A microwave semiconductor silicon wafer drying apparatus

Abstract

The utility model discloses a kind of microwave semiconductor silicon wafer drying equipment, and it is related to drying technical field.The microwave semiconductor silicon wafer drying equipment, including body, drying cavity is opened in the body, the microwave absorption plate is arranged in the inside bottom of drying cavity, the support frame is fixedly connected on the microwave absorption plate, air bearing table is fixedly installed on the support frame, air jet hole is opened in the air bearing table, suction hole is opened in the upper edge of the air bearing table, the air outlet pipe is fixedly connected on one side of suction hole, vacuum pump is fixedly connected on one end of the air outlet pipe, the fixed frame is fixedly connected in the inside of drying cavity, rotating magnetic field generator is installed on the fixed frame, microwave generator is fixedly connected in the inside of drying cavity, cooperate by four circumferential distribution microwave generator and the silicon wafer swing, rotating motion of rotating magnetic field drive, eliminate microwave field fixed blind area, avoid silicon wafer local overheating or drying deficiency, substantially reduce wafer temperature difference.

Description

Technical Field

[0001] This utility model relates to the field of drying technology, and in particular to a microwave semiconductor silicon wafer drying device. Background Technology

[0002] In semiconductor device research and manufacturing, silicon wafer drying is a key step to ensure the accuracy of subsequent processes such as photolithography and etching. Traditional silicon wafer drying equipment has the following defects. Single-source microwave or fixed heating methods are prone to creating energy distribution blind zones, causing local temperature differences on silicon wafers to exceed one degree Celsius, leading to problems such as warping and uneven oxidation, which seriously affects the photolithography alignment accuracy. The use of contact support structures such as quartz slide stages can easily lead to particulate contamination due to friction, and the difference in thermal resistance at the contact points further exacerbates uneven drying. Traditional equipment is difficult to be compatible with the drying requirements of silicon wafers of different sizes, and the vibration during operation is large, which leads to silicon wafer positioning deviation and affects the consistency of drying. Most of the equipment lacks integrated design, with scattered gas and electrical circuit layouts, resulting in high debugging and maintenance costs, making it difficult to meet the laboratory's needs for small-batch, high-frequency research and development. Therefore, there is an urgent need for a semiconductor silicon wafer drying equipment that combines drying uniformity, cleanliness, and ease of operation to address the pain points of traditional technologies. Utility Model Content

[0003] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a microwave semiconductor silicon wafer drying device that can solve the above-mentioned problem.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a microwave semiconductor silicon wafer drying device, comprising a body, wherein a support leg is fixedly connected to the bottom of the body; A hinge is fixedly connected to the machine body, and a machine cover is fixedly connected to the hinge. The machine cover is rotatably connected to the machine body via the hinge. A drying chamber is opened inside the machine body. A microwave absorption plate is provided at the bottom of the inner side of the drying chamber, and a sealing and fixing adhesive is provided on the outer side of the microwave absorption plate. A support frame is fixedly connected to the microwave absorption plate, and an air-floating platform is fixedly installed on the support frame. The air-floating platform is horizontally and centrally arranged, and air jet holes are opened on the air-floating platform. The air jet holes are arranged in a central array on the air-floating platform.

[0005] Preferably, the bottom of the support leg is provided with a cushioning pad.

[0006] Preferably, the drying chamber is a cylindrical cavity.

[0007] Preferably, the air flotation platform has four air intake holes at its upper edge, which are evenly distributed along the edge of the air flotation platform, and the bottom of the air flotation platform has an integrated annular air collection chamber.

[0008] Preferably, an exhaust pipe is fixedly connected to one side of each of the air intake holes, and a vacuum pump is fixedly connected to one end of the exhaust pipe.

[0009] Preferably, a fixed frame is fixedly connected to the inner side of the drying chamber, and a rotating magnetic field generator is installed on the fixed frame. The rotating magnetic field generator is symmetrically distributed at 120 degrees on the edge of the silicon wafer.

[0010] Preferably, a microwave generator is fixedly connected to the inside of the drying chamber. Four microwave generators are provided and are evenly distributed along the circumference of the side wall of the chamber. A horn-shaped antenna is installed at the emission port of the microwave generator.

[0011] Preferably, an air inlet pipe is fixedly connected to the bottom of the air flotation platform, the air inlet pipe is fixedly connected to the bottom of the outer side of the machine body, and a filter is fixedly connected to one end of the air inlet pipe.

[0012] Compared with the prior art, the beneficial effects of this utility model are: (1) This microwave semiconductor silicon wafer drying equipment uses four circumferentially distributed microwave generators and a rotating magnetic field to drive the silicon wafer to swing and rotate, thereby eliminating the fixed blind zone of the microwave field, avoiding local overheating or insufficient drying of the silicon wafer, and significantly reducing the temperature difference inside the wafer. The machine cover can be quickly opened and closed by the hinge rotation. The external design of the air inlet pipe and filter facilitates maintenance. The overall structure is reasonable and suitable for laboratory small-batch high-frequency use scenarios.

[0013] (2) In this microwave semiconductor silicon wafer drying equipment, the air jet hole of the air floating platform forms an air film to achieve contactless support of the silicon wafer. Combined with the negative pressure adsorption design of the suction hole, it reduces particle contamination caused by mechanical contact and meets the stringent cleanliness requirements of semiconductor silicon wafers.

[0014] (3) The combination of support legs and buffer pads in this microwave semiconductor silicon wafer drying equipment reduces the impact of equipment vibration on drying accuracy; the rotating magnetic field generator supports stepless speed regulation of silicon wafer rotation and reciprocating oscillation, which can be adapted to the drying needs of silicon wafers of different sizes. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments: Figure 1 This is a schematic diagram of a microwave semiconductor silicon wafer drying device according to the present invention; Figure 2 This is a schematic diagram of a microwave semiconductor silicon wafer drying device according to the present invention; Figure 3This is a cross-sectional schematic diagram of a microwave semiconductor silicon wafer drying device according to the present invention; Figure 4 This is a cross-sectional schematic diagram of a microwave semiconductor silicon wafer drying device according to the present invention.

[0016] Reference numerals: 1. Body; 2. Support leg; 3. Hinge; 4. Cover; 5. Drying chamber; 6. Microwave absorption plate; 7. Sealing adhesive; 8. Support frame; 9. Air float; 10. Air jet port; 11. Air intake port; 12. Air outlet pipe; 13. Vacuum pump; 14. Fixing frame; 15. Rotating magnetic field generator; 16. Microwave generator; 17. Air inlet pipe; 18. Filter. Detailed Implementation

[0017] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0018] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] In the description of this utility model, terms such as greater than, less than, and exceeding are understood to exclude the stated number, while terms such as above, below, and within are understood to include the stated number. The use of terms like "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the quantity or sequence of the indicated technical features.

[0020] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0021] Please see Figure 1-4 The present invention provides a technical solution: a microwave semiconductor silicon wafer drying device, including a body 1, a support leg 2 fixedly connected to the bottom of the body 1, and a buffer pad provided at the bottom of the support leg 2; A hinge 3 is fixedly connected to the body 1, and a cover 4 is fixedly connected to the hinge 3. The cover 4 is rotatably connected to the body 1 through the hinge 3. A drying chamber 5 is opened inside the body 1. The drying chamber 5 is a cylindrical cavity. A microwave absorption plate 6 is set at the bottom of the inner side of the drying chamber 5. A sealing and fixing adhesive 7 is glued to the outside of the microwave absorption plate 6. A support frame 8 is fixedly connected to the microwave absorption plate 6. An air-floating platform 9 is fixedly installed on the support frame 8. The air-floating platform 9 is horizontally and centrally arranged. It is an alumina ceramic air-floating platform 9. Air jet holes 10 are opened on the air-floating platform 9. The air jet holes 10 are arranged in a central array on the air-floating platform 9. Four air suction holes 11 are opened on the upper edge of the air-floating platform 9. The air-floating platform 9 has an integrated annular air collection chamber at the bottom. Each air intake hole 11 is fixedly connected to one side of an air outlet pipe 12, and a vacuum pump 13 is fixedly connected to one end of the air outlet pipe 12. A fixed frame 14 is fixedly connected to the inside of the drying chamber 5. A rotating magnetic field generator 15 is installed on the fixed frame 14. The rotating magnetic field generator 15 is symmetrically distributed at 120 degrees on the edge of the silicon wafer. It outputs alternating current through a frequency converter to generate a rotating magnetic field. Eddy currents are formed in the nickel layer by electromagnetic induction, which drives the silicon wafer to rotate with stepless speed regulation. By changing the current phase difference of the rotating magnetic field generator 15, the center of the rotating magnetic field is radially offset, which drives the silicon wafer to swing back and forth along the diameter direction, eliminating the fixed blind zone of the microwave field. A microwave generator 16 is fixedly connected to the inside of the drying chamber 5. Four microwave generators 16 are provided and are evenly distributed along the circumference of the side wall of the chamber. A horn-shaped antenna is installed at the transmitting port. The bottom of the air flotation platform 9 is fixedly connected to an air inlet pipe 17, which is fixedly connected to the bottom of the outer side of the body 1. A filter 18 is fixedly connected to one end of the air inlet pipe 17. Place the semiconductor silicon wafer to be dried on the air-floating platform 9, and close the machine cover 4 by rotating the hinge 3 to form a closed space in the drying chamber 5; External air enters the filter 18 through the air inlet pipe 17. The purified gas flows into the annular gas collection chamber at the bottom of the air-floating platform 9 and is then ejected through the jet holes 10 in the central array to form an air film that suspends the silicon wafer without contact. At the same time, the vacuum pump 13 works with the air outlet pipe 12 and the air intake hole 11 to adsorb excess gas at the edge of the air-floating platform 9 and stabilize the suspended state of the silicon wafer. Four microwave generators 16 emit microwaves circumferentially along the side wall of the drying chamber 5 to heat and dry the silicon wafer; the rotating magnetic field generator 15 is started simultaneously, and the rotating magnetic field is generated by the output of alternating current through the frequency converter power supply. The silicon wafer is driven to rotate steplessly by electromagnetic induction, and the silicon wafer is oscillating back and forth along the diameter direction by adjusting the current phase difference to ensure that each area of ​​the silicon wafer receives microwave energy uniformly.

[0022] Working principle: The semiconductor silicon wafer to be dried is placed on the air floating platform 9, and the cover 4 is closed by rotating the hinge 3, so that the drying chamber 5 forms a closed space; External air enters the filter 18 through the air inlet pipe 17. The purified gas flows into the annular gas collection chamber at the bottom of the air-floating platform 9 and is then ejected through the jet holes 10 in the central array to form an air film that suspends the silicon wafer without contact. At the same time, the vacuum pump 13 works with the air outlet pipe 12 and the air intake hole 11 to adsorb excess gas at the edge of the air-floating platform 9 and stabilize the suspended state of the silicon wafer. Four microwave generators 16 emit microwaves circumferentially along the side wall of the drying chamber 5 to heat and dry the silicon wafer; the rotating magnetic field generator 15 is started simultaneously, and the rotating magnetic field is generated by the output of alternating current through the frequency converter. The silicon wafer is driven to rotate steplessly by electromagnetic induction, and the silicon wafer is oscillating back and forth along the diameter direction by adjusting the current phase difference to ensure that each area of ​​the silicon wafer receives microwave energy uniformly. The hot and humid exhaust gas generated during the drying process flows out through the inside of the cavity to avoid moisture residue affecting the drying effect; the buffer pads at the bottom of the support leg 2 reduce equipment vibration and ensure overall stability. By combining the four circumferentially distributed microwave generators 16 with the oscillating and rotating motion of the silicon wafer driven by the rotating magnetic field, the fixed blind zone of the microwave field is eliminated, avoiding local overheating or insufficient drying of the silicon wafer, and significantly reducing the temperature difference within the wafer. The air jet holes 10 of the air flotation platform 9 form an air film to achieve contactless support of the silicon wafer. Combined with the negative pressure adsorption design of the suction holes 11, it reduces particulate contamination caused by mechanical contact and meets the stringent cleanliness requirements of semiconductor silicon wafers. The combination of support leg 2 and buffer pad reduces the impact of equipment vibration on drying accuracy; the rotating magnetic field generator 15 supports stepless speed regulation of silicon wafer rotation and reciprocating oscillation, which can adapt to the drying needs of silicon wafers of different sizes. The cover 4 can be opened and closed quickly by rotating the hinge 3. The external design of the air intake pipe 17 and filter 18 facilitates maintenance. The overall structure is reasonably laid out and suitable for small-batch, high-frequency use in the laboratory.

[0023] Structural Description: Body 1: As the main frame of the equipment, it is made of high-strength metal material. The interior forms the space for installing various functional components, and the exterior provides overall structural support for the equipment. It is the foundation for the installation of all components, ensuring that all components are arranged in an orderly manner and work together.

[0024] Support legs 2: Fixedly connected to the bottom of the machine body 1, four in total, to support the machine body 1 and keep the machine body 1 at a certain distance from the ground, so as to prevent ground moisture or impurities from directly affecting the internal components of the machine body; the buffer pads at the bottom of the support legs 2 are made of elastic materials (such as rubber), which can absorb the vibration generated during the operation of the equipment, reduce the interference of vibration on the drying process, and ensure the overall stability of the equipment.

[0025] Hing 3: It is fixedly connected between the body 1 and the cover 4. Through its own rotation characteristics, it realizes the rotational connection between the cover 4 and the body 1, so that the cover 4 can be opened and closed flexibly, which facilitates the loading and unloading of silicon wafers and the maintenance of the equipment.

[0026] Cover 4: It is rotatably connected to the body 1 via hinge 3 and is made of a material that matches the body 1. When closed, it can form a closed drying space (drying chamber 5) together with the body 1 to prevent microwave leakage and external impurities from entering. When open, it is convenient for operation and maintenance.

[0027] Drying chamber 5: Located inside the main body 1, it is a cylindrical cavity that provides a closed environment for drying silicon wafers, allowing microwave energy and airflow to be concentrated on the silicon wafers. At the same time, it facilitates the control of parameters such as temperature and humidity inside the cavity, ensuring a stable drying process.

[0028] Microwave Absorption Plate 6: Located at the bottom inside the drying chamber 5, it is made of microwave-absorbing material. It can absorb excess microwave energy in the drying chamber 5, prevent excessive reflection of microwaves in the chamber to form energy superposition, prevent local overheating of silicon wafers, and reduce the impact of microwaves on other components of the equipment.

[0029] Sealing adhesive 7: Adhesive is applied to the outside of the microwave absorption plate 6 to firmly fix the microwave absorption plate 6 to the bottom of the drying chamber 5, preventing it from loosening or shifting during equipment operation. It also serves as a seal to prevent impurities or moisture from seeping into the gap between the microwave absorption plate 6 and the chamber.

[0030] Support frame 8: Fixedly connected to microwave absorption plate 6, made of high temperature resistant and high strength material, used to support air floating platform 9, so that air floating platform 9 can be stably positioned at a suitable height in drying chamber 5, ensuring that silicon wafers are in the optimal drying position.

[0031] Air-floating platform 9: Made of alumina ceramic, it is horizontally and centrally fixed on the support frame 8. Alumina ceramic has the characteristics of high temperature resistance, corrosion resistance, smooth surface and not easy to generate particulate pollution, which is suitable for non-contact support of semiconductor silicon wafers. As a carrier platform for silicon wafers, the air-floating platform 9 forms an air film through the gas ejected from the air jet hole 10 to achieve non-contact suspension of silicon wafers and avoid mechanical contact from damaging the surface of silicon wafers.

[0032] Air jet holes 10: Arranged in a central array on the air-floating platform 9, several air jet holes 10 are evenly distributed to spray out purified gas to form a uniform gas film, supporting the suspension of the silicon wafer. At the same time, the airflow can carry away some of the water vapor generated during the silicon wafer drying process.

[0033] Suction holes 11: Four are evenly distributed on the upper edge of the air-floating platform 9. They work in conjunction with the vacuum pump 13 to absorb excess gas from the edge of the air-floating platform 9, balance the gas film pressure, stabilize the suspension state of the silicon wafer, and prevent the silicon wafer from shifting or shaking on the gas film.

[0034] The exhaust pipe 12 is fixedly connected at one end to the suction port 11 and at the other end to the vacuum pump 13. It serves as a channel for gas flow, transporting the excess gas adsorbed by the suction port 11 to the vacuum pump 13 for discharge.

[0035] Vacuum pump 13: It is connected to suction port 11 through air outlet pipe 12 to provide negative pressure suction. It works with suction port 11 to adsorb excess gas at the edge of air floating platform 9 to ensure stable suspension of silicon wafer.

[0036] Fixed frame 14: Fixedly connected to the inside of the drying chamber 5, made of high-strength and high-temperature resistant material, used to install and fix the rotating magnetic field generator 15, ensuring that the rotating magnetic field generator 15 is stable in position during operation and does not shake.

[0037] Rotating magnetic field generator 15: mounted on the mounting bracket 14, symmetrically distributed at 120 degrees along the edge of the silicon wafer, generates a rotating magnetic field by outputting alternating current through a frequency converter; eddy currents are formed in the nickel layer of the silicon wafer by electromagnetic induction, driving the silicon wafer to rotate with stepless speed regulation; at the same time, by changing the phase difference of the current, the center of the rotating magnetic field is radially offset, causing the silicon wafer to oscillate back and forth along the diameter direction, thereby eliminating the fixed blind zone of the microwave field and ensuring that all areas of the silicon wafer receive microwave energy uniformly.

[0038] Microwave generator 16: Fixedly connected to the inside of the drying chamber 5, four of them are evenly distributed along the circumference of the side wall of the chamber, and a horn-shaped antenna is installed at the emission port for transmitting microwave energy; the four evenly distributed microwave generators 16 can form a relatively uniform microwave field in the drying chamber 5 to heat and dry the silicon wafer, and the horn-shaped antenna can enhance the directional emission effect of microwaves and improve energy utilization.

[0039] Air intake pipe 17: One end is fixedly connected to the bottom of the air float 9, and the other end is fixedly connected to the bottom of the outer side of the body 1. It serves as a channel for gas to enter the air float 9 and delivers external air to the annular air collection chamber at the bottom of the air float 9.

[0040] Filter 18: Fixedly connected to one end of the air inlet pipe 17, used to purify the gas entering the air flotation platform 9, filter out dust, particles and other impurities in the gas, avoid impurities contaminating the silicon wafer surface, and meet the cleanliness requirements of semiconductor silicon wafers.

[0041] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A microwave semiconductor silicon wafer drying device, comprising a body (1), characterized in that: The bottom of the body (1) is fixedly connected to a support leg (2); A hinge (3) is fixedly connected to the body (1), and a cover (4) is fixedly connected to the hinge (3). The cover (4) is rotatably connected to the body (1) through the hinge (3). A drying chamber (5) is opened inside the body (1). A microwave absorption plate (6) is provided at the bottom of the inner side of the drying chamber (5), and a sealing and fixing adhesive (7) is provided on the outer side of the microwave absorption plate (6). A support frame (8) is fixedly connected to the microwave absorption plate (6), and an air-floating platform (9) is fixedly installed on the support frame (8). The air-floating platform (9) is arranged horizontally in the center, and air-jet holes (10) are provided on the air-floating platform (9). The air-jet holes (10) are arranged in a central array on the air-floating platform (9).

2. The microwave semiconductor silicon wafer drying equipment according to claim 1, characterized in that: The bottom of the support leg (2) is provided with a cushioning pad.

3. The microwave semiconductor silicon wafer drying equipment according to claim 2, characterized in that: The drying chamber (5) is a cylindrical cavity.

4. The microwave semiconductor silicon wafer drying equipment according to claim 3, characterized in that: The air flotation platform (9) has an air intake hole (11) on its upper edge. There are four air intake holes (11) and they are evenly distributed on the edge of the air flotation platform (9). The bottom of the air flotation platform (9) has an integrated annular air collection chamber.

5. The microwave semiconductor silicon wafer drying equipment according to claim 4, characterized in that: Each of the air intake holes (11) is fixedly connected to one side of an air outlet pipe (12), and a vacuum pump (13) is fixedly connected to one end of the air outlet pipe (12).

6. The microwave semiconductor silicon wafer drying equipment according to claim 5, characterized in that: A fixing frame (14) is fixedly connected to the inside of the drying chamber (5). A rotating magnetic field generator (15) is installed on the fixing frame (14). The rotating magnetic field generator (15) is symmetrically distributed at 120 degrees on the edge of the silicon wafer.

7. The microwave semiconductor silicon wafer drying equipment according to claim 6, characterized in that: A microwave generator (16) is fixedly connected to the inside of the drying chamber (5). There are four microwave generators (16) and they are evenly distributed along the circumference of the side wall of the chamber. A horn-shaped antenna is installed at the emission port of the microwave generator (16).

8. The microwave semiconductor silicon wafer drying equipment according to claim 7, characterized in that: The bottom of the air-floating platform (9) is fixedly connected to an air inlet pipe (17), which is fixedly connected to the bottom of the outer side of the body (1). A filter (18) is fixedly connected to one end of the air inlet pipe (17).

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