An adaptive guiding device for wafer detection

Abstract

This utility model relates to the field of semiconductor manufacturing inspection equipment, and more particularly to an adaptive guiding device for wafer inspection. It includes an operating table with a placement rack embedded in its top surface, a movable frame mounted on the operating table, a detection component located in the center of the movable frame, a controller mounted on the operating table, and a bidirectional lead screw rotatably connected within the operating table. A motor is installed within the operating table, with its output shaft connected to the end of the bidirectional lead screw. Guide plates are slidably connected to the left and right ends of the top of the operating table, with their bottoms threadedly connected to the bidirectional lead screw. A limit plate is slidably connected to the rear end of the top of the operating table, and an electric slide rail is installed within the operating table, with the bottom of the limit plate slidably connected within the electric slide rail. Through the inclined design of the guide plates and the elastic contact of the limit plates, when the wafer is pushed in, it automatically moves towards the center of the placement rack until its rear end contacts the protective pad of the limit plate to complete positioning. This eliminates the need for initial scanning to determine the center, thus improving inspection efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing inspection equipment, and in particular to an adaptive guiding device for wafer inspection. Background Technology

[0002] Semiconductor chips, as the core foundational components of the modern electronics and information industry, are hailed as the "grain of industry" and the "heart of the digital age." Their manufacturing precision has entered the nanometer-level era, with the integration of billions of transistors on a single wafer becoming commonplace, placing stringent demands on defect control throughout the entire production process. In the chip manufacturing process, the inspection stage plays a crucial role in quality control, directly impacting product yield and reliability. The market demand for high-performance chips is growing exponentially, leading to a corresponding increase in requirements for inspection efficiency and accuracy.

[0003] Current mainstream wafer inspection equipment employs visual scanning and positioning technology. A typical workflow involves the operator randomly placing the wafer to be inspected onto the inspection table, after which the equipment performs an initial global scan using a fixed camera. This scanning process aims to determine the actual center coordinates of the wafer through image processing algorithms. Subsequently, the gantry drive mechanism is controlled to adjust the camera's spatial position, aligning its optical axis with the wafer's geometric center. Only after mechanical positioning is complete can the equipment initiate the formal inspection process, capturing surface defects on the wafer through a high-resolution imaging system. This phased operation mode has been used in the semiconductor manufacturing industry for many years, and its technical architecture is based on a sequential working logic of "positioning first, then inspection."

[0004] The sole function of the initial global scan is to acquire wafer position deviation data. This step does not generate effective detection information but consumes equipment inspection time. In summary, the repeated start-up and shutdown of the mechanical positioning system increases equipment energy consumption, the waiting time between two scans reduces production line cycle time, and the large-scale movement of the scanning equipment affects the stability of the optical system, ultimately affecting the wafer detection rate and accuracy. Utility Model Content

[0005] To overcome the drawbacks of scanning redundancy and inefficient detection, this invention provides an adaptive guiding device for wafer inspection, aiming to solve the aforementioned shortcomings.

[0006] An adaptive guiding device for wafer inspection includes an operating table with a placement rack embedded in its top surface. A movable frame is mounted on the operating table, and a detection component is disposed in the middle of the movable frame. The operating table is equipped with a power component for driving the movable frame. A controller is mounted on the operating table and wiredly connected to the detection component. The device also includes a bidirectional lead screw rotatably connected within the operating table. A motor is installed within the operating table, and the output shaft of the motor is connected to the end of the bidirectional lead screw. Guide plates are slidably connected to the left and right ends of the top of the operating table, with the bottom of the guide plates threadedly connected to the bidirectional lead screw. A limit plate is slidably connected to the rear end of the top of the operating table. An electric slide rail is installed within the operating table, and the bottom of the limit plate is slidably connected within the electric slide rail.

[0007] As a further preferred embodiment, an electric push rod is installed inside the operating table, a top block is slidably connected to the middle of the placement frame, a triangular plate is connected to the piston rod of the electric push rod, the triangular plate is pressed and engaged with the top block, the top surface of the triangular plate is set as an inclined surface, a guide rod is connected to the bottom of the top block, and the guide rod is slidably connected inside the operating table.

[0008] As a further preferred embodiment, the guide rod is fitted with a return spring, the top of which is connected to the operating table, and the bottom of which is connected to a circular piece fixed to the bottom end of the guide rod.

[0009] As a further preferred embodiment, a rangefinder is mounted on the top of the two guide plates, and the rangefinder is wired to the controller.

[0010] As a further preferred embodiment, protective pads are connected to adjacent sides of both guide plates, and the protective pads are connected to the front side of the limiting plate.

[0011] As a further preferred embodiment, the top of the placement rack is rotatably connected with a number of ball bearings.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. Through the inclined design of the guide plate and the elastic contact of the limiting plate, when the wafer is pushed in, it automatically moves towards the center of the placement rack until the rear end contacts the protective pad of the limiting plate to complete the positioning. There is no need to determine the center through the first scan, thus improving the detection efficiency.

[0014] 2. The motor drives the bidirectional lead screw to rotate, causing the guide plates on both sides to move synchronously towards or away from each other. At the same time, the electric slide rail drives the limiting plate to slide back and forth to match the wafer radius, so that the distance between the guide plate and the center of the placement rack, and the distance between the front side of the limiting plate and the center of the placement rack are all adapted to the wafer radius, thereby achieving the purpose of optimizing the detection adaptability.

[0015] 3. By using an electric push rod to drive the top block to engage with the inclined surface of the triangular plate, the horizontal thrust is converted into vertical lift, which lifts the center area of ​​the wafer to form a picking gap. Combined with the elastic potential energy of the reset spring and the gravity of the triangular plate, automatic reset is achieved, thereby replacing the manual operation of picking up the wafer, shortening the picking time, and reducing the risk of wafer edge damage. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0017] Figure 2 This is a cross-sectional view of the installation structure of the motor and the bidirectional lead screw of this utility model.

[0018] Figure 3 This is a cross-sectional view of the mounting structure of the electric push rod and the return spring of this utility model.

[0019] Figure 4 This is a cross-sectional view of the installation structure of the guide rod and triangular plate of this utility model.

[0020] The components are: 1-operating table, 2-placement rack, 3-moving rack, 4-detection component, 5-controller, 6-motor, 7-double-acting lead screw, 8-guide plate, 9-electric slide rail, 10-limit plate, 11-top block, 12-triangular plate, 13-guide rod, 14-electric push rod, 15-reset spring, 16-rangefinder, 17-protective pad, 18-ball bearing. Detailed Implementation

[0021] The technical solution will be further described below with reference to specific embodiments. It should be noted that the terms "up," "down," "left," and "right" used herein refer only to the position of the illustrated structure in the corresponding drawings. The component numbers used herein, such as "first," "second," etc., are merely for distinguishing the described objects and have no sequential or technical meaning. Furthermore, terms such as "connection" and "linkage," unless otherwise specified, include both direct and indirect connections.

[0022] Example: An adaptive guiding device for wafer inspection, such as... Figures 1-4As shown, the system includes an operating platform 1, a placement rack 2, a movable frame 3, a detection component 4, and a controller 5. The placement rack 2 is embedded in the top surface of the operating platform 1. The movable frame 3 is mounted on the operating platform 1, and the detection component 4 is located in the middle of the movable frame 3. The operating platform 1 is equipped with a power component for driving the movable frame 3. The controller 5 is mounted on the operating platform 1 and is wiredly connected to the detection component 4. The built-in power component in the operating platform 1 provides precise displacement control for the movable frame 3 and works in conjunction with the controller 5 to achieve path planning for the detection component 4. The system also includes a motor 6, a bidirectional lead screw 7, a guide plate 8, an electric slide rail 9, and... The limiting plate 10 and the bidirectional lead screw 7 are rotatably connected to the operating table 1. The operating table 1 is equipped with a motor 6, and the output shaft of the motor 6 is connected to the end of the bidirectional lead screw 7. The top left and right ends of the operating table 1 are slidably connected with guide plates 8. The bottom of the guide plates 8 is threadedly connected to the bidirectional lead screw 7. The adjacent side of the guide plates 8 is set as an inclined surface, which plays a guiding role when the wafer is pushed in, so that the wafer automatically moves towards the center and realizes automatic centering and positioning of the wafer. The limiting plate 10 is slidably connected to the rear end of the top of the operating table 1. The operating table 1 is equipped with an electric slide rail 9, and the bottom of the limiting plate 10 is slidably connected to the electric slide rail 9.

[0023] like Figure 3 and Figure 4 As shown, it also includes a top block 11, a triangular plate 12, a guide rod 13, and an electric push rod 14. The electric push rod 14 is installed inside the operating table 1. The top block 11 is slidably connected to the middle of the placement frame 2. The piston rod of the electric push rod 14 is connected to the triangular plate 12. The triangular plate 12 and the top block 11 are pressed together. The top surface of the triangular plate 12 is set with an inclined surface. The bottom front end of the top block 11 is set with a wedge-shaped inclined surface to convert the horizontal thrust of the electric push rod 14 into vertical lift. The bottom of the top block 11 is connected to the guide rod 13, which is slidably connected inside the operating table 1. The top block 11 quickly lifts the center area of ​​the wafer to form a picking gap, avoiding damage to the wafer edge caused by manual picking.

[0024] like Figure 3 As shown, it also includes a reset spring 15. The guide rod 13 is fitted with the reset spring 15. The top of the reset spring 15 is connected to the operating table 1, and the bottom of the reset spring 15 is connected to the circular piece fixed at the bottom of the guide rod 13 to ensure the reliability of repeated use of the device.

[0025] like Figure 1 and Figure 2 As shown, it also includes a rangefinder 16. The rangefinder 16 is installed on the top of the two guide plates 8. The rangefinder 16 is wired to the controller 5. The rangefinder 16 monitors the distance between the guide plates 8 in real time. When the distance reaches the target value, it feeds back a signal to the controller 5 to stop the motor 6 from rotating, thus forming a closed-loop control.

[0026] like Figure 2As shown, it also includes a protective pad 17. The two guide plates 8 are connected to a protective pad 17 on their adjacent sides. The front side of the limiting plate 10 is connected to a protective pad 17. The protective pad 17 is made of an elastic and smooth material. The protective pad 17 on the side of the guide plate 8 buffers the lateral pressure when the wafer is pushed in.

[0027] like Figure 1 As shown, it also includes ball bearings 18. Several ball bearings 18 are slidably connected to the top of the placement frame 2. The ball bearings 18 roll when the wafer is pushed in, converting sliding friction into rolling friction.

[0028] After placing the wafer to be inspected on the top surface of the operating table 1, the operator gently pushes the rear edge of the wafer with their palm to make it slide backward. The bottom of the wafer contacts the array of ball bearings 18 on the top surface of the placement rack 2. Multiple ball bearings 18 roll synchronously as the wafer slides, converting sliding friction into rolling friction and significantly reducing movement resistance. The left and right sides of the wafer are guided by the inclined surfaces of the guide plates 8. During the continuous backward push, the guide plates 8 on both sides decompose the horizontal pushing force of the wafer into an inward lateral force through the inclined structure, causing the wafer to automatically move towards the center area of ​​the placement rack 2. When the rear end of the wafer contacts the protective pad 17 on the front side of the limiting plate 10, it stops moving. At this time, the center of the wafer coincides with the geometric center of the placement rack 2. The elastic deformation of the protective pad 17 ensures positioning accuracy and avoids hard contact that could scratch the wafer surface.

[0029] After positioning is completed, the controller 5 activates the power unit to drive the moving frame 3, carrying the detection component 4, to scan along the wafer surface. The detection component 4 performs non-contact defect detection on the wafer surface through the coordinated operation of an optical lens and a light source. During the detection process, the moving frame 3 moves at a constant speed along a preset path, and the detection component 4 acquires image data in real time and transmits it to the controller 5 for analysis. When an abnormal area is detected, the system automatically adjusts the scanning speed to perform local magnification detection, ensuring the accuracy of defect identification.

[0030] After the test is completed, the controller 5 controls the piston rod of the electric push rod 14 to extend, pushing the top block 11 to move axially along the guide rod 13. The wedge-shaped inclined surface at the front end of the top block 11 contacts the inclined surface of the triangular plate 12. Through the inclined surface cooperation, the horizontal thrust is converted into vertical lift, causing the triangular plate 12 to drive the guide rod 13 to slide upward, lifting the center area of ​​the wafer until a 5 mm gap is formed with the top surface of the placement rack 2. At this time, the operator can easily remove the wafer from the side. During the lifting process, the return spring 15 is compressed and stores elastic potential energy. When the piston rod of the electric push rod 14 retracts, the spring potential energy is released and works together with the weight of the triangular plate 12 to drive the guide rod 13 and the triangular plate 12 to quickly return to the initial position.

[0031] When it is necessary to inspect wafers of different diameters, the operator inputs the target wafer diameter parameters through the controller 5, and the system automatically calculates the required spacing between the guide plates 8 and the position of the limiting plate 10. The motor 6 drives the bidirectional lead screw 7 to rotate, causing the guide plates 8 on both sides to move synchronously towards or away from each other through threaded transmission. During the adjustment process, the rangefinder 16 monitors the spacing between the guide plates 8 in real time. When the spacing reaches the target value, the motor 6 stops rotating. At the same time, the electric slide rail 9 drives the limiting plate 10 to move back and forth, ensuring that the distance from the front of the limiting plate 10 to the center of the placement frame 2 matches the spacing between the guide plates 8, ultimately forming a positioning space adapted to the wafer diameter. The entire adjustment process is controlled by a closed loop to ensure positioning accuracy.

[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An adaptive guiding device for wafer inspection, characterized in that: The system includes an operating table (1), with a placement rack (2) embedded in its top surface. A movable frame (3) is mounted on the operating table (1), and a detection component (4) is located in the middle of the movable frame (3). The operating table (1) is equipped with a power component for driving the movable frame (3). A controller (5) is mounted on the operating table (1) and is wiredly connected to the detection component (4). The system also includes a bidirectional lead screw (7) rotatably connected to the operating table (1). Inside the operating table (1), a motor (6) is installed. The output shaft of the motor (6) is connected to the end of the bidirectional lead screw (7). Guide plates (8) are slidably connected to the left and right ends of the top of the operating table (1). The bottom of the guide plates (8) is threadedly connected to the bidirectional lead screw (7). A limit plate (10) is slidably connected to the rear end of the top of the operating table (1). An electric slide rail (9) is installed inside the operating table (1). The bottom of the limit plate (10) is slidably connected to the electric slide rail (9).

2. The adaptive guiding device for wafer inspection as described in claim 1, characterized in that: An electric push rod (14) is installed inside the operating table (1). A top block (11) is slidably connected to the middle of the placement rack (2). A triangular plate (12) is connected to the piston rod of the electric push rod (14). The triangular plate (12) is pressed and engaged with the top block (11). The top surface of the triangular plate (12) is set as an inclined surface. A guide rod (13) is connected to the bottom of the top block (11). The guide rod (13) is slidably connected inside the operating table (1).

3. An adaptive guidance device for wafer detection as recited in claim 2, wherein: The guide rod (13) is fitted with a reset spring (15). The top of the reset spring (15) is connected to the operating table (1), and the bottom of the reset spring (15) is connected to a circular piece fixed at the bottom of the guide rod (13).

4. An adaptive guidance device for wafer detection as recited in claim 3, wherein: A rangefinder (16) is mounted on the top of the two guide plates (8), and the rangefinder (16) is wired to the controller (5).

5. An adaptive guidance device for wafer detection as recited in claim 4, wherein: The two guide plates (8) are each connected to a protective pad (17) on one side of each other, and the protective pad (17) is connected to the front side of the limiting plate (10).

6. An adaptive guidance device for wafer detection as recited in claim 5, wherein: The top of the placement rack (2) is connected to several ball bearings (18).

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