A silver ion-supplementing silver electroplating tank structure
Patent Information
- Application Number
- CN202522267270.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-27
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-10-27
AI Technical Summary
[0002]电镀银是一种通过电解原理，在金属（或非金属经表面处理）基体表面沉积一层金属银的工艺，目的是赋予基体表面优良的导电性、反光性、装饰性及焊接性等，电镀银的核心优势源于其材料本身的卓越性能（导电、反光、焊接性、装饰性），而应用特点则体现在对场景的高度适配性（厚度调控、基体广泛、工艺灵活），使其在电子、光学、精密制造、装饰等领域长期保持不可替代的地位，成为支撑现代工业发展的关键表面处理技术之一，在电镀银工艺的实施过程中，银离子浓度是电镀银工艺的 “核心命脉”，其管控直接关系到镀层质量（均匀性、致密度、结合力）、工艺稳定性（电流密度、沉积速度）、生产成本（银资源利用率）及环保风险，在实际生产中，需通过定期检测（如化学分析、在线监测）和及时补加（如可溶性阳极溶解补充或人工添加银盐），将浓度维持在工艺要求的区间内，这是保证电镀银工艺高效、稳定运行的关键，但通过对溶液的分析、计算后按需人工添加银盐（氰化银或氰化银钾等），不仅会因银盐纯度问题而给镀银溶液带入有害杂质，且添加补充时需要镀银溶液停止施镀作业以免影响正在施镀的产品质量，影响生产效率，而且因银盐的理化特性所限（结晶性粉末、剧毒等），其存储、购买必须具备一定的条件，人工补充添加时存在一定的安全隐患和环境污染风险
本实用新型旨在将镀银槽和制银机两个设备融为一体的结构设计，在电解液中对银板实施电解并通过离子交换膜让电解所得的银离子选择性的持续进入电镀银溶液，以补充施镀过程中镀银槽内银离子得的消耗，从而降低电镀企业对银盐的采购、存储与管理成本，提高生产效率，降低生产成本（使用银盐的成本要高于银板），避免人工添加的不便和安全风险及环境污染风险，同时避免分体式设置所带来的诸多不便和安全隐患，降低企业投资和维护成本。
Smart Images
Figure CN224768910U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of silver plating tank equipment, specifically to a structure for a silver plating tank that replenishes silver ions. Background Technology
[0002] Electroplating silver is a process that deposits a layer of metallic silver onto the surface of a metal (or non-metallic, surface-treated) substrate through electrolysis. The aim is to impart excellent conductivity, reflectivity, decorative properties, and weldability to the substrate surface. The core advantages of electroplating silver stem from the inherent superior properties of the material itself (conductivity, reflectivity, weldability, and decorative properties), while its application characteristics are reflected in its high adaptability to various scenarios (thickness control, wide range of substrates, and flexible processes). This has enabled it to maintain an irreplaceable position in fields such as electronics, optics, precision manufacturing, and decoration, becoming one of the key surface treatment technologies supporting modern industrial development. In the implementation of the electroplating silver process, the silver ion concentration is the "core lifeline," and its control directly affects the coating quality (uniformity, density, adhesion) and process stability (current density, deposition rate). Due to factors such as speed, production costs (silver resource utilization rate), and environmental risks, in actual production, it is necessary to maintain the concentration within the range required by the process through regular testing (such as chemical analysis and online monitoring) and timely replenishment (such as soluble anodic dissolution or manual addition of silver salts). This is crucial for ensuring the efficient and stable operation of the electroplating silver process. However, manually adding silver salts (such as silver cyanide or potassium silver cyanide) as needed after analyzing and calculating the solution not only introduces harmful impurities into the silver plating solution due to the purity of the silver salts, but also requires stopping the plating operation to avoid affecting the quality of the product being plated and thus affecting production efficiency. Furthermore, due to the limitations of the physicochemical properties of silver salts (crystalline powder, highly toxic, etc.), their storage and purchase must meet certain conditions, and manual replenishment poses certain safety hazards and environmental pollution risks. The existing silver ion replenishment method is also a separate type, that is, a silver making machine is set up independently outside the silver plating tank and the silver making machine is mounted at a position higher than the liquid level of the silver plating tank. It is connected to the silver plating tank by a pipeline, and a circulation pump is set up to draw the silver plating solution to the silver making machine to keep the silver plating solution and the silver ion-containing solution of the silver making machine circulating and exchanging. This method occupies a lot of production space, has high investment costs, and the high equipment height makes maintenance and operation inconvenient and poses certain safety hazards. Utility Model Content
[0003] The purpose of this invention is to provide a structure for a silver plating tank that replenishes silver ions, so as to solve the problems mentioned in the background art.
[0004] To achieve the above objectives, the present invention provides the following technical solution: a silver plating tank structure for supplementing silver ions, comprising a silver plating tank and a silver preparation tank, wherein the silver plating tank is provided at the side end of the silver preparation tank, the silver plating tank and the silver preparation tank are separated by a partition, and the silver plating tank and the silver preparation tank are also connected by a filter. The silver plating tank is equipped with a first DC power supply. The positive terminal of the first DC power supply is connected to the second anode and the third anode, and the negative terminal of the first DC power supply is connected to the second cathode, so that silver plating is performed in the silver plating tank. The silver plating tank is divided into two parts by an ion exchange membrane: a cathode electrolysis zone and an anodic electrochemical corrosion zone. The positive terminal of the second DC power supply is connected to the first anode, and the negative terminal of the second DC power supply is connected to the first cathode. The anodic electrochemical corrosion zone is connected to a filter through a pipe, and the filter is connected to the inside of the silver plating tank.
[0005] Specifically, the second cathode is located between the second anode and the third anode.
[0006] Specifically, the first DC power supply and the second DC power supply have the same structure.
[0007] Specifically, both the second anode and the third anode are connected to the positive terminal of the first DC power supply.
[0008] Specifically, the silver plating tank and the silver-making tank are integrated into one unit.
[0009] Specifically, the current of the first DC power supply and the second DC power supply adopts an adjustable design.
[0010] Compared with the prior art, the beneficial effects of this utility model are: This invention aims to integrate the silver plating tank and the silver plating machine into a single structural design. The silver plate is electrolyzed in an electrolyte solution, and the resulting silver ions are selectively and continuously introduced into the silver plating solution via an ion exchange membrane. This replenishes the silver ions consumed in the silver plating tank during the plating process, thereby reducing the procurement, storage, and management costs of silver salts for electroplating companies, improving production efficiency, and lowering production costs (the cost of using silver salts is higher than that of silver plates). It avoids the inconvenience, safety risks, and environmental pollution risks associated with manual addition, while also avoiding the numerous inconveniences and safety hazards associated with separate installations, thus reducing the company's investment and maintenance costs.
[0011] By integrating the silver plating tank and the silver-making machine into a single structure, the silver ion replenishment of the silver plating solution is achieved. This reduces the procurement, storage, and management costs of silver salts for electroplating companies, improves production efficiency, avoids the inconvenience, safety risks, and environmental pollution risks associated with manual addition, and lowers production costs (the cost of using silver salts is higher than that of silver plates). At the same time, it eliminates many problems associated with the existing practice of setting up the silver-making machine independently around the silver plating tank, such as the need to elevate the silver-making machine so that its overflow port is higher than the liquid level in the electroplating tank, and the need to add an additional circulation pump to drive the circulation and exchange of the silver plating tank solution and the silver-making machine solution. This saves production space, reduces equipment investment and maintenance costs, and lowers safety hazards. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the main structure of this utility model.
[0013] In the diagram: 1-Silver plating tank; 2-Silver preparation tank; 3-First DC power supply; 4-Second DC power supply; 5-Ion exchange membrane; 6-First cathode; 7-First anode; 8-Cathode electrolysis zone; 9-Anode electrochemical corrosion zone; 10-Filter; 11-Pipeline; 12-Second anode; 13-Second cathode; 14-Third anode. Detailed Implementation
[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0015] Please see Figure 1 This utility model provides a technical solution: a silver plating tank structure for supplementing silver ions, including a silver plating tank 1 and a silver preparation tank 2. The silver plating tank 1 is provided with a silver preparation tank 2 at its side end. The silver plating tank 1 and the silver preparation tank 2 are separated by a partition, and the silver plating tank 1 and the silver preparation tank 2 are also connected by a filter 10. The silver plating tank 1 is equipped with a first DC power supply 3. The positive terminal of the first DC power supply 3 is connected to the second anode 12 and the third anode 14, and the negative terminal of the first DC power supply 3 is connected to the second cathode 13, so that silver plating is performed in the silver plating tank 1. The silver plating tank 2 is divided into two parts by an ion exchange membrane 5: a cathode electrolysis zone 8 and an anodic electrochemical corrosion zone 9. The positive terminal of the second DC power supply 4 is connected to the first anode 7, and the negative terminal of the second DC power supply 4 is connected to the first cathode 6. The anodic electrochemical corrosion zone 9 is connected to the filter 10 through a pipe 11, and the filter 10 is connected to the inside of the silver plating tank 1.
[0016] The second cathode 13 is located between the second anode 12 and the third anode 14.
[0017] The first DC power supply 3 and the second DC power supply 4 have the same structure.
[0018] The second anode 12 and the third anode 14 are both connected to the positive terminal of the first DC power supply 3.
[0019] The silver plating tank 1 and the silver making tank 2 are integrated into one unit.
[0020] The current of the first DC power supply 3 and the second DC power supply 4 are designed to be adjustable.
[0021] Working principle: When needed, the silver plating tank is a single integrated structure, divided into two parts by a grid-like partition made of the same material as the tank body: the silver plating tank 1 and the silver preparation tank 2. The silver plating tank consists of a first DC power supply 3, an anode (stainless steel plate, titanium plate, or silver plate, etc.), and a cathode (the part to be plated), completing the deposition of a metallic silver layer on the surface of the part. The inner cavity of the silver preparation tank 2 is divided into two parts by an ion exchange membrane 5: a cathode electrolysis zone 8 and an anodic electrochemical corrosion zone 9. Through a second DC power supply 4 and the first cathode 6 set in the cathode electrolysis zone and the first anode 7 set in the anodic electrochemical corrosion zone, as well as the ion exchange membrane separating the cathode and anode zones, the metallic silver anode is oxidized into silver ions. The silver ions are circulated through a filter connecting the silver plating tank and the silver preparation tank, accelerating the diffusion of silver ions into the electroplating solution and maintaining a uniform distribution in the silver plating solution.
[0022] The specific working process is as follows: In the cathode area of the silver-making tank, an inert metal is used as the cathode and connected to the negative terminal of a DC power supply. An electrolyte solution, which can be an aqueous solution of sodium hydroxide, potassium hydroxide, sodium cyanide, or potassium cyanide, is added to the cathode area. In the anode area, a silver plate is used as the anode and connected to the positive terminal of the DC power supply. After turning on the DC power supply and the filter connected to both areas, the silver plate in the anode area is oxidized into positively charged silver ions. The anion exchange membrane repels the migration of silver ions, thereby preventing the silver ions from moving from the anode area to the cathode area and being reduced on the cathode surface. It is possible that silver ions will remain in the anode area and diffuse into the silver plating solution through the grid plate connected to the silver plating tank. The diffusion and uniform distribution of silver ions from the anode area into the silver plating solution are accelerated by the filter connected to both tanks. At the same time, the amount of silver produced can be controlled by adjusting the DC power supply current. If the current is kept consistent with the current used for silver plating, the balance between the consumption and replenishment of silver ions during plating can be maintained. If it is desired to reduce the silver ion content in the silver plating solution, the current of the DC power supply of the silver production machine can be reduced or even turned off to complete the work.
[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A silver ion replenishing electroplating silver tank structure, characterized in that: It includes a silver plating tank (1) and a silver making tank (2). The silver plating tank (1) is provided with a silver making tank (2) at its side end. The silver plating tank (1) and the silver making tank (2) are separated by a partition, and the silver plating tank (1) and the silver making tank (2) are also connected by a filter (10). The silver plating tank (1) is equipped with a first DC power supply (3). The positive terminal of the first DC power supply (3) is connected to the second anode (12) and the third anode (14), and the negative terminal of the first DC power supply (3) is connected to the second cathode (13), so that silver plating is performed in the silver plating tank (1). The silver plating tank (2) is divided into two parts by an ion exchange membrane (5): a cathode electrolysis zone (8) and an anodic electrochemical corrosion zone (9). The positive terminal of the second DC power supply (4) is connected to the first anode (7), and the negative terminal of the second DC power supply (4) is connected to the first cathode (6). The anodic electrochemical corrosion zone (9) is connected to the filter (10) through a pipe (11), and the filter (10) is connected to the silver plating tank (1).
2. The silver ion supplemented electroplating silver cell structure of claim 1, wherein: The second cathode (13) is located between the second anode (12) and the third anode (14).
3. The silver ion supplemented electroplating silver cell structure of claim 2, wherein: The first DC power supply (3) and the second DC power supply (4) have the same structure.
4. The silver ion supplemented electroplating silver cell structure of claim 3, wherein: The second anode (12) and the third anode (14) are both connected to the positive terminal of the first DC power supply (3).
5. The silver ion supplemented electroplating silver cell structure of claim 4, wherein: The silver plating tank (1) and the silver making tank (2) are integrated into one unit.
6. The silver ion supplemented electroplating silver cell structure of claim 5, wherein: The current of the first DC power supply (3) and the second DC power supply (4) are designed to be adjustable.