Deposition apparatus

Abstract

This application provides a deposition apparatus, including a deposition component, a transfer component, a support component, and a limiting component. The deposition component includes a deposition reaction chamber with an inlet and an outlet. The transfer component includes a transfer member disposed within the deposition reaction chamber, extending in the same direction as the line connecting the inlet and outlet of the deposition reaction chamber, and is used to carry the chip and transfer it from the inlet to the outlet. The support component includes a support portion located at the outlet, and the limiting component is disposed on opposite sides of the support portion to limit the deposited chip output from the outlet, ensuring that the deposited chip is positioned at a preset position on the support portion. Thus, the deposition apparatus, through the limiting component, limits the deposited chip output from the outlet to a preset position, ensuring that the pick-up component can accurately grasp the processed chip and accurately deliver it into the storage compartment, thereby guaranteeing the quality and reliability of the chip.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a deposition apparatus. Background Technology

[0002] In the semiconductor manufacturing industry, deposition equipment is typically used to fabricate interlayer dielectrics (such as BPSG) for chips. However, currently, when robotic arms pick up fabricated chips at the exit of the deposition equipment, they can easily damage the chips, affecting product quality. Utility Model Content

[0003] To overcome the technical problems mentioned in the above background, embodiments of this application provide a deposition apparatus, the deposition apparatus comprising: A deposition assembly, the deposition assembly including a deposition reaction chamber, the deposition reaction chamber including an inlet end and an outlet end; A transfer assembly, comprising a transfer element disposed within the deposition reaction chamber, the extension direction of the transfer element being the same as the line connecting the inlet end and the outlet end of the deposition reaction chamber, for carrying the chip and transferring the chip from the inlet end to the outlet end; A carrier assembly, the carrier assembly including a carrier portion located at the outlet end; A limiting component is disposed on opposite sides of the carrier portion to limit the deposited chip output from the outlet end so that the deposited chip is located at a preset position on the carrier portion.

[0004] In one possible implementation, the limiting component includes a first limiting part and a second limiting part, wherein the first limiting part and the second limiting part are respectively disposed on opposite sides of the bearing part; The first limiting part includes a first limiting shaft and a first limiting part body that wraps around the first limiting shaft; the second limiting part includes a second limiting shaft and a second limiting part body that wraps around the second limiting shaft. The distance between the first limiting part body and the second limiting part body is a first dimension, and the size of the deposited chip output from the outlet end is a second dimension. The first dimension is 2 mm to 5 mm larger than the second dimension.

[0005] In one possible implementation, the first limiting part further includes a first fixing member and a second fixing member. In the extending direction of the first limiting shaft, the first fixing member and the second fixing member are respectively disposed on opposite sides of the first limiting part body, for fixing the first limiting part body and the first limiting shaft. The second limiting part further includes a third fixing member and a fourth fixing member. In the extending direction of the second limiting shaft, the third fixing member and the fourth fixing member are respectively disposed on opposite sides of the body of the second limiting part, for fixing the body of the second limiting part and the second limiting shaft.

[0006] In one possible implementation, the support component further includes a support platform, the support portion is fixed on the support platform, and the support platform includes a plurality of through holes penetrating the support platform; The first limiting part and the second limiting part are detachably fixed on the bearing platform.

[0007] In one possible implementation, the first limiting part further includes a first fixing part, which is disposed on the side of the first limiting shaft away from the first fixing member. The first fixing part detachably fixes the first limiting part to the bearing platform by cooperating with the through hole. The second limiting part further includes a second fixing part, which is disposed on the side of the second limiting shaft away from the third fixing member. The second fixing part detachably fixes the second limiting part to the bearing platform by cooperating with the through hole.

[0008] In one possible implementation, in a direction perpendicular to the plane of the bearing platform, the distance between the side of the first limiting part away from the first fixing part and the bearing platform is a first distance, and the distance between the side of the second limiting part away from the second fixing part and the bearing platform is a second distance, wherein the first distance and the second distance are the same; In a direction perpendicular to the plane of the carrier platform, the distance between the deposited chip output from the outlet end and the carrier platform is the third distance, and the first distance is greater than or equal to the third distance.

[0009] In one possible implementation, the support portion includes a plurality of support columns, which are evenly arranged on the support platform; In a direction perpendicular to the plane of the bearing platform, the distance between the side of the plurality of bearing columns away from the bearing platform and the bearing platform is a fourth distance, which is less than or equal to the third distance.

[0010] In one possible implementation, the deposition apparatus further includes a pickup assembly comprising a pickup section and a storage section, the pickup section being disposed on the side of the first limiting section away from the support section, and the storage section being disposed on the side of the support platform away from the outlet end; The pickup unit is used to pick up the deposited chip carried by the carrier unit and store it in the storage unit.

[0011] In one possible implementation, the deposition apparatus further includes a cleaning assembly comprising an etching reaction chamber, a cleaning section, an air knife section, and a drying section. The conveyor is input from the outlet end to the inlet end after being processed sequentially through the etching reaction chamber, the cleaning section, the air knife section, and the drying section.

[0012] In one possible implementation, the materials of the first limiting part body and the second limiting part body include elastic materials.

[0013] Based on any of the above aspects, this application provides a deposition apparatus, which includes a deposition component, a transfer component, a support component, and a limiting component. The deposition component includes a deposition reaction chamber with an inlet and an outlet. The transfer component includes a transfer member disposed within the deposition reaction chamber, extending in the same direction as the line connecting the inlet and outlet of the deposition reaction chamber, and is used to carry the chip and transfer it from the inlet to the outlet. The support component includes a support portion located at the outlet, and the limiting component is disposed on opposite sides of the support portion, used to limit the deposited chip output from the outlet to a preset position on the support portion. Thus, the deposition apparatus, through the limiting component, limits the deposited chip output from the outlet to a preset position, ensuring that the pick-up component can accurately grasp the processed chip and accurately deliver it into the storage compartment, thereby guaranteeing the quality and reliability of the chip. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is one of the partial structural schematic diagrams of a deposition apparatus provided in this embodiment; Figure 2 This is a second partial structural schematic diagram of a deposition apparatus provided in this embodiment; Figure 3 This is a schematic diagram of the first limiting part provided in this embodiment; Figure 4 This is a schematic diagram of the second limiting part provided in this embodiment; Figure 5 This is a schematic diagram of the limiting component and the supporting component provided in this embodiment.

[0016] Icons: Deposition equipment-1; Chip-2; Deposition reaction chamber-10; Conveyor-20; Inlet end-100; Outlet end-110; Support unit-30; Limiting assembly-40; Pick-up assembly-50; Pick-up unit-500; Storage unit-510; Support platform-31; Through hole-310; Support column-300; First limiting part-400; Second limiting part-410; First limiting shaft-401; First limiting part body-402; First fixing member-403; Second fixing member-404; First fixing part-405; Second limiting shaft-411; Second limiting part body-412; Third fixing member-413; Fourth fixing member-414; Second fixing part-415. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0019] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0020] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0022] The inventors discovered through research that in the semiconductor manufacturing field, deposition equipment 1 is typically used to fabricate interlayer dielectrics (such as BPSG) for chip 2. Specifically, chip 2 is usually placed on a conveyor 20, which transports it to a deposition reaction chamber 10 for deposition processing. The conveyor 20 then outputs the fabricated chip 2 from the exit end 110. However, because the conveyor 20 typically has a 2mm left-right offset during movement, it easily causes a deviation between the chip 2 output from the exit end 110 and the preset position. This results in the robotic arm being unable to accurately grasp the deviated chip 2, leading to inaccurate delivery of the chip 2 into the memory chip 2's wafer frame.

[0023] On the one hand, if the transfer is incomplete, chip 2 may fall out, causing damage and affecting product quality and production schedule. On the other hand, if the transfer is incomplete, two chips 2 may overlap. Specifically, during the process of the robotic arm picking up the next chip 2 and feeding it into the chip holder, if the previous chip 2 is not transferred in place, it will interfere with the sensor detection of the next chip 2. The system will determine that there is no chip in the chip holder of the previous chip 2, and the robotic arm will transfer the next chip 2 to the chip holder of the previous chip 2, resulting in two chips 2 overlapping. This method is prone to scratches or abrasions on the surface of chip 2, thus affecting the surface quality of chip 2. Furthermore, if multiple chips 2 have the problem of incomplete transfer, that is, multiple chips 2 are stored in the same chip holder, when the robotic arm continues to transfer chips to that chip holder, it may push up the chip holder, causing chips 2 in other chip holders to fall out of the chip holder, resulting in scratches or contamination of chip 2, affecting the quality and reliability of chip 2. In addition, if the robotic arm forcibly grasps the chip 2 which has a deviation, it may damage the robotic arm, which will not only increase production costs but also affect the production schedule.

[0024] In order to solve the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, and the specific implementation scheme of this application will be described in detail below with reference to the accompanying drawings.

[0025] Please see Figure 1 and Figure 2 , Figure 1 This is one of the partial structural schematic diagrams of a deposition apparatus 1 provided in this embodiment. Figure 2This is a second partial structural schematic diagram of a deposition apparatus 1 provided in this embodiment. The deposition apparatus 1 includes a deposition component, a conveying component, a carrying component, and a limiting component 40. The deposition component includes a deposition reaction chamber 10, which includes an inlet end 100 and an outlet end 110. The conveying component includes a conveyor 20, which is disposed within the deposition reaction chamber 10. The extension direction of the conveyor 20 is the same as the line connecting the inlet end 100 and the outlet end 110 of the deposition reaction chamber 10, and is used to carry the chip 2 and transfer the chip 2 from the inlet end 100 to the outlet end 110. The carrying component includes a carrying portion 30, which is located at the outlet end 110. The limiting component 40 is disposed on opposite sides of the carrying portion 30 and is used to limit the deposited chip 2 output from the outlet end 110 so that the deposited chip 2 is located at a preset position on the carrying portion 30.

[0026] In this embodiment, the deposition equipment 1 is a key device in semiconductor manufacturing. The deposition reaction chamber 10 (e.g., an APCVD reaction chamber) is used to deposit the relevant interlayer medium onto the chip 2. Its interior typically maintains a specific vacuum environment or reactive gas range. The inlet end 100 and outlet end 110 of the deposition reaction chamber 10 are used for the continuous entry and exit of the chip 2. The conveyor 20 first carries the chip 2 at the inlet end 100 and inputs it into the deposition reaction chamber 10. Then, after the deposition process is completed, it is output from the outlet end 110 to the carrier unit 30 for further transport. The movement direction of the conveyor 20 is as follows... Figure 1 As indicated by the middle arrow, the carrier section 30 is used to receive and temporarily store the chip 2 that has completed the deposition process. Since the conveyor 20 is usually offset by 2 mm to the left and right during movement, it is easy for the chip 2 output from the outlet 110 to deviate from the preset position. Therefore, in this embodiment, limiting components 40 located on opposite sides of the carrier section 30 are used to precisely limit the deposited chip 2 output from the outlet 110, ensuring that each chip 2 can be accurately placed in the preset position of the carrier section 30. This provides accurate positioning for the subsequent picking section 500 to grasp the chip, significantly reducing the occurrence of chip 2 falling and chip 2 stacking in the storage section, thereby ensuring the quality and reliability of the chip 2.

[0027] Further, please see Figure 2The limiting component 40 in this embodiment includes a first limiting part 400 and a second limiting part 410, which are respectively disposed on opposite sides of the support part 30. Thus, the first limiting part 400 and the second limiting part 410 form a limiting region for the chip 2 output from the outlet end 110, ensuring that both sides of the chip 2 are limited by the first limiting part 400 and the second limiting part 410. For example, if the chip 2 output from the outlet end 110 is offset a certain distance in the offset direction of the first limiting part 400, when the chip 2 contacts the first limiting part 400, the first limiting part 400 will offset the chip 2 in the opposite direction to the original offset direction, so that the chip 2 returns to a preset position. For example, if the chip 2 output from the outlet 110 is offset a certain distance in the offset direction of the second limiting part 410, when the chip 2 contacts the second limiting part 410, the second limiting part 410 will also offset the chip 2 in the opposite direction to the original offset direction so that the chip 2 returns to the preset position.

[0028] In this embodiment, please refer to Figure 3 and Figure 4 , Figure 3 This is a schematic diagram of the first limiting part 400 provided in this embodiment. Figure 4 This is a schematic diagram of the second limiting portion 410 provided in this embodiment. The first limiting portion 400 includes a first limiting shaft 401 and a first limiting portion body 402 that surrounds the first limiting shaft 401. The second limiting portion 410 includes a second limiting shaft 411 and a second limiting portion body 412 that surrounds the second limiting shaft 411. The first limiting shaft 401 and the second limiting shaft 411 serve as the core support structures of the first limiting portion 400 and the second limiting portion 410, respectively. The first limiting portion body 402 and the second limiting portion body 412 surrounding them are typically used to contact the chip 2.

[0029] In this embodiment, please refer to Figure 5 , Figure 5 This is a schematic diagram of the limiting component 40 and the carrier component provided in this embodiment. The distance between the first limiting part body 402 and the second limiting part body 412 is a first dimension D1, and the size of the deposited chip 2 output from the outlet end 110 is a second dimension D2. The first dimension D1 is 2 mm to 5 mm larger than the second dimension D2. For example, the first dimension D1 is 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, and 5 mm larger than the second dimension D2. In this way, the limiting area formed between the first limiting part body 402 and the second limiting part body 412 can limit the chip 2 laterally while allowing the chip 2 to be smoothly and unobstructedly placed in the preset position of the carrier part 30, avoiding scratching or jamming between the chip 2 and the first limiting part body 402 and the second limiting part body 412 due to the small distance.

[0030] Further, please see Figure 3 and Figure 4 The first limiting part 400 further includes a first fixing member 403 and a second fixing member 404. In the extending direction of the first limiting shaft 401, the first fixing member 403 and the second fixing member 404 are respectively disposed on opposite sides of the first limiting part body 402, for fixing the first limiting part body 402 and the first limiting shaft 401. The second limiting part 410 further includes a third fixing member 413 and a fourth fixing member 414. In the extending direction of the second limiting shaft 411, the third fixing member 413 and the fourth fixing member 414 are respectively disposed on opposite sides of the second limiting part 410 body, for fixing the second limiting part 410 body and the second limiting shaft 411. In this embodiment, the first fixing member 403, the second fixing member 404, the third fixing member 413, and the fourth fixing member 414 can prevent the first limiting part body 402 and the second limiting part 410 body from rotating or moving axially. The first fastener 403, the second fastener 404, the third fastener 413, and the fourth fastener 414 include screws or clips, and their specific types are not limited here. They can be selected according to the actual situation.

[0031] Further, please see Figure 2 The support assembly also includes a support platform 31, on which the support portion 30 is fixed. The support platform 31 includes multiple through holes 310 penetrating through it. The first limiting portion 400 and the second limiting portion 410 are detachably fixed to the support platform 31. In this embodiment, the through holes 310 can be arranged in an array on the support platform 31, and the spacing between the first limiting portion 400 and the second limiting portion 410 can be adjusted. Specifically, the spacing between the two is adjusted by adjusting their positions on the support platform 31, thereby ensuring that the spacing can accommodate different types of chips 2, enhancing the flexibility of the limiting function of the first limiting portion 400 and the second limiting portion 410. Furthermore, the detachable design of the first limiting portion 400 and the second limiting portion 410 meets the needs of daily cleaning and maintenance, increasing operational convenience.

[0032] Further, please see Figure 2 , Figure 3 and Figure 4The first limiting part 400 further includes a first fixing part 405, which is disposed on the side of the first limiting shaft 401 away from the first fixing member 403. The first fixing part 405 detachably fixes the first limiting part 400 to the support platform 31 by cooperating with the through hole 310. The second limiting part 410 further includes a second fixing part 415, which is disposed on the side of the second limiting shaft 411 away from the third fixing member 413. The second fixing part 415 detachably fixes the second limiting part 410 to the support platform 31 by cooperating with the through hole 310.

[0033] In this embodiment, the first fixing part 405 is inserted into the through hole 310 on the support platform 31 and tightened with a nut or thread, thereby fixing the first limiting part 400 to the support platform 31. Similarly, the second fixing part 415 is inserted into the through hole 310 on the support platform 31 and tightened with a nut or thread, thereby fixing the second limiting part 410 to the support platform 31.

[0034] Further, please see Figure 5 In the direction perpendicular to the plane of the support platform 31, the distance between the side of the first limiting part body 402 away from the first fixing part 405 and the support platform 31 is the first distance H1, and the distance between the side of the second limiting part body 412 away from the second fixing part 415 and the support platform 31 is the second distance H2. The first distance H1 and the second distance H2 are the same. In the direction perpendicular to the plane of the support platform 31, the distance between the deposited chip 2 output from the outlet end 110 and the support platform 31 is the third distance H3, and the first distance H1 is greater than or equal to the third distance H3.

[0035] In this embodiment, it is also necessary to ensure that the distance between the side of the first limiting part body 402 near the first fixing part 405 and the support platform 31 is the same as the distance between the side of the second limiting part body 412 near the second fixing part 415 and the support platform 31, and that the distance between the side of the first limiting part body 402 near the first fixing part 405 and the support platform 31 is less than or equal to a third distance H3. This ensures that the chip 2 with offset output from the outlet end 110 can contact the first limiting part body 402 or the second limiting part body 412, thereby limiting the chip 2.

[0036] Further, please see Figure 2 In this embodiment, the support portion 30 includes a plurality of support pillars 300, which are evenly arranged on the support platform 31. This multi-point support method minimizes the contact area with the back of the deposited chip 2, effectively preventing damage caused by contact. When the number of support pillars 300 is four, their distribution on the support platform 31 is as follows: Figure 2As shown, the uniform distribution of the support pillars 300 ensures the stability of the support chip 2.

[0037] In this embodiment, please refer to Figure 5 In the direction perpendicular to the plane of the support platform 31, the distance between the side of the multiple support columns 300 away from the support platform 31 and the support platform 31 is a fourth distance H4, which is less than or equal to the third distance H3. When the conveyor 20 transports the chip 2 to the outlet end 110 and prepares to release it onto the support part 30, the lower surface of the chip 2 will first contact and finally stably rest against the top of the support column 300. In this way, it can be ensured that the support column 300 will not obstruct the chip 2, and that the chip 2 is stably placed on the support column 300.

[0038] Further, please see Figure 2 The deposition apparatus 1 also includes a pick-up assembly 50, which includes a pick-up section 500 and a storage section 510. The pick-up section 500 is located on the side of the first limiting section 400 away from the carrier section 30, and the storage section 510 is located on the side of the carrier platform 31 away from the exit end 110. The pick-up section 500 is used to pick up the deposited chip 2 carried by the carrier section 30 and store it in the storage section 510. In this embodiment, the pick-up section 500 is typically a high-precision robotic arm with a vacuum chuck or edge gripper suitable for the fragile chip 2 at its end. The storage section 510 is typically a standard wafer carrier, such as a FOUP or SMIF cassette, which includes multiple layers of wafer positions for storing the chip 2.

[0039] In this embodiment, when the deposited chip 2 is output from the outlet 110 to the carrier 30 by the conveyor 20, it is accurately positioned on the carrier post 300 of the carrier 30 after being limited by the limiting component 40. The picking unit 500 will move to the top of the carrier 30 according to the program, safely pick up the chip 2 by means of vacuum adsorption, etc., and then transfer and accurately place it in the designated chip position of the storage unit 510 for batch storage, in preparation for the next process.

[0040] Further, please see Figure 1 The deposition equipment 1 also includes a cleaning assembly (not shown in the figure), which includes an etching reaction chamber, a cleaning section, an air knife section and a drying section. The conveyor 20 is fed from the outlet end 11 through the etching reaction chamber, the cleaning section, the air knife section and the drying section in sequence and then input to the inlet end 100.

[0041] In this embodiment, after the conveyor 20 transports the chip 2 to the carrier 30 for carrying, it will sequentially pass through the etching reaction chamber, the cleaning section, the air knife section and the drying section for cleaning treatment, and then move to the inlet end 100 of the deposition reaction chamber 10 to prepare for carrying the deposition operation of the next chip 2.

[0042] In this embodiment, the transfer component 20 is immersed in hydrogen fluoride (HF) in the etching reaction chamber to remove the oxide layer on the surface of the transfer component 20 through a chemical reaction, preventing the increase of particles or friction on the surface of the transfer component 20 from affecting the quality of the chip 2. The cleaning section (e.g., an ultrasonic cleaning tank) uses the "cavitation effect" generated by ultrasound in a liquid to flush the surface of the transfer component 20, removing firmly attached particles and organic impurities. The air knife section uses a high-speed, pure airflow or inert gas to effectively remove droplets and water stains from the surface of the chip 2. The drying section uses a controllable heating system to thoroughly remove any moisture and contaminants that may be adsorbed on the surface of the transfer component 20. Thus, the above cleaning operations ensure that the transfer component 20 remains dry and clean, preventing it from affecting the chip 2.

[0043] Furthermore, the materials of the first limiting part body 402 and the second limiting part body 412 in this embodiment include elastic materials. The elastic material can effectively buffer the impact force when the chip 2 contacts the first limiting part body 402 and the second limiting part body 412, significantly reducing the risk of chip edge chipping and micro-cracks on the surface of the chip 2, thus ensuring the quality of the chip 2. Elastic materials include Teflon (PTFE), PEEK, or special silicone rubber, etc. The specific type of elastic material is not limited here and can be selected according to actual conditions.

[0044] In summary, this application provides a deposition apparatus comprising a deposition component, a transfer component, a support component, and a limiting component. The deposition component includes a deposition reaction chamber with an inlet and an outlet. The transfer component includes a transfer member disposed within the deposition reaction chamber, extending in the same direction as the line connecting the inlet and outlet of the deposition reaction chamber, and is used to carry the chip and transfer it from the inlet to the outlet. The support component includes a support portion located at the outlet, and the limiting component is disposed on opposite sides of the support portion to limit the deposited chip output from the outlet, ensuring that the deposited chip is positioned at a preset position on the support portion. Thus, the deposition apparatus, through the limiting component, limits the deposited chip output from the outlet to a preset position, ensuring that the pick-up component can accurately grasp the processed chip and accurately deliver it into the storage compartment, thereby guaranteeing the quality and reliability of the chip.

[0045] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A deposition apparatus, characterized by, The deposition apparatus includes: A deposition assembly, the deposition assembly including a deposition reaction chamber, the deposition reaction chamber including an inlet end and an outlet end; A transfer assembly, comprising a transfer element disposed within the deposition reaction chamber, the extension direction of the transfer element being the same as the line connecting the inlet end and the outlet end of the deposition reaction chamber, for carrying the chip and transferring the chip from the inlet end to the outlet end; A carrier assembly, the carrier assembly including a carrier portion located at the outlet end; A limiting component is disposed on opposite sides of the carrier portion to limit the deposited chip output from the outlet end so that the deposited chip is located at a preset position on the carrier portion.

2. The deposition apparatus of claim 1, wherein The limiting component includes a first limiting part and a second limiting part, which are respectively disposed on opposite sides of the bearing part; The first limiting part includes a first limiting shaft and a first limiting part body that wraps around the first limiting shaft; the second limiting part includes a second limiting shaft and a second limiting part body that wraps around the second limiting shaft. The distance between the first limiting part body and the second limiting part body is a first dimension, and the size of the deposited chip output from the outlet end is a second dimension. The first dimension is 2 mm to 5 mm larger than the second dimension.

3. The deposition apparatus of claim 2, wherein The first limiting part further includes a first fixing member and a second fixing member. In the extending direction of the first limiting shaft, the first fixing member and the second fixing member are respectively disposed on opposite sides of the first limiting part body, for fixing the first limiting part body and the first limiting shaft. The second limiting part further includes a third fixing member and a fourth fixing member. In the extending direction of the second limiting shaft, the third fixing member and the fourth fixing member are respectively disposed on opposite sides of the body of the second limiting part, for fixing the body of the second limiting part and the second limiting shaft.

4. The deposition apparatus of claim 3, wherein The support assembly further includes a support platform, the support part is fixed on the support platform, and the support platform includes a plurality of through holes penetrating the support platform; The first limiting part and the second limiting part are detachably fixed on the bearing platform.

5. The deposition apparatus of claim 4, wherein The first limiting part further includes a first fixing part, which is disposed on the side of the first limiting shaft away from the first fixing member. The first fixing part is detachably fixed to the bearing platform by cooperating with the through hole. The second limiting part further includes a second fixing part, which is disposed on the side of the second limiting shaft away from the third fixing member. The second fixing part detachably fixes the second limiting part to the bearing platform by cooperating with the through hole.

6. The deposition apparatus of claim 5, wherein In a direction perpendicular to the plane of the bearing platform, the distance between the side of the first limiting part away from the first fixing part and the bearing platform is the first distance, and the distance between the side of the second limiting part away from the second fixing part and the bearing platform is the second distance. The first distance and the second distance are the same. In a direction perpendicular to the plane of the carrier platform, the distance between the deposited chip output from the outlet end and the carrier platform is the third distance, and the first distance is greater than or equal to the third distance.

7. The deposition apparatus of claim 6, wherein The supporting part includes a plurality of supporting columns, which are evenly arranged on the supporting platform; In a direction perpendicular to the plane of the bearing platform, the distance between the side of the plurality of bearing columns away from the bearing platform and the bearing platform is a fourth distance, which is less than or equal to the third distance.

8. The deposition apparatus of claim 7, wherein The deposition apparatus further includes a pickup assembly, which includes a pickup section and a storage section. The pickup section is located on the side of the first limiting section away from the support section, and the storage section is located on the side of the support platform away from the outlet end. The pickup unit is used to pick up the deposited chip carried by the carrier unit and store it in the storage unit.

9. The deposition apparatus of claim 1, wherein, The deposition equipment also includes a cleaning assembly, which includes an etching reaction chamber, a cleaning section, an air knife section, and a drying section. The conveyor is fed from the outlet end through the etching reaction chamber, the cleaning section, the air knife section, and the drying section in sequence and then input to the inlet end.

10. The deposition apparatus of claim 2, wherein, The materials of the first limiting part body and the second limiting part body include elastic materials.

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