Nanoscale leveling support device and evaporation apparatus

Abstract

The utility model embodiment provides nanometer level leveling support device and evaporation equipment. The utility model discloses nanometer level leveling support device includes: support structure has support placement surface for supporting mask plate, the support structure is provided with the installation groove on the position close to four corners, four leveling structures are fixed on the installation groove respectively, and the leveling structure includes actuator and support part, and the actuator is piezoelectric ceramic actuator, and the actuator is used to drive the support part to move up and down with nanometer level distance, and the support part is used to support the mask plate, and the support part has initial state, and in the initial state, the support part is flush with the support placement surface, and the moving distance range of support part is 0~500 nanometers. This embodiment can realize nanometer level size adjustment, and realizes mask plate leveling fast, and is high -efficient stable, and has promoted leveling efficiency, and then has promoted equipment productivity.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a nanoscale leveling support device and a vapor deposition equipment. Background Technology

[0002] In OLED (Organic Light-Emitting Diode) vapor deposition processes, the nanometer-level horizontal adjustment of the precision metal mask is crucial for ensuring panel resolution and color purity. However, current technologies often employ mechanical fine-tuning components for manual adjustment. Due to the gaps and hysteresis of the mechanical structure and the difficulty in achieving stable nanometer-level precision through manual control, the process is also inefficient. As OLED panels develop towards larger sizes and higher resolutions, the demand for mask nanometer-level adjustment precision and leveling efficiency becomes more urgent. Therefore, nanometer-level leveling support devices are needed to improve leveling efficiency and thus increase equipment production capacity. Utility Model Content

[0003] Therefore, in order to overcome at least some of the defects and deficiencies in the prior art, this utility model provides a nanoscale leveling support device and a vapor deposition equipment.

[0004] Specifically, on one hand, the nanoscale leveling support device provided in this embodiment of the present invention includes: a support structure having a support placement surface for supporting a mask plate, wherein mounting grooves are provided near the four corners of the support structure; four leveling structures are respectively fixed on the mounting grooves, each leveling structure including an actuator and a support portion, wherein the actuator is a piezoelectric ceramic actuator, the actuator is used to drive the support portion to move up and down at a distance in the nanometer range, the support portion is used to support the mask plate, the support portion has an initial state in which the support portion is flush with the support placement surface, and the movement distance of the support portion ranges from 0 to 500 nanometers.

[0005] In one specific embodiment of this utility model, the leveling structure further includes a leveling support member, which has a first connecting part and a second connecting part. The first connecting part is fixedly connected to the mounting groove, the support part is located on the upper surface of the actuator, the other end of the actuator is fixedly connected to the second connecting part, and the height of the second connecting part is lower than the height of the first connecting part. The actuator extends along the height direction of the support structure.

[0006] In a specific embodiment of this utility model, the leveling structure further includes a leveling support member, which is fixedly installed at the bottom of the mounting groove. The support part is located on the upper surface of the leveling support member. The leveling support member is provided with two third connecting parts and an installation space between the two third connecting parts. The actuator is disposed in the installation space. The two ends of the actuator are connected to the third connecting parts and extend along the width or length direction of the support structure. The height of the leveling support member can change with the left and right movement of the actuator.

[0007] In a specific embodiment of this utility model, the leveling support includes two first sidewalls and two second sidewalls arranged opposite to each other. The support part is located on the first sidewall, the second sidewall is located between the two first sidewalls, and the third connecting part is provided on the second sidewall. The second sidewall is a deformable structure, and the second sidewall can deform with the left and right movement of the actuator to adjust the height between the first sidewall and the second sidewall.

[0008] In one specific embodiment of this utility model, the leveling structure further includes a leveling support, which includes a connecting base and a moving part. The support is located on the moving part, the connecting base is fixedly connected to the mounting groove, the moving part is rotatably connected to the connecting base, and the actuator extends along the height direction of the support structure. The actuator is connected between the moving part and the connecting base, and the actuator can actuate the moving part to rotate relative to the connecting base to adjust the height of the support.

[0009] In a specific embodiment of this utility model, a limiting groove is provided on the moving part, and a easing cover is sleeved on one end of the actuator near the moving part, and the other end is fixedly connected to the connecting base. The easing cover is disposed in the limiting groove, and the easing cover can move in the limiting groove under the actuation of the actuator, and can drive the moving part to rotate.

[0010] In one specific embodiment of this utility model, the inner wall of the limiting groove is an arc-shaped guide surface, the outer wall of the easing cover is an arc-shaped structure corresponding to the arc-shaped guide surface, and the depth of the limiting groove is greater than the thickness of the easing cover.

[0011] In a specific embodiment of this utility model, the connecting base is an L-shaped structure, the connecting base has a first end and a second end, one end of the moving member is rotatably connected to the first end, the other end of the moving member is provided with the support part, an elastic deformation member is connected between the support part and the second end, the actuator is disposed close to the second end, and the distance between the support part and the base is less than the height of the actuator.

[0012] In one specific embodiment of this utility model, the nanoscale leveling support device further includes: a leveling sensor disposed on the support structure, the leveling sensor being used to detect whether the mask plate is in a horizontal state.

[0013] On the other hand, this utility model embodiment also provides a vapor deposition equipment, including: a vapor deposition chamber; and a nanoscale leveling support device as described above, disposed in the vapor deposition chamber. As can be seen from the above, the nanoscale leveling support device provided in this utility model embodiment achieves nanoscale position adjustment by setting a leveling structure on the support structure. The leveling structure includes an actuator and a support part. The actuator is used to drive the support part to move up and down by a nanoscale distance, thereby achieving nanoscale size adjustment, quickly achieving mask plate leveling, which is efficient and stable, improving leveling efficiency, and thus increasing equipment capacity. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 A schematic diagram of the structure of a vapor deposition apparatus provided in an embodiment of this utility model; Figure 2 A schematic diagram of a nanoscale leveling support device provided in an embodiment of this utility model; Figure 3 for Figure 2 A schematic diagram of a structure on a nanoscale leveling support device with a mask plate placed on it. Figure 4 for Figure 2 Exploded view of the nanoscale leveling support device; Figure 5 for Figure 4 A schematic diagram of the central leveling structure; Figure 6 for Figure 5 Exploded view of the leveling structure; Figure 7 A schematic diagram of another nanoscale leveling support device provided in this embodiment of the present invention; Figure 8 for Figure 7 A schematic diagram of a structure on a nanoscale leveling support device with a mask plate placed on it. Figure 9 for Figure 7 Exploded view of the nanoscale leveling support device; Figure 10 and Figure 11 for Figure 9 A schematic diagram of the central leveling structure; Figure 12 for Figure 10 Exploded view of the leveling structure; Figure 13 for Figure 10 Schematic diagram of the structure of the leveling support component; Figure 14 A schematic diagram of the structure of another nanoscale leveling support device provided in an embodiment of this utility model; Figure 15 for Figure 14 A schematic diagram of a structure on a nanoscale leveling support device with a mask plate placed on it. Figure 16 for Figure 14 Exploded view of the nanoscale leveling support device; Figure 17 for Figure 16 A schematic diagram of the central leveling structure; Figure 18 for Figure 17 Exploded view of the leveling structure; Figure 19 and Figure 20 for Figure 17 Schematic diagrams of different states of the leveling structure.

[0016] Key component designations: 1. Evaporation equipment; 10. Nanoscale leveling support device; 20. Housing; 30. Mask plate; 100. Support structure; 101. Mounting groove; 102. Support placement surface; 110. First support frame; 120. Second support frame; 200. Leveling structure; 210. Actuator; 211. Electrical connection wire; 220. Support part; 230. Leveling support component; 231. First connecting part; 232. Second connecting part; 2321. Mounting hole; 2322. Clearance position; 241. First limiting base ; 242, Second limiting base; 2311, First side wall; 2312, Installation space; 2313, Second side wall; 2314, Third connecting part; 2315, Clearance hole; 250, Connecting base; 251, First rotating connecting part; 252, Fourth connecting part; 253, Fifth connecting part; 254, First spring connecting part; 260, Moving part; 261, Second rotating connecting part; 262, Second spring connecting part; 263, Limiting groove; 270, Elastic deformation part; 280, Softening cover. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments described in this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0018] It should be noted that all directional indicators (such as up, down, left, right, front, back, top, and bottom) in this embodiment of the invention are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicator will also change accordingly. Furthermore, the term "vertical" in the embodiments and claims refers to an angle of 90° between two components or a deviation of -5° to +5°, and the term "parallel" refers to an angle of 0° between two components or a deviation of -5° to +5°.

[0019] In this embodiment of the invention, the use of terms such as "first" and "second" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0020] See Figure 1 and Figure 2 This utility model embodiment provides a nanoscale leveling support device 10 and a vapor deposition apparatus 1. For example... Figure 1 As shown, the vapor deposition equipment 1 includes a vapor deposition chamber 20 and a... Figure 2 The nanoscale leveling support device 10 shown is disposed inside the evaporation chamber 20. The evaporation equipment 1 is the core equipment for OLED display panel manufacturing. Its main function is to heat and evaporate organic light-emitting materials or metal electrode materials in a vacuum environment, so that they are deposited on the surface of a substrate (such as glass or flexible film) in atomic or molecular form to form a functional film with a specific pattern.

[0021] See Figure 2 and Figure 3 The nanoscale leveling support device 10 includes a support structure 100 and a leveling structure 200. The support structure 100 has a support placement surface 102 for supporting the mask plate 30. (See also...) Figure 4 The support structure 100 is also provided with a mounting groove 101, and the leveling structure 200 is fixed to the mounting groove 101. (See also...) Figure 5The leveling structure 200 includes an actuator 210 and a support 220. The actuator 210 is used to drive the support 220 to move up and down by a distance in the nanometer range, and the support 220 is used to support the mask plate 30.

[0022] During long-term use of the vapor deposition equipment 1, the support structure 100 may undergo slight deformation due to the vapor deposition process, causing the mask plate 30 placed on the support placement surface 102 to not be horizontal, thus affecting the vapor deposition effect. During vapor deposition, the mask plate 30 is placed on the support placement surface 102 of the support structure 100 and located on the support portion 220 of the leveling structure 200. When the mask plate 30 cannot be horizontal due to the slight deformation of the support structure 100, the actuator 210 can drive the support portion 220 to move up and down by nanometer-level distances, thereby achieving nanometer-level dimensional adjustment, quickly leveling the mask plate 30, ensuring high efficiency and stability, improving leveling efficiency, and thus increasing equipment capacity.

[0023] In this embodiment, the actuator 210 may be, for example, a piezoelectric ceramic actuator. A piezoelectric ceramic actuator is a precision driving device based on the inverse piezoelectric effect. It generates micron- to nanometer-level displacement or force output by applying voltage to the piezoelectric ceramic material, and has characteristics such as high precision, fast response, and high stiffness. The actuator 210 may also be an electrostrictive actuator or other types of actuators, and this embodiment is not limited thereto.

[0024] In another embodiment of this example, the leveling structure 200 can be a single unit. During the leveling process of the mask plate 30, the leveling structure 200 can be adjusted according to actual needs to control the support part 220 to move upward or downward, thereby achieving leveling. See also Figure 2 and Figure 4 In another embodiment of this invention, for example, four mounting slots 101 and four leveling structures 200 may be provided. The support structure 100 may be, for example, a rectangular frame structure. The four mounting slots 101 are located near the four corners of the support structure 100. The four leveling structures 200 may be symmetrically arranged. By providing the four leveling structures 200 and by symmetrical arrangement, during the leveling of the mask plate 30, the corresponding leveling structure 200 can be adjusted according to actual needs, which can further improve the leveling accuracy and leveling speed.

[0025] In this embodiment, the support portion 220 has an initial state, i.e., an unadjusted state. In the initial state, the support portion 220 is flush with the support placement surface 102, and the movement distance of the support portion 220 ranges from 0 to 500 nanometers. In the initial state, by aligning the support portion 220 with the support placement surface 102, horizontal support can be directly achieved without deformation of the support structure 100. This allows for minute (nanometer-level) adjustments under slight deformation of the support structure 100, reducing adjustment difficulty and distance, and further improving leveling efficiency.

[0026] See Figure 4 The support structure 100 may be, for example, a rectangular frame structure. The support structure 100 may include, for example, a first support frame 110 and a second support frame 120. The first support frame 110 may be a rectangular frame, and the second support frame 120 is stacked on the first support frame 110, and the second support frame 120 is provided with a notch, thereby forming a mounting groove 101. Of course, the way the mounting groove 101 is formed is not limited to this.

[0027] See Figure 5 and Figure 6 The leveling structure 200 also includes a leveling support 230, which can be a sheet metal part or other material, used to fix and support the actuator 210. Specifically, the leveling support 230 has a first connecting portion 231 and a second connecting portion 232. The first connecting portion 231 is fixedly connected to the mounting groove 101, the support portion 220 is located on the upper surface of the actuator 210, and the other end of the actuator 210 is fixedly connected to the second connecting portion 232. The height of the second connecting portion 232 is lower than the height of the first connecting portion 231, and the actuator 210 extends along the height direction of the support structure 100. The leveling support 230 has a Z-shaped structure. The first connecting portion 231 is fixed to the bottom of the mounting groove 101, and the second connecting portion 232 extends toward the side away from the mask plate 30, thereby reducing the height of the actuator 210. Because the installation space of the mounting slot 101 on the support structure 100 is limited, and the height of the support part 220 and the support placement surface 102 must be flush in the initial state, while also meeting the necessary dimensions of the actuator 210, the leveling support 230 can be used to fix the actuator 210 while reducing its height, thus saving installation space. During the leveling process, the actuator 210 moves up and down along the height direction to achieve leveling.

[0028] Furthermore, the actuator 210 is further provided with a first limiting base 241 and a second limiting base 242 at its bottom. The second limiting base 242 is located on the first limiting base 241, and the actuator 210 is fixed to the second limiting base 242. The size of the first limiting base 241 is larger than the size of the second limiting base 242. The second connecting part 232 is provided with a mounting hole 2321, and the second limiting base 242 passes through the mounting hole 2321. The first limiting base 241 is fixed to the side of the second connecting part 232 away from the actuator 210, thereby fixing the actuator 210. An electrical connection line 211 is also provided near the first limiting base 241 of the actuator 210. The bottom of the second connecting part 232 is also provided with a clearance position 2322, and the electrical connection line 211 is located in the clearance position 2322, thereby facilitating the connection of the electrical connection line 211 to an external power source. Of course, this embodiment is not limited to this.

[0029] See Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 In such Figure 7 In the illustrated embodiment, the leveling structure 200 further includes a leveling support 230, which is fixedly installed at the bottom of the mounting groove 101, with the support portion 220 located on the upper surface of the leveling support 230. See also Figure 12 The leveling support 230 has two third connecting portions 2314 and an installation space 2312 located between the two third connecting portions 2314. An actuator 210 is disposed within the installation space 2312. Both ends of the actuator 210 are connected to the third connecting portions 2314 and extend along the width or length direction of the support structure 100. The height of the leveling support 230 can change with the left and right movement of the actuator 210. Since the actuator 210 extends along the width or length direction of the support structure 100, the actuation direction of the actuator 210 is also the width or length. When the actuator 210 is working, the two abutting third connecting portions 2314 move accordingly, thereby pushing the height of the leveling support 230 to change, causing the support portion 220 to move up and down, achieving support leveling. Furthermore, since the actuator 210 extends along the width or length direction of the support structure 100, the necessary dimensions of the actuator 210 can be ensured while reducing the space occupied in the installation. In this embodiment, the initial height of the leveling support 230 can be, for example, the same as the depth of the mounting groove 101, so that the support 220 is level with the support placement surface 102 in the initial state.

[0030] See Figure 12 and Figure 13The leveling support 230 includes two first sidewalls 2311 and two second sidewalls 2313 arranged opposite to each other. The support portion 220 is located on the first sidewalls 2311, and the second sidewalls 2313 are located between the two first sidewalls 2311. The two first sidewalls 2311 and the two second sidewalls 2313 enclose an installation space 2312. The third connecting portion 2314 is provided on the second sidewall 2313, specifically on the inner wall of the second sidewall 2313 near the installation space 2312. The second sidewall 2313 is a deformable structure, and it can deform with the left and right movement of the actuator 210 to adjust the height between the first sidewalls 2311 and the second sidewalls 2313, thereby adjusting the height of the support portion 220 and achieving the leveling of the mask plate 30. For example, the second sidewall 2313 may also be provided with a clearance hole 2315, through which the electrical connection wire 211 passes.

[0031] Furthermore, in one embodiment of this example, the second sidewall 2313 may have one or more bending structures. When the actuator 210 moves left and right, the bending structure of the second sidewall 2313 is stretched or restored to its original bending state by the force of the third connecting part 2314, thereby realizing the deformation of the second sidewall 2313 to adjust the height between the first sidewall 2311 and the second sidewall 2313.

[0032] See Figure 14 , Figure 15 , Figure 16 and Figure 17 In such Figure 14 In the embodiment shown, the leveling support 230 includes a connecting base 250 and a moving part 260. The support part 220 is located on the moving part 260. The connecting base 250 is fixedly connected to the bottom of the mounting groove 101. The moving part 260 is rotatably connected to the connecting base 250. The actuator 210 extends along the height direction of the support structure 100 and is connected between the moving part 260 and the connecting base 250. The actuator 210 can actuate the moving part 260 to rotate relative to the connecting base 250 to adjust the height of the support part 220.

[0033] Further, see Figure 18 , Figure 19 and Figure 20The moving part 260 is provided with a limiting groove 263. An actuator 210 has a buffer cover 280 fitted onto one end near the moving part 260, and the other end is fixedly connected to the connecting base 250. The buffer cover 280 is disposed within the limiting groove 263, and can move within the limiting groove 263 under the actuation of the actuator 210, thereby driving the moving part 260 to rotate. In one embodiment, the inner wall of the limiting groove 263 is an arc-shaped guide surface, and the outer wall of the buffer cover 280 is an arc-shaped structure corresponding to the arc-shaped guide surface. Further, the depth of the limiting groove 263 can, for example, be greater than the thickness of the buffer cover 280. Through the provision of the arc-shaped guide surface and the arc-shaped structure, the moving part 260 can achieve rotation along an arc-shaped trajectory under the vertical force of the actuator 210, thereby actuating the height adjustment of the support part 220. Figure 19 As shown, Figure 19 The actuator 210 is in its initial state, meaning the support 220 is not adjusted and is flush with the support surface 102. For example... Figure 20 As shown, Figure 20 To put the actuator 210 into operation, the support 220 is raised.

[0034] In one embodiment of this invention, the connecting base 250 may be L-shaped, having a first end and a second end. One end of the moving member 260 is rotatably connected to the first end, and the other end of the moving member 260 is provided with a support portion 220. An elastic deformation member 270 is connected between the support portion 220 and the second end. The actuator 210 is disposed close to the second end, and the distance between the support portion 220 and the connecting base 250 is less than the height of the actuator 210. This arrangement satisfies the necessary dimensions of the actuator 210 while ensuring that the support portion 220 is flush with the support placement surface 102 in its initial state. Furthermore, the elastic deformation member 270 allows control of the movement trajectory of the moving member 260, improving adjustment accuracy.

[0035] See also Figure 17 and Figure 18The connecting base 250 has an L-shaped structure, with the first end and the second end located at the two ends of the L-shape. The first end of the connecting base 250 has a first rotating connecting portion 251, and the second end has a first spring connecting portion 254. Near the second end, the connecting base 250 also has a fourth connecting portion 252 and a fifth connecting portion 253. The moving member 260 can have a Z-shaped structure. The moving member 260 may include, for example, a first straight arm, a second straight arm, and a third straight arm. The first and third straight arms are arranged parallel to each other and connected to the two ends of the second straight arm, extending in opposite directions. One end of the moving member 260 has a second rotating connecting portion 261 located at the end of the first straight arm. A second spring connecting portion 262 is located at the connection between the third straight arm and the second arm. The support portion 220 is located on the upper surface of the third straight arm. The first rotating connecting part 251 and the second rotating connecting part 261 can be rotatably connected by a rotating shaft. The elastic deformation element 270 can be two springs, which are respectively connected between the first spring connecting part 254 and the second spring connecting part 262. The actuator 210 passes through the fourth connecting part 252 and can be fixed to the fifth connecting part 253 by fasteners such as screws. Of course, this embodiment is not limited to this.

[0036] In this embodiment, the nanoscale leveling support device 10 further includes a leveling sensor, which is disposed on the support structure 100 and is used to detect whether the mask 30 is in a horizontal state. Specifically, when the mask 30 is placed on the support structure 100, the controller in the vapor deposition equipment 1 can automatically detect whether the mask 30 is in a horizontal state, for example, by detecting the flatness of the mask 30. When the flatness of the mask 30 is detected to meet the requirements, the controller controls the vapor deposition equipment 1 to operate normally; when the flatness of the mask 30 is detected to not meet the requirements, the controller controls the leveling structure to start, for example, by outputting a voltage to control the actuator 210 for adjustment, and after adjustment, the controller checks again whether the mask 30 is in a horizontal state.

[0037] Furthermore, it is understood that the foregoing embodiments are merely illustrative examples of this utility model. Provided that the technical features do not conflict, the structure is not contradictory, and the inventive purpose of this utility model is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A nanoscale leveling support device, characterized in that, include: A support structure has a support surface for supporting the mask plate, and mounting grooves are provided near the four corners of the support structure; Four leveling structures are fixed to the mounting slots. Each leveling structure includes an actuator and a support. The actuator is a piezoelectric ceramic actuator. The actuator is used to drive the support to move up and down by a distance in the nanometer range. The support is used to support the mask plate. The support has an initial state in which the support is flush with the support placement surface. The movement distance of the support ranges from 0 to 500 nanometers.

2. The nanoscale leveling support device as described in claim 1, characterized in that, The leveling structure further includes a leveling support member, which has a first connecting part and a second connecting part. The first connecting part is fixedly connected to the mounting groove, the support part is located on the upper surface of the actuator, the other end of the actuator is fixedly connected to the second connecting part, and the height of the second connecting part is lower than the height of the first connecting part. The actuator extends along the height direction of the support structure.

3. The nanoscale leveling support device as described in claim 1, characterized in that, The leveling structure also includes a leveling support, which is fixedly installed at the bottom of the mounting groove. The support is located on the upper surface of the leveling support. The leveling support has two third connecting parts and an installation space between the two third connecting parts. The actuator is located in the installation space. The two ends of the actuator are connected to the third connecting parts and extend along the width or length of the support structure. The height of the leveling support can change with the left and right movement of the actuator.

4. The nanoscale leveling support device as described in claim 3, characterized in that, The leveling support includes two first sidewalls and two second sidewalls arranged opposite to each other. The support part is located on the first sidewall, and the second sidewall is located between the two first sidewalls. The third connecting part is provided on the second sidewall. The second sidewall is a deformable structure and can deform with the left and right movement of the actuator to adjust the height between the first sidewall and the second sidewall.

5. The nanoscale leveling support device as described in claim 1, characterized in that, The leveling structure further includes a leveling support, which includes a connecting base and a moving part. The support is located on the moving part, the connecting base is fixedly connected to the mounting groove, the moving part is rotatably connected to the connecting base, and the actuator extends along the height direction of the support structure. The actuator is connected between the moving part and the connecting base, and the actuator can actuate the moving part to rotate relative to the connecting base to adjust the height of the support.

6. The nanoscale leveling support device as described in claim 5, characterized in that, The moving part is provided with a limiting groove. One end of the actuator near the moving part is fitted with a easing cover, and the other end is fixedly connected to the connecting base. The easing cover is located in the limiting groove, and the easing cover can move in the limiting groove under the actuation of the actuator, and can drive the moving part to rotate.

7. The nanoscale leveling support device as described in claim 6, characterized in that, The inner wall of the limiting groove is an arc-shaped guide surface, and the outer wall of the easing cover is an arc-shaped structure corresponding to the arc-shaped guide surface. The depth of the limiting groove is greater than the thickness of the easing cover.

8. The nanoscale leveling support device as described in claim 7, characterized in that, The connecting base has an L-shaped structure, with a first end and a second end. One end of the moving part is rotatably connected to the first end, and the other end of the moving part is provided with the support part. An elastic deformation member is connected between the support part and the second end. The actuator is located close to the second end, and the distance between the support part and the base is less than the height of the actuator.

9. The nanoscale leveling support device according to any one of claims 1 to 8, characterized in that, Also includes: A leveling sensor is mounted on the support structure and is used to detect whether the mask is in a horizontal position.

10. A vapor deposition apparatus, characterized in that, include: Evaporation box; The nanoscale leveling support device as described in any one of claims 1 to 9 is disposed within the vapor deposition chamber.

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