A flexible testing device for testing IC chips

Abstract

The application provides a flexible detection device for detecting IC chips, comprising a feeding module, a detection module, a discharging module and a conveying module connected with each module, which are arranged in sequence along an IC chip carrier conveying path; the feeding module is used for reading the code of an IC chip box, opening a blocking rod and unstacking a carrier; the detection module is used for performing 2D image detection and 3D image detection on the IC chip and identifying surface defects; the conveying module is used for accurately conveying the IC chip carrier between each module; and the discharging module is used for stacking the IC chip carrier, closing the box blocking rod and discharging. The problem that it is difficult to adapt to the core demand of modern semiconductor industry for efficient and stable detection is solved.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to a flexible testing device for testing IC chips. Background Technology IC chips, as the core carrier of integrated circuits, are made by integrating electronic components such as transistors, capacitors, and resistors onto semiconductor materials. They are widely used in key fields such as computers, communications, consumer electronics, automotive electronics, medical devices, and industrial automation. The performance of IC chips directly determines the reliability of end products.

[0002] In existing technologies, the automation level of IC chip testing processes is low. During the loading stage, manual scanning of the material box information and manual opening of the material box barrier are required. After testing, the carriers must be manually stacked into the material box and the barrier closed. Each step involves significant manual intervention and low efficiency. Especially in batch testing scenarios, when processing 500 IC chip carriers in a single batch, the manual loading and unloading process can take over two hours. Furthermore, manual operation is prone to errors in material box information entry and barrier damage due to fatigue and inexperience, further affecting the continuity of testing. Meanwhile, while some automation solutions have achieved automation of the testing process, the integration of loading, unloading, and testing modules is insufficient, still relying on manual carrier transfer, making it difficult to meet the core requirements of the modern semiconductor industry for efficient and stable testing. Utility Model Content

[0003] The purpose of this application is to provide a flexible testing device for IC chips, so as to solve the technical problem of a flexible testing device for IC chips in the prior art.

[0004] A flexible inspection device for inspecting IC chips includes a feeding module, an inspection module, and an unloading module arranged sequentially along the IC chip carrier conveying path, as well as a conveying module connecting each module. The feeding module is used to read the codes of the IC chip boxes, open the baffles, and destacking the carriers. The inspection module is used to perform 2D image inspection and 3D image inspection on the IC chips to identify surface defects. The conveying module is used to accurately convey the IC chip carriers between the modules. The unloading module is used to stack the IC chip carriers, close the baffles of the boxes, and discharge the chips.

[0005] Furthermore, the feeding module includes a horizontally arranged material box placement platform, an industrial barcode reader fixed to one side of the material box placement platform, and a pneumatic stop lever opening mechanism installed at the output end of the material box placement platform; the surface of the material box placement platform is provided with positioning protrusions for limiting the IC chip material box; the pneumatic stop lever opening mechanism is driven by a cylinder to adapt to the opening action of the stop lever built into the material box.

[0006] Furthermore, the detection module includes at least one detection station, each equipped with an XY-axis positioning platform, an image acquisition component, and an embedded algorithm processing unit. The XY-axis positioning platform is used to drive the IC chip carrier to translate, enabling chip-by-chip detection. The image acquisition component includes a 2D optical head and a 3D line scan camera fixed above the XY-axis positioning platform, with the lens axes of both perpendicular to the surface of the IC chip carrier. The embedded algorithm processing unit is connected to the image acquisition component via Ethernet for real-time image data processing.

[0007] Furthermore, the detection module includes a first detection station and a second detection station arranged in series; the image acquisition component of the first detection station contains only a 2D optical head, used to acquire 2D images of the IC chip and detect surface dirt and solder joint defects; the image acquisition component of the second detection station contains only a 3D line scan camera, used to acquire 3D images of the IC chip and detect solder line spacing, solder line height, and solder joint defects; the two detection stations are connected by a connecting conveyor belt of the conveyor module.

[0008] Furthermore, it also includes a buffer re-inspection module located between the detection module and the unloading module. The buffer re-inspection module includes a vertical lifting buffer frame, a 3D rotating microscope, and a re-inspection industrial control computer. The vertical lifting buffer frame has multiple carrier placement layers along the vertical direction, and the layer switching is achieved by stepper motor drive. The 3D rotating microscope is fixed to the output side of the vertical lifting buffer frame by a bracket, and its lens can rotate 360°. The re-inspection industrial control computer is communicatively connected to the 3D rotating microscope and the algorithm processing unit of the detection module, and can retrieve historical detection images for comparison.

[0009] Furthermore, each layer of the vertical lifting buffer rack is equipped with a photoelectric sensor to detect whether an IC chip carrier is placed; the output end of the buffer rack is equipped with a push cylinder, which can push the carrier to the observation platform of the 3D rotating microscope.

[0010] Furthermore, it also includes a defective product processing module integrated into the output of the cache re-inspection module. The defective product processing module includes a CCD positioning camera, a three-axis motion platform, and an execution component. The CCD positioning camera is used to identify the specific location of the defective IC chip. The three-axis motion platform drives the execution component to move. The execution component is an ink valve or a laser cutting head, which are used to mark the defective product surface with ink or to cut the solder lines, respectively.

[0011] Furthermore, the conveying module includes a synchronous conveyor belt, a servo drive motor, and side guide plates; the surface of the synchronous conveyor belt is covered with an anti-slip rubber layer to prevent the carrier from slipping; the servo drive motor is connected to the drive shaft of the conveyor belt through a reducer to achieve stepless speed regulation; the side guide plates are symmetrically arranged on both sides of the conveyor belt, and the spacing between the guide plates can be adjusted by adjusting bolts to accommodate IC chip carriers of different sizes.

[0012] Furthermore, the unloading module includes a material box support platform, an electric stop lever closing mechanism, and a discharge roller conveyor; the material box support platform has the same structure as the material box placement platform of the loading module and is equipped with a weight sensor to detect the full state of the material box; the electric stop lever closing mechanism is driven by a servo motor and is adapted to the locking structure of the material box stop lever; the conveying direction of the discharge roller conveyor is perpendicular to the material box support platform, conveying the full material box to the manual material handling area.

[0013] Furthermore, the XY-axis positioning platform has vacuum adsorption holes on its surface, which generate negative pressure through a vacuum generator to adsorb the IC chip carrier; the platform's drive mechanism uses ball screw transmission; the outer side of the image acquisition component is equipped with a ring light source, the brightness of which can be automatically adjusted by the algorithm processing unit to adapt to IC chips with different surface reflectivity.

[0014] The testing device in this application forms an integrated, closed-loop process by sequentially setting up loading, testing, and unloading modules along the IC chip carrier transport path and connecting them with a conveyor module: the loading module automatically completes the reading of material boxes, opening of the stop levers, and unstacking of the carriers, replacing manual scanning, moving of the stop levers, and handling; the conveyor module realizes the precise transfer of the carriers between the modules, eliminating the need for manual transfer and ensuring connection stability; the unloading module automatically performs carrier stacking, stop lever closing, and unloading, avoiding manual stacking and handling of heavy material boxes; the four modules work together in a coordinated manner through signal linkage, fundamentally solving the problems of low automation, excessive manual intervention in each link, and inability to form a closed-loop process in the IC chip testing process in the background technology, and significantly improving testing efficiency and stability. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 2 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 3 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 4 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 5 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 6 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 7 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 8 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 9 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 10 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 11 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 12 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 13 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 14 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 15 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 16 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 17 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 18 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 19 This is a schematic diagram of a flexible testing device for detecting IC chips; Figure 20 This is a schematic diagram of a flexible testing device for detecting IC chips. Detailed Implementation

[0017] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0018] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0019] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0021] This application provides a flexible testing device for IC chips, including a feeding module, a testing module, and a discharging module arranged sequentially along the IC chip carrier conveying path, as well as a conveying module connecting each module; the feeding module is used to read the IC chip box code, open the baffle, and destacking the carrier; the testing module is used to perform 2D image testing and 3D image testing on the IC chip to identify surface defects; the conveying module is used to transport the IC chip carrier between the modules; and the discharging module is used to stack the IC chip carrier, close the box baffle, and discharge the chip.

[0022] In this embodiment, the flexible testing device for IC chips according to the present application embodiment realizes full automation of IC chip box automatic feeding, 2D / 3D joint testing, and automatic unloading, increasing the daily testing capacity. At the same time, modules such as re-inspection and defective product handling can be flexibly added according to subsequent needs to adapt to the testing requirements of different batches of IC chips.

[0023] The IC chip carrier is a plastic tray that holds the IC chips. Its surface features positioning grooves and QR codes, and it is compatible with, for example, 64-pin QFP packages. The loading module is a functional unit that reads the IC chip cassette codes, opens the baffle, and destacking the carriers. The cassettes are standard enterprise bins (e.g., 50 carriers per bin) and have built-in mechanical baffles to prevent carriers from falling. The inspection module is the core unit that identifies IC chip surface defects through 2D / 3D image acquisition and algorithm processing, covering 2D optical inspection (surface defects) and 3D line scan inspection (three-dimensional defects). The conveying module connects the conveying units of each module, ensuring smooth movement of the IC chip carriers between processes. The unloading module is a functional unit that handles carrier stacking, closes the cassette baffle, and discharges the chips, and is compatible with the cassette specifications of the loading module.

[0024] The flexible testing device is arranged in a straight line along the IC chip carrier transport path, with each module connected sequentially. Its specific composition is as follows: The device is laid out in a straight line along the IC chip carrier transport path, with a total length of 3.5m. Each module is rigidly connected through the transport module.

[0025] The feeding module includes a material box placement platform, an industrial barcode reader, and a pneumatic stop lever opening mechanism. The industrial barcode reader is fixed to the right side of the material box placement platform (150mm from the side of the material box) by an L-shaped bracket. The pneumatic stop lever opening mechanism is fastened to the aluminum alloy bracket at the output end of the material box placement platform by bolts, and is aligned with the position of the material box stop lever.

[0026] The detection module includes an XY-axis positioning platform, a 2D optical head, a 3D line scan camera, and an algorithm processing unit. The 2D optical head and the 3D line scan camera are suspended above the XY-axis positioning platform via a gantry. The algorithm processing unit is fixed to the side of the detection module by a metal shell and is connected to the image acquisition component via an Ethernet cable.

[0027] The conveying module includes a synchronous conveyor belt, a servo motor, and side guide plates. The conveyor belt is fixed to the ground frame through bearing seats, and the servo motor is connected to the drive shaft of the conveyor belt through a coupling. The side guide plates are connected to the guide rails on both sides of the conveyor belt through sliders, and the spacing can be adjusted by sliding along the guide rails.

[0028] The feeding module includes a material box support platform, an electric stop lever closing mechanism, and a discharge roller conveyor. The material box support platform is seamlessly connected to the end of the conveying module via a connecting plate. The electric stop lever closing mechanism is installed on the right side of the material box support platform. The discharge roller conveyor is fixed to the output end of the material box support platform via a bracket and is perpendicular to the support platform at 90°.

[0029] like Figure 1(Front view of the layout diagram) As shown, the device is laid out along a horizontal straight line, with each physical station and functional module corresponding to the others from left to right: Loading Station 1: Corresponds to the loading module, integrating a material box placement platform (with positioning protrusions), an industrial barcode reader (L-shaped bracket fixed to the right side of the station), and a pneumatic stop lever opening mechanism (bolted to the output end bracket of the station), performing material box barcode reading, stop lever opening, and destacking; Inspection Station 2: Corresponds to the inspection module, with an XY axis positioning platform (with vacuum adsorption holes) in the center of the station, a gantry frame above suspending a 2D optical head and a 3D line scan camera (lens perpendicular to the platform), and an embedded algorithm processing unit (Ethernet-connected image component) fixed to the side, performing 2D / 3D inspection; Unloading Station 3: Corresponds to the unloading module, integrating a material box support platform (with the same structure as the loading platform and built-in weight sensor), an electric stop lever closing mechanism (right side of the station), and an unloading roller conveyor (perpendicular to the support platform), performing carrier stacking, stop lever closing, and unloading. Each workstation is connected by a conveyor module. The conveyor belt is fixed to the workstation frame by bearing seats, and the side guide plates are arranged symmetrically (the spacing is adjustable).

[0030] like Figure 2 As shown in the top view of the layout, the workstations are arranged in a straight line: the material box placement platform of the loading workstation 1 is directly opposite the barcode reader lens, which is adapted to read the QR code of the material box; the XY axis platform of the detection workstation 2 is located in the center of the conveyor belt, and the 2D / 3D equipment is arranged along the length of the platform without obstruction; the discharge roller conveyor of the unloading workstation 3 is perpendicular to the conveyor belt, and the end points to the manual material picking area, which meets the "automatic material box conveying" requirement in the embodiment.

[0031] The working process in this embodiment includes: the operator places a cassette filled with IC chip carriers (e.g., containing 50 carriers) onto the cassette placement platform of the feeding module. Positioning protrusions on the platform surface mechanically limit the cassette's position. An industrial barcode reader automatically reads the QR code on the side of the cassette, obtains batch information (e.g., IC model, production time), and uploads it to the system. After the system confirms the cassette information is correct, the cylinder of the pneumatic stop lever opening mechanism drives the lever to rotate, opening the mechanical stop lever on the cassette itself. The vacuum suction cup of the destacking mechanism picks up the top layer of carriers from the cassette and conveys them to the inlet of the conveying module via a linear module, achieving automated feeding. The synchronous conveyor belt of the conveying module starts, and the side guide plate guides the carriers to prevent deviation. The servo motor provides real-time position feedback via an encoder. When the carrier reaches the inlet of the detection module, the conveyor belt stops, and the push cylinder precisely moves the carrier to the XY-axis positioning platform of the detection module. The inspection module completes defect detection: The XY-axis positioning platform fixes the carrier through vacuum adsorption, moving the carrier directly under the 2D optical head. The 2D optical head first reads the carrier's QR code and associates it with the batch information of the material box; the 2D optical head (with automatically adjusted brightness of the ring light source) takes images of the IC chip surface one by one, and identifies surface dirt (abnormal grayscale areas) and missing solder joints (template matching fails to find solder joint features) through image enhancement and edge detection algorithms; the XY-axis positioning platform moves the carrier to below the 3D line scan camera, which collects three-dimensional data of the solder lines and solder joints, calculates the solder line spacing and height through three-dimensional reconstruction and feature extraction algorithms, and determines whether there are any cold solder joints through grayscale distribution; the embedded algorithm processing unit summarizes the 2D / 3D inspection results in real time. If any indicator exceeds the threshold, it is marked as a defective product, and the inspection data is uploaded to the system database in real time. After the inspection is completed, the conveying module transfers the carrier from the inspection module to the material box support platform of the unloading module; the stacking mechanism places the carrier into the empty material box layer by layer according to the first-in-first-out principle. The weight sensor on the material box support platform monitors the weight in real time. When the weight of the full box is reached, the system determines that the material box is full; the electric stop lever closing mechanism drives the servo motor to rotate, which drives the locking tongue to engage with the locking hole of the material box stop lever, completing the stop lever closing; the discharge roller conveyor starts and transports the full material box to the manual material picking area. The operator only needs to remove the material box periodically.

[0032] In this embodiment, manual sampling inspection is replaced to achieve full-process automation, reducing labor requirements and solving the problem of low efficiency in traditional inspection. The device includes a 2D / 3D joint inspection unit gate, covering planar and three-dimensional defects, reducing the false judgment rate and avoiding misjudgments caused by human subjective factors. Each module of the device is independently designed, and buffer re-inspection, defective product handling, and other modules can be added between the inspection module and the unloading module according to subsequent needs, without reconstructing the overall device, adapting to different inspection scenarios. The modular layout of this embodiment provides a foundation for expansion, reflecting the core advantage of "flexible inspection".

[0033] In one embodiment, the feeding module includes a horizontally arranged material box placement platform, an industrial barcode reader fixed to one side of the material box placement platform, and a pneumatic stop lever opening mechanism installed at the output end of the material box placement platform; the surface of the material box placement platform is provided with positioning protrusions for limiting the IC chip material box; the pneumatic stop lever opening mechanism is driven by a cylinder to drive a lever, which is adapted to the opening action of the stop lever built into the material box.

[0034] In this embodiment, the feeding module enables automatic positioning, barcode scanning, and barrier opening of the material box, reducing the feeding time per box and lowering the barrier damage rate. It is also compatible with the existing material box specifications of enterprises, eliminating the need to change the material box structure and significantly improving the stability and efficiency of the feeding process.

[0035] The cassette placement platform is the basic support unit of the feeding module, used to place IC chip cassettes. A surface positioning structure ensures the cassettes are fixed in position. The industrial barcode reader is used to read the QR code information on the cassettes and must meet the requirement of easy scanning without adjustment after placement. The pneumatic stop lever opening mechanism is an actuator that uses pneumatic drive to open the cassette stop lever and must be compatible with the mechanical structure of the cassette's built-in stop lever. The positioning protrusion is a mechanical limiting structure on the surface of the cassette placement platform, matching the positioning groove on the bottom of the cassette to ensure the cassette's unique position after placement.

[0036] The feeding module is further detailed, and its specific components are as follows: The material box placement platform has four positioning protrusions on its surface. The platform is fixed to the ground with expansion bolts, and the bottom is welded with reinforcing ribs to improve stability. The positioning protrusions are fixed to the pre-set screw holes on the surface of the platform by threaded connections. The industrial barcode reader is a fixed QR code reader. The reader is mounted on the side column of the placement platform via an adjustable angle bracket. The bracket can rotate 360° around the column and slide up and down to adjust its position. The pneumatic lever opening mechanism includes a double-acting cylinder, an L-shaped lever, and a photoelectric sensor. The cylinder is fixed to the bracket at the output end of the placement platform via a flange; the L-shaped lever is hinged to the cylinder piston rod via a pin; and the photoelectric sensor is fixed to the bracket below the lever via a snap-fit.

[0037] The working principle of this embodiment includes: the operator places a cassette filled with IC chip carriers (with four grooves on the bottom that match the positioning protrusions of the placement platform) onto the cassette placement platform. Rapid positioning is achieved through the groove-protrusion interaction: the positioning protrusions insert into the grooves at the bottom of the cassette, restricting the movement of the cassette in the X and Y directions, ensuring that the QR code on the side of the cassette is aligned with the lens of the industrial barcode reader; the baffle at the edge of the placement platform restricts the swaying of the cassette in the Z direction, ensuring stable placement and providing a stable reference for subsequent barcode scanning and lever opening. After the system starts, the barcode reader emits a red laser line, aiming at the QR code on the side of the cassette; it acquires and decodes the QR code image, extracting cassette information (such as IC model "QFP64-0805", batch "20240901", carrier quantity "50"); the information is uploaded to the central control system, which verifies the integrity of the information. If the verification passes, a lever opening command is issued; if the verification fails (e.g., the QR code is blurry), the system issues an audible and visual alarm to prompt the operator to handle the situation. After the main control system triggers the command, the cylinder of the pneumatic stop lever opening mechanism is vented, and the piston rod extends, driving the L-shaped lever to rotate around the pin shaft. The end of the lever presses against the protruding part of the material box stop lever, pushing the stop lever upward as the cylinder stroke progresses (the material box stop lever rotates around its own axis) until the stop lever is completely disengaged from the carrier limit position. The photoelectric sensor on the mechanism detects that the stop lever is fully opened (by blocking the sensor light) and sends a signal to the system indicating that the stop lever opening is complete. After receiving the signal, the system triggers the subsequent destacking mechanism (such as a vacuum suction cup) to pick up the top layer of carrier in the material box, completing the material loading preparation. This pneumatic drive method avoids damage to the stop lever caused by manual operation, meeting the equipment protection requirements of flexible detection.

[0038] In this embodiment, automatic positioning and barcode scanning replace manual operation, reducing the time required to load a single box and avoiding manual data entry errors. The pneumatically driven lever provides uniform force, avoiding the forceful operation of manual manipulation. No modifications to existing material boxes are required (utilizing only the built-in baffle and bottom groove of the material box), lowering the barrier to equipment modification and allowing for rapid implementation by businesses.

[0039] In one embodiment, the detection module includes at least one detection station, each equipped with an XY-axis positioning platform, an image acquisition component, and an embedded algorithm processing unit. The XY-axis positioning platform is used to drive the IC chip carrier to translate, enabling chip-by-chip detection. The image acquisition component includes a 2D optical head and a 3D line scan camera fixed above the XY-axis positioning platform, with the lens axes of both perpendicular to the surface of the IC chip carrier. The embedded algorithm processing unit is connected to the image acquisition component via Ethernet for real-time image data processing.

[0040] The detection module of this application integrates 2D / 3D image acquisition and algorithm processing functions, and can perform simultaneous detection of two types of defects at the same workstation, meeting the high-precision detection requirements of server IC chips.

[0041] The XY-axis positioning platform drives the IC chip carrier to translate, realizing a motion mechanism that precisely aligns each chip.

[0042] The image acquisition component comprises a 2D optical head and a 3D line scan camera, a combination of devices that acquire planar and stereo images of the chip, respectively. The embedded algorithm processing unit receives and processes image data in real time, serving as the core control unit for executing defect identification algorithms. The IC chip carrier is a tray used to hold BGA chips, with a surface capable of arranging 20 chips in a matrix.

[0043] The specific components of this detection module are as follows: The XY-axis positioning platform is driven by ball screws and servo motors. The platform base is fixed to the detection module frame with bolts. The X-axis slider and Y-axis guide rail are connected by linear bearings, and the Y-axis platform can slide along the X-axis. The servo motor is fixed to both ends of the platform by motor mounts and connected to the ball screws by couplings. The image acquisition assembly includes a 2D optical head and a 3D line scan camera, both of which are fixed to the gantry beam by an integrated mounting plate. The mounting plate can be adjusted up and down by a screw. The lens axis is perpendicular to the platform surface.

[0044] The embedded algorithm unit is suspended on the side of the detection module by a metal bracket and is connected to the 2D optical head and 3D line scan camera via a shielded Ethernet cable, which is protected by a metal corrugated pipe.

[0045] The ring light source is fixed to the front of the 2D optical head lens via a threaded connection and is installed coaxially with the lens.

[0046] The working principle of this embodiment includes: the conveying module transfers the carrier loaded with chips to the XY-axis positioning platform. The platform generates negative pressure through vacuum suction holes to adsorb the carrier and prevent slippage during movement. The system reads the QR code on the carrier to obtain the chip arrangement matrix information and issues a positioning command. The XY-axis positioning platform drives the carrier to align. The embedded algorithm processing unit controls the XY-axis positioning platform to move along a preset path according to the chip matrix information: first, the first chip is moved to directly below the 2D optical head, and the platform stops and maintains its position. After the single chip is detected, the platform sequentially drives the subsequent chips to the detection position until all 20 chips have been detected. During the movement, the encoder provides real-time feedback on the platform position to ensure the alignment accuracy of each chip. For each chip, the image acquisition component performs the following steps: 2D measurement first, followed by 3D measurement. The ring light source is automatically adjusted to a suitable brightness, and the 2D optical head captures an image of the chip surface, obtaining a planar image containing solder balls and the chip body, focusing on capturing surface contaminants (areas with abnormal grayscale values) and missing solder joints (areas without solder balls). The XY-axis positioning platform drives the carrier to pass under the 3D line scanning camera at a constant speed of 5mm / s. The 3D line scanning camera emits a laser to scan the chip surface, acquiring the three-dimensional contour data of the solder balls and generating a point cloud image containing the height and spacing of the solder balls. The image data is transmitted in real time to the embedded algorithm processing unit via Ethernet to achieve defect detection.

[0047] In this embodiment, 2D / 3D detection is integrated at the same workstation to avoid repeated positioning and shorten the detection time of a single chip; 2D detection detects planar defects (dirt, missing parts), and 3D detection detects three-dimensional defects (height, spacing), solving the problem of missing some defects in traditional single detection equipment, and achieving a high detection coverage.

[0048] In one embodiment, the detection module includes a first detection station and a second detection station arranged in series; the image acquisition component of the first detection station includes only a 2D optical head, used to acquire 2D images of the IC chip and detect surface dirt and solder joint defects; the image acquisition component of the second detection station includes only a 3D line scan camera, used to acquire 3D images of the IC chip and detect solder line spacing, solder line height, and solder joint defects; the two detection stations are connected by a connecting conveyor belt of a conveyor module.

[0049] In this embodiment, a dual-detection station design is used, with the first station focusing on 2D planar detection and the second station focusing on 3D stereoscopic detection. This division of labor and cooperation shortens the total detection time for a single chip, meeting the dual requirements of efficiency and accuracy in mass production scenarios.

[0050] The first inspection station, the pre-station in the serial inspection process, is equipped only with a 2D image acquisition component, focusing on the detection of planar defects in IC chips. The second inspection station, the post-station in the serial inspection process, is equipped only with a 3D image acquisition component, focusing on the detection of three-dimensional defects in IC chips. A connecting conveyor belt connects the two inspection stations, ensuring the smooth transfer of the IC chip carrier between the stations.

[0051] like Figure 11 As shown in the front view, the inspection module is divided into two serial stations: the first inspection station 2 corresponds to the 2D inspection sub-module, which is equipped with only a 2D optical head (gantry suspension), an XY axis platform (vacuum adsorption), and a 2D algorithm unit to perform surface dirt / missing solder joint detection; the second inspection station 3 corresponds to the 3D inspection sub-module, which is equipped with only a 3D line scan camera (side-mounted bracket), an XY axis platform (consistent with the first station), and a 3D algorithm unit to perform solder wire height / spacing detection; the two stations are connected by a connecting conveyor belt.

[0052] like Figure 12 (Top view) As shown: The two workstations are arranged side by side along the conveyor belt, with 2D / 3D equipment set on both sides of the conveyor belt, and the algorithm units are symmetrically installed on the outside of the workstations.

[0053] The working principle of this embodiment includes: carrier loading and first-station 2D inspection. The conveying module transports the carrier loaded with chips to the first inspection station. The XY-axis positioning platform fixes the carrier by vacuum adsorption and reads the carrier's QR code to obtain chip arrangement information. The ring light source is adjusted to a suitable brightness, and the XY-axis platform drives the carrier to move the chips one by one to below the 2D optical head. The 2D optical head acquires images of the chip surface, and the algorithm processing unit executes a feature extraction algorithm to identify surface dirt and determine whether pin solder joints are missing. The inspection results are stored in real time and associated with the carrier's QR code. After the 2D inspection is completed, the platform pushes the carrier to the connecting conveyor belt.

[0054] The connecting conveyor belt starts, smoothly transporting the carrier from the first inspection station to the entrance of the second inspection station. Side guide plates on both sides of the conveyor belt ensure the carrier does not deviate. Upon reaching the second station, a push cylinder moves the carrier to its XY-axis positioning platform, where it is fixed by vacuum adsorption. The XY-axis platform moves along the same chip matrix path as the first station, driving the carrier to move each chip one by one to below the 3D line scan camera, passing through the laser scanning area at a uniform speed. The 3D line scan camera emits laser lines to illuminate the chip pins, acquiring the pin's three-dimensional contour data. The algorithm processing unit executes a feature fitting algorithm to identify defects such as height or spacing deviations. The detection results (if associated with 2D results) are stored. After 3D inspection is completed, the platform pushes the carrier back to the main conveyor module for subsequent unloading.

[0055] In this embodiment, the dual-station division of labor avoids the superposition of 2D+3D processes at a single station, reducing the inspection time for a single chip, increasing daily production capacity, and meeting the full inspection requirements of large-scale mass production. Each station is equipped with only a single type of image acquisition component, avoiding redundant equipment functions (such as not needing to integrate 2D / 3D equipment at the same station), reducing the manufacturing cost and maintenance difficulty of a single station. Both stations use a consistent XY-axis positioning platform to ensure a unified chip positioning reference; algorithms can be optimized specifically for a single inspection type (e.g., focusing on planar features for 2D and focusing on three-dimensional contours for 3D).

[0056] In one embodiment, the device further includes a buffer re-inspection module disposed between the detection module and the unloading module. The buffer re-inspection module includes a vertical lifting buffer frame, a 3D rotating microscope, and a re-inspection industrial control computer. The vertical lifting buffer frame has multiple carrier placement layers along the vertical direction, and the layer switching is realized by stepper motor drive. The 3D rotating microscope is fixed to the output side of the vertical lifting buffer frame by a bracket, and its lens can rotate 360°. The re-inspection industrial control computer is communicatively connected to the 3D rotating microscope and the algorithm processing unit of the detection module, and can retrieve historical detection images for comparison.

[0057] The cached re-inspection module caches the automatically detected defective carriers and delivers them sequentially to the re-inspection position. The 3D rotating microscope automatically locates the defect position, and the operator can directly compare historical inspection images with real-time images. The re-inspection time per piece is shortened, and the misjudgment correction rate is improved. This not only solves the problem of low efficiency of manual re-inspection, but also ensures the accuracy of the inspection results.

[0058] The buffer re-inspection module is located between the inspection module and the unloading module, serving as a functional unit for buffering defective product carriers, manual verification, and image comparison. A vertically lifting buffer rack provides a layered, three-dimensional buffer structure for storing defective product carriers, adapting to the buffering requirements of batch inspection. A 3D rotating microscope: This verification device allows for 360° lens rotation, enabling multi-view observation of IC chips, and requires data communication with the inspection module. The re-inspection industrial control computer connects the microscope and the inspection module, serving as the control terminal for image comparison and result modification. The vertical lifting buffer rack is fixed to the ground with expansion bolts, and horizontal tie rods are welded between the frame columns to enhance rigidity. Each placement layer is connected to the column guide rail via a slider and is driven to lift by a stepper motor via a synchronous belt. The 3D rotating microscope is fixed to the ground base on the output side of the buffer rack via an L-shaped bracket. The height of the bracket can be adjusted by a screw to ensure that the lens is at the same height as the output layer of the buffer rack. The re-inspection industrial control computer is placed on the side of the microscope via a workbench and is connected to the microscope and the detection module algorithm processing unit via a network cable. A cable tray is provided under the workbench to store cables. The push cylinder is fixed to the crossbeam at the output end of the buffer rack via a flange. The piston rod axis is parallel to the surface of the placement layer and faces the microscope observation platform.

[0059] like Figure 3 (Facing the situation directly): In Figure 1 Based on this, a buffer re-inspection station 3 is added between inspection station 2 (inspection module) and unloading station 4 (unloading module), corresponding to the buffer re-inspection module: vertical lifting buffer rack, 3D rotating microscope, and re-inspection industrial control computer; the conveyor belt of inspection station 2 branches (good products go directly to unloading station 4, and defective products turn to buffer re-inspection station 3), and the output end of the buffer rack is connected to the microscope observation platform through a push cylinder. Figure 4 As shown in the top view, the buffer re-inspection station 3 is located on the right side of the device, forming an L-shaped connection with the inspection and unloading stations: the buffer rack is arranged vertically along the station, and the placement layer is at the same height as the conveyor belt; the industrial control computer is connected to the algorithm processing unit of the inspection station 2 via a network cable.

[0060] like Figure 13 As shown (from the front), in Figure 11 Based on this, a buffer re-inspection station 4 (corresponding to the buffer re-inspection module) is added after the second inspection station 3: 2D inspection at the first station → 3D inspection at the second station, with data synchronized to the buffer re-inspection station; Buffer re-inspection station 4: equipment is synchronized with... Figure 3 The industrial control computer can simultaneously retrieve 2D / 3D historical images. For example... Figure 14 (Top view) shows: the two inspection stations are arranged in a straight line, the buffer re-inspection station is located at the right end, and the microscope lens is facing the output direction of the conveyor belt.

[0061] The working principle of this embodiment includes: defective carriers are cached in a vertical lifting cache rack. After the detection module completes the IC chip detection, if the carrier is determined to be defective (containing at least one defective chip), the conveying module diverts it to the entrance of the cache re-inspection module, while good carriers are directly conveyed to the unloading module. The photoelectric sensor of the vertical lifting cache rack detects the arrival of the carrier, and the system controls the lifting platform to move to an empty placement layer. The pushing mechanism delivers the carrier into this layer and positions it. During a single batch of inspection, defective carriers are stored in different placement layers in sequence, and the system records the storage location of each carrier and the associated defective chip information in real time. The layered storage design of the vertical lifting cache rack perfectly meets the functional requirements of upward caching. After a single batch of inspection is completed, the operator initiates a "batch re-inspection" command on the re-inspection industrial control computer, and the system retrieves the storage list of defective carriers in that batch. The vertical lifting cache rack moves the layer containing the carrier to be re-inspected to the output height in an order from bottom to top, driven by a stepper motor. The pushing cylinder actuates to smoothly push the carrier to the observation platform of the 3D rotating microscope. The observation platform's QR code scanner reads the carrier's QR code. The re-inspection industrial control computer retrieves the carrier's historical inspection data from the detection module's algorithm processing unit based on the QR code information. The re-inspection industrial control computer sends the coordinates of the defective chip to the 3D rotating microscope. The microscope's motorized platform moves the lens to that position, automatically adjusting the magnification. The lens can rotate 360° as needed to observe the chip's side pins. The industrial control computer simultaneously displays historical inspection images (left) and real-time microscope images (right) on dual screens. The operator compares the two to determine if it is a genuine defect. If it is determined to be an algorithmic misjudgment (such as false dirt), the industrial control computer selects to change the judgment to good and records the reason. If it is confirmed to be a genuine defect, it is marked as maintaining the defective product judgment. After the single carrier verification is completed, the observation platform transmits it to the subsequent stage (such as the defective product processing module). The system controls the buffer rack to transport the next carrier to be verified until all defective carriers have been verified.

[0062] In this embodiment, the system automatically locates defect positions and retrieves historical images, reducing the time required for single-chip verification. Dual-screen comparison reduces human judgment errors, improves the rate of corrected misjudgments, and avoids wasting qualified chips. Combining the results of automatic and manual inspections improves the accuracy of automatic inspection. A vertical lifting buffer rack stores batch defective product carriers in layers, preventing chaotic carrier stacking. Sequential delivery ensures a standardized verification process, adapting to the quality traceability requirements of large-scale inspections. Verification and correction data can be fed back to the detection module to optimize the defect detection algorithm.

[0063] In one embodiment, each layer of the vertical lifting buffer rack is equipped with a photoelectric sensor to detect whether an IC chip carrier is placed; the output end of the buffer rack is equipped with a push cylinder, which can push the carrier to the observation platform of the 3D rotating microscope.

[0064] Through the optimized design of the vertical lifting buffer rack, each placement layer is equipped with a photoelectric sensor to realize the carrier in place. The output end push cylinder accurately moves the carrier, completely avoiding the problems of empty layer conveying and repeated feeding. The time for anomaly investigation in the single batch verification process is reduced. At the same time, the carrier pushing and positioning accuracy is improved, ensuring the positioning accuracy during subsequent 3D rotating microscope verification.

[0065] The vertically oriented lifting buffer rack features a layered design along the vertical direction for the orderly storage of defective IC chip carriers. Photoelectric sensors, detection elements installed on each layer of the buffer rack, determine whether an IC chip carrier has been placed on that layer. A push cylinder, an actuator located at the output end of the buffer rack, pushes the carrier to be reviewed from its placement layer to the observation platform of the 3D rotating microscope.

[0066] The working principle of this embodiment includes: Defective carriers are diverted to the buffer rack: CSP chip carriers identified as defective by the detection module are diverted to the entrance of the vertical lifting buffer rack via the conveying module. The control system filters out empty placement layers based on the signals from the photoelectric sensors of each layer. The entrance pushing mechanism feeds the carrier along the guide rail of the placement layer. When the carrier is fully in place (touching the end baffle of the placement layer), the photoelectric sensors at both ends of that layer are blocked by the carrier, immediately outputting a material presence signal to the control system. If a placement layer has already output a material presence signal, the control system still receives the material release command for that layer and immediately triggers an audible and visual alarm to prevent carrier stacking and crushing from damaging the chips. After a single batch of testing is completed, the operator initiates a review command through the re-inspection industrial control computer. The control system retrieves the defective carrier storage list (including the placement layer number of each carrier); the stepper motor of the lifting drive mechanism starts, driving the ball screw to rotate, precisely lifting the target placement layer to the output height (equal to the height of the 3D rotating microscope observation platform). After positioning is completed, a ready signal is fed back to the system. After receiving the ready signal, the control system starts the push cylinder at the output end of the placement layer. The piston rod extends and pushes the carrier to move along the guide rail. When the magnetic switch detects that the piston has extended to the correct position, the carrier is completely transferred to the observation platform. After the carrier is pushed out, the photoelectric sensor of the placement layer is no longer blocked and outputs a no-material signal. The control system marks the layer as idle and ready to receive new defective carriers. Once all defective carriers in a single batch have been checked, the lifting drive mechanism moves the placement layer back to its initial position (bottom layer aligned with the entrance). The control system clears the storage list and waits for the buffer instruction for the next batch of defective carriers.

[0067] In this embodiment, the in-situ detection by photoelectric sensors completely eliminates carrier compression caused by repeated feeding and verification interruptions caused by empty layer conveying, reducing the abnormality rate of the single-batch buffer process and ensuring the continuity of detection. The positioning accuracy achieved by the push cylinder in conjunction with the guide rail ensures that defective chips on the carrier can be accurately positioned by the 3D rotating microscope, avoiding missed detections or misjudgments due to carrier misalignment. Automatic sensor detection and automatic cylinder pushing replace manual carrier handling, reducing manual operation steps and lowering the risk of equipment failure due to manual placement deviations, meeting the cost reduction requirements of automated detection.

[0068] In one embodiment, the device further includes a defective product processing module integrated into the output of the cache re-inspection module. The defective product processing module includes a CCD positioning camera, a three-axis motion platform, and an execution component. The CCD positioning camera is used to identify the specific location of the defective IC chip. The three-axis motion platform drives the execution component to move. The execution component is an ink valve or a laser cutting head, which are used to mark the defective product surface with ink or to cut the solder wires, respectively.

[0069] The defective chip processing module enables automatic positioning, precise marking, or cutting of defective chips, reducing the processing time for a single defective chip, lowering the chip damage rate, and providing clear and traceable markings, effectively solving the problem of defective chip management.

[0070] The defective product processing module is integrated into the output of the buffer re-inspection module. It is a functional unit that performs marking or functional failure processing on confirmed defective products. A CCD positioning camera is a vision device used to identify the specific location of defective IC chips, providing precise coordinates for the execution component. A three-axis motion platform drives the execution component's movement via a precision motion mechanism, ensuring accurate alignment of the processing actions. The execution component is the end effector that performs the defective product processing actions, consisting of an ink valve (marking) and a laser cutting head (functional failure processing).

[0071] The CCD positioning camera is suspended above the worktable via a gantry crane, which is bolted to the ground. The camera height can be adjusted using a lead screw. The three-axis motion platform has its base bolted to the frame below the worktable. The X and Y axes are connected by linear guides, and the Z axis is connected to the Y axis by a slider. The servo motors of each axis are connected to ball screws via couplings. The actuators (ink valve / laser cutting head) are fixed to the Z-axis slider of the three-axis platform via quick-change connectors, allowing for quick disassembly and replacement. The laser cutting head has a protective cover on its outside and is fixed to the side of the platform by a bracket. The control unit is fixed to the side of the module by a metal shell and is connected to the CCD camera, three-axis motors, and actuators via signal cables, which are protected by cable chains.

[0072] The working principle of this embodiment includes: The defective carrier, confirmed by the buffer re-inspection module, is conveyed by the conveying module to the workbench of the defective processing module. The workbench uses vacuum adsorption to fix the carrier and prevent movement. The control unit communicates with the re-inspection industrial control computer to obtain the defective information of the carrier, including: the position coordinates of the defective chip and the processing type instruction (dot marking or line cutting). A CCD positioning camera accurately identifies the position; the CCD positioning camera takes a complete image of the carrier, reads the carrier's QR code using a QR code recognition algorithm, and verifies it against the information sent by the re-inspection industrial control computer to ensure that the processed object is correct; because there may be slight offsets during carrier transport, the camera uses a template matching algorithm to calibrate the theoretical coordinates of the defective chip, outputs the calibrated actual coordinates, and sends them to the three-axis motion platform. The control unit drives the three-axis motion platform to move along the X and Y axes according to the actual coordinates output by the CCD camera, and moves the execution component (ink valve or laser cutting head) to directly above the defective chip; Z-axis height adjustment: adjust the Z-axis height according to the processing type - the ink valve is lowered to 2mm away from the chip surface (to ensure clear ink dosing and no damage to the chip), and the laser cutting head is lowered to 3mm away from the bonding wire (to ensure cutting accuracy).

[0073] The execution component completes the defective product processing. Scenario 1: Ink dotting marking (applicable to reworkable defective products): The control unit triggers the ink dotting valve to apply high-temperature resistant red ink (temperature resistance 120℃) to the non-functional areas of the defective chip (such as the edge of the package), forming a clear and identifiable mark; after ink dotting, the platform moves the ink dotting valve to the cleaning station to clean the nozzle to prevent clogging and avoid ink drying; the control unit records the ink dotting time, location, and other data, and stores them in conjunction with the carrier's QR code for easy quality traceability. Scenario 2: Laser cutting (applicable to non-reworkable defective products): The control unit activates the laser cutting head, emitting a laser beam focused on the bonding wire position of the defective chip; the three-axis motion platform moves the cutting head along the bonding wire trajectory, and the laser beam cuts the bonding wire, causing the chip to completely lose its function and preventing it from being misused in production; after cutting, the platform moves the cutting head to the dust removal station, where negative pressure adsorption removes the tiny debris generated during cutting.

[0074] After the defective products are processed, the vacuum adsorption on the workbench is released, and the conveying module transfers the carrier to the defective product-specific material box of the unloading module. The control unit sends a processing completion signal back to the system, waiting for the next defective product carrier to enter.

[0075] In this embodiment, automated processing replaces manual operation, reducing the processing time for a single defective product. CCD positioning and a three-axis platform work together to ensure precise processing. The ink dots are clear and wear-resistant, while the rigging process ensures the defective product fails. Simultaneously, the processing data is associated with a QR code for storage, facilitating subsequent quality traceability and analysis, meeting the compliance requirements of industrial-grade chips. The execution component can flexibly switch between ink dotting and rigging modes depending on the type of defective product (reworkable / non-reworkable) without changing the module structure, adapting to the processing needs of different inspection scenarios and embodying the design concept of flexible inspection.

[0076] like Figure 5 As shown (from the front), in Figure 1 Based on this, the optimization is as follows: Inspection Station 2 → Defective Product Processing Station 3 → Unloading Station 4. Defective Product Processing Station 3: The left side is a vertical lifting buffer rack (for storing defective products), and the right side is the defective product processing unit (CCD positioning camera + three-axis motion platform + ink valve / laser cutting head). The output end of the buffer rack is connected to the processing unit workbench via a conveyor belt. The CCD camera is suspended above the workbench (fixed by a gantry frame), and the three-axis platform drives the execution components to move. Figure 6 (Top view) The buffer rack and processing unit are arranged side by side in the workstation, and the conveyor belt runs through both: the three-axis platform of the processing unit covers the entire range of the workbench, and the ink valve / laser cutting head is fixed by a quick-change connector to meet the flexible switching processing requirements of the embodiment.

[0077] like Figure 7 (Front view), set up a buffer re-inspection and defective product processing station 3. Left side of the station: Vertical lifting buffer rack (to receive defective products from inspection station 2); Middle of the station: Re-inspection area (3D rotating microscope + industrial computer, dual-screen image comparison); Right side of the station: Processing area (same as above). Figure 5 The defective product processing unit (equipped with a dust removal device) operates by having the carrier output from the buffer rack → confirming in the re-inspection area → executing actions in the processing area; the entire process is completed at the same workstation. For example... Figure 8 (Top view) The buffer rack, re-inspection area, and processing area are arranged sequentially along the conveyor belt. The conveyor belt has a uniform width and the side guide plates are continuous to ensure smooth transport of the carrier.

[0078] like Figure 9 As shown in the diagram (front view), the process flow includes a buffer re-inspection station 3 (corresponding to the buffer re-inspection module) and a defective product processing station 4 (corresponding to the defective product processing module): Buffer re-inspection station 3: contains only a buffer rack + 3D rotating microscope + industrial computer, performing re-inspection (same as...). Figure 3 ); Defective product processing station 4: Independently equipped with a CCD camera, three-axis platform, and laser cutting head, and a newly added negative pressure dust removal device (the bracket is fixed to the side of the station); the two stations are connected by a conveyor belt, and the defective products after re-inspection are sent to the processing station via the conveyor belt. Figure 10As shown in the top view, the two workstations are arranged in a straight line. The three-axis platform of the processing workstation and the microscope of the re-inspection workstation are staggered to avoid equipment interference.

[0079] like Figure 15 As shown (from the front), in Figure 11 Based on this, a buffer defective product processing station 4 (corresponding to a buffer + defective product processing module) is added after the second inspection station 3: Left side of the station: A buffer rack stores defective products after dual inspection; Right side of the station: A processing unit (CCD + three-axis platform + ink dot / cutting assembly) performs defective product processing. For example... Figure 16 As shown in the top view, a solenoid valve guide plate is installed at the bifurcation point of the conveyor belt to separate good products (straight-through downward material station 5) from defective products (turning processing station).

[0080] like Figure 17 As shown in the front view, a buffer re-inspection and defective product processing station 4 is set up, integrating the buffering, re-inspection, and processing functions after dual detection. Defective products at the second detection station 3 → buffer rack → re-inspection area → processing area → unloading station 5. Figure 18 (Top view): The integrated workstations are arranged linearly along the conveyor belt, with no equipment interference between the functional areas, enabling efficient batch processing in the adapted embodiment.

[0081] like Figure 19 As shown in the diagram (front view), the process flow is as follows: 1. Loading station 1 (loading module) → 2. First inspection station 2 (2D module) → 3. Second inspection station 3 (3D module) → 4. Buffer re-inspection station 4 (buffer re-inspection module) → 5. Defective product processing station 5 (defective product processing module) → 6. Unloading station 6 (unloading module); each station is connected by a conveyor belt, and each section of the conveyor belt is equipped with a servo motor and a photoelectric sensor. Figure 20 (Top view): All workstations are arranged in a straight line, with core equipment arranged along both sides of the conveyor belt.

[0082] In one embodiment, the conveying module includes a synchronous conveyor belt, a servo drive motor, and side guide plates; the surface of the synchronous conveyor belt is coated with an anti-slip rubber layer to prevent the carrier from slipping; the servo drive motor is connected to the drive shaft of the conveyor belt through a reducer to achieve stepless speed regulation; the side guide plates are symmetrically arranged on both sides of the conveyor belt, and the spacing between the guide plates can be adjusted by adjusting bolts to accommodate IC chip carriers of different sizes.

[0083] The conveyor module, employing anti-slip synchronous belts, stepless speed-regulating servo drives, and adjustable side guide plates, enables smooth transport of carriers of different sizes. Batch replacement and adjustment time is reduced to 2 minutes, providing reliable transport assurance for subsequent testing, re-inspection, and other processes, and adapting to the flexible testing needs of IC chips of various specifications.

[0084] The conveyor module is the core unit connecting the loading, inspection, buffer re-inspection, and unloading modules, enabling precise delivery of IC chip carriers. The synchronous belt conveyor uses synchronous belt drive and features an anti-slip surface design to prevent carrier slippage. The servo drive motor provides power to the conveyor belt and supports stepless speed adjustment to adapt to the conveying rhythm of different processes. Side guide plates are symmetrically arranged on both sides of the conveyor belt, and their spacing can be adjusted to accommodate carriers of different sizes.

[0085] The working principle of this embodiment includes: adjusting the side guide plates according to the carrier size: for the IC chip carrier of the current inspection batch, the operator adjusts the distance between the two side guide plates to a suitable distance by rotating the adjusting bolts; according to the processing rhythm of the downstream inspection station (e.g., the inspection station takes 20 seconds to process a single carrier), the control system sets the conveyor belt speed to 50mm / s to ensure that the carrier conveying matches the inspection process. After the feeding module completes the unpacking of the material box, it moves the single carrier to the inlet of the conveying module. The photoelectric sensor at the inlet detects the carrier and triggers the conveyor belt to start; the carrier is placed on the anti-slip rubber layer of the synchronous belt conveyor. The rough surface of the rubber layer increases the friction with the bottom of the carrier, so that even if there is inertia when the conveyor belt starts and stops, the carrier does not slip significantly; during the conveying process, the side guide plates limit the lateral displacement of the carrier to ensure that the center of the carrier is always aligned with the center line of the conveyor belt.

[0086] When the carrier is conveyed to the entrance of the inspection station, the servo drive motor automatically reduces the conveyor belt speed according to the "ready" signal of the inspection station, and slowly moves the carrier to the XY axis positioning platform of the inspection station to avoid carrier deviation caused by high-speed impact; the encoder collects the rotation angle of the conveyor belt drive shaft in real time and calculates the carrier conveying distance; when the carrier reaches the target position (such as the entrance of the inspection station), the control system triggers the motor to stop according to the encoder signal; if the photoelectric sensor detects that the carrier conveying is stuck (such as the carrier edge getting stuck on the guide plate), the system immediately triggers the motor to stop and sounds and lights an alarm to prevent equipment damage.

[0087] When the testing batch is switched to a different chip carrier: operators do not need to disassemble the components; they only need to adjust the spacing of the side guide plates to a suitable distance by adjusting the bolts. Based on the testing rhythm of the new carrier, the conveyor belt speed is reset in the control system to start the new batch transport, without any further adjustments. The adjustable and stepless speed regulation design of the conveyor module's guide plates enables flexible adaptation.

[0088] In this embodiment, the anti-slip rubber layer works in conjunction with the side guide plates to reduce the carrier slippage rate, providing a reliable benchmark for subsequent testing and re-inspection, and reducing misjudgments caused by transmission deviations. The adjustable guide plate spacing and stepless speed regulation design allow the same conveyor module to be compatible with carriers of various sizes, shortening batch changeover and adjustment time. The modular design and convenient adjustment method allow batch switching to be completed without the need for professional personnel, while the high reliability of the synchronous belt and servo motor reduces equipment maintenance costs.

[0089] In one embodiment, the unloading module includes a material box support platform, an electric stop lever closing mechanism, and a discharge roller conveyor; the material box support platform has the same structure as the material box placement platform of the loading module and is equipped with a weight sensor for detecting the full state of the material box; the electric stop lever closing mechanism is driven by a servo motor and is adapted to the locking structure of the material box stop lever; the conveying direction of the discharge roller conveyor is perpendicular to the material box support platform, conveying the full material box to the manual material handling area.

[0090] This feeding mold enables automatic stacking of carriers, full box detection, automatic closing of the baffle, and automatic feeding of the box. It improves the accuracy of full box judgment, reduces the damage rate of the baffle, eliminates the need for manual handling of the box, and shortens the feeding time per batch, thus meeting the high-efficiency feeding requirements of batch testing.

[0091] The unloading module receives the inspected IC chip carriers and performs functions such as stacking, closing the cassette stop lever, and discharging. The cassette support platform is the basic component for placing empty cassettes and supporting the stacking carriers; it must be compatible with the cassette placement platform of the loading module. The electric stop lever closing mechanism is the actuator that uses electric drive to lock the cassette stop lever; it is compatible with the locking structure of the cassette's built-in stop lever. The discharge roller conveyor is the transport component that conveys full cassettes to the manual unloading area; it must operate in conjunction with the cassette support platform.

[0092] The material box support platform is connected to the end of the conveyor module via a connecting plate, the surface of which is flush with the surface of the conveyor belt; the weight sensor is fixed to the center of the bottom of the support platform with bolts. The electric stop lever closing mechanism includes a servo motor and a cam transmission structure. The motor is fixed to the bracket on the right side of the support platform via a motor mount. The cam is fixed to the motor output shaft via a key connection, and the cam profile is adapted to the material box stop lever. The discharge roller conveyor is fixed to the output end of the support platform by a bracket. The height of the bracket is adjustable to ensure that the surface of the roller conveyor is at the same height as the surface of the support platform. The roller conveyor motor is connected to the roller shaft for transmission via a chain. The stacking and pushing assembly includes a pushing cylinder and a guide rail. The cylinder is fixed to the frame on the inlet side of the support platform by a flange. The guide rail is parallel to the surface of the support platform. The push plate is connected to the piston rod of the cylinder and slides along the guide rail.

[0093] The working principle of this embodiment includes: the operator places an empty material box (with an unlocked mechanical stop bar) on the material box carrier platform. The positioning protrusion on the surface of the carrier platform cooperates with the groove at the bottom of the material box to achieve precise positioning of the material box; the weight sensor is zeroed, the initial weight of the empty material box is recorded, and an empty box ready signal is fed back to the control system. The IC chip carrier that has been tested is conveyed to the inlet of the unloading module via the conveying module. After the photoelectric sensor detects the carrier, the cylinder of the stacking and pushing component is activated, pushing the carrier along the guide rail into the material box to achieve stacking; after each carrier is pushed, the weight sensor automatically detects the total weight of the material box and compares it with the preset full box weight threshold (e.g., the total weight of 50 carriers + empty box is about 5.5kg); when the total weight of the material box reaches 5.5kg±5g, the weight sensor sends a "material box full" signal to the control system, the system immediately stops receiving new carriers and triggers the subsequent stop bar closing process. After receiving a full box signal, the control system activates the servo motor of the electric stop mechanism, which drives a lever to rotate via a cam transmission structure. The lever pushes the stop bar of the material box to rotate downwards around its own axis. When the stop bar rotates to the locking hole position, the cam transmission structure pushes the locking tongue into the locking hole of the stop bar, achieving mechanical locking. The position sensor detects that the stop bar is in position (locked state) and sends a signal to the system that the stop bar is closed. The servo motor reverses, driving the transmission structure to reset, waiting for the next stop bar closing command. After the control system confirms that the stop bar is closed, the pushing mechanism of the material box carrier platform moves the full material box to the discharge roller conveyor. The discharge roller conveyor starts, conveying the material box in a direction perpendicular to the carrier platform to the manual picking area. When the photoelectric sensor at the end of the roller conveyor detects the arrival of the material box, it emits an audible and visual prompt, notifying the operator to pick up the material box. After the operator puts in a new empty material box, the weight sensor is zeroed, the system resumes receiving the carrier, and enters the next round of stacking cycle.

[0094] In this embodiment, the entire material unloading process is automated, reducing reliance on manual labor and replacing manual stacking, closing barriers, and transporting of material boxes, thus solving the problem of high labor intensity in traditional unloading. The material box carrier platform is compatible with the feeding module, eliminating the need to change the material box specifications; the discharge roller conveyor enables automatic material box transfer, supporting continuous batch unloading and meeting the post-processing needs of tens of thousands of carriers per day.

[0095] In one embodiment, the XY-axis positioning platform has a vacuum adsorption hole on its surface, and a vacuum generator generates negative pressure to adsorb the IC chip carrier; the platform's drive mechanism adopts ball screw transmission; an annular light source is provided on the outside of the image acquisition component, and the brightness of the annular light source can be automatically adjusted by the algorithm processing unit to adapt to IC chips with different surface reflectivity.

[0096] Through the optimized design of the detection station in this embodiment, the XY-axis positioning platform uses vacuum adsorption to fix the carrier, the brightness of the ring light source can be automatically adjusted according to the light reflection characteristics of the chip, the image overexposure rate is reduced, the defect misjudgment rate is decreased, and at the same time, the ball screw drive ensures stable positioning accuracy, which meets the high-precision detection requirements of high-reflection IC chips.

[0097] The XY-axis positioning platform is a precision motion mechanism that drives the translation of the IC chip carrier in the detection station. The focus of this embodiment lies on vacuum adsorption fixing and ball screw transmission. The vacuum adsorption holes are negative pressure adsorption structures on the platform surface, which generate suction through a vacuum generator to fix the carrier and prevent slipping. Ball screw transmission is the core component of the platform drive mechanism, which achieves high-precision motion through ball rolling and replaces traditional sliding screws. The ring light source is a fill light device matched with the image acquisition assembly, and its brightness can be automatically adjusted by the algorithm processing unit to adapt to chips with different reflectivities.

[0098] For the XY-axis positioning platform, the platform base is fixed to the frame of the detection module by bolts; the adsorption holes are connected through air passages inside the platform surface, and the outlet of the air passage is connected to the air pipe of the vacuum generator through a quick plug connector; For the vacuum generator, the generator is fixed to the frame below the platform through a bracket, and the pressure sensor is installed on the air pipe through threaded connection and connected to the signal line of the control system; For the drive mechanism (ball screw), the screw is fixed to both ends of the platform through bearing seats, the motor is connected to the platform by bolts through the motor seat, and the motor shaft and the screw are coaxially connected through a coupling; For the ring light source, it is fixed to the front end of the 2D optical head lens through threaded connection, and the light sensor is fixed to the side of the light source by a buckle and connected to the signal line of the algorithm processing unit; For the embedded algorithm processing unit, it is fixed to the side of the detection module through a metal bracket, and connected to the light source and the image acquisition assembly through shielded network cables, which are arranged inside the cable trough.

[0099] In this embodiment, the conveying module transports the carrier loaded with chips to the XY-axis positioning platform entrance, and the push cylinder moves the carrier to the platform surface. The system triggers the vacuum generator to operate, generating negative pressure at the platform's adsorption holes. Through the ventilation holes at the bottom of the carrier (corresponding to the adsorption holes), the carrier is firmly adsorbed onto the platform surface. A pressure sensor monitors the vacuum level in real time to ensure reliable adsorption. The platform reads the carrier's QR code to obtain chip arrangement information, providing a positioning reference for subsequent chip-by-chip inspection. The embedded algorithm processing unit sends motion commands to the X / Y-axis servo motors based on the chip matrix information. The servo motors drive the ball screw to rotate, and the rolling friction between the balls and the screw nut drives the platform to translate, moving the first chip directly below the 2D optical head. The low-friction characteristics of the ball screw ensure smooth and seamless platform movement, and the encoder provides real-time position feedback. After the platform is positioned, the ring light source first captures the first frame image at 50% brightness, while the photosensor simultaneously collects the reflectivity of the chip surface. The embedded algorithm processing unit analyzes the grayscale distribution of the image. If the overexposed area (grayscale value ≥ 240) accounts for more than 5% of the image, the brightness is gradually reduced (decreasing by 10 levels each time). If the dark area (grayscale value ≤ 30) accounts for more than 10%, the brightness is gradually increased (increasing by 10 levels each time) until the proportion of overexposed / dark areas is ≤ 3%. After the brightness is adjusted to the optimal value (e.g., high-reflectivity chips are ultimately adjusted to 30% brightness), the 2D optical head and 3D line scan camera sequentially acquire images, and the algorithm processing unit performs defect identification to ensure that defects such as surface dirt and poor solder joints are clearly identifiable. Once all chips on the carrier have been inspected, the vacuum generator stops working, the negative pressure in the adsorption hole disappears, and the platform pushes the carrier back to the transport module, waiting for the next carrier to enter.

[0100] In this embodiment, vacuum adsorption reduces carrier slippage, and ball screw drive ensures positioning accuracy, providing a reliable benchmark for defect detection and reducing missed detections due to positioning deviations. The ring light source's automatic dimming function reduces image overexposure and significantly minimizes reflective interference, solving the detection challenge of highly reflective chip materials. The ball screw drive has low wear and long lifespan, and vacuum adsorption and automatic dimming require no manual intervention, making it suitable for the stable operation requirements of mass production.

[0101] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A flexible testing device for testing IC chips, characterized in that, The system includes a loading module, a detection module, and a unloading module arranged sequentially along the IC chip carrier transport path, as well as a conveying module connecting each module. The loading module is used to read the IC chip box codes, open the baffle, and unpack the carrier. The detection module is used to perform 2D and 3D image detection on the IC chip to identify surface defects. The conveying module is used to accurately transport the IC chip carrier between the modules. The unloading module is used to stack the IC chip carrier, close the baffle of the box, and discharge the chip.

2. The detection device of claim 1, wherein, The feeding module includes a horizontally arranged material box placement platform, an industrial barcode reader fixed to one side of the material box placement platform, and a pneumatic stop lever opening mechanism installed at the output end of the material box placement platform; the surface of the material box placement platform is provided with positioning protrusions for limiting the IC chip material box; the pneumatic stop lever opening mechanism is driven by a cylinder to adapt to the opening action of the stop lever built into the material box.

3. The detection device of claim 1, wherein, The detection module includes at least one detection station, each equipped with an XY-axis positioning platform, an image acquisition component, and an embedded algorithm processing unit. The XY-axis positioning platform is used to drive the IC chip carrier to translate, enabling chip-by-chip detection. The image acquisition component includes a 2D optical head and a 3D line scan camera fixed above the XY-axis positioning platform, with the lens axes of both perpendicular to the surface of the IC chip carrier. The embedded algorithm processing unit is connected to the image acquisition component via Ethernet for real-time image data processing.

4. The detection device of claim 3, wherein, The detection module includes a first detection station and a second detection station arranged in series. The image acquisition component of the first detection station contains only a 2D optical head, which is used to acquire 2D images of the IC chip and detect surface dirt and solder joint defects. The image acquisition component of the second detection station contains only a 3D line scan camera, which is used to acquire 3D images of the IC chip and detect solder line spacing, solder line height, and solder joint defects. The two detection stations are connected by a connecting conveyor belt of the conveyor module.

5. The detection device of claim 1, wherein, It also includes a buffer re-inspection module located between the detection module and the unloading module. The buffer re-inspection module includes a vertical lifting buffer frame, a 3D rotating microscope, and a re-inspection industrial control computer. The vertical lifting buffer frame has multiple carrier placement layers along the vertical direction, and the layer switching is achieved by stepper motor drive. The 3D rotating microscope is fixed to the output side of the vertical lifting buffer frame by a bracket, and its lens can rotate 360°. The re-inspection industrial control computer is communicatively connected to the 3D rotating microscope and the algorithm processing unit of the detection module, and can retrieve historical detection images for comparison.

6. The detection device of claim 5, wherein, Each layer of the vertical lifting buffer rack is equipped with a photoelectric sensor to detect whether an IC chip carrier is placed; the output end of the buffer rack is equipped with a push cylinder, which can push the carrier to the observation platform of the 3D rotating microscope.

7. The detection device of claim 1, wherein, It also includes a defective product processing module integrated into the output of the cache re-inspection module. The defective product processing module includes a CCD positioning camera, a three-axis motion platform, and an execution component. The CCD positioning camera is used to identify the specific location of the defective IC chip. The three-axis motion platform drives the execution component to move. The execution component is an ink valve or a laser cutting head, which are used to mark the defective product surface with ink or to cut the solder lines, respectively.

8. The detection device of claim 1, wherein, The conveying module includes a synchronous conveyor belt, a servo drive motor, and side guide plates. The surface of the synchronous conveyor belt is covered with an anti-slip rubber layer to prevent the carrier from slipping. The servo drive motor is connected to the drive shaft of the conveyor belt through a reducer to achieve stepless speed regulation. The side guide plates are symmetrically arranged on both sides of the conveyor belt, and the spacing between the guide plates can be adjusted by adjusting bolts to accommodate IC chip carriers of different sizes.

9. The detection device of claim 1, wherein, The unloading module includes a material box support platform, an electric stop lever closing mechanism, and a discharge roller conveyor. The material box support platform has the same structure as the material box placement platform of the loading module and is equipped with a weight sensor to detect the full state of the material box. The electric stop lever closing mechanism is driven by a servo motor and is adapted to the locking structure of the material box stop lever. The conveying direction of the discharge roller conveyor is perpendicular to the material box support platform, and it conveys the full material box to the manual material handling area.

10. The detection device of claim 3, wherein, The XY-axis positioning platform has vacuum adsorption holes on its surface, which generate negative pressure through a vacuum generator to adsorb IC chip carriers; the platform's drive mechanism uses ball screw transmission; the outer side of the image acquisition component is equipped with a ring light source, the brightness of which can be automatically adjusted by the algorithm processing unit to adapt to IC chips with different surface reflectivity.

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