An LED lighting module and lighting device

Abstract

The utility model provides a kind of LED lighting module and lighting device, wherein, the LED lighting module includes: lens unit;Heat dissipation unit, the lens unit cover is equipped on the heat dissipation unit;The heat dissipation unit includes ceramic heat dissipation baseplate, metal electrically conductive heat conduction layer and LED light emitting piece, the LED light emitting piece is set on the metal electrically conductive heat conduction layer, the metal electrically conductive heat conduction layer is set on the top end surface of the ceramic heat dissipation baseplate;The bottom end surface of the ceramic heat dissipation baseplate is equipped with evenly distributed heat dissipation sawtooth piece, and the heat dissipation sawtooth piece is sawtooth shape.The utility model can give consideration to heat dissipation efficiency and high-voltage insulation performance, and corrosion resistance can increase, improve the service life.

Description

Technical Field

[0001] This utility model relates to the field of LED lighting technology, and in particular to an LED lighting module and lighting device. Background Technology

[0002] Current LED lighting heat dissipation solutions mainly rely on aluminum substrates (MCPCBs) and traditional heat sinks, but they have the following drawbacks:

[0003] (1) Limitations of aluminum substrates: Aluminum substrates consist of a circuit layer, an insulating layer, and a metal base layer. Although the insulating layer ensures safety, its thermal conductivity is only 1.0-2.0 W / (m·K), which becomes a bottleneck for heat dissipation. Furthermore, if the insulating layer is too thick, it will hinder heat conduction, and if it is too thin, it will be prone to breakdown, resulting in insufficient safety. At the same time, aluminum substrates can only pass high-voltage tests below 1kV, indicating insufficient high-voltage insulation performance.

[0004] (2) Aluminum alloy radiators are prone to electrochemical corrosion in salt spray environments, which leads to the peeling of the surface oxide layer (annual corrosion rate > 0.5 mm) and failure of the heat conduction path. Surface coatings (such as powder coating process) are prone to cracking after long-term thermal cycling (-40 to 100℃), and salt spray penetration accelerates the corrosion of the substrate.

[0005] (3) Limitations of plastic radiators: Some products use salt spray resistant engineering plastics (such as PA66) as radiators, but their thermal conductivity is low (<3W / m·K), which is only suitable for low-power lamps and cannot meet the needs of high-power lighting products.

[0006] Therefore, given the technical problems of the contradiction between heat dissipation efficiency and insulation performance, poor corrosion resistance and short lifespan of aluminum substrates and traditional heat sinks, it is necessary to provide an LED lighting module and lighting device to solve the above-mentioned problems in the prior art. Utility Model Content

[0007] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide an LED lighting module and lighting device to solve the technical problems of contradiction between heat dissipation efficiency and insulation performance, poor corrosion resistance and short lifespan in the prior art.

[0008] To solve the above-mentioned technical problems, this utility model provides an LED lighting module, comprising:

[0009] Lens unit;

[0010] A heat dissipation unit is provided, with the lens unit covering the heat dissipation unit; the heat dissipation unit includes a ceramic heat dissipation substrate, a metal conductive and thermally conductive layer, and an LED light-emitting element, the LED light-emitting element being disposed on the metal conductive and thermally conductive layer, the metal conductive and thermally conductive layer being disposed on the top surface of the ceramic heat dissipation substrate; the bottom surface of the ceramic heat dissipation substrate is provided with uniformly distributed heat dissipation serrations, the heat dissipation serrations being serrated.

[0011] The LED lighting module provided by this utility model has the following beneficial effects:

[0012] By creating uniformly distributed heat dissipation serrations on the bottom surface of the ceramic heat dissipation substrate, and leveraging the extremely high emissivity of ceramic materials, the serrated design of these serrations significantly increases the heat radiation area and the air convection heat dissipation area, greatly improving the heat dissipation efficiency of the LED lighting module during operation. Simultaneously, a metal conductive and thermally conductive layer is designed between the ceramic heat dissipation substrate and the LED light-emitting element, forming a gradient thermal conductivity structure. This structure enables rapid longitudinal conduction of heat generated during LED lighting module operation and facilitates electrical interconnection of the LED light-emitting elements. Furthermore, based on the inherent high-voltage insulation properties of ceramic materials, this LED lighting module ensures both efficient heat dissipation and high-voltage insulation, increases corrosion resistance, and extends service life.

[0013] Furthermore, the lens unit includes a base and a plurality of lenses corresponding to the LED light-emitting element, with the plurality of lenses disposed on the top of the base.

[0014] Furthermore, it also includes a sealing element, wherein the bottom of the base is provided with a sealing groove adapted to the sealing element, and the sealing element is snapped into the sealing groove.

[0015] Furthermore, a first mounting hole is provided at the middle position of the ceramic heat dissipation substrate.

[0016] Furthermore, it also includes a waterproof sealing gasket, the top surface of which is attached to the middle position of the bottom of the ceramic heat dissipation substrate; the waterproof sealing gasket has a first fastening hole and a second mounting hole corresponding to the first mounting hole.

[0017] Furthermore, it also includes a metal pressure plate, the top surface of which is in contact with the bottom surface of the waterproof sealing gasket; the metal pressure plate is provided with a second fastening hole corresponding to the first fastening hole, and a third mounting hole corresponding to the first mounting hole and the second mounting hole.

[0018] Furthermore, it also includes a connector and a coupler, one end of which is fixedly disposed in the first mounting hole, the second mounting hole and the third mounting hole, and the other end is connected to the input line end of the coupler.

[0019] Furthermore, it also includes fasteners that pass through the first fastening hole and the second fastening hole to fix the metal pressure plate to the waterproof sealing gasket.

[0020] Furthermore, the ceramic heat dissipation substrate is made of aluminum nitride ceramic or alumina ceramic.

[0021] To solve the above-mentioned technical problems, the present invention also provides a lighting device, including: the LED lighting module as described above.

[0022] The beneficial effects of the lighting device provided by this utility model are the same as those of the LED lighting module described above. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the LED lighting module according to an embodiment of the present utility model;

[0024] Figure 2 This is an exploded view of the LED lighting module according to an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the heat dissipation unit according to an embodiment of the present invention.

[0026] Component designation explanation

[0027] 1. Lens unit; 11. Base; 12. Lens; 2. Heat dissipation unit; 21. Ceramic heat dissipation substrate; 211. Heat dissipation serrated part; 212. First mounting hole; 22. Metal conductive and thermally conductive layer; 23. LED light-emitting component; 24. Adapter; 3. Sealing component; 4. Waterproof sealing gasket; 41. First fastening hole; 42. Second mounting hole; 5. Metal pressure plate; 51. Second fastening hole; 52. Third mounting hole; 6. Wire coupler; 7. Fastener. Detailed Implementation

[0028] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0029] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this utility model, should still fall within the scope of the technical content disclosed in this utility model. The following detailed description should not be considered restrictive, and the scope of the embodiments of this application is limited only by the claims of the published patents. The terminology used herein is for describing specific embodiments only and is not intended to limit this application. Spatial terms such as "upper," "lower," "left," "right," "below," "below," "lower part," "above," "upper part," etc., may be used in the text to illustrate the relationship between one element or feature shown in the figures and another element or feature.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," and "holding" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, operation, element, component, item, kind, and / or group, but do not preclude the presence, occurrence, or addition of one or more other features, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition arise only when combinations of elements, functions, or operations are inherently mutually exclusive in some manner.

[0032] like Figures 1-3 As shown, an embodiment of this utility model provides an LED lighting module, including a lens unit 1 and a heat dissipation unit 2. The lens unit 1 is disposed on the heat dissipation unit 2 and is used to focus or project light to improve the luminous efficiency of the lighting device.

[0033] The heat dissipation unit 2 includes a ceramic heat dissipation substrate 21, a metal conductive and thermally conductive layer 22, and an LED light-emitting element 23. The LED light-emitting element 23 is disposed on the metal conductive and thermally conductive layer 22, which is disposed on the top surface of the ceramic heat dissipation substrate 21. The bottom surface of the ceramic heat dissipation substrate 21 has uniformly distributed heat dissipation serrations 211, which are serrated.

[0034] By creating uniformly distributed heat dissipation serrations 211 on the bottom surface of the ceramic heat dissipation substrate 21, and leveraging the extremely high emissivity of ceramic materials, the serrated design of the heat dissipation serrations 211 significantly increases the heat radiation area and the air convection heat dissipation area, greatly improving the heat dissipation efficiency during operation, thus achieving uniform lateral heat dissipation. Simultaneously, a metal conductive and thermally conductive layer 22 is designed between the ceramic heat dissipation substrate 21 and the LED light-emitting element 23, forming a gradient thermal conductivity structure. This structure enables rapid longitudinal heat conduction and electrical interconnection of the LED light-emitting element 23. Furthermore, based on the inherent high-voltage insulation properties of the ceramic material, this LED lighting module ensures both heat dissipation efficiency and high-voltage insulation performance, achieving "rapid longitudinal heat conduction + uniform lateral heat dissipation." This solves the technical problems of contradiction between heat dissipation efficiency and insulation performance, poor corrosion resistance, short lifespan, and light decay in existing technologies.

[0035] For example, the metal conductive and thermally conductive layer 22 is made of metal materials such as copper, aluminum, and silver. By using a metal layer with high thermal conductivity (thermal conductivity > 400 W / (m·K)) as the metal conductive and thermally conductive layer 22, the heat generated by the electronic components is rapidly conducted longitudinally through the metal conductive and thermally conductive layer 22. In addition, combined with the lateral uniform heat dissipation of the ceramic heat dissipation substrate 21, the overall heat dissipation performance of the LED lighting module of this utility model is greatly improved.

[0036] like Figure 1 and Figure 2 As shown, in some embodiments of this utility model, the lens unit 1 includes a base 11 and a plurality of lenses 12 corresponding to the LED light-emitting element 23. The plurality of lenses 12 are disposed on the top of the base 11. Exemplarily, the lens 12 is convex curved. When the lens unit 1 is fitted onto the heat dissipation unit 2, the LED light-emitting element 23 is placed inside the cavity formed by the convex curved lens 12, which converges the divergent light emitted by the LED light-emitting element 23 into a collimated beam, thereby improving the luminous efficiency.

[0037] like Figure 2As shown, in some embodiments of this utility model, the LED lighting module further includes a sealing element 3. A sealing groove adapted to the sealing element 3 is provided at the bottom of the base 11, and the sealing element 3 is snapped into the sealing groove. Exemplarily, the sealing element 3 is a silicone ring. The silicone ring is snapped into the sealing groove at the bottom of the base 11, and then liquid silicone is applied to the side of the base 11. After assembly, the liquid silicone cures to form a secondary seal, simultaneously bonding the contact surfaces between the base 11 and the ceramic heat dissipation substrate 21, thereby firmly sealing the base 11 and the ceramic heat dissipation substrate 21 and preventing moisture, dust, salt spray, etc., from entering the interior between the base 11 and the ceramic heat dissipation substrate 21.

[0038] like Figure 2 and Figure 3 As shown, in some embodiments of this utility model, a first mounting hole 212 is provided in the middle of the ceramic heat sink substrate 21. In this embodiment, the first mounting hole 212 is used to assemble the coupler 6.

[0039] like Figure 2 As shown, in some embodiments of this utility model, the LED lighting module further includes a waterproof sealing gasket 4. The top surface of the waterproof sealing gasket 4 is attached to the middle position of the bottom of the ceramic heat sink substrate 21. The waterproof sealing gasket 4 has a first fastening hole 41 and a second mounting hole 42 corresponding to the first mounting hole 212. Specifically, by attaching the waterproof sealing gasket 4 to the position of the first mounting hole 212 at the bottom of the ceramic heat sink substrate 21, the first mounting hole 212 and the second mounting hole 42 are aligned. The waterproof sealing gasket 4 can prevent water vapor, salt spray, and cleaning fluid from penetrating along the capillary gaps, thus achieving a sealing effect.

[0040] like Figure 2 As shown, in some embodiments of this utility model, the LED lighting module further includes a metal pressure plate 5. The top surface of the metal pressure plate 5 is attached to the bottom surface of the waterproof sealing gasket 4. The metal pressure plate 5 has a second fastening hole 51 corresponding to the first fastening hole 41, and a third mounting hole 52 corresponding to the first mounting hole 212 and the second mounting hole 42. Specifically, the metal pressure plate 5 is attached to the bottom surface of the waterproof sealing gasket 4. At this time, the first mounting hole 212, the second mounting hole 42 and the third mounting hole 52 are aligned. The metal pressure plate 5 not only presses the waterproof sealing gasket 4 tightly, but also works in conjunction with the waterproof sealing gasket 4 to assemble the coupler 6.

[0041] like Figure 2As shown, in some embodiments of this utility model, the LED lighting module further includes a connector and a coupler 6. One end of the connector is fixedly disposed in the first mounting hole 212, the second mounting hole 42, and the third mounting hole 52, and the other end is connected to the input wire end of the coupler 6. Exemplarily, the connector is a waterproof metal connector, and the first mounting hole 212, the second mounting hole 42, and the third mounting hole 52 are provided with matching threads. The threads of the waterproof metal connector are adapted to the threads of the first mounting hole 212, the second mounting hole 42, and the third mounting hole 52. By rotating and tightening, the waterproof metal connector is installed on the ceramic heat sink substrate 21. The coupler 6 is a wire coupler, and the other end of the waterproof metal connector is sleeved on the wire coupler, thereby assembling the wire coupler on the ceramic heat sink substrate 21 through the waterproof metal connector.

[0042] like Figure 2 As shown, in some embodiments of this utility model, the LED lighting module further includes a fastener 7. The fastener 7 passes through the first fastening hole 41 and the second fastening hole 51 to fix the metal pressure plate 5 to the waterproof sealing gasket 4. Exemplarily, a first fastening hole 41 is provided on each side of the second mounting hole 42, and a second fastening hole 51 is provided on each side of the third mounting hole 52. Correspondingly, two fasteners 7 are provided, each passing through the corresponding first fastening hole 41 and second fastening hole 51, thereby assembling the metal pressure plate 5 and the waterproof sealing gasket 4 together.

[0043] like Figure 1 As shown, in some embodiments of this utility model, the ceramic heat dissipation substrate 21 is made of aluminum nitride ceramic or alumina ceramic. Since aluminum substrates can only pass high-voltage tests below 1kV due to insufficient high-voltage insulation, while ceramic substrates can withstand 15kV tests, offering superior safety and reliability. Therefore, this embodiment uses aluminum nitride ceramic (thermal conductivity 135-175 W / (m·K)) or alumina ceramic (thermal conductivity 15-30 W / (m·K)). The ceramic heat dissipation substrate 21 does not require an additional insulating layer or metal heat sink, directly serving as the circuit carrier and reducing thermal resistance.

[0044] like Figure 1 As shown, in some embodiments of this utility model, the heat dissipation unit 2 further includes an adapter 24. The adapter 24 is disposed around the first mounting hole 212 to facilitate the input line to pass through and be soldered to the adapter 24. Since the ceramic (such as aluminum nitride ceramic or alumina ceramic) of the ceramic heat dissipation substrate 21 has high thermal conductivity, it is difficult to directly solder the input line on the ceramic. Therefore, the adapter 24 is designed as a transition layer for soldering the input line to achieve a reliable electrical connection between the input line and the ceramic heat dissipation substrate 21.

[0045] Exemplarily, the steps for installing the LED lighting module of this utility model are as follows: the sealing member 3 is snapped into the sealing groove at the bottom of the base 11, the lens unit 1 is placed on the heat dissipation unit 2, and the base 11 of the lens unit 1 and the ceramic heat dissipation substrate 21 of the heat dissipation unit 2 are connected by gluing. At this time, the LED light-emitting element 23 is placed in the cavity formed by the lens 12; the waterproof sealing gasket 4 is attached to the bottom position corresponding to the first mounting hole 212 of the ceramic heat dissipation substrate 21, and the fastener 7 is passed through the first fastening hole 41 and the second fastening hole 51. The metal pressure plate 5 is attached to the waterproof sealing gasket 4, and one end of the metal waterproof connector is assembled into the first mounting hole 212, the second mounting hole 42 and the third mounting hole 52, and the other end is connected to the wire coupler.

[0046] The LED lighting module of this invention forms a metal conductive and thermally conductive layer 22 on the surface of a ceramic heat sink substrate 21. The LED light-emitting element 23 is soldered to the metal conductive and thermally conductive layer 22. The gradient thermal conductivity layer design reduces the interface thermal resistance to 0.05 K / W, eliminating the need for other materials for heat dissipation and avoiding thermal resistance layers between different materials, thus improving the overall heat dissipation structure. Simultaneously, the large exposed ceramic surface enhances the heat radiation capacity of the heat sink. Furthermore, the heat sink made of ceramic material increases the thermal conductivity to 20–200 W / (m·K), far exceeding the thermal conductivity of aluminum substrates (1.0–2.0 W / (m·K)), while maintaining an insulation strength of 15 kV / mm. Uniformly distributed heat dissipation serrations 211 are formed on the bottom surface of the ceramic heat sink substrate 21, doubling the heat dissipation area and increasing the natural convection heat transfer coefficient by 120%. This also reduces manufacturing costs by 25% and improves material utilization compared to traditional machining.

[0047] Furthermore, after testing the LED lighting module of this utility model in a high-temperature salt spray environment for 2000 hours, the product surface showed no abnormalities and could continue to work normally (traditional metal heat sinks showed obvious rust on the surface after 500 hours, and the protective layer failed over a large area). Under the same product size requirements, the power of the product with ceramic heat sink alone is 1.75 times higher than that of the traditional aluminum substrate combined with metal heat sink.

[0048] An embodiment of this utility model also provides a lighting device, including an LED lighting module as described above. Furthermore, the lighting device includes a lamp post and a lamp body, with the LED lighting module disposed within the lamp body and the lamp body assembled onto the lamp post. The structural components and beneficial effects of the lighting device in this embodiment are described above with reference to the LED lighting module description, and will not be repeated here.

[0049] In summary, addressing the technical problems of existing technologies, such as the contradiction between heat dissipation efficiency and insulation performance, poor corrosion resistance, short lifespan, and light decay, this utility model provides an LED lighting module and lighting device. By creating uniformly distributed heat dissipation serrations on the bottom surface of a ceramic heat sink substrate, and leveraging the extremely high emissivity of ceramic materials (0.95, compared to only 0.05 for aluminum or copper), the serrated design of the heat dissipation serrations significantly increases the heat radiation area (doubling the area) and also increases the air convection heat dissipation area, greatly improving the heat dissipation efficiency of the LED lighting module during operation. Simultaneously, a metal conductive and thermally conductive layer is designed between the ceramic heat sink substrate and the LED light-emitting element. Based on the high thermal conductivity (thermal conductivity > 400 W / (m·K)) of the metal conductive and thermally conductive layer, a gradient thermal conductivity structure is constructed. This structure enables rapid vertical heat conduction during operation and facilitates electrical interconnection of the LED light-emitting components. Furthermore, leveraging the inherent high-voltage insulation properties of ceramic materials, the LED lighting module of this invention employs an all-ceramic heat dissipation structure, increasing thermal conductivity by more than 20 times while ensuring high-voltage insulation performance (>15kV). The modular integration combined with the gradient thermal conductivity layer achieves "rapid vertical heat conduction + uniform horizontal heat dissipation," reducing chip junction temperature by more than 30%. This solves the technical problems of existing technologies, such as the contradiction between heat dissipation efficiency and insulation performance, poor corrosion resistance, short lifespan, and light decay. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0050] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An LED lighting module, characterized in that, include: Lens unit; A heat dissipation unit is provided, with the lens unit covering the heat dissipation unit; the heat dissipation unit includes a ceramic heat dissipation substrate, a metal conductive and thermally conductive layer, and an LED light-emitting element, the LED light-emitting element being disposed on the metal conductive and thermally conductive layer, the metal conductive and thermally conductive layer being disposed on the top surface of the ceramic heat dissipation substrate; the bottom surface of the ceramic heat dissipation substrate is provided with uniformly distributed heat dissipation serrations, the heat dissipation serrations being serrated.

2. The LED lighting module according to claim 1, characterized in that, The lens unit includes a base and a plurality of lenses corresponding to the LED light-emitting element, with the plurality of lenses disposed on the top of the base.

3. The LED lighting module according to claim 2, characterized in that, It also includes a sealing element, and the bottom of the base is provided with a sealing groove that is adapted to the sealing element, and the sealing element is snapped into the sealing groove.

4. The LED lighting module according to claim 1, characterized in that, The ceramic heat sink substrate has a first mounting hole in the middle.

5. The LED lighting module according to claim 4, characterized in that, It also includes a waterproof sealing gasket, the top surface of which is attached to the middle position of the bottom of the ceramic heat dissipation substrate; the waterproof sealing gasket has a first fastening hole and a second mounting hole corresponding to the first mounting hole.

6. The LED lighting module according to claim 5, characterized in that, It also includes a metal pressure plate, the top surface of which is in contact with the bottom surface of the waterproof sealing gasket; the metal pressure plate is provided with a second fastening hole corresponding to the first fastening hole, and a third mounting hole corresponding to the first mounting hole and the second mounting hole.

7. The LED lighting module according to claim 6, characterized in that, It also includes a connector and a coupler, one end of which is fixedly disposed in the first mounting hole, the second mounting hole and the third mounting hole, and the other end is connected to the input line end of the coupler.

8. The LED lighting module according to claim 6, characterized in that, It also includes fasteners that pass through the first fastening hole and the second fastening hole to fix the metal pressure plate to the waterproof sealing gasket.

9. The LED lighting module according to claim 1, characterized in that, The ceramic heat dissipation substrate is made of aluminum nitride ceramic or alumina ceramic.

10. A lighting device, characterized in that, include: The LED lighting module as described in any one of claims 1 to 9.

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