A tool for improving the transfer efficiency in a micro-a7 cooling cavity

Abstract

The utility model discloses a kind of jigs for improving micro A7 cooling cavity transfer efficiency, including the processing equipment for preparing semiconductor material, installation cavity is opened in processing equipment outer wall, bracket is fixedly installed in installation cavity inner top wall, bracket top wall is evenly installed with several MOCVD stations, bracket top wall is fixedly installed with conversion frame, steering assembly for being used to connect transfer to epitaxial wafer is installed in conversion frame inner wall, the utility model relates to cooling technical field;The jigs for improving micro A7 cooling cavity transfer efficiency, by the cooperation of MOCVD station, cooling component and steering assembly, in epitaxial wafer production process, it is quickly connected transfer by being quickly to it, and by two-way synchronous cooling, epitaxial wafer can be rapidly cooled in short time, and then epitaxial wafer production and turnover efficiency are further improved, by the step optimization of cooling work, the overall production efficiency of epitaxial wafer has good improving effect.

Description

Technical Field

[0001] This utility model relates to the field of cooling technology, specifically a fixture for improving the transfer efficiency of the cooling chamber of the Zhongwei A7. Background Technology

[0002] In the LED industry, at the AMEC A7 MOCVD station, the epitaxial wafers reach 400°C after growth in the MOCVD chamber. The grown epitaxial wafers need to be placed in the cooling chamber to cool down to 65°C before they can be transferred to the upper and lower wafer chambers. Since the AMEC A7 has four MOCVD stations sharing one cooling chamber and one upper and lower wafer chamber. When two MOCVD machines complete their growth simultaneously, one machine must wait for the cooling chamber to cool the previous epitaxial wafer to 65°C and transfer it to the unloading chamber before the second MOCVD wafer can be placed into the cooling chamber to accelerate the transfer efficiency of the cooling chamber.

[0003] The aforementioned technologies have certain shortcomings in their application: Since the four AMEC A7 MOCVD stations simultaneously grow epitaxial wafers but share the same cooling chamber and wafer loading / unloading chamber, after two or more AMEC A7 MOCVD stations have finished growing epitaxial wafers, they need to wait for the epitaxial wafers to be cooled and unloaded in sequence. Therefore, the overall efficiency of epitaxial wafer cooling is not high.

[0004] Therefore, this utility model provides a fixture to improve the transfer efficiency of the cooling chamber of the micro A7, in order to solve the above problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a fixture for improving the transfer efficiency of the cooling chamber in the Zhongwei A7, thus solving the aforementioned problems.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: a fixture for improving the transfer efficiency of the cooling cavity of the AMEC A7, comprising a processing equipment for preparing semiconductor materials, an installation cavity is opened on the outer wall of the processing equipment, a bracket is fixedly installed on the top wall of the installation cavity, a plurality of MOCVD stations are evenly installed on the top wall of the bracket, a conversion frame is fixedly installed on the top wall of the bracket, a steering component for receiving and transferring epitaxial wafers is installed on the inner wall of the conversion frame, and a cooling component for cooling the epitaxial wafers is installed at the rear of the top wall of the conversion frame; The cooling assembly includes a cooling station installed on the rear wall of the conversion frame. The top and bottom walls of the cooling station are provided with through grooves that communicate with the inner cavity of the conversion frame. A drive motor is fixedly installed on the top wall of the cooling station via a U-shaped frame. Cooling fans are mounted on both sides of the inner wall of the U-shaped frame via rotating shafts. Synchronous pulleys are fixedly installed on the outer walls of the two rotating shafts. The two synchronous pulleys are connected by a synchronous belt drive. A dustproof plate is fixedly installed on the inner wall of the through groove at the top. Cooling plates are installed on the inner wall of the cooling station. A mounting bracket is fixed on the inner wall of the through groove at the bottom. Water-cooled copper pipes are installed on the inner wall of the mounting bracket at the position corresponding to the cooling plates.

[0007] The above technical solution uses a combination of water-cooled copper pipes and cooling fans to rapidly dissipate heat and cool the epitaxial wafers produced by the MOCVD station.

[0008] Furthermore, several MOCVD stations are evenly arranged at the outer edge of the conversion frame and are closely connected to each other. The drive shaft of the drive motor is fixedly connected to the corresponding rotating shaft through the bearing through the U-shaped frame, and the water-cooled copper pipe is connected to the external water cooling equipment.

[0009] With the above technical solution, the drive motor is mainly used to drive the rotating shaft and cooling fan to rotate, and they work together through the transmission of the synchronous pulley and the synchronous belt.

[0010] Furthermore, the steering assembly is rotatably mounted on a hexagonal seat on the inner wall of the conversion frame, and a connecting shaft is fixedly mounted on the bottom wall of the hexagonal seat.

[0011] With the above technical solution, after the connecting shaft rotates in the inner wall of the conversion frame, it will synchronously drive the hexagonal seat to start turning.

[0012] Furthermore, a transmission gear one is fixedly installed at the bottom end of the connecting shaft through a bearing through the bracket, and a servo motor is fixedly installed on the bottom wall of the bracket through an L-shaped seat. The power shaft of the servo motor is fixedly installed with a transmission gear two that meshes with the transmission gear one through a bearing through the L-shaped seat.

[0013] Through the above technical solution, the servo motor drives the second transmission gear and the first transmission gear to mesh and rotate, thereby causing the connecting shaft and the hexagonal seat to start turning, thus matching the position of the receiving platform with the MOCVD station.

[0014] Furthermore, a slide rail is installed on the top wall of the hexagonal base, a slide block is slidably installed on the inner wall of the slide rail, and a receiving platform is fixedly installed on the top wall of the slide block.

[0015] With the above technical solution, when the slide moves on the slide rail surface, it will drive the receiving platform to move into the corresponding MOCVD station to receive the completed epitaxial wafer.

[0016] Furthermore, a film loading chamber is installed on the front part of the inner wall of the conversion frame.

[0017] Through the above technical solution, the unloading chamber is mainly used to receive epitaxial wafers that have completed cooling.

[0018] Furthermore, a door is hinged to the front wall of the processing equipment at the position corresponding to the mounting cavity, and a main control console is installed on the right side of the processing equipment.

[0019] The above technical solution enables the entire device's electrical control equipment to work in a coordinated manner through the central control console, thereby improving the overall coordination and automation of the device. Beneficial effects

[0020] This invention provides a fixture for improving the transfer efficiency of the cooling chamber in the Zhongwei A7 micro-microcomputer. Compared with the prior art, it has the following advantages: (1) The fixture that improves the transfer efficiency of the cooling chamber of the A7 micro-micro wafer, with the cooperation of the MOCVD station, cooling components and steering components, can quickly receive and transfer the epitaxial wafer during the production process. Through bidirectional synchronous cooling, the epitaxial wafer can be cooled down quickly in a short time, thereby further improving the production and turnover efficiency of the epitaxial wafer. By optimizing the cooling process, the overall production efficiency of the epitaxial wafer is greatly improved. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the combination of the conversion frame and the MOCVD station of this utility model; Figure 3 This is a schematic diagram of the combination of the bracket and the conversion frame of this utility model; Figure 4 This is an exploded view of the internal structure of the steering component of this utility model; Figure 5 The internal structure of the cooling component of this utility model exploded. Figure 1 ; Figure 6 The internal structure of the cooling component of this utility model exploded. Figure 2 .

[0022] In the diagram: 1. Processing equipment; 2. Main control console; 3. Mounting cavity; 4. Door; 5. MOCVD station; 6. Cooling assembly; 61. Through slot; 62. U-shaped frame; 63. Drive motor; 64. Synchronous pulley; 65. Cooling fan; 66. Dustproof plate; 67. Cooling plate; 68. Water-cooled copper pipe; 69. Mounting frame; 610. Cooling station; 7. Steering assembly; 71. Servo motor; 72. Transmission gear two; 73. Transmission gear one; 74. Connecting shaft; 75. Unloading chamber; 76. Hexagonal base; 77. Slide rail; 78. Slide seat; 79. Receiving platform; 8. Bracket; 9. Conversion frame. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example 1: Please see Figures 1-6 A fixture for improving the transfer efficiency of the cooling cavity of the AMEC A7 includes a processing equipment 1 for preparing semiconductor materials. The outer wall of the processing equipment 1 has a mounting cavity 3. A bracket 8 is fixedly installed on the top wall of the mounting cavity 3. Several MOCVD stations 5 are evenly installed on the top wall of the bracket 8. A conversion frame 9 is fixedly installed on the top wall of the bracket 8. A steering component 7 for receiving and transferring epitaxial wafers is installed on the inner wall of the conversion frame 9. A cooling component 6 for cooling the epitaxial wafers is installed at the rear of the top wall of the conversion frame 9. The cooling assembly 6 includes a cooling station 610 installed on the rear wall of the conversion frame 9. The top and bottom walls of the cooling station 610 are provided with through grooves 61 that communicate with the inner cavity of the conversion frame 9. A drive motor 63 is fixedly installed on the top wall of the cooling station 610 via a U-shaped frame 62. Cooling fans 65 are rotatably installed on both sides of the inner wall of the U-shaped frame 62 via rotating shafts. Synchronous pulleys 64 are fixedly installed on the outer walls of the two rotating shafts. The two synchronous pulleys 64 are connected by a synchronous belt drive. A dustproof plate 66 is fixedly installed on the inner wall of the through groove 61 located at the top. A cooling plate 67 is installed on the inner wall of the cooling station 610. A mounting bracket 69 is fixed on the inner wall of the through groove 61 located at the bottom. A water-cooled copper pipe 68 is installed on the inner wall of the mounting bracket 69 at the position corresponding to the cooling plate 67. Several MOCVD stations 5 are evenly arranged at the outer extension of the conversion frame 9 and are connected to each other. The power shaft of the drive motor 63 is fixedly connected to the corresponding rotating shaft through the bearing through the U-shaped frame 62. The water-cooled copper pipe 68 is connected to the external water cooling equipment. In this embodiment of the utility model, the purpose of this setting is that the setting of the cooling component 6 can rapidly cool the epitaxial wafer by performing bidirectional cooling operation, thereby achieving a good improvement in production conversion efficiency, which can be reduced from the original 22 minutes to within 10 minutes.

[0025] Example 2: Please see Figures 1-6This embodiment provides a technical solution based on embodiment one: the steering assembly 7 is rotatably mounted on the hexagonal seat 76 on the inner wall of the conversion frame 9. A connecting shaft 74 is fixedly mounted on the bottom wall of the hexagonal seat 76. The bottom end of the connecting shaft 74 passes through the bracket 8 through the bearing and is fixedly mounted on the transmission gear 73. A servo motor 71 is fixedly mounted on the bottom wall of the bracket 8 through the L-shaped seat. The power shaft of the servo motor 71 passes through the L-shaped seat through the bearing and is fixedly mounted on the transmission gear 72 that meshes with the transmission gear 73. A slide rail 77 is mounted on the top wall of the hexagonal seat 76. A slide block 78 is slidably mounted on the inner wall of the slide rail 77. A receiving platform 79 is fixedly mounted on the top wall of the slide block 78. A lowering chamber 75 is mounted on the front part of the inner wall of the conversion frame 9. A door 4 is hinged to the front wall of the processing equipment 1 at the position corresponding to the mounting cavity 3. A main control console 2 is mounted on the right side of the processing equipment 1. In this embodiment of the utility model, the purpose of this setting is that the setting of the steering component 7 is to quickly adjust the facing position of the receiving platform 79 to match the location of the MOCVD station 5, and when the slide block 78 slides along the outer wall of the slide rail 77, the receiving platform 79 can be controlled to move to the corresponding MOCVD station 5 to receive the epitaxial wafer for transfer and heat dissipation.

[0026] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0027] The working principle of this device is as follows: The main control console 2 is electrically connected to the processing equipment 1, MOCVD station 5, drive motor 63, water-cooled copper pipe 68, servo motor 71, slide rail 77, slide base 78, and unloading chamber 75. When the entire device is working, the epitaxial wafer is grown in the MOCVD station 5 through the settings of the processing equipment 1 and the MOCVD station 5. After production is completed, the servo motor 71 drives the transmission gear 2 72 to drive the meshing transmission gear 1 73 to start rotating. As the transmission gear 1 73 rotates, it drives the connecting shaft 74 and the hexagonal seat 76 to rotate on the conversion frame 9 to the corresponding position of the MOCVD station 5. When the slide base 78 drives the receiving platform 79 to move linearly on the slide rail 77, the receiving platform 79 extends into the interior of the MOCVD station 5 to start receiving the produced epitaxial wafer. After the receiving is completed, the epitaxial wafer is located on the receiving platform 79, and the hexagonal base 76 continues to rotate inside the conversion frame 9, so that the epitaxial wafer is turned to the area of ​​the cooling station 610. The epitaxial wafer is cooled by the cooperation of the water-cooled copper pipe 68 and the cooling plate 67. At the same time, the drive motor 63 is started to drive the synchronous pulley 64 to rotate, and the cooling fan 65 is continuously rotated on the top of the dustproof plate 66 through the transmission of the synchronous belt, and the generated airflow continuously cools the epitaxial wafer. After the epitaxial wafer has cooled down, the epitaxial wafer on the top of the receiving platform 79 is continuously rotated to the position of the unloading chamber 75 by the steering assembly 7, thereby completing the unloading process. The cooling component 6 can optimize the cooling rate of the epitaxial wafer and reduce the original cooling time from 22 minutes to 10 minutes throughout the entire processing, which greatly improves the cooling efficiency.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A tool for improving the transfer efficiency in a micro-A7 cooling chamber, characterized by: The equipment includes a processing device (1) for preparing semiconductor materials. The processing device (1) has an installation cavity (3) on its outer wall. A bracket (8) is fixedly installed on the top wall of the installation cavity (3). Several MOCVD stations (5) are evenly installed on the top wall of the bracket (8). A conversion frame (9) is fixedly installed on the top wall of the bracket (8). A steering assembly (7) for receiving and transferring epitaxial wafers is installed on the inner wall of the conversion frame (9). A cooling assembly (6) for cooling epitaxial wafers is installed at the rear of the top wall of the conversion frame (9). The cooling assembly (6) includes a cooling station (610) installed on the rear wall of the conversion frame (9). The top and bottom walls of the cooling station (610) are provided with through grooves (61) that communicate with the inner cavity of the conversion frame (9). The top wall of the cooling station (610) is fixedly equipped with a drive motor (63) via a U-shaped frame (62). Cooling fans (65) are rotatably installed on both sides of the inner wall of the U-shaped frame (62) via rotating shafts. Synchronous pulleys (64) are fixedly installed on the outer walls of the two rotating shafts. The two synchronous pulleys (64) are connected by a synchronous belt drive. A dustproof plate (66) is fixedly installed on the inner wall of the through groove (61) located at the top. A cooling plate (67) is installed on the inner wall of the cooling station (610), and a mounting bracket (69) is fixed on the inner wall of the through groove (61) located at the bottom. A water-cooled copper pipe (68) is installed on the inner wall of the mounting bracket (69) at the position corresponding to the cooling plate (67).

2. The tool for improving the transfer efficiency in the micro-A7 cooling cavity according to claim 1, wherein: Several MOCVD stations (5) are evenly arranged at the outer position of the conversion frame (9) and connected to each other. The power shaft of the drive motor (63) is fixedly connected to the corresponding rotating shaft through the bearing through the U-shaped frame (62). The water-cooled copper pipe (68) is connected to the external water cooling equipment.

3. The fixture for improving the transfer efficiency of the cooling chamber of the micro-A7 according to claim 1, characterized in that: The steering assembly (7) is rotatably mounted on a hexagonal seat (76) on the inner wall of the conversion frame (9), and a connecting shaft (74) is fixedly mounted on the bottom wall of the hexagonal seat (76).

4. The tool for improving the transfer efficiency in the cooling cavity of the middle micro A7 according to claim 3, wherein: The bottom end of the connecting shaft (74) is fixedly installed with a transmission gear one (73) through the bearing through the bracket (8). The bottom wall of the bracket (8) is fixedly installed with a servo motor (71) through an L-shaped seat. The power shaft of the servo motor (71) is fixedly installed with a transmission gear two (72) that meshes with the transmission gear one (73) through the bearing through the L-shaped seat.

5. The tool for improving the transfer efficiency in the cooling cavity of the middle micro A7 according to claim 3, wherein: The top wall of the hexagonal base (76) is equipped with a slide rail (77), the inner wall of the slide rail (77) is slidably equipped with a slide block (78), and the top wall of the slide block (78) is fixedly equipped with a receiving platform (79).

6. The fixture for improving the transfer efficiency of the cooling chamber of the micro-A7 according to claim 1, characterized in that: The transfer frame (9) has a lower plate chamber (75) installed on the front of its inner wall.

7. The tool for improving the efficiency of transferring the middle micro-A7 cooling chamber according to claim 1, wherein: A door (4) is hinged to the front wall of the processing equipment (1) at the position corresponding to the mounting cavity (3), and a main control console (2) is installed on the right side of the processing equipment (1).

Images