Wafer top needle fracture early warning device

Abstract

The utility model discloses a kind of wafer trocar needle fracture early warning devices, early warning device includes: the lower end of wafer trocar needle is arranged at the pressure sensor, connect in data processing module of pressure sensor, and connect in controller of data processing module;Pressure sensor is used to detect the pressure value of the lower end of wafer trocar needle applied to pressure sensor in real time, data processing module is used to obtain the pressure value of pressure sensor and convert into pressure data, controller is used to obtain the pressure data of data processing module and according to preset early warning logic determines whether to start early warning processing action.It detects the pressure value of wafer trocar needle in real time through pressure sensor, compares according to pressure value and wafer trocar needle maximum stress value, to judge whether control heating disc stops descending, avoid because wafer trocar needle inclination causes its and heating disc trocar needle hole jamming to cause damage to wafer trocar needle, reduce wafer fragment risk, improve production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a wafer pin breakage early warning device. Background Technology

[0002] In semiconductor process equipment, especially wafer thin film deposition equipment, the temperature of various components inside the process chamber is also very high due to the high process temperature. During the thin film deposition process, wafer pushers pass through pusher holes on a heating plate, and the wafer is supported on the top of the wafer pushers. Heating of the wafer is achieved by controlling the raising and lowering of the heating plate. However, during the raising and lowering of the heating plate, especially during the descent, the wafer pushers undergo thermal deformation due to the high-temperature process environment, causing the wafer pushers to tilt relative to the pusher holes. This can lead to the wafer pushers getting stuck or even jammed in the pusher holes. If the heating plate continues to descend, it can cause problems such as wafer pusher breakage, wafer fragmentation, or damage to the robotic arm. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a wafer pin breakage early warning device to solve the technical problem that existing wafer pins may get stuck or damaged during the descent of the heating plate.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] In a first aspect, embodiments of this utility model provide a wafer pin breakage early warning device, comprising: a pressure sensor disposed at the lower end of the wafer pin, a data processing module connected to the pressure sensor, and a controller connected to the data processing module; the pressure sensor is used to detect the pressure value applied to the lower end of the wafer pin in real time, the data processing module is used to acquire the pressure value of the pressure sensor and convert it into pressure data, and the controller is used to acquire the pressure data of the data processing module and determine whether to initiate an early warning processing action according to a preset early warning logic.

[0006] The pressure sensor has a central support surface and an annular detection surface surrounding the central support surface. When the lower end of the wafer pin slides from the central support surface to the annular detection surface, the controller initiates a warning logic judgment.

[0007] The pressure sensor is a piezoelectric ceramic.

[0008] The wafer pin has a weight at its lower end, a support assembly at the bottom of the pressure sensor, a mounting groove at the top of the support assembly, the pressure sensor being recessed in the mounting groove, and the weight being movable up and down within the mounting groove.

[0009] The controller is used to acquire pressure data from the data processing module and determine whether to initiate an early warning processing action based on preset early warning logic, including the following steps:

[0010] As the heating plate descends, the pressure sensor detects the pressure value exerted by the wafer ejector pin on the pressure sensor in real time.

[0011] Determine whether the pressure value exceeds a preset threshold;

[0012] If so, the heating plate will stop descending and an alarm will sound.

[0013] The step of determining whether the pressure value exceeds a preset threshold includes the following steps:

[0014] Determine whether the pressure value detected by the pressure sensor is zero;

[0015] If the pressure value is non-zero, the warning logic will be activated.

[0016] In the step of determining whether the pressure value exceeds a preset threshold, the preset threshold is the maximum stress value that the wafer pin can withstand when tilted.

[0017] The formula for calculating the maximum stress value is σ. _max σ _max =Md / 2I+N _2 cosα-f _1 -f _2 / A; where M = N _3 (Dtanα+t / cosα), I=π / 4(d / 2) 4 A = π(d / 2) 2 N _3 N represents the pressure exerted on the wafer ejector pin by the upper edge of the ejector pin hole on the heating plate. _2 Here, α is the pressure value detected by the pressure sensor, α is the angle between the wafer ejector pin and the vertical direction when tilted, D is the diameter of the ejector pin hole on the heating plate, d is the diameter of the wafer ejector pin, t is the depth of the ejector pin hole on the heating plate, and f is the depth of the ejector pin hole on the heating plate. _1 f is the frictional force exerted by the lower edge of the ejector pin hole of the heating plate on the wafer ejector pin. _2 The friction force exerted by the upper edge of the ejector pin hole of the heating plate on the wafer ejector pin.

[0018] Wherein, the stress value calculation formula σ _max In the middle, f _1 =μN _1 f _3 =μN _3 ; where N _2 -GN _1 sinα+N _3sinα-f _1 cosα-f _3 cosα=0, N _1 cosα-N _3 cosα-f _1 sinα-f _3 sinα=0, N1 is the pressure value exerted by the lower edge of the ejector pin hole of the heating plate on the wafer ejector pin, μ is the static friction coefficient, α=tan -1 D / t, f _3 G is the frictional force exerted by the upper edge of the ejector pin hole on the heating plate on the wafer ejector pin, and G is the gravity of the wafer ejector pin.

[0019] In the step of determining whether the pressure value detected by the pressure sensor is zero, a pressure sensor with a central support surface and an annular detection surface surrounding the central support surface is used. If the lower end of the wafer pin is supported on the central support surface, the warning judgment is not activated. If the lower end of the wafer pin slides to the annular detection surface, the warning judgment is activated.

[0020] This invention relates to a wafer ejector pin breakage early warning device. It uses a pressure sensor to detect the pressure value of the wafer ejector pin in real time. By comparing the pressure value with the maximum stress value of the ejector pin, it determines whether to control the heating plate to stop descending. This avoids damage to the wafer ejector pin caused by jamming between the wafer ejector pin and the ejector pin hole of the heating plate due to tilting. This early warning device and method can predict wafer ejector pin jamming, prevent ejector pin damage, reduce the risk of wafer fragmentation, and improve production efficiency.

[0021] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the wafer pin breakage early warning device and heating plate assembly state according to an embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of the overall structure of the wafer pin breakage early warning device according to an embodiment of the present invention.

[0024] Figure 3 This is an exploded view of the wafer pin breakage early warning device according to an embodiment of the present invention.

[0025] Figure 4 This is a flowchart of a wafer pin breakage early warning method according to an embodiment of the present invention.

[0026] Figure 5 This is a schematic diagram showing the force breakdown of the wafer pin in an inclined state in the wafer pin fracture early warning device according to an embodiment of the present invention.

[0027] Explanation of reference numerals in the attached figures:

[0028] Process chamber base plate 1, heating plate 2, ejector pin hole 21, lifting support assembly 22, ejector pin assembly 3, wafer ejector pin 31, counterweight 32, connection hole 321, support assembly 33, mounting slot 331, data processing module 34, pressure sensor 35, central support surface 351, annular detection surface 352, data transmission line 36. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0031] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] In semiconductor process equipment, especially wafer thin film deposition equipment, the process temperature is very high, and the temperature of various components inside the process chamber is also very high. During the thin film deposition process, wafer pins pass through pin holes on a heating plate, and the wafer is supported on the top of the wafer pins. Heating of the wafer is achieved by controlling the raising and lowering of the heating plate. However, during the raising and lowering of the heating plate, especially during the descent, the wafer pins undergo thermal deformation due to the high-temperature process environment, causing the wafer pins to tilt relative to the pin holes. This can lead to the wafer pins getting stuck or even becoming jammed in the pin holes. If the heating plate continues to descend, it can cause problems such as wafer pin breakage, wafer fragmentation, or damage to the robotic arm. To solve the above problems, this embodiment discloses a wafer pin breakage early warning device.

[0037] Please see Figure 1This is a simplified schematic diagram of a wafer ejector pin breakage early warning device and a heating plate assembly. It includes a heating plate 2, a process chamber base plate 1, and an ejector pin assembly 3. The process chamber base plate 1 is part of the complete thin-film deposition process chamber structure, with the process chamber itself located above it. The heating plate 2 is situated within the process chamber, and its bottom is supported and fixed by a lifting support assembly 22. The lifting support assembly 22 passes through the process chamber base plate 1, maintaining a sealed connection between the lifting support assembly 22 and the process chamber base plate 1. Figure 1 For schematic purposes, the sealing structure is omitted. The process chamber bottom plate 1 is also equipped with several ejector pin assemblies 3, with wafer ejector pins 31 of the ejector pin assemblies 3 passing through ejector pin holes 21 on the heating plate 2. Because the heating plate 2 has a certain thickness, its ejector pin holes 21 are relatively deep. When the wafer ejector pin 31 tilts due to factors such as thermal deformation, the sidewall of the wafer ejector pin 31 will become stuck with the top and bottom edges of the ejector pin hole 21. If the heating plate 2 continues to descend, the pressure exerted by the ejector pin hole 21 on the wafer ejector pin 31 will exceed its maximum stress value, ultimately causing the wafer ejector pin 31 to break. The wafer supported on top of the wafer ejector pin 31 will then fall into fragments. If the subsequent wafer transfer robot performs its original predetermined action, interference and collision will occur, resulting in damage.

[0038] To address the risk of breakage in the aforementioned wafer ejector pin 31, this embodiment provides a wafer ejector pin breakage early warning device. This device includes a pressure sensor 35 disposed at the lower end of the wafer ejector pin 31, a data processing module 34 connected to the pressure sensor 35, and a controller (not shown in the figure) connected to the data processing module 34. The pressure sensor 35 is used to detect the pressure value applied to the lower end of the wafer ejector pin 31 in real time. The data processing module 34 is used to acquire the pressure value from the pressure sensor 35 and convert it into pressure data. The controller is used to acquire the pressure data from the data processing module 34 and determine whether to initiate an early warning action based on preset early warning logic.

[0039] In this embodiment, to prevent the wafer ejector pin 31 from breaking during the descent of the heating plate 2, a pressure sensor 35 is installed below the lower end 311 of the wafer ejector pin 31. The pressure sensor 35 detects the pressure value exerted by the wafer ejector pin 31 on the sensor in real time. If the pressure value exceeds a preset threshold, it indicates that the wafer ejector pin 31 is stuck or jammed. In this case, a rapid warning action is required, such as stopping the descent of the heating plate 2, to avoid the risk of the wafer ejector pin 31 breaking due to the continued descent of the heating plate 2. In existing solutions, the wafer ejector pin 31 is periodically inspected and replaced based on usage experience, or a comprehensive investigation is conducted when a fault such as a wafer falling occurs. Compared with existing solutions, the warning device in this embodiment can promptly and accurately detect potential risks and quickly take warning actions, greatly reducing the risk of wafer ejector pin 31 breakage and ensuring the long-term, efficient, and safe operation of the process equipment.

[0040] During long-term operation of the thin film deposition equipment, it was found that the main factor causing the jamming phenomenon between the wafer ejector pin 31 and the ejector pin hole 21 of the heating plate 2 was the tilting caused by the deformation of the wafer ejector pin 31 due to high temperature.

[0041] To accurately determine whether the wafer ejector pin 31 has deformed and tilted, the pressure sensor 35 has a central support surface 351 and an annular detection surface 352 surrounding the central support surface 351. When the lower end of the wafer ejector pin 31 slides from the central support surface 351 to the annular detection surface 352, the controller initiates an early warning logic judgment. In this embodiment, the central support surface 351 of the pressure sensor 35 can be understood as a non-pressure detection area. When the wafer ejector pin 31 and the pressure sensor 35 are assembled into the ejector pin assembly 3, the central support surface 351 is located directly below the lower end 311 of the wafer ejector pin 31. When the wafer ejector pin 31 is in normal operating condition, the lower end 311 of the wafer ejector pin 31 is always supported on the central support surface 351. At this time, the pressure detection value of the pressure sensor 35 is zero. During this process, it can directly reflect that the ejector pin assembly 3 is in normal operating condition, without the need to initiate an early warning judgment.

[0042] In this embodiment, the pressure sensor 35 is a piezoelectric ceramic. The piezoelectric ceramic has a central support surface 351 and an annular detection surface 352. In other embodiments, other pressure sensors capable of detecting pressure values ​​can of course be used.

[0043] It is understood that in this embodiment, the pressure sensor 35 is a piezoelectric ceramic with a central support surface 351 and an annular detection surface 352. In other embodiments, when other types of pressure sensors are used, the lower end 311 of the wafer pin 31 can directly act on the detection surface of the pressure sensor 35. In this case, the pressure sensor 35 will feed back a non-zero pressure value to the controller. If the non-zero pressure value is within the set pressure value range, it indicates that the wafer pin 31 is operating normally. If it exceeds the preset threshold, it indicates that the wafer pin 31 is stuck and an early warning process needs to be initiated.

[0044] In this embodiment, a piezoelectric ceramic with a central support surface 351 and an annular detection surface 352 is used as the pressure sensor 35, which can improve the service life of the pressure sensor 35. Under normal operating conditions, the pressure sensor 35 does not work. Pressure detection is only activated when the wafer pin 31 tilts and the lower end 311 slides to the annular detection surface 352. Therefore, the energy consumption of the pressure sensor 35 can be reduced, its service life can be increased, and the cost of use can be reduced.

[0045] Please refer to the figure again. The specific structure of the ejector assembly 3 is as follows: the lower end 311 of the wafer ejector 31 is also provided with a counterweight 32, and the bottom of the pressure sensor 35 is also provided with a support assembly 33. The top of the support assembly 33 is provided with a mounting groove 331. The pressure sensor 35 is recessed in the mounting groove 331, and the counterweight 32 can move up and down in the mounting groove 331. The counterweight 32 is fixedly connected to the lower end of the wafer ejector 31, and it is used to automatically reset after the wafer ejector 31 moves up and down. The counterweight 32 is provided with a connecting hole 321 in the axial direction. The wafer ejector 31 passes through the connecting hole 321, and the lower end 311 extends out of the lower end face of the counterweight 32, so that the lower end 311 can contact the pressure sensor 35.

[0046] The data processing module 34 is connected to the lower end of the support component 33. A data transmission line 36 is also installed inside the support component 33. The data transmission line 36 is used to transmit the pressure detection signal of the pressure sensor 35 to the data processing module 34. The data processing module 34 processes the pressure detection signal and sends it to the controller for processing.

[0047] The controller includes a PLC, an industrial computer, a computer device, etc., and stores a software program inside. The software program is used to control the wafer pin breakage early warning device to perform early warning actions according to the preset early warning judgment logic.

[0048] In this embodiment, the pressure sensor 35 is used to detect the force exerted on the lower end 311 of the wafer ejector pin 31 during the descent of the heating plate 2, in order to determine whether there is a risk of breakage of the wafer ejector pin 31. It is understood that this wafer ejector pin breakage warning device is also applicable to the risk warning of wafer ejector pin breakage during the ascent of the heating plate 2. Actual testing revealed that if the wafer ejector pin 31 tilts and jams during the descent of the heating plate 2, the breaking force it experiences is much greater than during the ascent of the heating plate 2. Therefore, prioritizing the detection of the breaking force on the wafer ejector pin 31 during the descent of the heating plate 2 can basically ensure the safe and reliable operation of the wafer ejector pin 31.

[0049] Please see Figure 4 and Figure 5 The early warning method of the wafer pin breakage early warning device includes the following steps:

[0050] Step S100: During the descent of the heating plate 2, the pressure sensor 35 detects the pressure value of the wafer ejector pin 31 acting on the pressure sensor 35 in real time. Of course, in this step, the pressure of the heating plate 2 acting on the wafer ejector pin 31 acting on the pressure sensor 35 can also be detected simultaneously during the ascent of the heating plate 2. By detecting the pressure of the wafer ejector pin 31 in real time during its operation, the risk of breakage can be predicted in advance, so as to intervene in advance and avoid irreparable damage to the wafer ejector pin 31.

[0051] Step S200: Determine whether the pressure value exceeds a preset threshold; based on the detected real-time pressure value, compare the detected pressure value with the preset pressure threshold to determine whether to activate the early warning process. The preset threshold is the maximum breaking force measured during the design of the wafer ejector pin 31. If the external breaking force on the wafer ejector pin 31 exceeds the threshold, it may break and become unusable; otherwise, it can continue to operate.

[0052] Step S300: If yes, control the heating plate 2 to stop descending and trigger an alarm. If the real-time detected pressure value exceeds the preset threshold, it indicates that the wafer ejector pin 31 may be stuck. If the heating plate 2 continues to descend, the wafer ejector pin 31 may break. Therefore, it is necessary to quickly control the heating plate 2 to stop moving and wait for maintenance.

[0053] The early warning method of this embodiment uses a pressure sensor 35 to detect the pressure of the wafer pin 31 in real time. When the pressure on the wafer pin 31 exceeds a preset threshold, an early warning process can be initiated to proactively detect potential jamming or deadlock risks and avoid damage to the wafer pin 31 or the wafer.

[0054] The step S200, before determining whether the pressure value exceeds a preset threshold, further includes the following steps:

[0055] Step S201: Determine whether the pressure value detected by the pressure sensor 35 is zero;

[0056] Step S202: If the pressure value is non-zero, the warning logic judgment is initiated. In this warning method, in order to improve the service life of the pressure sensor 35, the lower end of the wafer pin 31 is supported on the non-detection surface of the pressure sensor 35. That is, during the normal operation of the wafer pin 31, the wafer pin 31 does not act on the pressure sensor 35. At this time, the pressure sensor 35 can remain in a dormant or non-working state to improve its service life.

[0057] In step S200, the step of determining whether the pressure value exceeds a preset threshold, the preset threshold is the maximum stress value that the wafer ejector pin can withstand when tilted. This maximum stress value refers to the maximum breaking force that the wafer ejector pin 31 can withstand based on its material and process requirements during its design.

[0058] The formula for calculating the maximum stress value is σ. _max σ _max =Md / 2I+N _2 cosα-f _1 -f _2 / A;

[0059] Among them, such as Figure 5 As shown in the diagram, based on the force decomposition diagram of wafer ejector pin 31, it can be seen that:

[0060] M = N _3 (Dtanα+t / cosα);

[0061] I = π / 4(d / 2) 4 ;

[0062] A = π(d / 2) 2 ;

[0063] N _3 N represents the pressure exerted on the wafer ejector pin by the upper edge of the ejector pin hole on the heating plate. _2 Here, α is the pressure value detected by the pressure sensor, α is the angle between the wafer ejector pin and the vertical direction when tilted, D is the diameter of the ejector pin hole 21 on the heating plate, d is the diameter of the wafer ejector pin 31, t is the depth of the ejector pin hole 21 on the heating plate 2, and f is the depth of the ejector pin hole 21 on the heating plate 2. _1 The frictional force exerted by the lower edge of the ejector pin hole 21 of the heating plate 2 on the wafer ejector pin 31, f _2 The frictional force acting on the wafer ejector pin 31 by the upper edge of the ejector pin hole 21 of the heating plate 2. Wherein, N... _3 N _2 It can be measured directly using a pressure sensor.

[0064] Wherein, the stress value calculation formula σ _max In the middle, f _1 =μN_1 f _3 =μN _3 ;

[0065] According to the principles of force decomposition and equilibrium, the following equation is satisfied:

[0066] N _2 -GN _1 sinα+N _3 sinα-f _1 cosα-f _3 cosα=0;

[0067] N _1 cosα-N _3 cosα-f _1 sinα-f _3 sinα=0;

[0068] N1 is the pressure exerted by the lower edge of the ejector pin hole of the heating plate on the wafer ejector pin, μ is the static friction coefficient, and α = tan - 1 D / t, f _3 G is the frictional force exerted by the upper edge of the ejector pin hole on the heating plate on the wafer ejector pin, and G is the gravity of the wafer ejector pin.

[0069] N1 and N can be calculated using the above mechanical decomposition equilibrium equation. _3 N _2 The relationship between them ultimately leads to the calculation of N. _2 The maximum value of N, which can be calculated _2 The maximum value can be compared with the actual pressure value detected by the pressure sensor 35 to reflect the breaking force currently borne by the wafer pin 31. The comparison between the two can determine whether an early warning process needs to be initiated.

[0070] In step S201, the step of determining whether the pressure value detected by the pressure sensor is zero, a pressure sensor 35 with a central support surface 351 and an annular detection surface 352 surrounding the central support surface 351 is used. If the lower end 311 of the wafer ejector pin 31 is supported by the central support surface 351, the warning judgment is not activated. If the lower end 311 of the wafer ejector pin 31 slides to the annular detection surface 352, the warning judgment is activated. That is, if the wafer ejector pin 31 tilts, the lower end will slide, which can initially trigger the warning mechanism. Then, based on the actual detected pressure value, it is further determined whether to perform the warning processing action.

[0071] The wafer pin breakage early warning device in this embodiment detects the pressure value of the wafer pin in real time through a pressure sensor. By comparing the pressure value with the maximum stress value of the pin, it determines whether to control the heating plate to stop descending. This avoids damage to the wafer pin caused by it getting stuck between the wafer pin and the pin hole of the heating plate due to tilting. The early warning device and method can predict wafer pin jamming, prevent pin damage, reduce the risk of wafer fragmentation, and improve production efficiency.

[0072] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A wafer top needle breakage early warning device, characterized in that, include: A pressure sensor is located at the lower end of the wafer ejector pin, a data processing module is connected to the pressure sensor, and a controller is connected to the data processing module. The pressure sensor is used to detect the pressure value applied to the lower end of the wafer ejector pin in real time. The data processing module is used to acquire the pressure value of the pressure sensor and convert it into pressure data. The controller is used to acquire the pressure data from the data processing module and determine whether to activate the warning processing action according to the preset warning logic. The pressure sensor has a central support surface and an annular detection surface surrounding the central support surface. When the lower end of the wafer ejector pin slides from the central support surface to the annular detection surface, the controller activates the warning logic judgment.

2. The wafer top needle breakage early warning device of claim 1, wherein, The pressure sensor is a piezoelectric ceramic.

3. The wafer top needle breakage early warning device of any one of claims 1 to 2, wherein, The lower end of the wafer ejector pin is also provided with a counterweight, the bottom of the pressure sensor is also provided with a support assembly, the top of the support assembly is provided with a mounting groove, the pressure sensor is recessed in the mounting groove, and the counterweight can be raised and lowered in the mounting groove.

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