High-temperature-resistant hot melt adhesive film

Abstract

This utility model relates to a high-heat resistant hot melt adhesive film, belonging to the field of hot melt adhesive film technology. It includes a hot melt adhesive film body with a composite functional structure internally. The composite functional structure includes an adhesive film body layer, an inorganic filler layer, a high-temperature resistant resin layer, a mineral filler layer, a conductive layer, a natural antibacterial layer, a mildew-resistant layer, and a stain-resistant layer. The various functional layers of the composite functional structure are connected by hot melting, with the stain-resistant layer being the thinnest. This high-heat resistant hot melt adhesive film has extremely low thermal conductivity, which disperses within the film to form a physical barrier, delaying heat transfer and reducing the overall thermal response speed of the film. Furthermore, the aromatic structure of polyimide is difficult to oxidize, and it does not easily generate free radicals at high temperatures, delaying thermal oxidation. This makes the hot melt adhesive film body less prone to softening, loss of adhesion, or flow under heating conditions, thereby reducing the probability of adhesion failure, delamination, or component displacement.

Description

Technical Field

[0001] This utility model relates to the field of hot melt adhesive film technology, specifically a high-heat resistant hot melt adhesive film. Background Technology

[0002] Hot melt adhesive film is a solid adhesive material based on thermoplastic polymers. It becomes tacky after being heated and melted, and then solidifies after cooling to form an adhesive bond. Because it does not require solvents and is environmentally friendly and efficient, it is widely used in industries such as textiles, electronics, automobiles, and packaging.

[0003] Chinese utility model patent CN219907467U discloses a convenient hot melt adhesive film, comprising a first film body and a second film body symmetrically arranged. The first film body includes a first film body made of hot melt adhesive and a first base layer fixedly heat-sealed onto the first film body. The second film body includes a second film body made of hot melt adhesive and a second base layer fixedly heat-sealed onto the second film body. Compared with the prior art, this utility model has a third release paper that facilitates the separation between the first film body and the second film body. After separation, an object, such as a maple leaf or painting, can be placed between them. Then, the first film body and the second film body are closed and heat-sealed to achieve film coating of the object.

[0004] This invention facilitates the separation between the first and second films. However, existing hot melt adhesive films have poor heat resistance and limited functionality. In high-temperature environments such as outdoor summers or heated electronic devices, the adhesive film may soften, lose its adhesiveness, or flow, leading to bonding failure, delamination, or component displacement. Furthermore, its application scenarios are limited and it lacks special functions, failing to meet high-end demands. Therefore, a high-heat resistant hot melt adhesive film is proposed to solve the aforementioned problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a high-heat resistant hot melt adhesive film with advantages such as high heat resistance and multiple functions, thus solving the problems mentioned in the background section.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A heat-resistant hot melt adhesive film includes a hot melt adhesive film body, wherein a composite functional structure is provided inside the hot melt adhesive film body. The composite functional structure includes a film body layer, an inorganic filler layer, a high-temperature resistant resin layer, a mineral filler layer, a conductive layer, a natural antibacterial layer, a mildew-resistant layer, and a stain-resistant layer.

[0007] Furthermore, the various functional layers of the composite functional structure are connected by thermal fusion, and the thickness of the stain-resistant layer is the thinnest.

[0008] Furthermore, the main body layer of the adhesive film is epoxy resin, and the inorganic filler layer is nano-silica.

[0009] Furthermore, the high-temperature resistant resin layer is polyimide, and the mineral filler layer is calcium carbonate.

[0010] Furthermore, the conductive layer is a carbon nanotube filler, and the natural antibacterial layer is a chitosan coating.

[0011] Furthermore, the anti-mildew layer is a silver ion coating, and the stain-resistant layer is a plastic film.

[0012] Furthermore, the main body of the hot melt adhesive film is an arc-shaped adhesive film sheet.

[0013] Furthermore, the thickness of the adhesive film base layer, inorganic filler layer, high-temperature resistant resin layer, mineral filler layer, conductive layer, natural antibacterial layer, and anti-mildew layer is consistent with each other.

[0014] Compared with the prior art, this utility model provides a high-heat resistant hot melt adhesive film, which has the following beneficial effects: 1. This high-heat resistant hot melt adhesive film, through the setting of a composite functional structure, wherein the inorganic filler layer made of nano-silica and the high-temperature resistant resin layer made of polyimide have extremely low thermal conductivity, which can form a physical barrier when dispersed in the adhesive film, delaying heat transfer and reducing the overall thermal response speed of the adhesive film. In addition, the aromatic structure of polyimide is difficult to be oxidized and does not easily generate free radicals at high temperatures, delaying heat oxidation. This makes the hot melt adhesive film less likely to soften, lose its stickiness or flow under heating environment, thereby reducing the probability of adhesive failure, delamination or component displacement.

[0015] 2. This high-heat resistant hot melt adhesive film, through the combination of a mineral filler layer, a conductive layer, a natural antibacterial layer, an anti-mildew layer, and a stain-resistant layer, achieves the functions of reducing costs, improving conductivity, antibacterial and anti-mildew properties, and stain resistance. It expands the application scenarios of the hot melt adhesive film and has multiple functions to better meet high-end needs. Attached Figure Description

[0016] Figure 1 This is a three-dimensional view of the structure of this utility model; Figure 2 This utility model Figure 1 Enlarged view of the structure at point A in the middle; Figure 3 This is a side view of the structure of this utility model.

[0017] In the diagram: 1 Hot melt adhesive film body, 101 Adhesive film body layer, 102 Inorganic filler layer, 103 High temperature resistant resin layer, 104 Mineral filler layer, 105 Conductive layer, 106 Natural antibacterial layer, 107 Anti-mildew layer, 108 Stain-resistant layer. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figures 1 to 3 This embodiment of a high-heat resistant hot melt adhesive film includes a hot melt adhesive film body 1, which has a composite functional structure inside. The composite functional structure includes an adhesive film body layer 101, an inorganic filler layer 102, a high-temperature resistant resin layer 103, a mineral filler layer 104, a conductive layer 105, a natural antibacterial layer 106, an anti-mildew layer 107, and a stain-resistant layer 108. Among them, the inorganic filler layer 102, which is made of nano-silica, and the high-temperature resistant resin layer 103, which is made of polyimide, have extremely low thermal conductivity. When dispersed in the adhesive film, they can form a physical barrier, delaying heat transfer and reducing the overall thermal response speed of the adhesive film. In addition, the aromatic structure of polyimide is difficult to be oxidized and does not easily generate free radicals at high temperatures, thus delaying heat oxidation. This makes the hot melt adhesive film body 1 less likely to soften, lose its stickiness, or flow under heating conditions, thereby reducing the probability of adhesion failure, delamination, or component displacement.

[0020] By combining the mineral filler layer 104, conductive layer 105, natural antibacterial layer 106, mildew-proof layer 107, and stain-resistant layer 108, the functions of reducing costs, improving conductivity, antibacterial and mildew-proofing, and stain resistance are achieved. This expands the application scenarios of the hot melt adhesive film body 1 and has multiple functions to better meet high-end needs.

[0021] In this embodiment, the functional layers of the composite functional structure are connected by heat fusion. The anti-fouling layer 108 is the thinnest, and the connection between the functional layers by heat fusion makes it less likely to fall off.

[0022] It should be noted that the main body layer 101 of the film is epoxy resin, the inorganic filler layer 102 is nano-silica, the high-temperature resistant resin layer 103 is polyimide, and the mineral filler layer 104 is calcium carbonate. The filler layer 104, which is made of calcium carbonate, can partially replace the resin, maintaining performance while reducing costs.

[0023] It should be noted that the conductive layer 105 is a carbon nanotube filler, and the natural antibacterial layer 106 is a chitosan coating. The conductive layer 105, made of carbon nanotube filler, has good conductivity, making it convenient for use in electronic packaging. The natural antibacterial layer 106, made of chitosan coating, has a natural antibacterial effect.

[0024] Specifically, the anti-mold layer 107 is a silver ion coating, and the stain-resistant layer 108 is a plastic film. The silver ion coating material of the anti-mold layer 107 reduces the growth of mold, while the plastic film material of the stain-resistant layer 108 has the function of waterproofing and preventing the adhesion of stains.

[0025] It should be noted that the hot melt adhesive film body 1 is an arc-shaped adhesive film sheet.

[0026] Specifically, the thickness of the adhesive film main layer 101, inorganic filler layer 102, high-temperature resistant resin layer 103, mineral filler layer 104, conductive layer 105, natural antibacterial layer 106 and anti-mildew layer 107 is consistent with each other.

[0027] The working principle of the above embodiments is as follows: In use, the inorganic filler layer 102, made of nano-silica, and the high-temperature resistant resin layer 103, made of polyimide, have extremely low thermal conductivity. When dispersed in the film, they can form a physical barrier, delaying heat transfer and reducing the overall thermal response speed of the film. Furthermore, the aromatic structure of polyimide is difficult to oxidize and does not easily generate free radicals at high temperatures, thus delaying thermal oxidation. The filler layer 104, made of calcium carbonate, can partially replace the resin, maintaining performance while reducing costs. The conductive layer 105, made of carbon nanotube filler, has good conductivity, making it convenient for electronic packaging. The natural antibacterial layer 106, made of chitosan coating, has a natural antibacterial effect. The anti-mildew layer 107, made of silver ion coating, reduces mold growth. The stain-resistant layer 108, made of plastic film, provides waterproofing and prevents the adhesion of dirt.

[0028] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods, and any method that can achieve its beneficial effects can be implemented.

[0029] It should be noted that the orientations or positional relationships indicated herein are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the purpose of facilitating the description of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-heat resistant hot melt adhesive film comprising a hot melt adhesive film main body (1), characterized by: The hot melt adhesive film body (1) has a composite functional structure inside; The composite functional structure includes a film body layer (101), an inorganic filler layer (102), a high-temperature resistant resin layer (103), a mineral filler layer (104), a conductive layer (105), a natural antibacterial layer (106), an anti-mildew layer (107), and a stain-resistant layer (108).

2. The high-heat resistant hot melt adhesive film according to claim 1, characterized in that: The composite functional structure is connected to its functional layers by hot-melt, and the dirt-resistant layer (108) is the thinnest.

3. The high-heat resistant hot melt adhesive film according to claim 1, characterized in that: The main body layer (101) of the adhesive film is epoxy resin, and the inorganic filler layer (102) is nano-silica.

4. The high-heat resistant hot melt adhesive film according to claim 1, characterized in that: The high-temperature resistant resin layer (103) is polyimide, and the mineral filler layer (104) is calcium carbonate.

5. The high-heat resistant hot melt adhesive film according to claim 1, characterized in that: The conductive layer (105) is a carbon nanotube filler, and the natural antibacterial layer (106) is a chitosan coating.

6. The hot melt adhesive film of claim 1, wherein: The anti-mildew layer (107) is a silver ion coating, and the stain-resistant layer (108) is a plastic film.

7. The high-heat resistant hot melt adhesive film according to claim 1, wherein: The hot melt adhesive film body (1) is an arc-shaped adhesive film sheet.

8. The hot melt adhesive film of claim 1, wherein: The thickness of the main film layer (101), inorganic filler layer (102), high-temperature resistant resin layer (103), mineral filler layer (104), conductive layer (105), natural antibacterial layer (106) and anti-mildew layer (107) is consistent with each other.

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