Chip fine adjustment mechanism and light detection device

Abstract

The application provides a chip fine adjustment mechanism and an optical detection device, and relates to the technical field of chip detection. The chip fine adjustment mechanism comprises a driving structure, the driving structure comprises a driving part, the driving part is connected with a second connecting plate, the second connecting plate is provided with a first connecting frame, the first connecting frame is provided with a vacuum chuck, the outer surface of the vacuum chuck is fixedly connected with an auxiliary part, the auxiliary part comprises a fixed disc fixedly connected to the outer surface of the vacuum chuck, a plurality of connecting rods are connected to the fixed disc, and the top portions of the connecting rods are fixedly connected with a counterweight ring. The auxiliary part is arranged, the bottom of the pressing ring is lower than the bottom of the vacuum chuck, displacement is generated between the counterweight ring and the fixed disc when the vacuum chuck sucks the chip, so that a gap is left between the fixed disc and the counterweight ring, and the counterweight ring, the connecting rods and the pressing ring move downward under the action of gravity when the vacuum chuck lowers the chip and then rises, so as to separate the chip from the vacuum chuck.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and more specifically, to a chip fine-tuning mechanism and a photodetector. Background Technology

[0002] In the precision industrial field of chip manufacturing and testing, optical inspection of chips is a key step in ensuring chip quality and performance. Among the existing chip positioning technologies, vacuum chucks have become a commonly used tool for picking up and moving chips because they can provide stable and uniform adsorption force.

[0003] In practical applications, separating the chip from the vacuum chuck after chip detection or movement presents numerous challenges. Due to the strong adhesion of the vacuum chuck and the smooth surface of the chip, a tight bond easily forms between them, potentially causing the chip to fail to detach smoothly from the chuck. Therefore, we propose an improvement: a chip fine-tuning mechanism and a photodetector. Utility Model Content

[0004] This utility model provides a chip fine-tuning mechanism, including a driving structure. The driving structure includes a driving part, which is connected to a second connecting plate. A first connecting frame is mounted on the second connecting plate and connected to the second connecting plate by bolts. A vacuum suction cup is provided on the first connecting frame. An auxiliary component is fixedly connected to the outer surface of the vacuum suction cup. The auxiliary component includes a fixing plate fixedly connected to the outer surface of the vacuum suction cup. A plurality of connecting rods are inserted and connected to the fixing plate. A counterweight ring is fixedly connected between the tops of the plurality of connecting rods. A pressure ring is fixedly connected between the tops of the plurality of connecting rods. The bottom end of the pressure ring is lower than the bottom end of the vacuum suction cup. A plurality of semi-circular protrusions are fixedly connected to the bottom of the pressure ring. The semi-circular protrusions can reduce the contact area between the pressure ring and the chip.

[0005] The pressure ring contacts the chip before the vacuum chuck, allowing for pressure and positioning of the chip before it is picked up. Multiple sets of symmetrically distributed connecting rods ensure that the pressure from the pressure ring is evenly applied to the chip edges, reducing chip warping caused by single-point stress and further ensuring the integrity of the chip structure.

[0006] The fixed plate is specifically welded to the metal part of the vacuum chuck. The connecting rod, counterweight ring, pressure ring, and semi-circular protrusion are welded together. A linear bearing can also be installed between the connecting rod and the fixed plate to ensure the smooth descent of the counterweight ring and pressure ring. The gravity exerted on the chip by the connecting rod, counterweight ring, pressure ring, and semi-circular protrusion is less than the suction force exerted on the chip by the vacuum chuck.

[0007] As a preferred technical solution of this application, a third connecting frame is also installed on the second connecting plate, located on one side of the first connecting frame. A second camera and a second fill light located below the second camera are installed on the third connecting frame. The third connecting frame is connected to the second camera, the second fill light and the second connecting plate by bolts. The second camera is used to collect the position information of the chip picked up and placed by the vacuum suction cup.

[0008] As a preferred technical solution of this application, the drive unit includes a frame, on which a first linear module is mounted. A first connecting plate is mounted on the moving slide of the first linear module, and a second linear module is connected to the first connecting plate. The second connecting plate is mounted on the moving slide of the second linear module. The frame and the first linear module are connected by bolts, the first connecting plate and the moving slide of the first linear module are connected by bolts, the second linear module and the first connecting plate are connected by bolts, and the second connecting plate and the moving slide of the second linear module are connected by bolts.

[0009] A light detection device uses a chip fine-tuning mechanism. The bottom of the rack is fixedly connected to a cabinet, and a component protective box is installed on the top of the cabinet. The drive structure is located inside the component protective box. An operation port is provided between the front and top of the component protective box. The drive structure and the component protective box are connected to the cabinet by welding or bolting.

[0010] As a preferred technical solution of this application, a fourth linear module is installed on the top of the cabinet. One end of the fourth linear module is located inside the component protective box, and the other end of the fourth linear module passes through the operation port and extends to the outside of the component protective box. A fourth connecting plate is installed on the moving slide of the fourth linear module. A first cylinder is installed on both sides of the bottom of the fourth connecting plate. The first cylinder is connected to a second clamping plate. The fourth connecting plate is used to place a tray containing a chip to be tested. The tray is clamped and fixed by the cooperation of the first cylinder and the second clamping plate, and is transported by the fourth linear module.

[0011] As a preferred technical solution of this application, a third linear module is installed on the top of the cabinet. One end of the third linear module is located inside the component protective box, and the other end of the third linear module passes through the operation port and extends to the outside of the component protective box. A third connecting plate is installed on the moving slide of the third linear module. A second cylinder is installed on both sides of the bottom of the third connecting plate. The second cylinder is connected to a first clamping plate. A tray for collecting and testing qualified chips is placed on the third connecting plate. The tray is clamped and fixed by the cooperation of the second cylinder and the first clamping plate, and is transported by the third linear module.

[0012] As a preferred technical solution of this application, a second connecting frame is installed on the top of the cabinet. The second connecting frame is located between the fourth linear module and the third linear module. A first camera and a first fill light located above the first camera are installed on the second connecting frame. The first camera is located on the moving trajectory of the vacuum suction cup. The second connecting frame is connected to the cabinet, the first camera and the first fill light by bolts. The first camera is used to collect pin information at the bottom of the chip to detect whether there are defects in the chip pins.

[0013] As a preferred technical solution of this application, a feeding channel is installed on the top of the cabinet. The feeding channel is located on the side of the third linear module away from the fourth linear module. One end of the feeding channel passes through the component protective box and extends to the outside of the component protective box. The feeding channel is inclined. Unqualified chips are placed in the feeding channel and slide out from the feeding channel. A collection container or conveyor can be placed at the bottom of the feeding channel for collection or transportation.

[0014] As a preferred technical solution of this application, the component protective box is equipped with a component protective door located at the operation port via a hinge. A protective door baffle located at the operation port is fixedly installed inside the component protective box, and the side of the protective door baffle contacts the component protective door. The protective door baffle and the component protective box are connected by bolts.

[0015] An industrial computer is installed on the side of the cabinet. The second camera and the first camera are both connected to the industrial computer via image acquisition cards. The industrial computer is connected to a PLC controller. The PLC controller is connected to the rack, the second linear module, the third linear module, and the fourth linear module. The rack, the second linear module, the third linear module, and the fourth linear module are all connected using a lead screw type linear module. The vacuum suction cup is an existing component. The suction and release process of the vacuum suction cup is also controlled by the PLC. The specific principle and air circuit connection are existing technologies and will not be described in detail in this application.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] In the scheme of this application:

[0018] This application utilizes an auxiliary component. Because the bottom of the pressure ring is lower than the bottom of the vacuum chuck, when the vacuum chuck picks up the chip, a displacement occurs between the counterweight ring and the fixed plate, creating a gap between them. When the vacuum chuck lowers the chip and then rises again, the counterweight ring, connecting rod, and pressure ring move downwards under gravity to push the chip away from the vacuum chuck. Attached Figure Description

[0019] Figure 1 A schematic diagram of the chip fine-tuning mechanism and photodetector provided in this application;

[0020] Figure 2 This is a structural diagram of the top of the cabinet provided in this application;

[0021] Figure 3 This is a structural schematic diagram of the component protective box provided in this application;

[0022] Figure 4 A schematic diagram of the structure of the second camera provided in this application;

[0023] Figure 5 A schematic diagram of the structure of the fixed disk provided in this application;

[0024] Figure 6 This is a system block diagram of the chip fine-tuning mechanism and photodetector provided in this application.

[0025] The image shows:

[0026] 1. Cabinet; 101. Component Protective Box; 102. Operating Port; 103. Component Protective Door; 104. Protective Door Baffle; 2. Drive Structure; 201. Frame; 202. First Linear Module; 203. First Connecting Plate; 204. Second Linear Module; 205. Second Connecting Plate; 3. First Connecting Frame; 301. Vacuum Suction Cup; 4. Fixing Plate; 401. Connecting Rod; 402. Pressure Ring; 403. Semi-circular Protrusion; 404. Counterweight Ring; 5. Third Linear Module; 501. Third Connecting Plate; 502. First Clamping Plate; 6. Fourth Linear Module; 601. Fourth Connecting Plate; 602. Second Clamping Plate; 7. Unloading Channel; 8. Second Connecting Frame; 801. First Camera; 802. First Fill Light; 9. Third Connecting Frame; 901. Second Camera; 902. Second Fill Light; 10. Industrial Computer. Detailed Implementation

[0027] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0028] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] Example 1, please refer to Figure 2 , Figure 4 and Figure 5 As shown, a chip fine-tuning mechanism includes a driving structure 2, which includes a driving part connected to a second connecting plate 205. A first connecting frame 3 is mounted on the second connecting plate 205 and connected to the second connecting plate 205 by bolts. A vacuum suction cup 301 is provided on the first connecting frame 3. An auxiliary component is fixedly connected to the outer surface of the vacuum suction cup 301. The auxiliary component includes a fixed plate 4 fixedly connected to the outer surface of the vacuum suction cup 301. A plurality of connecting rods 401 are inserted and connected to the fixed plate 4. A counterweight ring 404 is fixedly connected between the tops of the plurality of connecting rods 401 and a pressure ring 402 is fixedly connected between the tops of the plurality of connecting rods 401. The bottom end of the pressure ring 402 is lower than the bottom end of the vacuum suction cup 301. A plurality of semi-circular protrusions 403 are fixedly connected to the bottom of the pressure ring 402. The semi-circular protrusions 403 can reduce the contact area between the pressure ring 402 and the chip.

[0031] The pressure ring 402 contacts the chip before the vacuum chuck 301, allowing for pressure and positioning of the chip before it is picked up. Multiple sets of connecting rods 401 are symmetrically distributed, ensuring that the pressure from the pressure ring 402 is evenly applied to the chip edge, reducing chip warping caused by single-point stress and further guaranteeing the chip's structural integrity.

[0032] The fixed plate 4 is specifically welded to the metal part of the vacuum chuck 301. The connecting rod 401, counterweight ring 404, pressure ring 402 and semi-circular protrusion 403 are welded together. A linear bearing can also be set between the connecting rod 401 and the fixed plate 4 to ensure the smooth descent of the counterweight ring 404 and pressure ring 402. The gravity of the connecting rod 401, counterweight ring 404, pressure ring 402 and semi-circular protrusion 403 on the chip is less than the suction force of the vacuum chuck 301 on the chip.

[0033] Furthermore, a third connecting frame 9 located on one side of the first connecting frame 3 is also installed on the second connecting plate 205. A second camera 901 and a second fill light 902 located below the second camera 901 are installed on the third connecting frame 9. The third connecting frame 9 is connected to the second camera 901, the second fill light 902 and the second connecting plate 205 by bolts. The second camera 901 is used to collect the position information of the chip picked up and placed by the vacuum suction cup 301.

[0034] Furthermore, the drive unit includes a frame 201, on which a first linear module 202 is mounted. A first connecting plate 203 is mounted on the movable slide of the first linear module 202, and a second linear module 204 is connected to the first connecting plate 203. A second connecting plate 205 is mounted on the movable slide of the second linear module 204. The frame 201 and the first linear module 202 are connected by bolts, the first connecting plate 203 and the movable slide of the first linear module 202 are connected by bolts, the second linear module 204 and the first connecting plate 203 are connected by bolts, and the second connecting plate 205 and the movable slide of the second linear module 204 are connected by bolts.

[0035] Example 2, please refer to Figures 1-6 A light detection device using a chip fine-tuning mechanism, with a cabinet 1 fixedly connected to the bottom of the frame 201, a component protection box 101 installed on the top of the cabinet 1, a drive structure 2 located inside the component protection box 101, and an operation port 102 provided between the front and top of the component protection box 101. The drive structure 2 and the component protection box 101 are both connected to the cabinet 1 by welding or bolting.

[0036] Furthermore, a fourth linear module 6 is installed on the top of the cabinet 1. One end of the fourth linear module 6 is located inside the component protective box 101, and the other end of the fourth linear module 6 passes through the operation port 102 and extends to the outside of the component protective box 101. A fourth connecting plate 601 is installed on the moving slide of the fourth linear module 6. A first cylinder is installed on both sides of the bottom of the fourth connecting plate 601. The first cylinder is connected to a second clamping plate 602. A tray containing the chip to be tested is placed on the fourth connecting plate 601. The tray is clamped and fixed by the cooperation of the first cylinder and the second clamping plate 602, and is transported by the fourth linear module 6.

[0037] Furthermore, a third linear module 5 is installed on the top of the cabinet 1. One end of the third linear module 5 is located inside the component protection box 101, and the other end of the third linear module 5 passes through the operation port 102 and extends to the outside of the component protection box 101. A third connecting plate 501 is installed on the moving slide of the third linear module 5. A second cylinder is installed on both sides of the bottom of the third connecting plate 501. The second cylinder is connected to a first clamping plate 502. A tray for collecting and testing qualified chips is placed on the third connecting plate 501. The tray is clamped and fixed by the cooperation of the second cylinder and the first clamping plate 502, and is transported by the third linear module 5.

[0038] Furthermore, a second connecting frame 8 is installed on the top of the cabinet 1. The second connecting frame 8 is located between the fourth linear module 6 and the third linear module 5. A first camera 801 and a first fill light 802 located above the first camera 801 are installed on the second connecting frame 8. The first camera 801 is located on the moving trajectory of the vacuum suction cup 301. The second connecting frame 8 is connected to the cabinet 1, the first camera 801 and the first fill light 802 by bolts. The first camera 801 is used to collect pin information at the bottom of the chip to detect whether there are defects in the chip pins.

[0039] Furthermore, a feeding channel 7 is installed on the top of the cabinet 1. The feeding channel 7 is located on the side of the third linear module 5 away from the fourth linear module 6. One end of the feeding channel 7 passes through the component protection box 101 and extends to the outside of the component protection box 101. The feeding channel 7 is set at an angle. Chips that fail the test are put into the feeding channel 7 and slide out from the feeding channel 7. A collection container or conveyor can be placed at the bottom of the feeding channel 7 for collection or transportation.

[0040] Furthermore, the component protective box 101 is hinged to have a component protective door 103 located at the operation port 102. A protective door baffle 104 located at the operation port 102 is fixedly installed inside the component protective box 101, and the side of the protective door baffle 104 contacts the component protective door 103. The protective door baffle 104 and the component protective box 101 are connected by bolts.

[0041] An industrial computer 10 is installed on the side of the cabinet 1. The second camera 901 and the first camera 801 are all connected to the industrial computer 10 via image acquisition cards. The industrial computer 10 is connected to a PLC controller. The PLC controller is connected to the rack 201, the second linear module 204, the third linear module 5, and the fourth linear module 6. The rack 201, the second linear module 204, the third linear module 5, and the fourth linear module 6 are all connected using lead screw type linear modules. The vacuum suction cup 301 is an existing component. The suction and release process of the vacuum suction cup 301 is also controlled by the PLC. The specific principle and air circuit connection are existing technologies and will not be described in detail in this application.

[0042] In use, the tray containing the chip to be tested is placed on top of the fourth connecting plate 601. The tray is clamped and fixed by the cooperation of the first cylinder and the second clamping plate 602. Then, the fourth linear module 6 drives the fourth connecting plate 601 to move the tray to the area that the vacuum suction cup 301 can pick up. The empty tray for collecting qualified products is placed on top of the third connecting plate 501. The empty tray is clamped and fixed by the cooperation of the second cylinder and the first clamping plate 502. Then, the third linear module 5 drives the third connecting plate 501 to move the empty tray to the moving trajectory of the vacuum suction cup 301.

[0043] Based on the position information of the chip to be tested collected by the second camera 901 (the second camera 901 captures the position of the chip in the tray in real time, and the data is transmitted to the industrial computer 10 via the image acquisition card; the industrial computer 10 analyzes the data and generates a position adjustment command), the PLC controller sends control signals to the first linear module 202 and the second linear module 204 of the drive structure 2. The first linear module 202 drives the first connecting plate 203 and the second linear module 204 connected to it to move horizontally, adjusting the position of the vacuum suction cup 301 in the horizontal direction; the second linear module 202... 4. Drive the vacuum chuck 301 on the second connecting plate 205 and the first connecting bracket 3 to move vertically downward, so that the vacuum chuck 301 gradually approaches the chip to be tested. During the descent of the vacuum chuck 301, since the bottom of the pressure ring 402 is lower than the bottom of the vacuum chuck 301, the semi-circular protrusion 403 at the bottom of the pressure ring 402 first contacts the top of the chip, pressing and limiting the chip. Then the vacuum chuck 301 continues to descend and adheres to the chip surface. At this time, a relative displacement occurs between the counterweight ring 404 and the fixed plate 4, and the vacuum chuck 301 activates its suction function, firmly adhering to the chip.

[0044] After the vacuum suction cup 301 picks up the chip, the PLC controller controls the first linear module 202 and the second linear module 204 to work together, driving the vacuum suction cup 301 to move to the detection area of ​​the first camera 801. The first camera 801 captures images of the chip's bottom pins, and the captured image data is transmitted to the industrial computer 10 through the image acquisition card. The detection algorithm built into the industrial computer 10 analyzes and judges whether there are defects (such as pin deformation, missing pins, etc.) in the chip pins. If the industrial computer 10 determines that the chip is qualified for inspection, the PLC controller controls the first linear module 202 and the second linear module 204 to drive the vacuum suction cup 301 to move above the pre-positioned empty tray. Subsequently, the second linear module 204 drives the vacuum suction cup 301... The chip is placed in an empty tray and the vacuum suction cup 301 is deactivated and begins to rise vertically. During the rise of the vacuum suction cup 301, the counterweight ring 404, connecting rod 401, and pressure ring 402 move downward under their own weight, pushing the chip to completely separate from the vacuum suction cup 301, ensuring that the chip falls into the empty tray. If the industrial computer 10 determines that the chip is unqualified, the PLC controller controls the vacuum suction cup 301 to move above the unloading channel 7, and the vacuum suction cup 301 deactivates its suction function. The unqualified chip falls into the unloading channel 7. Since the unloading channel 7 is inclined, the chip slides along the channel to the outside of the component protection box 101. A collection container or conveyor can be placed at the bottom of the channel to achieve centralized collection and subsequent processing of unqualified chips.

[0045] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0046] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A chip fine-tuning mechanism, characterized in that, The device includes a drive structure (2), which includes a drive unit connected to a second connecting plate (205). A first connecting frame (3) is mounted on the second connecting plate (205). A vacuum suction cup (301) is provided on the first connecting frame (3). An auxiliary component is fixedly connected to the outer surface of the vacuum suction cup (301). The auxiliary component includes a fixed plate (4) fixedly connected to the outer surface of the vacuum suction cup (301). A plurality of connecting rods (401) are inserted and connected on the fixed plate (4). A counterweight ring (404) is fixedly connected between the tops of the plurality of connecting rods (401). A pressure ring (402) is fixedly connected between the tops of the plurality of connecting rods (401). The bottom end of the pressure ring (402) is lower than the bottom end of the vacuum suction cup (301).

2. The chip fine-tuning mechanism according to claim 1, characterized in that, The bottom of the pressure ring (402) is fixedly connected with several semi-circular protrusions (403).

3. The chip fine-tuning mechanism according to claim 2, characterized in that, The second connecting plate (205) is also equipped with a third connecting frame (9) located on one side of the first connecting frame (3), and the third connecting frame (9) is equipped with a second camera (901) and a second fill light (902) located below the second camera (901).

4. The chip fine-tuning mechanism according to claim 3, characterized in that, The drive unit includes a frame (201), on which a first linear module (202) is mounted. A first connecting plate (203) is mounted on the movable slide of the first linear module (202), and a second linear module (204) is connected to the first connecting plate (203). The second connecting plate (205) is mounted on the movable slide of the second linear module (204).

5. A photodetector, using the chip fine-tuning mechanism as described in claim 4, characterized in that, The bottom of the rack (201) is fixedly connected to the cabinet (1), and the top of the cabinet (1) is equipped with a component protection box (101). The drive structure (2) is located inside the component protection box (101), and an operation port (102) is provided between the front and the top of the component protection box (101).

6. The optical detection device according to claim 5, characterized in that, A fourth linear module (6) is installed on the top of the cabinet (1). One end of the fourth linear module (6) is located inside the component protection box (101), and the other end of the fourth linear module (6) passes through the operation port (102) and extends to the outside of the component protection box (101). A fourth connecting plate (601) is installed on the moving slide of the fourth linear module (6). A first cylinder is installed on both sides of the bottom of the fourth connecting plate (601), and the first cylinder is connected to a second clamping plate (602).

7. The optical detection device according to claim 6, characterized in that, A third linear module (5) is installed on the top of the cabinet (1). One end of the third linear module (5) is located inside the component protection box (101), and the other end of the third linear module (5) passes through the operation port (102) and extends to the outside of the component protection box (101). A third connecting plate (501) is installed on the moving slide of the third linear module (5). A second cylinder is installed on both sides of the bottom of the third connecting plate (501), and the second cylinder is connected to a first clamping plate (502).

8. The optical detection device according to claim 7, characterized in that, The top of the cabinet (1) is equipped with a second connecting frame (8), which is located between the fourth linear module (6) and the third linear module (5). The second connecting frame (8) is equipped with a first camera (801) and a first fill light (802) located above the first camera (801). The first camera (801) is located on the moving trajectory of the vacuum suction cup (301).

9. The optical detection device according to claim 7, characterized in that, The top of the cabinet (1) is equipped with a material unloading channel (7), which is located on the side of the third linear module (5) away from the fourth linear module (6). One end of the material unloading channel (7) passes through the component protection box (101) and extends to the outside of the component protection box (101).

10. The optical detection device according to claim 5, characterized in that, The component protective box (101) is fitted with a component protective door (103) located at the operation port (102) via a hinge. A protective door baffle (104) located at the operation port (102) is fixedly installed inside the component protective box (101), and the side of the protective door baffle (104) is in contact with the component protective door (103).

Images