Apparatus for manufacturing display device and electronic device

Abstract

An apparatus for manufacturing a display device and an electronic device are provided. The apparatus for manufacturing a display device includes a mask frame defining an open area in a central portion thereof, a mask sheet disposed on the mask frame to cover the open area, a chuck portion disposed to face the mask sheet and to fix a display substrate, a clamp disposed between the mask sheet and the chuck portion to clamp the display substrate and to release the clamping in a case where the chuck portion approaches the display substrate and fixes the display substrate, and a deposition source disposed opposite the chuck portion, with the mask sheet between the deposition source and the chuck portion.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2024-0112335, filed on August 21, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] One or more embodiments relate to apparatus and methods, and more specifically, to apparatus and methods for manufacturing display devices. Background Technology

[0003] Electronic devices have become widely used recently. Electronic devices are used in various ways as both mobile and fixed electronic devices. To support diverse functions, electronic devices may include display devices that provide users with visual information such as images.

[0004] A display device is a device that visually displays data and is formed by depositing various layers such as organic layers, metal layers, etc. Deposited materials can be deposited to form multiple layers of the display device. For example, deposited materials from a deposition source are sprayed and deposited onto a substrate through a mask.

[0005] The background technology described above is the technical information owned by the inventor to obtain this disclosure or obtained during the process of obtaining this disclosure, and should not be considered as prior art disclosed to the public before this disclosure was filed. Utility Model Content

[0006] To ensure the substrate is adjacent to the mask, it can be supported and transported by a fixture. For example, because the substrate requires a free area supported by the fixture, the non-display area of ​​the substrate may increase. Because the substrate is mounted on the mask sheet and mask frame while being supported by the fixture, the mask frame needs to be fabricated separately to prevent interference between the fixture and the mask frame.

[0007] One or more embodiments include apparatus and methods for manufacturing a display device having a substrate with a reduced non-display area and improved process efficiency.

[0008] However, this technical problem is merely an example, and this disclosure is not limited thereto.

[0009] Additional aspects will be set forth in part in the description which follows, and in part will be apparent from the description or may be learned by practice of the implementation.

[0010] According to one or more embodiments, an apparatus for manufacturing a display device may include: a mask frame defining an opening region in its central portion; a mask sheet disposed on the mask frame to cover the opening region; a chuck portion disposed facing the mask sheet and fixing a display substrate; a clamp disposed between the mask sheet and the chuck portion to clamp the display substrate and release the clamping when the chuck portion approaches and fixes the display substrate; and a deposition source disposed opposite to the chuck portion, wherein the mask sheet is between the deposition source and the chuck portion.

[0011] In one embodiment, the clamp may include: a support for supporting a first surface of the display substrate; and a pressing portion for pressing a second surface of the display substrate to cooperate with the support in clamping the display substrate.

[0012] In one embodiment, the support can be rotated about the support axis to release the support on the display substrate.

[0013] In one embodiment, when the bracket rotates around the bracket axis, the pressing portion can rise to space itself out from the bracket.

[0014] In one embodiment, the clamp may further include: a movable plate capable of sliding vertically along a vertically extending support shaft, the movable plate being connected to a pressing portion; and a linkage including a first end connected to a support shaft and a second end connected to the movable plate.

[0015] In one embodiment, when the support rotates around the support axis, the connecting rod can also rotate around the support axis to push the moving plate upward, thereby moving the moving plate in a sliding manner.

[0016] In one embodiment, the second end of the connecting rod can slide on a guide rail located below the movable plate.

[0017] In one implementation, the chuck portion can hold the display substrate in place and move toward the mask frame.

[0018] In one embodiment, when the display substrate is fixed in the chuck portion, the clamp can be released, allowing the first surface of the display substrate facing the mask to be open.

[0019] In one embodiment, when the chuck portion on which the display substrate is fixed moves toward the mask frame and is placed on the mask frame, the fixture may not interfere with the mask frame.

[0020] In one embodiment, the opposite ends of the mask sheet can be fixed to the mask frame by welding, and the welding line used for welding can have a straight shape.

[0021] In one embodiment, the chuck portion may include an electrostatic chuck.

[0022] In one embodiment, multiple supports may be provided, and the multiple supports may be spaced apart from each other in a first direction.

[0023] According to one or more embodiments, a method of manufacturing a display device includes: clamping and supporting a display substrate using a jig such that the display substrate is spaced apart from a mask; moving a chuck portion toward the display substrate while the chuck portion is spaced apart from the mask, and fixing the display substrate by the chuck portion, and releasing the clamping of the display substrate by the jig; moving the display substrate and the chuck portion on which the display substrate is fixed toward the mask; and placing the display substrate and the chuck portion on the mask.

[0024] In one embodiment, the clamp may include: a support for supporting a first surface of the display substrate; and a pressing portion for pressing a second surface of the display substrate to cooperate with the support in clamping the display substrate.

[0025] In one embodiment, releasing the clamp on the display substrate may include rotating the support around the support axis such that a first surface of the display substrate is open.

[0026] In one embodiment, releasing the clamping of the display substrate may include: raising the pressing portion from the second surface of the display substrate as the support rotates about the support axis, such that the pressing portion is spaced apart from the support.

[0027] In one embodiment, the clamp may further include a movable plate capable of sliding vertically along a vertically extending support shaft, the movable plate being connected to a pressing portion; and a linkage having a first end connected to a support shaft and a second end connected to the movable plate.

[0028] In one embodiment, releasing the clamping of the display substrate may include rotating a link around the support axis and pushing the moving plate upward as the support rotates about the support axis.

[0029] In one embodiment, when the chuck portion and the display substrate fixed on the chuck portion are placed on the mask sheet, the fixture can be spaced apart from the mask sheet and located above the mask sheet.

[0030] In one embodiment, the electronic device may include a display device, which includes a functional layer for displaying images, wherein the functional layer is formed using a manufacturing process for the apparatus used to manufacture the display device.

[0031] Electronic devices can be at least one of a television, a laptop computer, a monitor, an advertising board, an Internet of Things (IoT) device, a portable electronic device, a dashboard for a car, a central dashboard or central information display (CID) on a dashboard for a car, an interior mirror display for a car, and an entertainment system display on the back of the front seats of a car, wherein portable electronic devices include mobile phones, smartphones, tablet personal computers (PCs), mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, ultra-mobile personal computers (UMPCs), smartwatches, watch phones, glasses-type displays, and head-mounted displays (HMDs).

[0032] These and / or other aspects will become apparent and more readily understood from the following detailed description of the embodiments, drawings, and claims. Attached Figure Description

[0033] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic cross-sectional view of an apparatus for manufacturing a display device according to an embodiment; Figure 2 This is a schematic cross-sectional view of the fixture according to the embodiment; Figure 3 This is a schematic perspective view of the fixture according to the embodiment; Figures 4 to 8 This is a schematic cross-sectional view illustrating a method of manufacturing a display device according to an embodiment; Figure 9 This is a schematic plan view of a display device manufactured by an apparatus for manufacturing a display device, according to an embodiment. Figure 10 It is according to the implementation method along Figure 9 A schematic cross-sectional view of a display device manufactured by an apparatus for manufacturing a display device, taken by line X-X'; and Figure 11 and Figure 12 This is a schematic perspective view illustrating an application example of an electronic device. Detailed Implementation

[0034] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein the same reference numerals refer to the same elements throughout. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only with reference to the accompanying drawings to explain aspects of this specification. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0035] Because this disclosure allows for various variations and numerous implementations, certain implementations will be shown in the accompanying drawings and described in the written description. The effects and features of this disclosure, as well as the methods for implementing them, will be elucidated with reference to the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the following embodiments and can be implemented in various forms.

[0036] In the following description, embodiments will be illustrated with reference to the accompanying drawings, wherein the same reference numerals always denote the same elements, and repeated descriptions thereof are omitted.

[0037] While terms such as "first" and "second" can be used to describe various components, these components are not necessarily limited to these terms. These terms are used to distinguish one component from another.

[0038] As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “one,” and “the” are intended to also include the plural forms.

[0039] It will be understood that, as used herein, the terms “comprising,” “including,” “containing,” and / or “containing” specify the presence of the stated feature or element, but do not preclude the addition of one or more other features or elements.

[0040] It will also be understood that when a layer, region, or element is referred to as being "on" another layer, region, or element, that layer, region, or element may be directly or indirectly on the other layer, region, or element. For example, there may be intermediate layers, regions, or elements.

[0041] It will be understood that when a layer, region, or element is referred to as being "connected" to another layer, region, or element, that layer, region, or element may be "directly connected" to that other layer, region, or element, or may be "indirectly connected" to that other layer, region, or element having another layer, region, or element therebetween. For example, it will be understood that when a layer, region, or element is referred to as being "electrically connected" to another layer, region, or element, that layer, region, or element may be "directly electrically connected" to that other layer, region, or element, or may be "indirectly electrically connected" to that other layer, region, or element having other layers, regions, or elements interposed therebetween.

[0042] For ease of explanation, the dimensions of the elements in the accompanying drawings may be enlarged or reduced. As an example, for ease of description, the dimensions and thicknesses of each element shown in the drawings are arbitrarily represented, and therefore, this disclosure is not necessarily limited thereto.

[0043] In the following implementation, "A and / or B" means A or B, or A and B. For example, "at least one of A and B" means A or B, or A and B.

[0044] As used in this article, when a cabling is referred to as “extending in a first or second direction”, it means that the cabling extends not only in a straight line in the first or second direction, but also in a zigzag or curved shape.

[0045] In the following embodiments, when referring to a "plan view," it means viewing the object portion from above. In the following embodiments, when referring to a "sectional view," it means viewing a cross-section of a vertically cut portion of the object from the side. As used herein, when referring to the first element and the second element "overlapping," the first element is positioned above or below the second element.

[0046] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different orientations that are not perpendicular to each other.

[0047] Where a particular implementation can be carried out differently, a specific process sequence can be executed in a different order than that described. As an example, two consecutively described processes can be executed substantially simultaneously and in reverse order.

[0048] Figure 1 This is a schematic cross-sectional view of apparatus 2 for manufacturing a display device according to an embodiment.

[0049] The apparatus 2 for manufacturing a display device may include a chamber 10, a fixture 20, a support 30, a mask assembly 40, a deposition source 50, a chuck portion 60, a vision portion 70, and a pressure regulator 80.

[0050] A space can be formed inside the chamber 10. The display substrate DS and the mask assembly 40 can be accommodated in the space. For example, a portion of the chamber 10 can be formed to be open. A gate valve 11 can be installed in the opening portion of the chamber 10. For example, the opening portion of the chamber 10 can be controlled to open or close according to the operation of the gate valve 11.

[0051] For example, the display substrate DS may refer to the substrate 100 described below, on which at least one of an organic layer, an inorganic layer, and a metal layer is deposited during the fabrication of the display device. In another example, the display substrate DS may be a substrate 100 on which any one of the organic layer, inorganic layer, and metal layer has not yet been deposited.

[0052] The clamp 20 can hold and support the display substrate DS. The clamp 20 can receive the display substrate DS from the transfer unit that transfers the display substrate DS into the chamber 10, and hold and support the display substrate DS. The clamp 20 can hold the display substrate DS until the chuck portion 60 approaches and clamps and secures the display substrate DS. After the display substrate DS is secured on the chuck portion 60, the clamp 20 can release the clamp.

[0053] The support member 30 can support the mask assembly 40. For example, the support member 30 can be disposed inside the chamber 10. The support member 30 can fine-tune the position of the mask assembly 40. For example, the support member 30 can include drivers, alignment units, etc., to move the mask assembly 40 in different directions.

[0054] In another embodiment, the support member 30 may be in a spindle shape. For example, a mask assembly 40 may be mounted (or disposed) on the support member 30. The support member 30 may transport the mask assembly 40. As an example, the support member 30 may be moved to the outside of the chamber 10, and after the mask assembly 40 is mounted (or disposed) on the support member 30, the support member 30 may enter the chamber 10 from the outside of the chamber 10.

[0055] The deposition source 50 may be positioned facing the mask assembly 40. For example, the deposition material may be contained within the deposition source 50. By applying heat to the deposition material, it may evaporate or sublimate. The deposition source 50 may be positioned fixed inside the chamber 10, or it may be positioned within the chamber 10 and capable of linear movement in one direction.

[0056] The mask assembly 40 may be disposed within the chamber 10. For example, the mask assembly 40 may include a mask frame 41 and a mask sheet 42. The mask frame 41 may include sides connected to each other and includes an opening region OA defined by the sides. For example, the opening region OA may be surrounded by the sides and may extend through the central portion of the mask frame 41. In an embodiment, the mask frame 41 may be a quadrilateral frame. However, the shape of the mask frame 41 is not limited to this, but may be various polygonal or circular shapes. In the following description, for ease of description, the case where the mask frame 41 is a quadrilateral frame is described.

[0057] In the case that the mask frame 41 is a quadrilateral frame, the edges may include the first direction (e.g., Figure 1 The first side extends along the x-axis direction and the second side intersects the first direction (e.g., in the x-axis direction) and the second side intersects the first direction (e.g., in the x-axis direction). Figure 1 The second side extends along the y-axis (in the image). Since the first sides are set as a pair facing each other, and the second sides are set as a pair facing each other, the first side can be connected to the second side. In an implementation, the first side can be a long side, and the second side can be a short side. However, the implementation is not limited to this, and the first side can be a short side, the second side can be a long side, or the first side and the second side can be equal in length. In the following description, for ease of description, the case where the first side is a long side and the second side is a short side is described.

[0058] The mask sheet 42 can be tensioned and mounted to the mask frame 41. The opening region OA in the central portion of the mask frame 41 can be covered by the mask sheet 42. In an embodiment, at least two mask sheets 42 may be provided. When two or more mask sheets 42 are provided, the mask sheets 42 may be arranged on the mask frame 41 parallel to each other. As an example, the mask sheets 42 may be respectively positioned in a first direction (e.g., Figure 1 Extending in the x-axis direction, and arranged in the second direction (e.g., Figure 1 They are parallel to each other in the y-axis direction. The two opposite ends of each of the mask pieces 42 can be fixed to the mask frame 41 by welding.

[0059] Each of the mask sheets 42 may include at least one patterned hole. The patterned hole may be a through-hole formed to allow deposited material to pass through the mask sheet 42. The deposited material passing through the mask sheet 42 may be deposited on the display substrate DS.

[0060] A chuck portion 60 may be disposed within the chamber 10 to face the display substrate DS and / or the mask assembly 40. The chuck portion 60 may be disposed opposite to the mask assembly 40, with the display substrate DS between the chuck portion 60 and the mask assembly 40. The chuck portion 60 may clamp, secure, and hold the display substrate DS. In one embodiment, the chuck portion 60 may include an electrostatic chuck. The electrostatic chuck may use electrostatic force to secure the display substrate DS to the chuck portion 60. In another embodiment, the chuck portion 60 may include an adhesive chuck. The adhesive chuck may use an adhesive material such as an adhesive pad or adhesive sheet to secure the display substrate DS by bonding it. Hereinafter, for ease of description, the case where the chuck portion 60 includes an electrostatic chuck is described.

[0061] The chuck portion 60 (e.g., an electrostatic chuck) may have electrodes embedded within the body, and power can be applied to the electrodes. When a high voltage is applied to the electrodes, the display substrate DS can be secured to the surface of the electrostatic chuck. In an embodiment, the chuck portion 60 may include alignment marks for aligning and securing the display substrate DS. Therefore, the chuck portion 60 and the display substrate DS can be aligned with each other and engaged in a precise location.

[0062] In an implementation, the chuck portion 60 can be vertical (e.g., in...). Figure 1 The chuck portion 60 can move toward the display substrate DS to clamp the display substrate DS held by the clamp 20. For example, after clamping the display substrate DS, the chuck portion 60 can move toward the mask sheet 42.

[0063] The vision unit 70 can be disposed in the chamber 10 and can capture the positions of the display substrate DS and the mask assembly 40. For example, the vision unit 70 may include a camera that captures the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 can be determined based on the images captured by the vision unit 70, and changes to the mask assembly 40 can be determined. For example, based on the captured images, the fixture 20 can fine-tune the position of the display substrate DS, or the support 30 can fine-tune the position of the mask assembly 40.

[0064] Pressure regulator 80 can be connected to chamber 10 and can regulate the internal pressure of chamber 10. For example, pressure regulator 80 can regulate the internal pressure of chamber 10 to be equal to or similar to atmospheric pressure. For instance, pressure regulator 80 can regulate the internal pressure of chamber 10 to be equal to or similar to a vacuum state.

[0065] The pressure regulator 80 may include a connecting pipe 81 and a pump 82. The connecting pipe 81 may be connected to the chamber 10, and the pump 82 may be mounted to the connecting pipe 81. For example, depending on the operation of the pump 82, external air may be introduced through the connecting pipe 81, or gas inside the chamber 10 may be guided to the outside through the connecting pipe 81.

[0066] A method for manufacturing a display device is described using apparatus 2 for manufacturing a display device. For example, a display substrate DS can be prepared.

[0067] The pressure regulator 80 can maintain the interior of chamber 10 at a pressure equal to or similar to atmospheric pressure. The gate valve 11 can be operated to open the opening portion of chamber 10.

[0068] For example, the display substrate DS can be loaded into the interior of the chamber 10 from the outside. The display substrate DS can be loaded into the chamber 10 in various ways. As an example, the display substrate DS can be loaded into the interior of the chamber 10 from the outside using a robotic arm positioned outside the chamber 10.

[0069] The mask assembly 40 may be disposed inside the cavity 10 as described above. In another embodiment, the mask assembly 40 may be loaded into the cavity 10 from the outside in the same or similar manner as the display substrate DS.

[0070] When the display substrate DS is loaded into the chamber 10, the fixture 20 can receive and place the display substrate DS from a transfer unit such as a robotic arm. As an example, the fixture 20 can clamp and support the display substrate DS from the transfer unit. For example, the vision section 70 can capture the positions of the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 can be determined based on the image captured by the vision section 70. For example, the apparatus 2 for manufacturing a display device may include a separate controller to determine the positions of the display substrate DS and the mask assembly 40.

[0071] Once the positions of the display substrate DS and the mask assembly 40 have been determined, the support member 30 can fine-tune the position of the mask assembly 40.

[0072] The chuck portion 60 can move toward the display substrate DS to clamp and secure the display substrate DS. After the display substrate DS is secured to the chuck portion 60, the clamp 20 can release its grip and move to space itself away from the display substrate DS. Therefore, the display substrate DS can be secured by the clamping force of the chuck portion 60.

[0073] The chuck portion 60 can move together with the display substrate DS toward the mask assembly 40 (e.g., mask sheet 42). The display substrate DS can be fixed to the chuck portion 60 and can be placed on the mask sheet 42.

[0074] For example, deposition source 50 can be operated to provide deposition material toward mask assembly 40, and deposition material passing through patterned holes in mask sheet 42 can be deposited on display substrate DS. For example, deposition source 50 can be moved parallel to display substrate DS and mask assembly 40, or display substrate DS and mask assembly 40 can be moved parallel to deposition source 50. For example, deposition source 50 can be moved relative to display substrate DS and mask assembly 40. For example, pump 82 can maintain the pressure of chamber 10 at or near a vacuum by drawing in gas from inside chamber 10 and venting gas to the outside.

[0075] As described above, the deposition material provided from the deposition source 50 can be deposited on the display substrate DS through the mask assembly 40 (e.g., mask sheet 42) and thus form at least one of a plurality of layers (e.g., organic layers, inorganic layers and metal layers stacked in the display device described below).

[0076] Figure 2 This is a schematic cross-sectional view of the fixture 20 according to the embodiment. Figure 3 This is a schematic perspective view of the fixture 20 according to the embodiment. Figure 2 and Figure 3 yes Figure 1 An enlarged view of a portion (e.g., the right portion), and shows the clamp 20.

[0077] refer to Figure 2 and Figure 3 In one embodiment, the clamp 20 may include a bracket 21, a pressing part 22, a moving plate 23, a support shaft 24, and a connecting rod 25.

[0078] The support 21 can support the display substrate DS. In an embodiment, multiple supports 21 can be provided and disposed on two opposite edges facing the display substrate DS to support the periphery of the display substrate DS. As an example, the supports 21 can be provided to support the edge portion of the display substrate DS on one side of a first direction (e.g., on one side in the positive x-axis direction) and on the other side of the first direction (e.g., on one side in the negative x-axis direction). For example, among the supports 21, the support 21 for supporting the edge portion of the display substrate DS on one side can be defined as the supports 21 in a first group, and the support 21 for supporting the edge portion of the display substrate DS on the other side can be defined as the supports 21 in a second group. Hereinafter, for ease of description, as shown in the accompanying drawings, the supports 21 in the first group disposed on one side of the first direction (in the positive x-axis direction) are described.

[0079] The supports 21 in the first group can be arranged to be spaced apart from each other in a second direction (e.g., the y-axis direction). For example, a support axis HX extending in the second direction can pass through the supports 21 in the first group. Therefore, the supports 21 in the first group can rotate about the support axis HX and rotate in relation to each other. For example, when the support axis HX rotates, the supports 21 connected to the support axis HX can rotate at the same angle relative to each other.

[0080] In one embodiment, the support 21 may include a support body 21A and a support protrusion 21B. The support body 21A may be the portion through which the support shaft HX passes and is inserted, and the support body 21A may rotate about the support shaft HX. The support protrusion 21B may protrude from the support body 21A and may protrude toward the support 21 in the second group. The display substrate DS may be disposed and supported on the upper surface of the support protrusion 21B.

[0081] The pressing portion 22 can press the display substrate DS to clamp the display substrate DS in cooperation with the support 21. When multiple supports 21 are provided, the number of pressing portions 22 can also correspond to the number of supports 21. The support 21 can support a first surface of the display substrate DS (e.g., the surface in the negative z-axis direction), and the pressing portion 22 can press a second surface of the display substrate DS opposite to the first surface (e.g., the surface in the positive z-axis direction). Therefore, the periphery of the display substrate DS can be clamped and fixed by the support 21 and the pressing portion 22.

[0082] The pressing portion 22 can move in a third direction (e.g., the z-axis direction), for example, vertically. For instance, the pressing portion 22 can descend to press the display substrate DS and rise to release the pressure on the display substrate DS. For instance, the support 21 can move in association with the pressing portion 22. As an example, when the pressing portion 22 descends, the support 21 can... Figure 2 The support 21 can be rotated clockwise to clamp the display substrate DS together. For example, when the pressing part 22 rises, the support 21 can... Figure 2 The bracket 21 can be rotated counterclockwise to release the clamping force on the display substrate DS. For example, the rotation of the bracket 21 and the raising or lowering of the pressing portion 22 can occur simultaneously in a coordinated manner.

[0083] The pressing portion 22 can be connected to the movable plate 23. The movable plate 23 can be connected to the pressing portion 22 on one side thereon to support the pressing portion 22. The movable plate 23 can move vertically, and therefore, the pressing portion 22 can move vertically. In an embodiment, the movable plate 23 may include a through hole TH, and a support shaft 24 can extend through the through hole TH. For example, the support shaft 24 can extend upward (e.g., vertically) and can be configured to pass through the movable plate 23. The movable plate 23 can slide vertically along the support shaft 24.

[0084] Link 25 allows the support 21 and the movable plate 23 to move in relation to each other. In one embodiment, a first end of link 25 may be connected to the support shaft HX, and a second end of link 25 may be connected to the lower part of the movable plate 23. The first end of link 25 may be pierced (or penetrated) and connected to the support shaft HX. Therefore, link 25 can rotate as the support shaft HX rotates. For example, link 25 can rotate together with the support 21 connected to the support shaft HX.

[0085] When the link 25 rotates about the support axis HX, the movable plate 23 connected to the second end of the link 25 can move vertically. As an example, when the support 21 and the link 25 rotate counterclockwise, the link 25 can push the movable plate 23 upwards to move the movable plate 23 upwards. For example, it can be understood that the pressing portion 22 connected to the movable plate 23 can move upwards. Therefore, the support 21 and the pressing portion 22 can move to space apart from each other and release the clamping of the display substrate DS. When the support 21 and the link 25 rotate clockwise, the movable plate 23 connected to the link 25 can move downwards along the link 25. For example, it will be understood that the pressing portion 22 connected to the movable plate 23 can also move downwards. Therefore, the support 21 and the pressing portion 22 can move to approach each other and clamp the display substrate DS.

[0086] In one embodiment, the second end of the link 25 may be connected to be slidably movable below the movable plate 23. For example, the second end of the link 25 may be pierced (or penetrated) by the moving shaft MX. The moving shaft MX may extend in a second direction (e.g., the y-axis direction) and parallel to the support axis HX. For example, the moving shaft MX may be positioned below the movable plate 23 and on a guide rail GR extending in a first direction (e.g., the positive x-axis direction). Therefore, the moving shaft MX and the second end of the link 25 pierced (or penetrated) by the moving shaft MX can slide slidably in the first direction below the movable plate 23. This can help correlate the rotation of the link 25 with the vertical movement of the movable plate 23.

[0087] Figures 4 to 8 This is a schematic cross-sectional view illustrating a method for manufacturing a display device according to an embodiment. Figures 4 to 8 The fixture 20 is shown. Although the method of manufacturing the display device can be implemented using the apparatus 2 for manufacturing the display device described above, the implementation is not limited thereto.

[0088] refer to Figure 4 The device can receive a display substrate DS loaded by a transfer unit such as a robotic arm to place (or set) the display substrate DS on a fixture 20 (e.g., a support 21). For example, the display substrate DS can be placed on the fixture 20 and can be positioned spaced apart from the mask assembly 40 in a third direction (e.g., the positive z-axis direction) and spaced apart from the chuck portion 60 in a third direction (e.g., the positive z-axis direction). For example, the fixture 20 and the display substrate DS can be positioned between the mask assembly 40 and the chuck portion 60.

[0089] refer to Figure 5 As described above, the support 21 can be configured to support two opposing edge portions of the display substrate DS that face each other. After the display substrate DS is placed on the clamp 20, the pressing portion 22 can be lowered and press the display substrate DS. For example, as described above, it will be understood that when the pressing portion 22 is lowered (or moved downward), the movable plate 23 connected to the pressing portion 22 can also be lowered (or moved downward). The display substrate DS can be held and secured by the support 21 and the pressing portion 22 (e.g., the clamp 20).

[0090] refer to Figure 6 The chuck portion 60 can move toward the display substrate DS. For example, the chuck portion 60 can descend until it contacts the display substrate DS. The chuck portion 60 can clamp the display substrate DS and secure and hold it. In an embodiment, the chuck portion 60 may include an electrostatic chuck. The electrostatic chuck can use electrostatic force to hold the display substrate DS to the chuck portion 60.

[0091] refer to Figure 7 After the display substrate DS is secured to the chuck portion 60, the clamp 20 can release its grip. The support shaft HX can rotate counterclockwise, and the support 21 can rotate about the support shaft HX to open the first surface (e.g., the lower surface) of the display substrate DS. For example, the link 25 connected to the support shaft HX can also rotate about the support shaft HX, and thus, the second end of the link 25 can rise. The link 25 can push and raise the movable plate 23. For example, the movable plate 23 can rise along the vertically extending support shaft 24. When the movable plate 23 rises, the pressing portion 22 connected to one side of the movable plate 23 can also rise. Therefore, the support 21 can rotate to open the first surface of the display substrate DS, and the pressing portion 22 can rise from the second surface of the display substrate DS to space away from the support 21, and the grip on the display substrate DS can be released. For example, the display substrate DS can be secured to the chuck portion 60 by the fixing force of the chuck portion 60.

[0092] refer to Figure 8 The chuck portion 60 can hold the display substrate DS thereon and descend toward the mask assembly 40 (e.g., mask sheet 42). The chuck portion 60 can be moved such that the display substrate DS can be positioned on the mask sheet 42. For example, the deposition source 50 can be operated to provide deposition material toward the mask assembly 40, and the deposition material passing through the patterned holes of the mask sheet 42 can be deposited on the display substrate DS.

[0093] For example, since the display substrate DS is not held by the clamp 20, the mask frame 41 and the mask sheet 42 on which the display substrate DS is mounted do not interfere with the clamp 20. For example, when the display substrate DS is mounted on the mask sheet 42, the clamp 20 supporting the display substrate DS can be released, and the display substrate DS can be secured by the chuck portion 60. Therefore, the free area in which the display substrate DS is supported by the clamp 20 is not required. Therefore, the area of ​​the non-display area of ​​the display substrate DS can be reduced.

[0094] As a comparative example, when the fixture 20 (e.g., the support 21) supports the display substrate DS, the support 21 can be moved until it is positioned on the mask frame 41. For example, the display substrate DS may be supported by the fixture 20 positioned on the mask frame 41, and additional areas may need to be supported by the fixture 20. This may increase the area of ​​the non-display region of the display substrate DS.

[0095] For example, when the support 21 is mounted on the mask frame 41, a groove for mounting the support 21 can be machined separately in the mask frame 41 to avoid interference. Therefore, additional processes may be required to manufacture the groove, and the strength of the mask frame 41 may be degraded due to the groove.

[0096] For example, in a comparative example, when the mask sheet 42 is welded to the mask frame 41, the weld line of the mask sheet 42 may be formed into an irregular shape in the plan view to avoid the groove. For example, when the weld line of the mask sheet 42 is complex, it may be difficult to perform trimming along the weld line when repairing the mask sheet 42.

[0097] Unlike the comparative example, in this embodiment, the clamp 20, including the support 21, can release its grip to open the display substrate DS. Therefore, the clamp 20 can be spaced apart from the mask assembly 40, and when the display substrate DS is placed on the mask sheet 42, the clamp 20 may not be placed on the mask sheet 42. Thus, it is not necessary to fabricate a separate recess in the mask frame 41. Because no recess is provided, the strength of the mask frame 41 can be maintained.

[0098] For example, because the mask frame 41 does not include a groove, the weld line from the mask sheet 42 to the mask frame 41 can be set as a substantially straight line. In the case of repairing the mask sheet 42, this can facilitate trimming along the weld line. For example, the trimming process can be automated.

[0099] Figure 9 This is a schematic plan view of a display device 1 manufactured by an apparatus for manufacturing a display device 1 according to an embodiment.

[0100] refer to Figure 9 The display device 1 manufactured according to the embodiment may include a display area DA and a peripheral area PA outside the display area DA. The display device 1 can display an image by means of an array of pixels PX arranged in two dimensions in the display area DA.

[0101] The peripheral area PA can be an area where no image is displayed, and can completely or partially surround the display area DA. Drivers or the like for providing electrical signals or power to the pixel circuits corresponding to pixels PX can be disposed in the peripheral area PA. Pads can be disposed in the peripheral area PA, and pads can be areas where electronic components or printed circuit boards are electrically connected.

[0102] In the following text, although the display device 1 includes an organic light-emitting diode (OLED) as a light-emitting diode (see Figure 10However, the display device 1 according to the embodiment is not limited thereto. In another embodiment, the display device 1 may be a light-emitting display device including an inorganic light-emitting diode (e.g., an inorganic light-emitting display device). The inorganic light-emitting diode may include a PN junction diode comprising a material based on an inorganic semiconductor. When a forward voltage is applied to the PN junction diode, holes and electrons are injected, and light of a preset color can be emitted while the energy generated by the recombination of holes and electrons is converted into light energy. The inorganic light-emitting diode may have a width in the range of several micrometers to several hundred micrometers. In an embodiment, the inorganic light-emitting diode may be represented by a micro light-emitting diode. In another embodiment, the display device 1 may be a quantum dot light-emitting display device.

[0103] Display device 1 can be used as a display screen in various products, including televisions, laptops, monitors, billboards, Internet of Things (IoT) devices, and portable electronic devices including mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile personal computers (UMPCs). For example, display device 1 according to embodiments can be used in wearable devices including smartwatches, watch phones, glasses displays, and head-mounted displays (HMDs). In embodiments, display device 1 can be used as a display screen in a car dashboard, a car center dashboard or a central information display (CID) arranged on a dashboard, an interior mirror display replacing a car side mirror, and an entertainment system display for rear passengers arranged on the back of the front seats in a car.

[0104] Figure 10 It is according to the implementation method along Figure 9 A schematic cross-sectional view of the display device 1 manufactured by the apparatus used to manufacture the display device 1, taken by line X-X'.

[0105] refer to Figure 10 The display device 1 may include a stacked structure of a substrate 100, a pixel circuit layer PCL, a display element layer DEL, and a packaging layer 300. The display substrate DS (see...) Figure 1 The structure may be a structure in which at least one of the pixel circuit layer PCL, display element layer DEL and encapsulation layer 300 is stacked on, for example, substrate 100 during the manufacturing process of display device 1.

[0106] Substrate 100 may have a multilayer structure comprising a base layer containing a polymer resin and an inorganic layer. As an example, substrate 100 may include a base layer containing a polymer resin and a barrier layer containing an inorganic insulating layer. As an example, substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 stacked sequentially. The first base layer 101 and the second base layer 103 may each comprise polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), and / or cellulose acetate propionate (CAP). The first barrier layer 102 and the second barrier layer 104 may each comprise an inorganic insulating material such as silicon oxide, silicon nitride, and / or silicon nitride. Substrate 100 may be flexible.

[0107] The pixel circuit layer PCL can be disposed on the substrate 100. Figure 10 The pixel circuit layer PCL shown includes a thin film transistor (TFT), a buffer layer 111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first planarization insulating layer 115, and a second planarization insulating layer 116 below and / or on the elements of the thin film transistor TFT.

[0108] The buffer layer 111 can reduce or block foreign matter, moisture, or outside air from penetrating from below the substrate 100, and can provide a flat surface on the substrate 100. The buffer layer 111 may include inorganic insulating materials such as silicon nitride, silicon oxide nitride, and silicon oxide, and may include a single-layer structure or a multi-layer structure containing the above materials.

[0109] The thin-film transistor (TFT) on the buffer layer 111 may include a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon. In another example, the semiconductor layer Act may include amorphous silicon, oxide semiconductor, or organic semiconductor. The semiconductor layer Act may include a channel region C, a drain region D, and a source region S disposed on two opposite sides of the channel region C. The gate electrode GE may overlap with the channel region C.

[0110] The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and has a single-layer or multi-layer structure comprising the above materials.

[0111] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE may include silicon oxide (SiO2) and silicon nitride (SiN). x), silicon nitride oxide (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Inorganic insulating materials, such as zinc oxide (ZnO). x () can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0112] The second gate insulating layer 113 may cover the gate electrode GE. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include silicon oxide (SiO2) and silicon nitride (SiN) compounds. x ), silicon nitride oxide (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Inorganic insulating materials, such as zinc oxide (ZnO). x () can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0113] The upper electrode Cst2 of the storage capacitor Cst can be disposed on the second gate insulating layer 113. The upper electrode Cst2 can overlap with the gate electrode GE below the upper electrode Cst2. For example, the overlapping gate electrode GE and the upper electrode Cst2 can constitute (or form) the storage capacitor Cst, wherein the second gate insulating layer 113 is between the gate electrode GE and the upper electrode Cst2. For example, the gate electrode GE can be used as (or act as) the lower electrode Cst1 of the storage capacitor Cst.

[0114] As described above, the storage capacitor Cst can overlap with the thin-film transistor TFT. In an embodiment, the storage capacitor Cst can be formed so as not to overlap with the thin-film transistor TFT.

[0115] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may include a single layer or multiple layers containing the above materials.

[0116] The interlayer insulating layer 114 may cover the upper electrode Cst2. The interlayer insulating layer 114 may include silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon nitride oxide (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Zinc oxide (ZnO) xThe interlayer insulation layer 114 may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2). The interlayer insulation layer 114 may include a single layer or multiple layers containing inorganic insulating material.

[0117] The drain electrode DE and the source electrode SE can each be disposed on the interlayer insulating layer 114. The drain electrode DE and the source electrode SE can be connected to the drain region D and the source region S, respectively, through contact holes in the insulating layer below them. The drain electrode DE and the source electrode SE can each comprise a highly conductive material. The drain electrode DE and the source electrode SE can each comprise a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and can comprise a single layer or multiple layers containing the above materials. In an embodiment, the drain electrode DE and the source electrode SE can each have a Ti / Al / Ti multilayer structure.

[0118] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may include an organic insulating material comprising a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol-based group, an acrolein-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and mixtures (or compositions thereof).

[0119] A second planarization insulating layer 116 may be disposed on a first planarization insulating layer 115. The second planarization insulating layer 116 and the first planarization insulating layer 115 may comprise the same material. The second planarization insulating layer 116 may comprise an organic insulating material comprising a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol-based group, an acrolein-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and mixtures (or compositions thereof).

[0120] The display element layer (DEL) can be disposed on the pixel circuit layer (PCL) having the above structure. The display element layer (DEL) can include an organic light-emitting diode (OLED) as a display element (e.g., a light-emitting element). The OLED can have a stacked structure of pixel electrode 210, intermediate layer 220, and common electrode 230. The OLED can emit, for example, red, green, or blue light, or emit red, green, blue, or white light. The OLED can emit light through an emitting region. The emitting region can be defined as a pixel (PX).

[0121] The pixel electrode 210 of the organic light-emitting diode (OLED) can be electrically connected to the thin-film transistor (TFT) through contact holes formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and contact metal CM disposed on the first planarization insulating layer 115.

[0122] Pixel electrode 210 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). In another embodiment, pixel electrode 210 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. In another embodiment, pixel electrode 210 may also include a layer on / below the reflective layer, and may include ITO, IZO, ZnO, or In2O3.

[0123] A pixel defining layer 117 may be disposed on the pixel electrode 210, and the pixel defining layer 117 includes an opening 117OP that exposes the central portion of the pixel electrode 210. The pixel defining layer 117 may include an organic insulating material and / or an inorganic insulating material. The opening 117OP may define an emission region for emitting light from an organic light-emitting diode (OLED). As an example, the size / width of the opening 117OP may correspond to the size / width of the emission region. Therefore, the size and / or width of the pixel PX may depend on the size and / or width of the opening 117OP of the pixel defining layer 117.

[0124] The intermediate layer 220 may include an emission layer 222 formed corresponding to the pixel electrode 210. The emission layer 222 may include a polymeric organic material or a low molecular weight organic material that emits light having a preset (or a certain) color. In another example, the emission layer 222 may include an inorganic emission material or quantum dots.

[0125] In an embodiment, the intermediate layer 220 may include a first functional layer 221 and a second functional layer 223 disposed below and above the emitter layer 222, respectively. The first functional layer 221 may include, for example, a hole transport layer (HTL), or may include an HTL and a hole injection layer (HIL). The second functional layer 223 may be elements disposed on the emitter layer 222 and may include an electron transport layer (ETL) and / or an electron injection layer (EIL). Similar to the common electrode 230 described below, the first functional layer 221 and / or the second functional layer 223 may be a common layer that covers (e.g., completely covers) the substrate 100.

[0126] The common electrode 230 can be disposed on and overlap with the pixel electrode 210. The common electrode 230 may include a conductive material with a low work function. As an example, the common electrode 230 may include a translucent or transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or alloys thereof. In another example, the common electrode 230 may also include a layer comprising ITO, IZO, ZnO, or In2O3 on the translucent or transparent layer. The common electrode 230 may be formed as a single entity to completely cover the substrate 100.

[0127] The encapsulation layer 300 can be disposed on the display element layer DEL and can cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In an embodiment, such as... Figure 10 As shown, the encapsulation layer 300 includes a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 stacked sequentially.

[0128] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise at least one inorganic material selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon nitride. The organic encapsulation layer 320 may comprise a polymer-based material. Polymer-based materials may include acrolein-based resins, epoxy-based resins, polyimides, and polyethylene. In an embodiment, the organic encapsulation layer 320 may comprise acrylate. The organic encapsulation layer 320 may be formed by curing monomers or coating polymers. The organic encapsulation layer 320 may be transparent.

[0129] For example, a touch sensor layer may be disposed on the encapsulation layer 300. An optical functional layer may be disposed on the touch sensor layer. The touch sensor layer may obtain coordinate information corresponding to external input (e.g., touch events). The optical functional layer may reduce the reflectance of light (e.g., external light) incident from the outside toward the display device 1, and / or improve the color purity of light emitted from the display device 1. In an embodiment, the optical functional layer may include a phase retarder and / or a polarizer. The phase retarder may include a film-type retarder or a liquid crystal-type retarder. The phase retarder may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may include a film-type polarizer or a liquid crystal-type polarizer. The film-type polarizer may include a stretchable synthetic resin film, and the liquid crystal-type polarizer may include liquid crystal arranged in a predetermined (or some) arrangement. Each of the phase retarder and polarizer may also include a protective film.

[0130] The adhesive component can be disposed between the touch sensor layer and the optical functional layer. For the adhesive component, general adhesive components can be used without restriction. The adhesive component can be a pressure-sensitive adhesive (PSA).

[0131] refer to Figure 11 The electronic device can be applied to a smartwatch 1000, which includes a display section 1100 and a band section 1200.

[0132] The smartwatch 1000 can be a wearable electronic device. For example, the smartwatch 1000 may have a structure in which a band portion 1200 is placed on the user's wrist. Electronic devices may be applied to the display portion 1100 so that image data, including time information, can be provided to the user.

[0133] refer to Figure 12 Electronic devices can be applied to head-mounted display devices 2000.

[0134] The head-mounted display device 2000 can be a wearable electronic device that can be worn on a user's head. For example, the head-mounted display device 2000 can be a wearable device for virtual reality (VR) or mixed reality (MR). The head-mounted display device 2000 may include a headband 2100 and a display housing 2200. The headband 2100 can be connected to the display housing 2200. The headband 2100 may include a horizontal strap and / or a vertical strap for securing the head-mounted display device 2000 to the user's head. The horizontal strap may be configured to surround the sides of the user's head, and the vertical strap may be configured to surround the top of the user's head. However, the implementation is not limited thereto. For example, the headband 2100 may be implemented in the form of eyeglass frames, helmets, etc., within the spirit and scope of this disclosure. For example, the electronic device can be at least one of a television, a laptop computer, a monitor, a billboard, an Internet of Things (IoT) device, a portable electronic device, a dashboard for a car, a central dashboard or central information display (CID) on a dashboard for a car, an interior mirror display for a car, and an entertainment system display on the back of the front seats of a car, wherein the portable electronic device includes a mobile phone, a smartphone, a tablet PC, a mobile communication terminal, an electronic notebook, an e-book, a portable multimedia player (PMP), a navigation device, an ultra-mobile personal computer (UMPC), a smartwatch, a watch phone, a glasses-type display, and a head-mounted display (HMD).

[0135] According to embodiments, apparatus and methods for manufacturing display devices having a reduced non-display area and improved process efficiency can be provided.

[0136] The effects of this disclosure are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the appended claims.

[0137] It should be understood that the embodiments described herein are to be considered descriptive only and not for limiting purposes. Descriptions of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. An apparatus for manufacturing a display device, characterized in that, The device includes: A mask frame, in which an opening area is defined in its central portion; A mask sheet is disposed on the mask frame to cover the opening area; The chuck portion is configured to face the mask sheet and fix the display substrate. A clamp, disposed between the mask and the chuck portion, for clamping the display substrate, and for releasing the clamp when the chuck portion approaches and secures the display substrate; and A deposition source is disposed opposite to the chuck portion, wherein the mask sheet is located between the deposition source and the chuck portion.

2. The apparatus according to claim 1, characterized in that, The clamp includes: A support, supporting the first surface of the display substrate; and The pressing portion presses the second surface of the display substrate to clamp the display substrate in cooperation with the bracket.

3. The apparatus according to claim 2, characterized in that, The support rotates about the support axis to release the support on the display substrate.

4. The apparatus according to claim 3, characterized in that, As the bracket rotates about the bracket axis, the pressing portion rises to space itself away from the bracket.

5. The apparatus according to claim 3, characterized in that, The clamp also includes: A movable plate, capable of sliding vertically along a vertically extending support axis, is connected to the pressing portion; and The connecting rod includes a first end connected to the support shaft and a second end connected to the movable plate.

6. The apparatus according to claim 5, characterized in that, When the bracket rotates around the bracket axis, the connecting rod also rotates around the bracket axis to push the moving plate upward, thereby moving the moving plate in a sliding manner.

7. The apparatus according to claim 6, characterized in that, The second end of the connecting rod slides on a guide rail located below the movable plate.

8. The apparatus according to claim 1, characterized in that, The chuck portion secures the display substrate and moves toward the mask frame.

9. The apparatus according to claim 8, characterized in that, With the display substrate secured in the chuck portion, the clamp releases its grip, leaving the first surface of the display substrate facing the mask open.

10. The apparatus according to claim 8, characterized in that, When the chuck portion on which the display substrate is fixed moves toward the mask frame and is placed on the mask frame, the fixture does not interfere with the mask frame.

11. The apparatus according to claim 1, characterized in that, The opposite ends of the mask pieces are fixed to the mask frame by welding, and The welding line used for the welding has a straight shape.

12. The apparatus according to claim 1, characterized in that, The chuck portion includes an electrostatic chuck.

13. The apparatus according to claim 2, characterized in that, The brackets are configured in multiple ways, and The plurality of said supports are arranged to be spaced apart from each other in a first direction.

14. An electronic device, characterized in that, The device includes a display device comprising a functional layer for displaying images, wherein the functional layer is formed using a manufacturing process according to any one of claims 1-13.

15. The electronic device according to claim 14, characterized in that, The electronic device is at least one of a television, a laptop computer, a monitor, an advertising board, an Internet of Things device, a portable electronic device, a dashboard for a car, a central dashboard or central information display on a dashboard for a car, an interior mirror display for a car, and an entertainment system display on the back of the front seat of a car, wherein the portable electronic device includes: a mobile phone, a smartphone, a tablet computer, a mobile communication terminal, an electronic notebook, an e-book, a portable multimedia player, a navigation device, an ultra-mobile personal computer, a smartwatch, a watch phone, an eyeglass display, and a head-mounted display.

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