes. Due to limitations in the precision of their mechanical structures, these devices often cannot achieve high-precision handling during positioning and transport. For example, mechanical clamping devices may cause slight shifts in the wafer cassette due to uneven clamping force or inaccurate clamping position, thus affecting the accuracy of subsequent photoresist coating. Simple vacuum adsorption devices, on the other hand, may experience wafer cassette movement or even detachment during transport due to limited adsorption area or unstable adsorption force. Utility Model Content

[0004] The purpose of this invention is to provide a robotic arm for handling materials in an OHT system to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A handling robotic arm for an OHT system includes a base, a suction cup, and a tray. A movable frame is horizontally slidably mounted on the base, and a flat plate is mounted on the movable frame via a lifting assembly. The lifting assembly can drive the flat plate to move vertically. The suction cup is disposed at the bottom of the flat plate, and the tray is horizontally slidably disposed on the flat plate via a sliding component, with the tray located below the suction cup; The flat plate is equipped with a negative pressure component, which cooperates with the suction cup and the tray respectively. When the negative pressure component is running, the suction cup will adsorb and fix the top of the wafer box, and at the same time, it can drive the tray to move horizontally to the bottom of the wafer box.

[0006] The robotic arm of the OHT system as described above: The lifting assembly includes a slide rod and an electric push rod. The slide rod is vertically slidably mounted on the movable frame, and the bottom of the slide rod is fixedly connected to the top of the flat plate.

[0007] The robotic arm of the OHT system as described above: The electric push rod is vertically mounted on the movable frame, and the output end of the electric push rod is fixedly connected to the top of the plate.

[0008] The robotic arm of the OHT system as described above: The sliding assembly includes a slide rail and a slide block slidably disposed on the slide rail, the slide rail being horizontally disposed at the bottom of the flat plate; A vertical frame is vertically installed on the slide block, and the bottom of the vertical frame is fixedly connected to the support plate.

[0009] The robotic arm of the OHT system as described above: The negative pressure assembly includes a sleeve and a piston rod, with one end of the sleeve and one end of the piston rod in a sealed sliding fit, and the sleeve is horizontally arranged on the plate.

[0010] The robotic arm of the OHT system as described above: An air pump is installed on the flat plate, and the output end of the air pump is fixedly connected to the other end of the sleeve. The sleeve is equipped with a spring inside, and the two ends of the spring abut against the piston rod and the inside of the other end of the sleeve, respectively.

[0011] The robotic arm of the OHT system as described above: The sleeve is connected to the suction cup via a branch pipe at one end of the side wall near the air pump. The other end of the piston rod is vertically provided with a support rod, and the bottom of the support rod is fixedly connected to the support plate.

[0012] Compared with the prior art, the beneficial effects of this utility model are: The horizontal sliding and lifting components of the mobile frame on the base control the vertical movement of the flat plate, enabling the robotic arm to accurately reach the target position and achieve precise handling of the wafer cassette, effectively improving the accuracy and reliability of the handling. The negative pressure component, together with the suction cup and the tray, allows the suction cup to firmly adhere to the top of the wafer cassette, while the tray can be moved horizontally to the bottom of the wafer cassette for support. This dual fixing method enhances the stability of the wafer cassette during handling and avoids wafer damage caused by shaking or collision. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of the handling robotic arm in the OHT system.

[0014] Figure 2 This is a schematic diagram of the overall structure of the handling robotic arm of the OHT system from another perspective.

[0015] Figure 3 This is a cross-sectional view of the flat plate and sleeve of the handling robot arm in the OHT system after the base has been removed.

[0016] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0017] Figure 5 In order to be in Figure 3 A side view based on the base.

[0018] In the diagram: 1. Base; 2. Suction cup; 3. Support plate; 4. Movable frame; 5. Flat plate; 6. Slide rod; 7. Electric push rod; 8. Slide rail; 9. Slide seat; 10. Vertical frame; 11. Sleeve; 12. Piston rod; 13. Air pump; 14. Spring; 15. Branch pipe; 16. Upright pole. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Please see Figure 1-5 As an embodiment of this utility model, a handling robotic arm of an OHT system includes a base 1, a suction cup 2 and a pallet 3. A movable frame 4 is horizontally slidably arranged on the base 1, and a flat plate 5 is arranged on the movable frame 4 through a lifting component. The lifting component can drive the flat plate 5 to move vertically. The suction cup 2 is disposed at the bottom of the flat plate 5, and the tray 3 is horizontally slidably disposed on the flat plate 5 via a sliding component, with the tray 3 located below the suction cup 2; The flat plate 5 is equipped with a negative pressure component, which cooperates with the suction cup 2 and the tray 3 respectively. When the negative pressure component is running, the suction cup 2 will adsorb and fix the top of the wafer box, and at the same time, it can drive the tray 3 to move horizontally to the bottom of the wafer box.

[0021] In this embodiment, the handling robotic arm is in standby mode, the moving frame 4 is located at the starting position of the base 1, the plate 5 is at the initial height position of the lifting assembly, the pallet 3 is at the initial horizontal position on the plate 5 through the sliding assembly, the suction cup 2 is fixed to the bottom of the plate 5 and does not adsorb any object, and the negative pressure assembly is in the off state. Upon receiving the task instruction to move the wafer cassette, the robotic arm begins to prepare for the moving operation. Based on the initial position coordinates of the wafer cassette, the moving frame 4 slides horizontally on the base 1 and moves to directly above the wafer cassette. After the moving frame 4 reaches the designated position, the lifting component is activated, driving the plate 5 to move vertically. The plate 5 moves downward until the suction cup 2 contacts the top of the wafer cassette. After the plate 5 descends to the appropriate position, the negative pressure component on the plate 5 is activated. The negative pressure component generates negative pressure through the suction cup 2, and the suction cup 2 begins to adsorb and fix the top of the wafer cassette. At this time, the adsorption force of the negative pressure component is large enough to firmly adsorb the wafer cassette and prevent it from loosening or falling off during the moving process. While the suction cup 2 adsorbs the wafer box, the negative pressure component drives the tray 3 to slide horizontally on the flat plate 5 through the sliding component. The tray 3 moves from its initial position to directly below the wafer box, providing bottom support for the wafer box.

[0022] As a further embodiment of this utility model, the lifting assembly includes a slide rod 6 and an electric push rod 7. The slide rod 6 is vertically slidably mounted on the movable frame 4, and the bottom of the slide rod 6 is fixedly connected to the top of the flat plate 5. The electric push rod 7 is vertically mounted on the movable frame 4, and the output end of the electric push rod 7 is fixedly connected to the top of the plate 5.

[0023] In this embodiment, after the moving frame 4 reaches the designated position, the electric push rod 7 is activated, and its output end begins to extend. Since the output end of the electric push rod 7 is fixedly connected to the top of the plate 5, when the plate 5 descends to the appropriate position and the suction cup 2 contacts the top of the wafer cassette, the electric push rod 7 stops extending, and the plate 5 stops descending. When the plate 5 moves vertically under the action of the electric push rod 7, the slide rod 6 slides vertically along the slide rail on the moving frame 4. The sliding of the slide rod 6 can ensure that the plate 5 remains stable during vertical movement, avoiding the situation where the plate 5 tilts or shakes due to uneven extension and retraction force of the electric push rod 7 or other factors.

[0024] As a further embodiment of this utility model, the sliding assembly includes a slide rail 8 and a slide block 9 slidably disposed on the slide rail 8, wherein the slide rail 8 is horizontally disposed at the bottom of the flat plate 5. A vertical frame 10 is vertically arranged on the slide 9, and the bottom of the vertical frame 10 is fixedly connected to the support plate 3.

[0025] In this embodiment, during the sliding of the slide block 9, the vertical frame 10, as a component connecting the slide block 9 and the support plate 3, moves synchronously with the movement of the slide block 9. The bottom of the vertical frame 10 is fixedly connected to the support plate 3. Therefore, the support plate 3 moves horizontally along the direction of the slide rail 8 under the drive of the vertical frame 10.

[0026] As a further embodiment of this utility model, the negative pressure assembly includes a sleeve 11 and a piston rod 12, one end of the sleeve 11 and one end of the piston rod 12 are sealed and slidably engaged, and the sleeve 11 is horizontally arranged on the plate 5. An air pump 13 is provided on the plate 5, and the output end of the air pump 13 is fixedly connected to the other end of the sleeve 11. A spring 14 is provided inside the sleeve 11, and the two ends of the spring 14 abut against the piston rod 12 and the inside of the other end of the sleeve 11, respectively. The sleeve 11 is connected to the suction cup 2 via a branch pipe 15 at one end of the side wall near the air pump 13. The other end of the piston rod 12 is vertically provided with a support rod 16, and the bottom of the support rod 16 is fixedly connected to the support plate 3.

[0027] In this embodiment, when the system needs to perform a handling operation, the air pump 13 is started. The output end of the air pump 13 is fixedly connected to the other end of the sleeve 11, and the air pump 13 begins to draw gas from the sleeve 11. As the air pump 13 draws gas from the sleeve 11, the air pressure in the sleeve 11 decreases. Under the action of the air pressure difference, the piston rod 12 begins to move towards the air pump 13 in the sleeve 11. The movement of the piston rod 12 compresses the spring 14, and the spring 14 undergoes elastic deformation to store energy. Since the side wall of the sleeve 11 near the air pump 13 is connected to the suction cup 2 through the branch pipe 15, the air pressure inside the suction cup 2 is also reduced, thus forming a negative pressure. The suction cup 2 uses the negative pressure to adsorb the top of the wafer box and firmly fix it on the suction cup 2. When the piston rod 12 moves toward the air pump 13, the upright rod 16 at its other end also moves synchronously. The bottom of the upright rod 16 is fixedly connected to the support plate 3. Therefore, under the drive of the upright rod 16, the support plate 3 slides horizontally along the sliding assembly (slide rail 8 and slide block 9) and moves to the bottom of the wafer box to provide bottom support for the wafer box. During the continuous operation of the air pump 13, the negative pressure component maintains the negative pressure state of the suction cup 2, ensuring that the wafer box is firmly attached to the suction cup 2 during the handling process. At the same time, the tray 3 is kept directly below the wafer box by the piston rod 12 and the upright rod 16, providing stable bottom support and enhancing stability during the handling process. When the robotic arm reaches the target position and the wafer cassette needs to be released, the air pump 13 stops running, the spring 14 releases its elastic potential energy, and pushes the piston rod 12 to move in the opposite direction and return to the initial position. At this time, the air pressure in the sleeve 11 is restored, the negative pressure of the suction cup 2 is released, and the wafer cassette is placed smoothly on the target position. At the same time, the pallet 3 also returns to the initial position under the action of the upright rod 16.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A handling robotic arm for an OHT system, comprising a base (1), a suction cup (2), and a pallet (3), characterized in that, A movable frame (4) is horizontally slidably mounted on the base (1), and a flat plate (5) is mounted on the movable frame (4) via a lifting assembly. The lifting assembly can drive the flat plate (5) to move vertically. The suction cup (2) is disposed at the bottom of the flat plate (5), and the tray (3) is horizontally slidably disposed on the flat plate (5) through a sliding component, and the tray (3) is located below the suction cup (2); The flat plate (5) is provided with a negative pressure component, which cooperates with the suction cup (2) and the tray (3) respectively. When the negative pressure component is running, the suction cup (2) will adsorb and fix the top of the wafer box, and at the same time, it can drive the tray (3) to move horizontally to the bottom of the wafer box.

2. The robotic arm for handling materials in an OHT system according to claim 1, characterized in that, The lifting assembly includes a slide rod (6) and an electric push rod (7). The slide rod (6) is vertically slidably mounted on the movable frame (4), and the bottom of the slide rod (6) is fixedly connected to the top of the plate (5).

3. The handling robotic arm of the OHT system according to claim 2, characterized in that, The electric push rod (7) is vertically mounted on the movable frame (4), and the output end of the electric push rod (7) is fixedly connected to the top of the plate (5).

4. The handling robotic arm of the OHT system according to claim 1, characterized in that, The sliding assembly includes a slide rail (8) and a slide block (9) slidably disposed on the slide rail (8), the slide rail (8) being horizontally disposed at the bottom of the flat plate (5); A vertical frame (10) is vertically arranged on the slide (9), and the bottom of the vertical frame (10) is fixedly connected to the tray (3).

5. The handling robotic arm of an OHT system according to claim 1, characterized in that, The negative pressure assembly includes a sleeve (11) and a piston rod (12). One end of the sleeve (11) and one end of the piston rod (12) are sealed and slidably fitted, and the sleeve (11) is horizontally arranged on the plate (5).

6. The handling robotic arm of an OHT system according to claim 5, characterized in that, An air pump (13) is provided on the plate (5), and the output end of the air pump (13) is fixedly connected to the other end of the sleeve (11); A spring (14) is provided inside the sleeve (11), and the two ends of the spring (14) abut against the piston rod (12) and the inside of the other end of the sleeve (11), respectively.

7. The handling robotic arm of an OHT system according to claim 6, characterized in that, The sleeve (11) is connected to the suction cup (2) via a branch pipe (15) at one end of the side wall near the air pump (13); The other end of the piston rod (12) is vertically provided with a support rod (16), and the bottom of the support rod (16) is fixedly connected to the support plate (3).

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