A pressure pulse and carbon deposit resistant boost pressure temperature sensor

Abstract

The utility model relates to a kind of pressure pulse and carbon deposit prevention's pressure temperature sensor of supercharging, it is characterized by, including: support component and detection component, support component includes shell and upper cover, shell inside is provided with mounting groove, and mounting groove is provided with air inlet channel;Upper cover is buckled on mounting groove, and the side of upper cover close to mounting groove is provided with I-shaped flow guide plate;Detection component includes circuit board and pressure sensor, and circuit board is embedded in mounting groove;Pressure sensor is set on circuit board, and upper cover is pressed on circuit board, and first cavity and second cavity are formed between I-shaped flow guide plate and circuit board, air inlet channel is set in first cavity, and pressure sensor is set in second cavity.The utility model realizes pulse air pressure buffering attenuation, avoids airflow direct impact pressure sensor, reduces fatigue damage and precision drift;Secondly, reduce the direct contact of impurity and sensor, avoid sensor surface area carbon, prolong service life.

Description

Technical Field

[0001] This utility model relates to the field of pressure and temperature sensor technology, and in particular to a pressure and temperature sensor that is resistant to pressure pulses and carbon buildup. Background Technology

[0002] As a key component of the engine intake system, the boost pressure and temperature sensor's core function is to convert the intake pressure and temperature signals after engine boosting and cooling into electrical signals and transmit them to the ECU, providing important information for engine operation control.

[0003] In existing technologies, the structure of boost pressure and temperature sensors typically involves directly introducing exhaust gas into the surface of the pressure sensor. The pulsed air pressure generated during the intake process will cause cyclic impacts on the internal chip of the sensor, which can easily lead to chip performance degradation over a long period of time. Secondly, impurities in the intake medium can easily form carbon deposits in key parts of the sensor, causing blockage of the air passage or obstruction of the detection channel. This directly leads to problems such as drift in detection accuracy and abnormal signal output of the sensor. In severe cases, it can cause the entire sensor to fail, affecting the control accuracy and operational stability of the engine. Utility Model Content

[0004] Therefore, the technical problem to be solved by this utility model is to overcome the defects of the existing pressure and temperature sensors, which are prone to carbon buildup and blockage and drift in detection accuracy due to the cyclic impact of the intake medium on the chip.

[0005] To solve the above-mentioned technical problems, this utility model provides a booster pressure and temperature sensor that prevents pressure pulses and carbon buildup, comprising: A support assembly includes a housing and a top cover. The housing has an internal mounting groove and an air intake channel extending to the outside of the housing. The top cover is fastened to the mounting groove, and an I-shaped baffle is provided on the side of the top cover near the mounting groove. The detection component includes a circuit board and a pressure sensor. The circuit board is embedded in the mounting groove and sleeved on the outside of the air intake channel. The pressure sensor is located on the side of the circuit board away from the mounting groove. The upper cover is pressed against the circuit board. A first cavity and a second cavity are formed between the I-shaped guide plate and the circuit board. The first cavity and the second cavity are connected. The air intake channel is located in the first cavity, and the pressure sensor is located in the second cavity.

[0006] In one embodiment of the present invention, the detection component further includes a conditioning chip disposed on the side of the circuit board away from the pressure sensor.

[0007] In one embodiment of this invention, the surface of the circuit board and the surface of the conditioning chip are covered with a waterproof layer.

[0008] In one embodiment of the present invention, the detection component further includes a thermistor, which is disposed within the air intake channel and electrically connected to the circuit board.

[0009] In one embodiment of the present invention, the housing is provided with a slot that mates with the upper cover, and a sealing layer is filled between the upper cover and the slot.

[0010] In one embodiment of the present invention, an output interface is further provided on one side of the housing, and the output interface is electrically connected to the circuit board.

[0011] In one embodiment of the present invention, a fixing ring is further provided on the side wall of the housing, and the fixing ring is integrally formed with the housing.

[0012] In one embodiment of this utility model, a sealing groove is provided on the outer side of the air intake channel near the input port, and a sealing ring is provided in the sealing groove.

[0013] In one embodiment of this utility model, the air outlet of the air inlet channel is flush with the surface of the circuit board near the pressure sensor.

[0014] In one embodiment of this utility model, the air intake channel is integrally formed with the housing.

[0015] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art: This invention discloses a pressure and temperature sensor designed to prevent pressure pulses and carbon buildup. An I-shaped baffle plate disperses the instantaneous impact force of the airflow, and the first chamber attenuates the pulse pressure. Combined with a connected dual-chamber design that buffers before detection, this design avoids direct airflow impact on the pressure sensor, reducing fatigue damage and accuracy drift, while ensuring complete pressure signal transmission. Furthermore, the nested layout of the circuit board and air intake channel, and the separate chamber design of the pressure sensor and air intake channel, reduce direct contact between impurities and the sensor. The baffle plate guides the airflow in an orderly manner, reducing eddy current dead zones, and the first chamber acts as a sedimentation zone for impurities, causing carbon buildup to concentrate around the air intake channel, preventing blockage of the detection channel and contamination of the sensor surface, thus extending the sensor's lifespan. Attached Figure Description

[0016] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a cross-sectional view of the internal structure of this utility model; Figure 3 This is an exploded view of the overall structure of this utility model; Figure 4 for Figure 3 Schematic diagram of the middle shell structure; Figure 5 for Figure 3 Schematic diagram of the upper and middle covers; Figure 6 for Figure 3 Exploded view of the structure of the detection component; Figure 7 This is the gas flow diagram of this utility model; Explanation of reference numerals in the accompanying drawings: 1. Support assembly; 2. Detection assembly; 11. Housing; 12. Top cover; 13. First cavity; 14. Second cavity; 15. Sealing layer; 21. Circuit board; 22. Pressure sensor; 23. Conditioning chip; 24. Waterproof layer; 25. Thermistor; 26. Sealing ring; 111. Mounting groove; 112. Air intake channel; 113. Slot; 114. Output interface; 115. Retaining ring; 116. Sealing groove; 121. I-shaped guide vane. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0018] Reference Figures 1-7 As shown, this utility model discloses a booster pressure and temperature sensor that prevents pressure pulses and carbon buildup, comprising: Support assembly 1 includes a housing 11 and a top cover 12. The housing 11 has a mounting groove 111 inside, and an air intake channel 112 is provided in the mounting groove 111, extending to the outside of the housing 11. The top cover 12 is fastened to the mounting groove 111, and an I-shaped guide plate 121 is provided on the side of the top cover 12 near the mounting groove 111. The detection component 2 includes a circuit board 21 and a pressure sensor 22. The circuit board 21 is embedded in the mounting groove 111 and sleeved on the outside of the air intake channel 112. The pressure sensor 22 is located on the side of the circuit board 21 away from the mounting groove 111. The upper cover 12 is pressed against the circuit board 21. The I-shaped guide plate 121 and the circuit board 21 form a first cavity 13 and a second cavity 14, which are connected. The air intake channel 112 is located in the first cavity 13, and the pressure sensor 22 is located in the second cavity 14.

[0019] In the above structure, the I-shaped guide plate 121 on the inner side of the upper cover 12 forms a structured cavity partition with the circuit board 21. The pressurized airflow delivered by the intake channel 112 must first enter the first cavity 13, and then flow to the second cavity 14 (the mounting area of ​​the pressure sensor 22) through the hollow or gap of the guide plate. The I-shaped structure can dissipate the instantaneous impact force of the pulse airflow, avoiding direct impact of the airflow on the pressure sensor 22. Secondly, the brief stagnation of the airflow in the first cavity 13 can attenuate the fluctuation amplitude of the pulse air pressure, making the airflow pressure entering the second cavity 14 more stable, reducing fatigue damage to the sensor chip caused by pulse cycle impact, and reducing the risk of accuracy drift. The connection design between the first cavity 13 and the second cavity 14 not only ensures the effective transmission of the pressure signal (the intake pressure can be completely transmitted to the pressure sensor 22), but also achieves a balance between "pulse attenuation" and "signal fidelity" through the "buffering before detection" path design, solving the problem of detection signal fluctuation caused by direct impact of airflow in traditional sensors.

[0020] The circuit board 21 is mounted on the outside of the intake channel 112, and the pressure sensor 22 is located in the second cavity 14. This layout reduces the probability of impurities in the intake medium (such as oil-gas mixtures and particulate matter) directly contacting the pressure sensor 22. Carbon deposits mainly form around the intake channel 112 in the first cavity 13, rather than on the sensor detection surface, avoiding signal distortion caused by carbon deposits clogging the detection channel or adhering to the sensor surface. The baffle guides the airflow along a fixed path, forming an orderly airflow circulation and reducing dead zones in the airflow within the cavity. At the same time, the first cavity 13 serves as an impurity settling area, allowing some large particles of impurities to settle at the bottom of the cavity during the airflow buffering process, rather than entering the second cavity 14 with the airflow, further reducing the risk of carbon buildup around the pressure sensor 22 and extending the service life of the pressure sensor 22.

[0021] Furthermore, the detection component 2 also includes a conditioning chip 23, which is disposed on the side of the circuit board 21 away from the pressure sensor 22; the surface of the circuit board 21 and the surface of the conditioning chip 23 are covered with a waterproof layer 24.

[0022] Specifically, the conditioning chip 23 is the core component of signal processing, and its core function is to convert the raw signals collected by the sensor into standardized signals that can be recognized and utilized by the ECU. In this invention, the waterproof layer 24 on the surface of the circuit board 21 is made of adhesive. Potting is used to seal the surfaces of the circuit board 21 and the conditioning chip 23, leaving the pressure sensor 22 exposed. Specifically, the potting process allows the adhesive to completely fill the gaps between the circuit board 21, the conditioning chip 23, and the housing 11, as well as key parts such as the pins and solder joints of the circuit components, forming a sealed, encapsulated structure. This prevents condensation and moisture from corroding the electronic components on the surface of the circuit board 21, ensuring the accuracy of the detection data and extending the service life of the entire detection device.

[0023] Furthermore, the detection component 2 also includes a thermistor 25, which is disposed within the air intake channel 112 and is electrically connected to the circuit board 21.

[0024] Specifically, the thermistor 25 is installed within the intake passage 112, directly contacting the intake medium. It can collect the intake air temperature after boosting in real time, avoiding temperature deviations caused by thermal conduction lag and environmental interference in traditional indirect temperature measurement. This ensures that the temperature data accurately reflects the actual intake air condition, providing precise temperature parameter support for the engine ECU. The thermistor 25 and the pressure sensor 22 share the same circuit board 21 and are electrically connected, eliminating the need for an additional independent temperature detection module or signal transmission line. This allows the sensor to simultaneously perform boost pressure detection and intake air temperature detection functions, reducing the number of components and installation space required in the engine intake system, lowering the risk of signal interference from multi-module collaboration, and simplifying the overall system architecture. The temperature and pressure signals are transmitted to the conditioning chip 23 through the same circuit board 21, enabling synchronous conditioning, calibration, and output of the two types of signals, avoiding signal delays or deviations caused by split transmission. After receiving the synchronized temperature and pressure signals, the ECU can more accurately calculate the intake air volume, adjust the fuel injection quantity and ignition timing, further optimizing the engine's combustion efficiency and emission performance.

[0025] Furthermore, the housing 11 is provided with a slot 113 that mates with the upper cover 12, and a sealing layer 15 is filled between the upper cover 12 and the slot 113.

[0026] Specifically, the upper cover 12 and the housing 11 are detachably connected via a slot 113. Similarly, to ensure the sealing of the upper cover 12, a sealing layer 15 is filled between the upper cover 12 and the slot 113. As a preferred embodiment of this utility model, the sealing layer 15 is made of sealant, which can completely fill the gap between the upper cover 12 and the slot 113, completely blocking the leakage path of external impurities, oil-gas mixture in the intake medium, and condensate inside the sensor. This not only prevents external impurities from entering the cavity and contaminating the core components, but also prevents internal condensate from overflowing from the assembly gap and back-eroding the housing 11 or surrounding pipelines.

[0027] Furthermore, an output interface 114 is provided on one side of the housing 11, and the output interface 114 is electrically connected to the circuit board 21.

[0028] Specifically, the output interface 114 is directly electrically connected to the circuit board 21, and the raw signals collected by the pressure sensor 22 and the thermistor 25 are processed by the conditioning chip 23 and then output to the ECU in a centralized manner, avoiding the signal diversion and attenuation problems caused by traditional distributed wiring.

[0029] Furthermore, a fixing ring 115 is provided on the side wall of the housing 11, and the fixing ring 115 is integrally formed with the housing 11.

[0030] Specifically, the one-piece molded fixing ring 115 provides a stable mounting point for the sensor, adapting to the assembly requirements of the engine intake system and improving installation convenience and positioning accuracy. Secondly, the one-piece molding process also enhances the structural rigidity of the housing 11, and combined with the overall vibration-resistant design, reduces the impact of vibration on internal components, ensuring detection stability. Similarly, the intake channel 112 and the housing 11 are integrally molded using injection molding, facilitating subsequent assembly.

[0031] Furthermore, a sealing groove 116 is provided on the outer side of the air intake channel 112 near the input port, and a sealing ring 26 is provided in the sealing groove 116.

[0032] Specifically, the sealing groove 116, in conjunction with the sealing ring 26, blocks leakage between the inlet of the air intake channel 112 and the mounting hole, ensuring the accuracy of air intake pressure and temperature detection.

[0033] Furthermore, the air outlet of the air intake channel 112 is flush with the surface of the circuit board 21 on the side near the pressure sensor 22.

[0034] Specifically, the air outlet is flush with the surface of the circuit board 21, so that the airflow is smoothly directed and evenly applied to the pressure sensor 22, reducing airflow turbulence and impact, and improving pressure detection accuracy; it also avoids the formation of a step gap between the channel and the circuit board 21, reducing carbon buildup and condensate retention, and ensuring smooth airflow.

[0035] In summary, this utility model introduces a booster pressure and temperature sensor that prevents pressure pulses and carbon buildup. The I-shaped baffle 121 disperses the instantaneous impact force of the airflow, and the first cavity 13 attenuates the pulse air pressure. Combined with the interconnected dual-cavity design of buffering before detection, it avoids direct airflow impact on the pressure sensor 22, reducing fatigue damage and accuracy drift, while ensuring complete pressure signal transmission. Secondly, the nested layout of the circuit board 21 and the air intake channel 112, and the cavity separation design of the pressure sensor 22 and the air intake channel 112, reduce direct contact of impurities with the sensor. The baffle guides the airflow to flow in an orderly manner, reducing eddy dead zones, and the first cavity 13 serves as an impurity settling area, causing carbon buildup to concentrate around the air intake channel 112, avoiding blockage of the detection channel and contamination of the sensor surface, thus extending the sensor's service life.

[0036] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A pressure pulsation and carbon deposit resistant boost pressure temperature sensor characterized by, include: A support assembly includes a housing and a top cover. The housing has an internal mounting groove and an air intake channel extending to the outside of the housing. The top cover is fastened to the mounting groove, and an I-shaped baffle is provided on the side of the top cover near the mounting groove. The detection component includes a circuit board and a pressure sensor. The circuit board is embedded in the mounting groove and sleeved on the outside of the air intake channel. The pressure sensor is located on the side of the circuit board away from the mounting groove. The upper cover is pressed against the circuit board. A first cavity and a second cavity are formed between the I-shaped guide plate and the circuit board. The first cavity and the second cavity are connected. The air intake channel is located in the first cavity, and the pressure sensor is located in the second cavity.

2. The pressure pulsation and carbon deposit proof charge pressure temperature sensor of claim 1, wherein: The detection component also includes a conditioning chip, which is disposed on the side of the circuit board away from the pressure sensor.

3. The pressure pulsation and carbon deposit proof charge pressure temperature sensor of claim 2, wherein: The surface of the circuit board and the surface of the conditioning chip are covered with a waterproof layer.

4. The pressure pulse and carbon deposit proof boost pressure temperature sensor of claim 1, wherein: The detection component also includes a thermistor, which is disposed within the air intake channel and is electrically connected to the circuit board.

5. The pressure pulse and carbon deposit proof boost pressure temperature sensor of claim 1, wherein: The housing is provided with a slot that mates with the top cover, and a sealing layer is filled between the top cover and the slot.

6. The pressure pulse and carbon deposit proof charge pressure temperature sensor of claim 1, wherein: An output interface is also provided on one side of the housing, and the output interface is electrically connected to the circuit board.

7. The pressure pulse and carbon deposit proof, boost pressure temperature sensor of claim 1, wherein: The side wall of the housing is also provided with a fixing ring, which is integrally formed with the housing.

8. The pressure and temperature sensor against pressure pulses and carbon buildup according to claim 1, characterized in that: A sealing groove is provided on the outer side of the air intake channel near the inlet, and a sealing ring is provided in the sealing groove.

9. The pressure pulse and carbon deposit proof, boost pressure temperature sensor of claim 1, wherein: The air outlet of the air intake channel is flush with the surface of the circuit board on the side closest to the pressure sensor.

10. The pressure pulse and carbon deposit proof boost pressure temperature sensor of claim 1, wherein: The air intake channel is integrally formed with the housing.

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