New semiconductor refrigeration temperature control device
Patent Information
- Application Number
- CN202522112305.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-09-30
AI Technical Summary
[0003]水冷机通过液体循环传递热量，需依赖泵、管道、冷排等组件，液体循环存在热惯性，温度调节滞后，难以实现快速、精准的稳态控制，市面水冷机采用固定PID参数+普通传感器，控温精度±0.2℃，无法满足半导体光刻、激光加工设备等场景需求
1、本实用新型通过双循环耦合设计和精密控制模块的协同作用，实现了±0.05℃的超精密控温，能够满足对温度控制要求极为苛刻的设备的冷却需求，安全可靠性强三级安全保护机制从不同层面保障了装置在各种工况下的安全运行，有效避免了因温度异常、设备故障等引发的安全事故，适应性好精密控制模块能够根据负载设备的热负荷变化和系统状态自动调整控制参数，适应不同的工况，确保装置在不同运行条件下都能稳定、高效地工作，节能高效合理的设计和精确的控制减少了能源的浪费，提高了能源利用效率，降低了运行成本，防尘散热佳防尘设计和散热设计保证了装置在洁净厂房等特殊环境下的正常运行，同时延长了设备的使用寿命。
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Figure CN224771842U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of temperature control equipment technology, and in particular to a novel semiconductor refrigeration temperature control device. Background Technology
[0002] A chiller, also known as a refrigeration unit, is essentially a cooling device that operates based on the reverse Carnot cycle. By consuming electrical energy, the chiller transfers heat from low-temperature areas to high-temperature areas, achieving a cooling effect. During the operation of semiconductor equipment, electronic components generate a significant amount of heat. If this heat cannot be dissipated in time, the equipment temperature will continue to rise, affecting its performance and stability. For example, if the optical lenses of a lithography machine deform due to heat, the imaging quality of the lithography process will degrade, thus affecting the chip manufacturing precision. The chiller, through circulating coolant, can quickly remove the heat generated during equipment operation, maintaining the equipment within a constant temperature range and ensuring the stability and reliability of its various performance indicators.
[0003] Water chillers transfer heat through liquid circulation, relying on components such as pumps, pipes, and radiators. Liquid circulation has thermal inertia, resulting in lag in temperature regulation and making it difficult to achieve fast and accurate steady-state control. Commercially available water chillers use fixed PID parameters and ordinary sensors, with a temperature control accuracy of ±0.2℃, which cannot meet the needs of scenarios such as semiconductor lithography and laser processing equipment. Utility Model Content
[0004] This utility model addresses the shortcomings of existing technologies by providing the following technical solution. A novel semiconductor refrigeration temperature control device includes a housing. A temperature control device is installed inside the housing cavity. A water tank is fixedly installed above the housing cavity. A water pump is connected to the outlet of the water tank. A compressor is connected to the outlet of the water pump. A heat exchanger and a condenser are connected to the outlet of the compressor. A frequency converter board is fixedly installed above the heat exchanger. A frequency converter fan is fixedly installed on one side of the frequency converter board. A filter is connected between the heat exchanger and the condenser. A control board is fixedly installed above the housing cavity and on one side of the water tank. A display screen is electrically connected to the outer end of the control board and is mounted on the outer wall of the housing.
[0005] As an improvement to the above technical solution, a cooling water outlet is provided on the upper side of the other side of the heat exchanger, and a cooling water inlet is provided on the lower side. The cooling water outlet and the cooling water inlet are circulated and connected. An internal thread filter is installed through the outer end of the cooling water inlet.
[0006] As an improvement to the above technical solution, a drain outlet is provided at the bottom of one side of the condenser, and the water pumped out by the connecting pipe on one side of the water pump passes through the tank and is provided with a circulating liquid outlet. The outer end of the water inlet of the water tank passes through the tank and is provided with a circulating liquid inlet. A temperature sensor is installed between the water tank and the circulating liquid inlet near the water tank. The circulating liquid outlet and the circulating liquid inlet are installed in a circulating connection.
[0007] As an improvement to the above technical solution, a water tank cover is movably installed on the top of the water tank, a level gauge is fixedly installed on one side of the water tank, both the water tank cover and the level gauge are fixedly installed on the front wall of the water tank, and a power supply and communication port are fixedly installed on one side of the rear wall of the water tank.
[0008] As an improvement to the above technical solution, a temperature sensor and a pressure control valve are installed between the water pump and the compressor, an expansion valve and a temperature sensor are installed sequentially between the heat exchanger and the condenser, and a temperature sensor, a pressure control valve and an expansion valve are installed between the condenser and the compressor.
[0009] Beneficial effects of this utility model 1. This utility model achieves ultra-precise temperature control of ±0.05℃ through the synergistic effect of a dual-cycle coupling design and a precision control module. It can meet the cooling requirements of equipment with extremely stringent temperature control requirements. It boasts strong safety and reliability with a three-level safety protection mechanism that ensures safe operation of the device under various working conditions, effectively preventing safety accidents caused by abnormal temperatures or equipment failures. It exhibits good adaptability; the precision control module can automatically adjust control parameters according to changes in the heat load of the load equipment and the system status, adapting to different working conditions and ensuring stable and efficient operation of the device under various operating conditions. It is energy-efficient; the reasonable design and precise control reduce energy waste, improve energy utilization efficiency, and lower operating costs. It features excellent dustproof and heat dissipation design, ensuring normal operation of the device in special environments such as cleanrooms, while extending the service life of the equipment. Attached Figure Description
[0010] Figure 1 This is the overall structure of the present utility model; Figure 2 This is a structural diagram of the internal temperature control device of the box in this utility model; Figure 3 This is a diagram showing the external structure of the housing of this utility model; Figure 4 This is a structural diagram of the liquid level gauge of this utility model; Figure 5 This is a structural diagram of the water pump of this utility model.
[0011] Attached reference numerals: 1. Housing; 11. Water tank; 111. Water tank cover; 112. Level gauge; 12. Power supply; 13. Communication port; 2. Water pump; 3. Compressor; 4. Heat exchanger; 41. Cooling water outlet; 42. Cooling water inlet; 5. Variable frequency board; 51. Variable frequency fan; 6. Condenser; 61. Drain outlet; 7. Circulating liquid outlet; 8. Circulating liquid inlet; 9. Control board; 91. Display screen. Detailed Implementation
[0012] To make the objectives, technical solutions, and advantages of this utility model clearer, the following provides a more detailed description of the utility model. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the utility model.
[0013] Please see Figure 1-5 This utility model provides a technical solution A novel semiconductor refrigeration temperature control device includes a housing 1. A temperature control device is installed inside the cavity of the housing 1. A water tank 11 is fixedly installed on the upper part of the cavity of the housing 1. A water pump 2 is connected to the water outlet of the water tank 11. A compressor 3 is connected to the drain end of the water pump 2. A heat exchanger 4 and a condenser 6 are connected to the air outlet of the compressor 3. A frequency converter board 5 is fixedly installed on the upper part of the heat exchanger 4. A frequency converter fan 51 is fixedly installed on one side of the frequency converter board 5. A filter is connected between the heat exchanger 4 and the condenser 6. A control board 9 is fixedly installed on the upper part of the cavity of the housing 1 and on one side of the water tank 11. A display screen 91 is electrically connected to the outer end of the control board 9. The display screen 91 is installed on the outer wall of the housing 1.
[0014] In this implementation scheme, the device adopts a dual-cycle coupling design, combining water circulation and Freon refrigeration cycle. Combined with precision control technology, it achieves ultra-precise temperature control of ±0.05℃. Water tank 11 is fixedly installed inside the upper part of the chamber 1, serving as the water storage component for the water circulation system and providing a water source. Water pump 2 connects to the outlet of water tank 11, pumping out the circulating water from water tank 11 to power the water circulation. Compressor 3 connects to the drain of water pump 2, acting as the core component of the Freon refrigeration cycle, compressing low-temperature, low-pressure Freon gas into high-temperature, high-pressure gas to power the refrigeration cycle. Heat exchanger 4 connects to the outlet of compressor 3, playing a crucial role in heat exchange between the water circulation and Freon refrigeration cycle. Condenser 6 connects to the outlet of compressor 3, further enhancing the Freon refrigeration cycle. In the condensation stage of the cycle, the heat of the high-temperature Freon gas is carried away by the external circulating cooling water, causing it to condense into a high-pressure liquid. A filter is connected between the heat exchanger 4 and the condenser 6 to filter impurities in the Freon and ensure the smooth operation of the refrigeration cycle. The inverter board 5 is fixedly installed above the heat exchanger 4, and the inverter fan 51 is fixedly installed on one side of the inverter board 5. The inverter board 5 is used to control the speed of the inverter fan 51 to regulate the internal temperature of the device. At the same time, the inverter fan 51 provides heat dissipation for the inverter board 5. The control board 9 and the display screen 91 are fixedly installed inside the cavity of the housing 1, on the upper part and on one side of the water tank 11. The outer end of the control board 9 is electrically connected to the display screen 91, which is installed on the outer wall of the housing 1. The control board 9 is responsible for the control and operation logic of the entire device, and the display screen 91 is used to display the operating parameters and status information of the device.
[0015] Working principle of the circulation system: Water circulation system: The path is water tank 11 → water pump 2 → compressor 3 → heat exchanger 4 → condenser 6 → water tank 11, forming a closed loop. During the start-up phase, the circulating water in water tank 11 is drawn out by water pump 2 and regulated to the set flow rate by a high-sensitivity flow control valve to ensure stable heat exchange efficiency. The water flows into compressor 3, absorbing the heat generated by compressor 3 for pre-cooling. The pre-cooled water flows into the water-side channel of condenser 6 for efficient heat exchange with the Freon side, and the water temperature is precisely reduced to the target value, such as 25℃±0.05℃. The low-temperature circulating liquid is then transported to the load equipment, such as lasers and semiconductor process chambers, through the outlet. After absorbing the heat from the equipment, it returns to water tank 11, completing one cycle. Freon refrigeration cycle: The path is compressor 3 → condenser 6 → expansion valve → heat exchanger 4 → compressor 3. During the compression phase, compressor 3 compresses the low-temperature, low-pressure Freon gas into a high-temperature, high-pressure gas, providing power for the refrigeration cycle. During the condensation phase, the high-temperature gas enters condenser 6, where external circulating cooling water carries away the heat, condensing it into a high-pressure liquid. During the throttling phase, the high-pressure liquid is precisely circulated through a high-speed circuit. The expansion valve throttles and reduces pressure, converting the liquid into a low-temperature, low-pressure mist. During the evaporation stage, the low-temperature liquid enters the Freon side channel of heat exchanger 4, absorbs heat from the water side, and completely evaporates into gas, returning to compressor 3 to complete the cycle. High-sensitivity PT1000 temperature sensors are installed at the water tank 11, the inlet and outlet of heat exchanger 4, and the load equipment to monitor the temperature in real time. Simultaneously, flow sensors are installed to monitor the water circulation flow rate, ensuring stable heat exchange efficiency. The control algorithm employs PID algorithm and fuzzy adaptive control. The PID algorithm dynamically adjusts the expansion valve opening and compressor 3 frequency based on the deviation and rate of change between the set temperature and the actual temperature. Real-time heat load data is obtained from the load equipment's host computer, allowing for advance adjustment of cooling capacity and elimination of temperature lag. Based on system status, such as cooling water inlet temperature fluctuations and load heat pulses, the PID parameters are automatically optimized to adapt to different operating conditions, such as the transition from standby to full load. The communication interface connects to the load equipment's host computer to obtain the equipment's internal temperature requirements, real-time correcting the temperature control target value, achieving a two-stage closed-loop control accuracy of ±0.0.05℃; Level 1 Protection: The FPGA controller monitors the device's operating status in real time. When the temperature exceeds the limit, it prioritizes adjusting the expansion valve opening. If adjustment is ineffective, it reduces the compressor frequency to prevent further temperature increases, ensuring the device operates within a safe temperature range. Level 2 Protection: The mechanical temperature controller functions in case of FPGA controller failure, cutting off the power supply to ensure the device stops operating under abnormal conditions, preventing damage and providing double safety protection. Level 3 Protection: In extreme cases, such as refrigerant leakage leading to dry burning, the fuse physically disconnects the circuit, preventing equipment damage and safety accidents, providing comprehensive protection for the device and operators. Dustproof Design: All components use a dust-free coating to prevent dust generation during operation and contamination of the cleanroom, meeting the requirements of high-cleanliness environments. The inverter board 5 has a rear-mounted fan heat sink, which can dissipate the heat generated by the inverter board 5 in a timely manner, ensuring stable operation of the inverter board 5 at a suitable temperature and extending its service life.
[0016] Beneficial effects: Through the synergistic effect of the dual-cycle coupling design and the precision control module, ultra-precise temperature control of ±0.05℃ is achieved, which can meet the cooling requirements of equipment with extremely demanding temperature control requirements. High safety and reliability: The three-level safety protection mechanism ensures the safe operation of the device under various working conditions from different levels, effectively avoiding safety accidents caused by abnormal temperature, equipment failure, etc. Good adaptability: The precision control module can automatically adjust the control parameters according to the heat load changes of the load equipment and the system status, adapting to different working conditions and ensuring that the device can work stably and efficiently under different operating conditions. Energy efficiency: The reasonable design and precise control reduce energy waste, improve energy utilization efficiency, and reduce operating costs. Excellent dustproof and heat dissipation: The dustproof and heat dissipation design ensures the normal operation of the device in special environments such as clean rooms, while extending the service life of the equipment.
[0017] Specifically, on the other side of the heat exchanger 4, a cooling water outlet 41 is provided above and a cooling water inlet 42 is provided below. The cooling water outlet 41 and the cooling water inlet 42 are connected in a loop, and an internal thread filter is installed through the outer end of the cooling water inlet 42.
[0018] In this embodiment, the outlet end of the compressor 3 is connected to the heat exchanger 4. A cooling water outlet 41 is provided on the upper side of the other side of the heat exchanger 4, and a cooling water inlet 42 is provided on the lower side. The cooling water outlet 41 and the cooling water inlet 42 are connected in a loop to form an independent cooling water circulation channel, which is used to remove the heat released by Freon during the condensation process. An internal thread filter is installed through the outer end of the cooling water inlet 42, which can effectively filter impurities in the cooling water entering the heat exchanger 4, prevent impurities from clogging the channel of the heat exchanger 4, and ensure the normal operation and service life of the heat exchanger 4.
[0019] Specifically, a drain outlet 61 is provided at the bottom of one side of the condenser 6, and water drawn from the connecting pipe on one side of the water pump 2 is connected to the housing 1 where a circulating liquid outlet 7 is provided. The outer end of the water inlet of the water tank 11 is connected to the housing 1 where a circulating liquid inlet 8 is provided. A temperature sensor is installed between the water tank 11 and the circulating liquid inlet 8 near the water tank 11. The circulating liquid outlet 7 and the circulating liquid inlet 8 are connected in a circulating manner.
[0020] In this embodiment, the outlet of compressor 3 is also connected to condenser 6. During the condensation stage of the Freon refrigeration cycle, it works in conjunction with heat exchanger 4 to remove the heat of high-temperature Freon gas through external circulating cooling water, causing it to condense into a high-pressure liquid. A drain outlet 61 is provided at the bottom of one side of condenser 6, which can be used to drain the condensate generated during the condensation process or for drainage operations during equipment maintenance. Water pumped from one side of water pump 2 is connected to housing 1, which has a circulating liquid outlet 7. The outer end of the water inlet of water tank 11 is connected to housing 1, which has a circulating liquid inlet 8. A temperature sensor is installed between water tank 11 and circulating liquid inlet 8 near water tank 11. Circulating liquid outlet 7 and circulating liquid inlet 8 are connected in a loop for exchanging circulating liquid with external load equipment. In terms of heat transfer and temperature control, the circulating water in water tank 11 is drawn out by water pump 2 and adjusted to the set flow rate by a high-sensitivity flow control valve to ensure stable heat exchange efficiency. The water flows into compressor 3, absorbs the heat generated by compressor 3, and achieves pre-cooling. The pre-cooled water flows into the water-side channel of heat exchanger 4 and performs efficient heat exchange with the Freon side. The water temperature is accurately reduced to the target value (e.g., 25℃±0.05℃). The low-temperature circulating liquid is delivered to the load equipment (e.g., laser, semiconductor process cavity) through the outlet. After absorbing the heat of the equipment, it returns to water tank 11 through circulating liquid inlet 8. During this process, the temperature sensor near water tank 11 between water tank 11 and circulating liquid inlet 8 monitors the temperature of the circulating liquid returning to water tank 11 in real time and feeds the data back to control board 9 so as to adjust the control strategy in a timely manner.
[0021] Specifically, a water tank cover 111 is movably installed on the top of the water tank 11, a level gauge 112 is fixedly installed on one side of the water tank 11, the water tank cover 111 and the level gauge 112 are both fixedly installed on the front wall of the water tank 11, and a power supply 12 and a communication port 13 are fixedly installed on one side of the rear wall of the water tank 11.
[0022] In this embodiment, the water tank 11 is fixedly installed inside the upper part of the tank body 1. It is the water storage component of the water circulation system, providing a sufficient and stable water source for water circulation. The top of the water tank 11 is movably equipped with a water tank cover 111, which facilitates operations such as adding water and cleaning the water tank 11. A level gauge 112 is fixedly installed on one side of the water tank 11, which can display the water level in the water tank 11 in real time and intuitively, making it easy for operators to keep track of changes in the water level of the water tank 11. Both the water tank cover 111 and the level gauge 112 are fixedly installed on the front wall of the water tank 11 for easy observation. For operation, a power supply 12 and a communication port 13 are fixedly installed on one side of the rear wall of the water tank 11 to provide power support for the device and realize communication functions. The communication port 13 fixedly installed on one side of the rear wall of the water tank 11 has the ability to support multiple communication protocols and can realize a stable connection with the MES system and the host computer of the temperature controlled device. The data acquisition module is integrated in the control board 9, which is responsible for collecting key data such as power consumption, cooling capacity, and temperature fluctuation during the operation of the device, and uploading these data to the MES system or the host computer of the temperature controlled device through the communication port 13.
[0023] Specifically, a temperature sensor and a pressure control valve are installed between the water pump 2 and the compressor 3, an expansion valve and a temperature sensor are installed between the heat exchanger 4 and the condenser 6, and a temperature sensor, a pressure control valve and an expansion valve are installed between the condenser 6 and the compressor 3.
[0024] In this embodiment, a temperature sensor and a pressure control valve are installed between the water pump 2 and the compressor 3. The temperature sensor monitors the temperature at this location in real time, providing data to the control board 9 for timely adjustment of the control strategy. The pressure control valve can automatically adjust its opening according to the system pressure to ensure that the system pressure is stable within a reasonable range. An expansion valve and a temperature sensor are installed sequentially between the heat exchanger 4 and the condenser 6. The expansion valve is used to throttle and reduce the pressure of the refrigerant after passing through the heat exchanger 4, converting it into a low-temperature, low-pressure mist liquid. The temperature sensor monitors the temperature of the refrigerant after throttling, providing a reference for subsequent control. Between the condenser 6 and the compressor 3, a temperature sensor, a pressure control valve, and an expansion valve are installed. The temperature sensor monitors the temperature of the refrigerant at this location, the pressure control valve adjusts the system pressure, and the expansion valve further throttles and regulates the pressure of the refrigerant to ensure that the refrigerant entering the compressor 3 meets the requirements. The temperature sensor, pressure control valve, and expansion valve described in this document are all prior art and can be effectively known to those skilled in the art. Specific details will not be elaborated further.
[0025] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.
Claims
1. A novel semiconductor refrigeration temperature control device, comprising a housing (1), characterized in that... A temperature control device is installed inside the cavity of the box (1). A water tank (11) is fixedly installed on the upper part of the cavity of the box (1). A water pump (2) is connected to the water outlet of the water tank (11). A compressor (3) is connected to the drain end of the water pump (2). A heat exchanger (4) and a condenser (6) are connected to the air outlet of the compressor (3). A frequency converter (5) is fixedly installed on the upper part of the heat exchanger (4). A frequency converter fan (51) is fixedly installed on one side of the frequency converter (5). A filter is connected between the heat exchanger (4) and the condenser (6). A control board (9) is fixedly installed on the upper part of the cavity of the box (1) and on one side of the water tank (11). A display screen (91) is electrically connected to the outer end of the control board (9). The display screen (91) is installed on the outer wall of the box (1).
2. The novel semiconductor refrigeration temperature control device according to claim 1, characterized in that... The heat exchanger (4) has a cooling water outlet (41) on the upper side and a cooling water inlet (42) on the lower side. The cooling water outlet (41) and the cooling water inlet (42) are connected in a loop. An internal thread filter is installed through the outer end of the cooling water inlet (42).
3. The novel semiconductor refrigeration temperature control device according to claim 1, characterized in that... A drain outlet (61) is provided at the bottom of one side of the condenser (6). Water drawn from the side of the water pump (2) is connected to the tank (1) and a circulating liquid outlet (7) is provided. The outer end of the water inlet of the water tank (11) is connected to the tank (1) and a circulating liquid inlet (8) is provided. A temperature sensor is installed between the water tank (11) and the circulating liquid inlet (8) near the water tank (11). The circulating liquid outlet (7) and the circulating liquid inlet (8) are connected in a circulating manner.
4. The novel semiconductor refrigeration temperature control device according to claim 1, characterized in that... A water tank cover (111) is movably installed on the top of the water tank (11), and a level gauge (112) is fixedly installed on one side of the water tank (11). The water tank cover (111) and the level gauge (112) are both fixedly installed on the front wall of the water tank (11), and a power supply (12) and a communication port (13) are fixedly installed on one side of the rear wall of the water tank (11).
5. The novel semiconductor refrigeration temperature control device according to claim 1, characterized in that... A temperature sensor and a pressure control valve are installed between the water pump (2) and the compressor (3). An expansion valve and a temperature sensor are installed between the heat exchanger (4) and the condenser (6) in sequence. A temperature sensor, a pressure control valve, and an expansion valve are installed between the condenser (6) and the compressor (3).