A honeycomb cushioning layer assembly for a slip-resistant, insulating, and shock-absorbing mat device

Abstract

The utility model provides a kind of honeycomb cushion layer assembly of antiskid heat insulation shock pad device, belong to antiskid heat insulation shock pad device technical field, the honeycomb cushion layer assembly of this antiskid heat insulation shock pad device includes honeycomb matrix layer, support frame layer and protective cover layer;The honeycomb matrix layer is mutually adhered and spliced by several hexagonal honeycomb units, the wall surface thickness of each honeycomb unit is evenly distributed along the direction perpendicular to bottom surface, the inner cavity of the honeycomb unit is regular hexagonal column structure;The support frame layer is set in the bottom of honeycomb matrix layer, and the edge contour of support frame layer is completely adhered with the outer circumferential edge of honeycomb matrix layer;Can solve the technical problems that antiskid heat insulation shock pad device in prior art exists honeycomb cushion layer assembly overall structure stability shortage, connection reliability between each layer is poor, interlayer peeling is likely to occur when stressed and the technical problem that buffering energy absorption effect is not ideal.

Description

Technical Field

[0001] This utility model belongs to the technical field of anti-slip, heat-insulating and shock-absorbing pad devices, specifically, it relates to a honeycomb buffer layer component of an anti-slip, heat-insulating and shock-absorbing pad device. Background Technology

[0002] Anti-slip, heat-insulating, and shock-absorbing pads are widely used in industrial equipment installation, precision instrument protection, building vibration isolation, and furniture feet in daily life. In these applications, the pads need to simultaneously prevent slippage, block heat conduction, and absorb impact vibrations. Common pads in existing technologies mainly use solid rubber pads, foam plastic pads, or simple honeycomb structure pads. While solid rubber pads offer good anti-slip performance and some shock absorption, their dense material results in poor heat insulation and a heavy weight. Foam plastic pads are lightweight and offer good heat insulation, but they have low strength, are prone to aging, and have insufficient anti-slip performance. Simple honeycomb structure pads utilize the air layers inside the honeycomb to achieve good heat insulation and provide cushioning through the deformation of the honeycomb walls. While these pads offer functional benefits, they generally suffer from poor overall structural stability. The connections between the honeycomb layer, base layer, and surface protective layer are often simple, relying on ordinary adhesives or mechanical fixation. In practical use, this can easily lead to interlayer delamination, causing relative slippage between layers and loss of collaborative working ability. Furthermore, unreasonable geometric parameter design of the honeycomb cells can easily result in overall instability or local collapse under significant pressure, leading to inadequate buffering and energy absorption. The lack of effective anti-slip design on the surface layer makes it prone to slippage on wet or smooth contact surfaces, affecting safety. To address these issues, it is necessary to optimize the structure of the honeycomb buffer layer assembly, improve the connection methods between layers, rationally select materials, and optimize the geometric parameters of the honeycomb cells. Utility Model Content

[0003] In view of this, the present invention provides a honeycomb buffer layer component for an anti-slip, heat-insulating, and shock-absorbing pad device, which can solve the technical problems of insufficient overall structural stability of the honeycomb buffer layer component, poor reliability of the connection between layers, easy delamination between layers under stress, and unsatisfactory buffering and energy absorption effect in the use of the existing anti-slip, heat-insulating, and shock-absorbing pad devices.

[0004] This utility model is implemented as follows:

[0005] This utility model provides a honeycomb buffer layer assembly for an anti-slip, heat-insulating, and shock-absorbing pad device, comprising a honeycomb substrate layer, a support frame layer, and a protective cover layer. The honeycomb substrate layer is composed of several hexagonal honeycomb units bonded together, with the wall thickness of each honeycomb unit uniformly distributed along a direction perpendicular to the bottom surface. The inner cavity of each honeycomb unit has a regular hexagonal columnar structure. The support frame layer is located at the bottom of the honeycomb substrate layer, with its edge contour completely fitting the outer peripheral edge of the honeycomb substrate layer. The support frame layer is fixedly connected to the bottom surface of the honeycomb substrate layer by adhesive. The protective cover layer is located at the top of the honeycomb substrate layer, with its geometric center coinciding with the geometric center of the honeycomb substrate layer. The protective cover layer is fixedly connected to the top surface of the honeycomb substrate layer by hot pressing, serving to protect the internal structure of the honeycomb substrate layer from external impact damage.

[0006] The technical effects of the honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device provided by this utility model are as follows: By combining and connecting the three main components—the honeycomb substrate layer, the support frame layer, and the protective cover layer—a buffer layer assembly with a complete structure is formed. The hexagonal columnar inner cavity structure of the honeycomb unit can produce uniform deformation when subjected to vertical pressure. The complete and fixed connection between the support frame layer and the bottom surface of the honeycomb substrate layer ensures the stability of the overall structure. The protective cover layer is firmly connected to the top surface of the honeycomb substrate layer through hot pressing, effectively preventing external impacts from directly acting on the honeycomb structure. The synergistic cooperation of the three layers achieves the comprehensive functions of anti-slip, heat insulation, and shock absorption, meeting the basic buffer protection requirements of the pad device in actual use.

[0007] Based on the above technical solution, the honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device of this utility model can be further improved as follows:

[0008] The ratio of the hexagonal side length to the height of the cellular unit is between 1:3 and 1:5.

[0009] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: by limiting the ratio of the hexagonal side length to the height of the honeycomb unit, the honeycomb unit has a suitable flexible deformation capability when subjected to vertical load. When the ratio is in the range of 1:3 to 1:5, the honeycomb unit will not lose its buffer stroke due to being too short, nor will it cause lateral instability due to being too tall. This ratio ensures that the honeycomb structure can be compressed in an orderly manner along the axial direction during the compression process, avoiding sudden failure of the structure, thereby improving the reliability and service life of the entire buffer layer assembly.

[0010] Furthermore, a completely flat contact surface is formed between the bottom surface of the honeycomb substrate layer and the top surface of the support frame layer, and the contact area accounts for a larger proportion of the total area of ​​the top surface of the support frame layer than the proportion of the total area of ​​the bottom surface of the honeycomb substrate layer.

[0011] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: by making the bottom surface of the honeycomb substrate layer and the top surface of the supporting frame layer form a completely flat contact surface, and by ensuring that the ratio of the contact area meets specific requirements, the load of the honeycomb substrate layer can be evenly transferred to the supporting frame layer, avoiding stress concentration caused by uneven contact surface or insufficient contact area. The design that the total area of ​​the top surface of the supporting frame layer is greater than the total area of ​​the bottom surface of the honeycomb substrate layer enables the supporting frame layer to provide a sufficient load-bearing foundation for the honeycomb substrate layer, preventing the edge of the honeycomb substrate layer from being suspended and deformed due to lack of support, and improving the mechanical performance of the overall structure.

[0012] Furthermore, the edge portion of the support frame layer extends outward to form an annular flange structure, and the width of the annular flange structure is uniformly distributed along the radial direction of the support frame layer.

[0013] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: by setting an outwardly extending annular flange structure at the edge of the support frame layer, the contact area between the support frame layer and the mounting base surface is increased. The uniform width distribution of the annular flange structure in the radial direction enables the support frame layer to generate uniform frictional resistance when subjected to horizontal thrust, effectively preventing the entire buffer layer assembly from slipping and displacing during use. The annular flange structure can also provide additional edge support under vertical load, reduce stress concentration at the edge of the support frame layer, and extend the service life of the support frame layer.

[0014] Furthermore, the top surface of the protective covering layer is provided with several parallel grooves, and the depth of the grooves along the thickness direction of the protective covering layer is less than 1 / 3 of the total thickness of the protective covering layer.

[0015] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: by setting several parallel grooves on the top surface of the protective cover layer, the friction coefficient of the protective cover layer surface is increased. The presence of the grooves allows the surface of the object in contact with the protective cover layer to be embedded in the grooves, generating a mechanical interlocking effect, which effectively improves the anti-slip performance. The design that the groove depth accounts for less than 1 / 3 of the total thickness of the protective cover layer ensures that the protective cover layer still maintains sufficient overall strength and avoids the protective cover layer from breaking and being damaged under force due to excessive groove depth. The parallel grooves can also guide the liquid to flow in a specific direction and prevent water accumulation.

[0016] Furthermore, the wall thickness of the cellular unit gradually increases near the top, and the area of ​​increased wall thickness accounts for a proportion of the total height of the cellular unit within the top 1 / 4 range.

[0017] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: by gradually increasing the thickness of the cell wall near the top, a gradual wall thickness structure is formed. This design enables the cell to have higher local stiffness in the top area when subjected to vertical impact loads, effectively resisting the initial impact energy and preventing plastic buckling of the top edge of the cell structure at the moment of impact. The design of the thickened area accounting for 1 / 4 of the total height of the cell ensures that the lower area of ​​the cell still maintains appropriate flexibility, maintains the buffer energy absorption characteristics of the overall structure, and achieves a balance between local reinforcement and overall flexibility.

[0018] Furthermore, the bottom surface of the support frame layer is provided with multiple circular recessed areas, which are evenly distributed around the geometric center of the bottom surface of the support frame layer, forming a symmetrical arrangement structure.

[0019] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: by setting multiple circular recessed areas on the bottom surface of the support frame layer and symmetrically distributing these recessed areas around the geometric center, the overall weight of the support frame layer is reduced, while maintaining the structural strength of the main load-bearing area of ​​the support frame layer. The presence of the circular recessed areas can also form an air gap between the support frame layer and the mounting base. These air gaps have good thermal insulation performance and can block the heat conduction path in the vertical direction. The symmetrical arrangement of the structural design ensures that the mechanical properties of the support frame layer remain consistent in all directions when under load, avoiding the eccentric force phenomenon caused by structural asymmetry.

[0020] Furthermore, the honeycomb substrate layer is made of polypropylene or polyethylene, the support frame layer is made of thermoplastic elastomer, and the protective cover layer is made of silicone rubber or nitrile rubber.

[0021] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: by selecting polypropylene or polyethylene materials to manufacture the honeycomb matrix layer, the honeycomb matrix layer can withstand repeated compression cycles without permanent deformation by utilizing the good toughness and fatigue resistance of these materials. The support frame layer is made of thermoplastic elastomer material, which fully utilizes the high elasticity and good shock absorption performance of the material at room temperature. The protective covering layer is made of silicone rubber or nitrile rubber material, which utilizes the excellent wear resistance and anti-aging properties of rubber materials to protect the internal honeycomb structure from external environmental erosion. The reasonable combination of the three materials achieves the organic unity of structural strength, elastic deformation and surface protection functions.

[0022] Furthermore, the side profile of the honeycomb substrate layer is a regular rectangle or square, and the four corners of the honeycomb substrate layer are provided with arc transition structures.

[0023] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: by making the side profile of the honeycomb substrate layer into a regular rectangle or square, the manufacturing process and assembly positioning process of the honeycomb substrate layer are simplified. The regular shape profile facilitates modular combination and mass production in practical applications. The rounded transition structure at the four corners eliminates the stress concentration phenomenon at the right angles and improves the impact resistance of the corner area of ​​the honeycomb substrate layer. The rounded transition structure can also avoid local point contact or line contact when the honeycomb substrate layer comes into contact with other components or the boundary of the installation space, making the contact stress distribution more uniform.

[0024] Furthermore, the hot-pressed connection area between the protective covering layer and the honeycomb substrate layer forms a continuous adhesive strip structure. The adhesive strip structure is distributed along the hexagonal edge of the honeycomb cell, and the width of the adhesive strip structure is more than twice the thickness of the honeycomb cell wall.

[0025] The beneficial effects of adopting the above-mentioned improved scheme are as follows: by forming a continuous adhesive strip structure in the hot-pressed connection area between the protective cover layer and the honeycomb substrate layer, and distributing the adhesive strip structure along the hexagonal edge of the honeycomb cell, a reliable connection between the protective cover layer and the top edge of each honeycomb cell is achieved. The design that the width of the adhesive strip structure is more than twice the thickness of the honeycomb cell wall ensures sufficient adhesive area, so that the protective cover layer will not peel off from the surface of the honeycomb substrate layer when subjected to tearing force. The continuous strip adhesive structure can also evenly distribute the local stress to multiple adjacent honeycomb cells, avoid damage to a single honeycomb cell due to overload, and improve the integrity and durability of the entire component.

[0026] Compared with existing technologies, the beneficial effects of the honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device provided by this utility model are as follows: This utility model solves the problem of insufficient overall structural stability of honeycomb buffer layer assemblies in existing technologies by rationally designing and reliably connecting and fixing the three components: the honeycomb substrate layer, the support frame layer, and the protective cover layer. The hexagonal honeycomb unit structure of the honeycomb substrate layer provides a uniform buffer energy absorption space. The support frame layer is firmly connected to the bottom surface of the honeycomb substrate layer by adhesive bonding, providing a stable load-bearing foundation for the entire assembly. The protective cover layer is reliably connected to the top surface of the honeycomb substrate layer by hot pressing, effectively preventing interlayer delamination. The edges of the support frame layer... The annular flange structure and the grooved texture on the top surface of the protective cover layer significantly improve the anti-slip performance of the component. The gradual thickness design of the honeycomb unit wall and the circular recessed area on the bottom surface of the support frame layer optimize the mechanical and thermal insulation performance of the component. By selecting known materials such as polypropylene, polyethylene, thermoplastic elastomers and rubber, the excellent performance of various materials is fully utilized. The reasonable ratio between the side length and height of the hexagonal honeycomb unit ensures the orderly deformation of the component under pressure. The continuous adhesive strip structure between the protective cover layer and the honeycomb matrix layer enhances the integrity of the component. The entire component exhibits excellent comprehensive performance in terms of anti-slip, thermal insulation and shock absorption, meeting the various functional requirements of the pad device in practical applications. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Fig. 1 A schematic diagram of the structure of a honeycomb buffer layer component of an anti-slip, heat-insulating, and shock-absorbing pad device;

[0029] Fig. 2 This is a schematic diagram of the cross-sectional structure of the honeycomb matrix layer;

[0030] The attached diagram lists the components represented by each number as follows:

[0031] 10. Honeycomb substrate layer; 20. Support frame layer; 30. Protective covering layer. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0033] likeFigs. 1-2 The diagram shows a structural schematic of a honeycomb buffer layer assembly of an anti-slip, heat-insulating, and shock-absorbing pad device provided by this utility model. In this embodiment, it includes a honeycomb substrate layer 10, a support frame layer 20, and a protective cover layer 30. The honeycomb substrate layer is formed by bonding and splicing several hexagonal honeycomb units together. The wall thickness of each honeycomb unit is evenly distributed along the direction perpendicular to the bottom surface, and the inner cavity of the honeycomb unit has a regular hexagonal columnar structure. The support frame layer is located at the bottom of the honeycomb substrate layer, and the edge contour of the support frame layer is completely fitted with the outer peripheral edge of the honeycomb substrate layer. The support frame layer is fixedly connected to the bottom surface of the honeycomb substrate layer by adhesive. The protective cover layer is located at the top of the honeycomb substrate layer, and the geometric center of the protective cover layer coincides with the geometric center of the honeycomb substrate layer. The protective cover layer is fixedly connected to the top surface of the honeycomb substrate layer by hot pressing, which is used to protect the internal structure of the honeycomb substrate layer from external impact damage.

[0034] In the above technical solution, the ratio of the hexagonal side length of the cellular unit to the height of the cellular unit is between 1:3 and 1:5.

[0035] Furthermore, in the above technical solution, a completely flat contact surface is formed between the bottom surface of the honeycomb substrate layer and the top surface of the supporting frame layer, and the contact area accounts for a larger proportion of the total area of ​​the top surface of the supporting frame layer than the proportion of the total area of ​​the bottom surface of the honeycomb substrate layer.

[0036] Furthermore, in the above technical solution, the edge portion of the support frame layer extends outward to form an annular flange structure, and the width of the annular flange structure is uniformly distributed along the radial direction of the support frame layer.

[0037] Furthermore, in the above technical solution, the top surface of the protective covering layer is provided with several parallel grooves, and the depth of the grooves along the thickness direction of the protective covering layer is less than 1 / 3 of the total thickness of the protective covering layer.

[0038] Furthermore, in the above technical solution, the wall thickness of the cellular unit gradually increases near the top, and the area of ​​increased wall thickness accounts for a proportion of the total height of the cellular unit within the top 1 / 4 range.

[0039] Furthermore, in the above technical solution, the bottom surface of the support frame layer is provided with multiple circular recessed areas, which are evenly distributed around the geometric center of the bottom surface of the support frame layer, forming a symmetrical arrangement structure.

[0040] Furthermore, in the above technical solution, the honeycomb substrate layer is made of polypropylene or polyethylene, the supporting frame layer is made of thermoplastic elastomer, and the protective cover layer is made of silicone rubber or nitrile rubber.

[0041] Furthermore, in the above technical solution, the side profile of the honeycomb substrate layer is a regular rectangle or square, and the four corners of the honeycomb substrate layer are provided with arc transition structures.

[0042] Furthermore, in the above technical solution, the hot-pressed connection area between the protective covering layer and the honeycomb substrate layer forms a continuous adhesive strip structure. The adhesive strip structure is distributed along the hexagonal edge of the honeycomb cell, and the width of the adhesive strip structure is more than twice the thickness of the honeycomb cell wall.

[0043] The following is a specific embodiment 1 of this utility model: In the honeycomb buffer layer assembly provided in this embodiment, the honeycomb substrate layer is manufactured from polypropylene material through injection molding. The entire honeycomb substrate layer contains 121 hexagonal honeycomb units arranged in an array of 11 rows and 11 columns. The hexagonal side length of each honeycomb unit is 8mm, and the height of the honeycomb unit is 32mm. The ratio of the hexagonal side length to the height is 1:4. The basic thickness of the honeycomb unit wall is 0.6mm. Within an 8mm height range near the top, the wall thickness gradually increases from 0.6mm to 1.2mm, forming a gradual transition. The overall dimensions of the honeycomb substrate layer are 100mm in length and 100mm in width. The support frame layer is 100mm thick and 32mm high, with rounded transitions at all four corners, each with a radius of 5mm. It is made of thermoplastic polyurethane elastomer with a hardness of 85A. The support frame layer is 5mm thick and has a planar dimension of 110mm long and 110mm wide, 5mm larger on each side than the honeycomb substrate layer, forming an annular flange structure with a width of 5mm. The bottom surface of the support frame layer has nine circular recessed areas, evenly distributed circumferentially around the geometric center of the support frame layer. Each circular recess has a diameter of 15mm and a depth of 2mm. The support frame layer is bonded to the honeycomb substrate layer with polyurethane adhesive. The bottom surface of the honeycomb substrate layer is bonded with adhesive, which is applied to the non-recessed area of ​​the top surface of the supporting frame layer. The coating thickness is 0.2 mm. The protective cover layer is made of silicone rubber with an orthogonal hardness of 60A. The thickness of the protective cover layer is 3 mm, and its planar dimensions are 100 mm long and 100 mm wide, completely consistent with the planar dimensions of the honeycomb substrate layer. The top surface of the protective cover layer has 12 parallel grooves extending along the length direction. The spacing between adjacent grooves is 8 mm, and each groove is 2 mm wide and 0.8 mm deep. The groove cross-section is V-shaped. The protective cover layer is connected to the top surface of the honeycomb substrate layer by a hot-pressing process at a temperature of [temperature missing]. At 180℃ and 0.5MPa, and held for 30 seconds, the adhesive strip structure formed after hot pressing has a width of 1.5mm and is continuously distributed along the hexagonal edge of each honeycomb unit. The total thickness of the assembled component is 40mm, and the total weight is approximately 95g. The honeycomb buffer layer component of this embodiment can withstand a vertical pressure of 1500N without permanent deformation. Under a 100N impact load, the maximum compression of the component is 6mm, and it can absorb approximately 0.3 joules of impact energy. The component has a thermal conductivity of 0.08W / m / K, a static friction coefficient of 0.85 on a dry surface, and a static friction coefficient of 0 on a wet surface.72. After placing a 50 kg device on the component and undergoing 1000 consecutive loading and unloading cycles, the component's compression rebound rate remained above 92%. The peel strength between the protective cover layer and the honeycomb substrate layer was 15 N / cm, and the peel strength between the support frame layer and the honeycomb substrate layer was 12 N / cm. This embodiment is suitable for applications such as vibration-damping installation of precision instruments, vibration reduction and noise reduction of household appliances, and vibration isolation and anti-slip of industrial equipment.

[0044] The following is another specific embodiment 2 of this utility model: This embodiment 2 is based on embodiment 1, and the structure of the honeycomb unit is improved. The hexagonal side length of the honeycomb unit is changed to 10mm, and the height is changed to 40mm, while maintaining the ratio of hexagonal side length to height at 1:4. The basic thickness of the honeycomb unit wall is increased to 0.8mm, and within a 10mm height range near the top, the wall thickness gradually increases from 0.8mm to 1.6mm. The overall external dimensions of the honeycomb substrate layer are adjusted accordingly to 120mm in length, 120mm in width, and 40mm in height. The honeycomb substrate layer contains 100 honeycomb units arranged in 10 rows and 10 columns. The planar dimensions of the supporting frame layer are adjusted to 130mm in length and 130mm in width, while maintaining the same thickness. The width of the annular flange remains at 5mm. The number of circular recessed areas on the bottom surface of the support frame layer is increased to 12, the diameter of each circular recess is increased to 18mm, and the depth remains at 2mm. The planar dimensions of the protective covering layer are adjusted to 120mm in length and 120mm in width, and the thickness is increased to 4mm. The number of grooves on the top surface is increased to 15, the spacing between adjacent grooves remains at 8mm, and the groove width and depth remain unchanged. The remaining structure and materials are the same as in Example 1. The total thickness of this embodiment after assembly is 49mm, which can withstand a vertical pressure of 2000N. Under a 150N impact load, the maximum compression is 8mm, and the energy absorbed is about 0.6 joules. It is suitable for shock absorption and heat insulation applications that support heavier equipment.

[0045] Specifically, the principle of this utility model is as follows: This utility model solves the problems existing in the prior art by optimizing the overall structural design of the honeycomb buffer layer assembly and the connection method between each component. The honeycomb matrix layer adopts a structure of hexagonal honeycomb units spliced ​​together. Hexagon is the geometric shape with the highest planar filling efficiency, which can provide the most load-bearing wall surface in the same area. When the inner cavity of the honeycomb unit is subjected to vertical pressure, the wall surface will undergo elastic or plastic buckling deformation. This deformation process absorbs and dissipates the external input energy, realizing the buffering and shock absorption function. The ratio of the side length to the height of the hexagonal honeycomb unit is controlled within the range of 1:3 to 1:5. This ratio ensures that the honeycomb wall surface has an appropriate slenderness ratio, and can undergo stable axial compression without lateral instability under pressure. The support frame layer is set at the bottom of the honeycomb matrix layer and is fixed by adhesive. The adhesive connection can form a continuous adhesive layer on the entire contact surface, and evenly distribute the load transmitted by the honeycomb matrix layer to the support frame layer. The support frame layer is made of thermoplastic elastomer material, which exhibits high elasticity similar to rubber at room temperature, and can further absorb the transmitted load. The vibration energy delivered to the substrate is increased by the annular flange structure at the edge of the supporting frame layer, which increases the contact area with the mounting surface and improves friction, effectively preventing slippage. The protective cover layer is connected to the top surface of the honeycomb substrate layer through hot pressing. During the hot pressing process, the protective cover layer material softens at high temperature and penetrates into the top edge of the honeycomb unit. After cooling, it forms a strong mechanical interlock and chemical bond. The strength of this connection method is much higher than that of ordinary adhesives and can withstand greater peeling forces. The groove texture on the top surface of the protective cover layer improves anti-slip performance by increasing surface roughness and providing embedding space. The gradually thickened design at the top of the honeycomb unit wall allows the top area to undergo smaller deformation first when the component is impacted, which plays a buffering role. Then, the load is gradually transferred to the thinner wall area at the bottom, which produces larger deformation to absorb energy, achieving a graded buffering effect. The circular recessed area at the bottom of the supporting frame layer forms an air gap that uses the low thermal conductivity of air to block heat conduction. The rational selection of materials for each component and the optimized design of the structure work together to enable the entire honeycomb buffer layer component to maintain lightweight while possessing excellent anti-slip, heat insulation and shock absorption performance.

[0046] When using the honeycomb buffer layer assembly of this utility model, first place the assembly at the location where the pad device needs to be installed, ensuring that the bottom surface of the support frame layer is in complete contact with the mounting base. The annular flange structure at the edge of the support frame layer will naturally fit against the base surface. Then, place the equipment or object to be supported or protected on the top surface of the protective cover layer. The grooves on the top surface of the protective cover layer will create frictional engagement with the bottom surface of the object, preventing slippage. When the weight of the equipment or object is applied to the assembly, the load first acts on the protective cover layer and is transferred to the top of each honeycomb cell in the honeycomb matrix layer through the adhesive strip structure of the hot-pressed connection area. Under the load, the honeycomb cells begin to compress and deform along the axial direction, and the wall surface undergoes elastic buckling, absorbing some energy. The load continues to be transferred downwards to the support frame layer, where the elastic material of the support frame layer undergoes slight deformation. Further absorbing vibration energy, if impact vibration is applied to the component during use, the thickened area at the top of the honeycomb unit responds first, generating a small deformation to buffer the initial impact. Subsequently, the thinner wall area at the bottom undergoes a larger deformation, completing the energy absorption process. The air gap in the circular recessed area at the bottom of the support frame layer blocks the upward conduction of heat from the base surface and also blocks the downward conduction of heat from the equipment, achieving a heat insulation function. When it is necessary to move or adjust the position of the equipment, simply lift the equipment, and the honeycomb unit in the component will gradually return to its original shape due to the elasticity of the material. The entire use process requires no additional operation steps. The component can maintain stable performance under various ambient temperature and humidity conditions. If the surface of the protective cover layer wears after long-term use, only the protective cover layer needs to be replaced, and the honeycomb base layer and support frame layer can still be used.

Claims

1. A honeycomb buffer layer assembly for an anti-slip, heat-insulating, and shock-absorbing pad device, characterized in that, The system comprises a honeycomb substrate layer, a supporting frame layer, and a protective cover layer. The honeycomb substrate layer is composed of several hexagonal honeycomb units bonded together, with the wall thickness of each honeycomb unit evenly distributed along a direction perpendicular to the bottom surface. The inner cavity of each honeycomb unit has a regular hexagonal columnar structure. The supporting frame layer is located at the bottom of the honeycomb substrate layer, with its edge contour completely fitting the outer periphery of the honeycomb substrate layer. The supporting frame layer is fixedly connected to the bottom surface of the honeycomb substrate layer by adhesive. The protective cover layer is located at the top of the honeycomb substrate layer, with its geometric center coinciding with the geometric center of the honeycomb substrate layer. The protective cover layer is fixedly connected to the top surface of the honeycomb substrate layer by hot pressing, serving to protect the internal structure of the honeycomb substrate layer from external impact damage.

2. The honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device according to claim 1, characterized in that, The ratio of the hexagonal side length to the height of the cellular unit is between 1:3 and 1:

5.

3. The honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device according to claim 2, characterized in that, The bottom surface of the honeycomb substrate layer and the top surface of the support frame layer form a completely flat contact surface, and the contact area accounts for a larger proportion of the total area of ​​the top surface of the support frame layer than the proportion of the total area of ​​the bottom surface of the honeycomb substrate layer.

4. The honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device according to claim 3, characterized in that, The edge portion of the support frame layer extends outward to form an annular flange structure, and the width of the annular flange structure is uniformly distributed along the radial direction of the support frame layer.

5. The honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device according to claim 4, characterized in that, The top surface of the protective covering layer is provided with several parallel grooves, and the depth of the grooves along the thickness direction of the protective covering layer is less than 1 / 3 of the total thickness of the protective covering layer.

6. The honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device according to claim 5, characterized in that, The wall thickness of the cellular unit gradually increases near the top, and the area of ​​increased wall thickness accounts for a proportion of the total height of the cellular unit within the top 1 / 4 range.

7. The honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device according to claim 6, characterized in that, The bottom surface of the support frame layer has multiple circular recessed areas, which are evenly distributed around the geometric center of the bottom surface of the support frame layer, forming a symmetrical arrangement.

8. The honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device according to claim 7, characterized in that, The honeycomb substrate layer is made of polypropylene or polyethylene, the support frame layer is made of thermoplastic elastomer, and the protective cover layer is made of silicone rubber or nitrile rubber.

9. The honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device according to claim 8, characterized in that, The side profile of the honeycomb substrate layer is a regular rectangle or square, and the four corners of the honeycomb substrate layer are provided with arc transition structures.

10. The honeycomb buffer layer assembly of the anti-slip, heat-insulating, and shock-absorbing pad device according to claim 9, characterized in that, The hot-pressed connection area between the protective covering layer and the honeycomb substrate layer forms a continuous adhesive strip structure. The adhesive strip structure is distributed along the hexagonal edge of the honeycomb cell, and the width of the adhesive strip structure is more than twice the thickness of the honeycomb cell wall.

Images