A multi-parameter interfeed type borehole testing device based on spatial variability for deep overburden

Abstract

The utility model discloses a kind of deep overburden multi-parameter mutual feedback type hole testing devices based on spatial variability, belong to soil testing device technical field.The deep overburden multi-parameter mutual feedback type hole testing device based on spatial variability includes main part, sound wave emission component, side wall friction measurement component, cone tip resistance measurement component and side pressure measurement component.Sound wave emission component, side wall friction measurement component, cone tip resistance measurement component and side pressure measurement component are respectively set in main part.The device can complete all tests once hole forming, compared with traditional testing method, can effectively improve testing efficiency and measurement accuracy.

Description

Technical Field

[0001] This utility model belongs to the technical field of soil testing devices, specifically relating to a multi-parameter mutual feedback borehole testing device for deep overburden layers based on spatial variability. Background Technology

[0002] In geotechnical engineering investigation, Vs (shear wave velocity), qc (cone tip resistance), and Em (Maynard modulus) are key indicators for evaluating the dynamic properties, bearing capacity, and deformation capacity of soil, respectively. Traditional testing methods typically require separate tests for Vs, qc, and Em, with the data then brought back to the laboratory for offline analysis and comparison. However, this step-by-step approach reveals significant limitations under complex geological conditions. Specifically, the inventors found in major engineering investigations such as Jinping and Baihetan that traditional CPT and pressuremeter tests cannot be performed simultaneously at the same location, and borehole offset can interfere with the accurate assessment of the spatial variability of the soil. Furthermore, multiple drilling operations in deep borehole exploration can easily cause unloading cracks in the borehole wall, resulting in a systematic underestimation of the measured Em by 15–20%, failing to accurately reflect the mechanical state of the in-situ soil.

[0003] In summary, improving the accuracy of surveying is a technical problem that urgently needs to be solved. Utility Model Content

[0004] The purpose of this invention is to provide a multi-parameter feedback in-hole testing device for deep overburden layers based on spatial variability, which has the advantage of high survey accuracy.

[0005] To achieve the aforementioned objectives, the technical solution adopted by this utility model is as follows: This application provides a multi-parameter feedback borehole testing device based on spatial variability in deep overburden layers, comprising a main body, an acoustic wave emitting component, a sidewall friction measurement component, a cone tip resistance measurement component, and a pressuremeter measurement component. The acoustic wave emitting component is disposed in the main body and is used to measure shear wave velocity. The sidewall friction measurement component is disposed in the main body and is used to measure sidewall friction resistance. The cone tip resistance measurement component is disposed in the main body and is used to measure the cone tip resistance when the main body penetrates the soil layer. The pressuremeter measurement component is disposed in the main body and is used to calculate the pressuremeter modulus of the soil.

[0006] In some embodiments, the pressure-side measurement component is configured to cooperate with the acoustic wave emission component and the cone tip resistance measurement component to measure data.

[0007] In some embodiments, the peripheral wall of the main body is provided with a spiral guide groove.

[0008] In some embodiments, a cone tip damper is provided at the bottom of the main body, and a cone tip resistance measuring component is disposed between the cone tip damper and the main body.

[0009] In some embodiments, the main body includes a first segment and a second segment, which are connected by a connecting segment. The pressure-spotting assembly includes a hollow bladder and a flexible protective sleeve. The hollow bladder is disposed between the first segment and the second segment, and the two ends of the flexible protective sleeve are connected to opposite sides of the first segment and the second segment.

[0010] In some embodiments, the hollow capsule is fitted onto the peripheral wall of the connecting section.

[0011] In some embodiments, the sidewall friction measurement assembly includes a sliding sleeve fitted onto the main body, and a friction sensor is disposed between the sliding sleeve and the main body.

[0012] In some embodiments, the main body is a hollow tubular structure.

[0013] In some embodiments, the acoustic emitting component includes an acoustic emitting chip.

[0014] In some embodiments, the acoustic emission chip is disposed on the top of the main body.

[0015] This utility model has the following beneficial effects: 1. This device can complete all tests in a single hole drilling operation, which effectively improves testing efficiency compared to traditional testing methods. Furthermore, it effectively eliminates the influence of factors such as hole position deviation and unloading disturbance on the test results, thus improving testing accuracy.

[0016] 2. During the testing process, the measured data can be verified and calibrated to improve measurement accuracy.

[0017] 3. After the main body reaches the test depth, Vs and qc can be acquired almost simultaneously, and the posterior estimate of Em at that depth can be calculated. This value can be used immediately to guide subsequent tests or directly output. Real-time data processing effectively improves test efficiency compared to traditional testing methods. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the deep overburden multi-parameter mutual feedback in-hole testing device based on spatial variability of this utility model.

[0019] Icon labels: 1-First segment, 2-Connecting segment, 3-Second segment, 4-Acoustic wave emitting component, 5-Hollow capsule, 6-Flexible protective sleeve, 7-Sliding sleeve, 8-Friction sensor, 9-Cone tip resistance measuring component, 10-Cone tip damper, 11-Main body, 12-Side wall friction measuring component, 13-Helical guide groove, 14-Side pressure measuring component. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Unless otherwise specified, the technical means used in the embodiments are conventional means well known to those skilled in the art.

[0021] In the description of this utility model, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] This application provides a multi-parameter feedback in-hole testing device for deep overburden layers based on spatial variability, including a main body 11, an acoustic wave emitting component 4, a sidewall friction measurement component 12, a cone tip resistance measurement component 9, and a pressure-side measuring component 14. The acoustic wave emitting component 4, the sidewall friction measurement component 12, the cone tip resistance measurement component 9, and the pressure-side measuring component 14 are respectively disposed on the main body 11.

[0023] The main body 11 is used to drill into the soil, enabling the various components to perform measurement operations. The drive structure that drives the main body 11 to move can be selected from existing drive structures. For example, the main body 11 can be connected to a drive device on the ground via a drill rod, enabling the main body 11 to penetrate the soil.

[0024] The acoustic wave emitting component 4 is used to measure the shear wave velocity (Vs), which is an important parameter for evaluating the strain stiffness and dynamic characteristics of soil.

[0025] The cone tip resistance measuring component 9 is used to measure the cone tip resistance (qc) when the main body 11 penetrates the soil layer.

[0026] The sidewall friction measurement component 12 is used to measure the sidewall friction resistance (fs). The combination of qc and fs can determine the soil type. The specific determination method is well-known to those skilled in the art; for example, the friction ratio Rf = fs / qc. Cohesive soils typically have a higher Rf, while sandy soils have a lower Rf. Furthermore, for different types of soil layers, their Rf, qc, and fs curves differ, which can also be used to determine the soil type.

[0027] The pressuremeter measurement component 14 is used to calculate the pressuremeter modulus (Em) of the soil.

[0028] In this embodiment, the acoustic wave emitting component 4, the cone tip resistance measuring component 9, the side wall friction measuring component 12, and the pressure-side component 14 are all technically mature products in the prior art. Those skilled in the art can choose the appropriate type as needed.

[0029] This device can complete all tests in a single drilling operation, significantly improving testing efficiency compared to traditional methods. Furthermore, it effectively eliminates the influence of factors such as hole position deviation and unloading disturbances on the test results, thus improving test accuracy.

[0030] Furthermore, during the testing process, the measured data can be verified and calibrated to improve measurement accuracy. For example, the processor can process the sensing data from the acoustic wave emitting component 4, the cone tip resistance measuring component 9, the sidewall friction measuring component 12, and the pressure-side component 14. The processor is equipped with a large data model. Vs and qc are relatively easy to obtain accurately, while Em is relatively more difficult to measure accurately. Therefore, the large data model in the processor can calculate an Em value correction parameter in real time based on the Vs and qc data, and then use this correction parameter to correct the measured value of Em, thereby improving the test accuracy.

[0031] Furthermore, once the main body 11 reaches the test depth, it can acquire Vs and qc almost simultaneously and calculate the posterior estimate of Em at that depth. This value can be used immediately to guide subsequent tests or directly output, processing data in real time, which effectively improves test efficiency compared to traditional testing methods.

[0032] In some embodiments, the pressure-side measurement component 14 is configured to cooperate with the acoustic wave emission component 4 and the cone tip resistance measurement component 9 to measure data.

[0033] The pressure-side measurement component 14 is configured to work with the acoustic wave emitting component 4 and the cone tip resistance measurement component 9 to measure data. This means that the Em value measured by the pressure-side measurement component 14 can be corrected based on the Vs value measured by the acoustic wave emitting component 4 and the qc value measured by the cone tip resistance measurement component 9 to improve test accuracy.

[0034] For example, the processor may include a digital signal processing module (DSP module), such as the Texas Instruments (TI) TMS320C6000 series or ADI's SHARC series chips. The DSP module can process digital signals in real time and may pre-store the algorithm of the Bayesian joint inversion model. During testing, the measured Vs, qc, and original Em values ​​are first acquired. Using the stable Vs as prior information and qc as observational evidence, the easily disturbed Em measurement value is corrected in real time, outputting a more accurate and reliable corrected Em value. In continuous testing, the spatial statistical characteristics of the parameters (such as the covariance matrix) are calculated in real time, directly outputting the variogram parameters for random field modeling, which can be directly used for random field inversion, saving investment. The relevant content of the aforementioned Bayesian joint inversion model algorithm is described in the prior application "A Multi-parameter Feedback In-hole Testing Device and Method Based on Spatial Variability in Deep Covering Layers" (202610068371.6), and will not be repeated here.

[0035] It should be noted that the specific code, working principle, programming code of the model forming algorithm, and hardware connection circuit of the processor controlling the operation of various components of this device are well known to those skilled in the art, and will not be described in detail here.

[0036] In some embodiments, the peripheral wall of the main body 11 is provided with a spiral guide groove 13.

[0037] The spiral guide groove 13 can be used to drive the main body 11 to move. When the ground equipment drives the main body 11 to move, it can apply a rotational force to the main body 11, causing the spiral guide groove 13 and the soil on the borehole wall to move, making deep hole advancement more labor-saving and faster. Furthermore, through rotational guidance, it effectively counteracts the eccentric force caused by uneven ground hardness, ensuring that the probe descends vertically and improving the accuracy of the acquired data.

[0038] Of course, some data measured by the rotational downward movement of the main body 11 may differ from those measured by the direct thrust movement. This data can be processed by a processor to obtain the required data type. The data model used by the processor to process the data is well known to those skilled in the art and will not be described further here.

[0039] In some embodiments, a cone tip damper 10 is provided at the bottom of the main body 11, and a cone tip resistance measuring component 9 is disposed between the cone tip damper 10 and the main body 11.

[0040] During the penetration of the main body 11 into the soil, when it encounters hard inclusions (such as gravel), the main body 11 will generate severe impact vibrations. The cone tip sensor can buffer the impacts and vibrations received by the main body 11, protecting the cone tip resistance measuring component 9 and the precision components installed on the main body 11.

[0041] The cone tip damper 10 is a technologically mature product in the prior art, and the technicians of this application can choose the appropriate type according to their needs.

[0042] The cone tip resistance measurement component 9 may include a cone tip resistance sensor, which senses the soil resistance. A strain gauge is usually set in the cone tip resistance sensor. The resistance causes it to undergo a small deformation, resulting in a change in resistance, thereby outputting a qc value.

[0043] There are mature products of cone tip resistance sensors in the prior art. Those skilled in the art can choose the appropriate type as needed. The specific circuits for the electrical connection between the cone tip resistance sensor and the processor, as well as the circuits for controlling its operation, are well known to those skilled in the art and will not be described in detail here.

[0044] When encountering hard inclusions (such as gravel), the data measured by the cone tip resistance sensor will be biased due to the action of the cone tip damper 10. This data can be cleaned by the processor to ensure the accuracy of the measured data.

[0045] In some embodiments, the main body 11 includes a first segment 1 and a second segment 3, which are connected by a connecting segment 2. The pressure-side measuring assembly 14 includes a hollow bladder 5 and a flexible protective sleeve 6. The hollow bladder 5 is disposed between the first segment 1 and the second segment 3, and the two ends of the flexible protective sleeve 6 are connected to opposite sides of the first segment 1 and the second segment 3.

[0046] When the hollow capsule 5 is working, hydraulic oil is injected into the hollow capsule 5 through the high-pressure oil circuit, so that it expands evenly. The hollow capsule 5 applies radial pressure to the surrounding soil wall and simultaneously measures the pressure value and volume change, thereby obtaining a pressure-volume curve (pV curve). Based on the pV curve, the modulus of pressure side of the soil Em can be calculated.

[0047] It should be noted that the auxiliary components required for the operation of the hollow bladder 5, such as the hydraulic oil station, pressure measuring components, and volume change measuring components, are well known to those skilled in the art and will not be described in detail here. The circuitry and programming code that control the expansion and contraction of the hollow bladder 5 and the operation of its auxiliary components via the processor are also well known to those skilled in the art and will not be described in detail here.

[0048] The flexible protective sleeve 6 is made of a flexible material that can deform, such as rubber with a protective layer.

[0049] The flexible protective sleeve 6 is used to protect the hollow bladder 5 when the main body 11 is drilling into the soil. When the hollow bladder 5 expands, it abuts against the flexible protective sleeve 6, and then the flexible protective sleeve 6 applies radial pressure to the soil of the borehole wall.

[0050] It should be noted that when the hollow capsule 5 applies pressure to the borehole wall soil through the flexible protective sleeve 6, the measured pressure value and volume change may differ from the data measured when the hollow capsule 5 directly applies pressure to the borehole wall soil. The processor can correct the measured data to obtain the required data type. The data model used by the processor to correct the data is well-known to those skilled in the art and will not be elaborated here.

[0051] The connecting section 2 allows the hollow capsule 5 to be housed between the first section 1 and the second section 3. When the main body 11 drills into the soil, the soil will not directly exert force on the hollow capsule 5.

[0052] In some embodiments, the hollow capsule 5 is fitted onto the peripheral wall of the connecting section 2.

[0053] The advantage of this design is that the hollow capsule 5 can be limited by the connecting section 2, which improves the reliability of fixing the hollow capsule 5.

[0054] In some embodiments, the sidewall friction measurement assembly 12 includes a sliding sleeve 7, which is sleeved on the main body 11, and a friction sensor 8 is disposed between the sliding sleeve 7 and the main body 11.

[0055] When the main body 11 penetrates the soil, the hole wall exerts a force on the sliding sleeve 7, which can be measured by the friction sensor 8, and the side wall friction fs has been obtained.

[0056] The friction resistance sensor 8 includes technologically mature products in the prior art. Those skilled in the art can choose the appropriate type as needed. The circuit and programming code that control the operation of the friction resistance sensor 8 through the processor are well known to those skilled in the art and will not be described in detail here.

[0057] In some embodiments, the main body 11 is a hollow tubular structure.

[0058] The hollow structure of the main body 11 allows for the installation of precision components, such as a processor, inside the main body 11.

[0059] In an embodiment where the main body 11 includes a first segment 1, a second segment 3, and a connecting segment 2, mounting portions may be provided on opposite sides of the first segment 1 and the second segment 3 to connect the connecting segments 2 and maintain the closed state of the main body 11. The interior of the connecting segment 2 may be a hollow structure, allowing wire harnesses and oil circuits to be laid between the first segment 1 and the second segment 3.

[0060] In some embodiments, the acoustic emitting component 4 includes an acoustic emitting chip.

[0061] When a high-frequency alternating voltage is applied, the acoustic wave emitting crystal generates high-frequency mechanical vibration, emitting shear waves. After the shear waves propagate in the soil, they are picked up by the receiving acoustic wave emitting crystal. By measuring the propagation time of the shear waves over a fixed distance, the shear wave velocity Vs can be calculated.

[0062] Acoustic wave emitting chips include technologically mature products in the prior art. Those skilled in the art can choose the appropriate type according to their needs. The circuitry and programming code that control the operation of the acoustic wave emitting chip via a processor are well-known to those skilled in the art and will not be described in detail here. When the acoustic wave emitting chip is working, the chip generates tangential mechanical vibration through the inverse piezoelectric effect. This vibration causes the surrounding medium particles to vibrate perpendicular to the wave propagation direction, thereby exciting shear waves that propagate into the medium. When the shear wave propagates to the receiving position, the tangential vibration of the medium is converted into an electrical signal by the receiving chip through the direct piezoelectric effect, allowing the processor to acquire relevant data for measuring the shear wave velocity.

[0063] In some embodiments, the acoustic emission chip is disposed on the top of the main body 11.

[0064] The acoustic wave emitting chip is located on the top of the main body 11, which facilitates the installation and maintenance of the acoustic wave emitting chip and reduces the risk of soil and sediment in the hole affecting the measurement results.

[0065] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Any modifications, alterations, alterations, or substitutions made by those skilled in the art to the technical solutions of the present utility model without departing from the spirit of the present utility model shall fall within the protection scope defined by the claims of the present utility model.

Claims

1. A multi-parameter mutual-feed in-hole testing device for deep overburden layers based on spatial variability, characterized in that, include: Main body (11); A sound wave emitting component (4) is disposed on the main body (11), and the sound wave emitting component (4) is used to measure the shear wave velocity; A sidewall friction measuring component (12) is disposed on the main body (11), and the sidewall friction measuring component (12) is used to measure the sidewall friction resistance. A cone tip resistance measuring component (9) is disposed on the main body (11). The cone tip resistance measuring component (9) is used to measure the cone tip resistance when the main body (11) penetrates the soil layer. A pressuremeter measuring component (14) is disposed on the main body (11), and the pressuremeter measuring component (14) is used to calculate the pressuremeter modulus of the soil.

2. The in-hole testing device for deep overburden layers based on spatial variability according to claim 1, characterized in that, The pressure-side measuring component (14) is configured to work with the acoustic wave emitting component (4) and the cone tip resistance measuring component (9) to measure data.

3. The in-hole testing device based on spatial variability and multi-parameter mutual feedback in deep overburden layers according to claim 1, characterized in that, The peripheral wall of the main body (11) is provided with a spiral guide groove (13).

4. The in-hole testing device for deep overburden layers based on spatial variability according to claim 1, characterized in that, A cone tip damper (10) is provided at the bottom of the main body (11), and the cone tip resistance measuring assembly (9) is disposed between the cone tip damper (10) and the main body (11).

5. The in-hole testing device for deep overburden layers based on spatial variability according to claim 1, characterized in that, The main body (11) includes a first segment (1) and a second segment (3), which are connected by a connecting segment (2). The pressure-metering assembly (14) includes: A hollow capsule (5) is disposed between the first segment (1) and the second segment (3); The flexible protective sleeve (6) is connected at both ends to the opposite sides of the first segment (1) and the second segment (3).

6. The in-hole testing device for deep overburden layers based on spatial variability according to claim 5, characterized in that, The hollow capsule (5) is fitted onto the periphery of the connecting section (2).

7. The in-hole testing device for deep overburden layers based on spatial variability according to claim 1, characterized in that, The sidewall friction measurement assembly (12) includes a sliding sleeve (7), which is sleeved on the main body (11), and a friction sensor (8) is provided between the sliding sleeve (7) and the main body (11).

8. The in-hole testing device for deep overburden layers based on spatial variability according to claim 1, characterized in that, The main body (11) is a hollow tubular structure.

9. The in-hole testing device for deep overburden layers based on spatial variability according to claim 1, characterized in that, The acoustic wave emitting component (4) includes an acoustic wave emitting chip.

10. The in-hole testing device for deep overburden layers based on spatial variability according to claim 9, characterized in that, The acoustic emission wafer is disposed on the top of the main body (11).

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