X-ray laue diffraction detection device
Patent Information
- Application Number
- CN202521703650.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-23
- Filing Date
- 2025-08-12
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-08-12
AI Technical Summary
[0003]半导体晶圆材料质量会决定下游芯片的可靠度及性能优劣,然而半导体材料长晶速度较慢,且其晶体缺陷仅能以破坏性且高成本的KOH(氢氧化钾)蚀刻检测方式进行抽样检测
(1)、本实用新型采用习知软件且借由对硬件的改进以克服上述现有技术由硬件所导致的问题。本实用新型可借由复数种狭缝模式(如,X射线劳厄衍射(Laue-XRD)狭缝模式、X射线劳厄形貌(Laue-XRT)狭缝模式及X射线层析劳厄形貌(Laue-LXRT)狭缝模式)间之调整或切换,对应地进行一或复数个选自于由X射线劳厄衍射(Laue-XRD)检测程序、X射线劳厄形貌(Laue-XRT)检测程序及X射线层析劳厄形貌(Laue-LXRT)检测程序所组成之族群之检测程序之单独或综合分析,亦即使用单一检测设备即可执行复数种可任意组合之检测程序,而无需使用复数种检测设备。
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Figure CN224772943U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a testing device, and more particularly to an X-ray Laue diffraction testing device. Background Technology
[0002] Laue-X-ray diffraction (XRD) is a technique that uses the principles of X-ray diffraction to study the internal structure of matter. Discovered in 1912 by German physicist Max von Laue, this technique can be used to analyze the structure of crystalline materials, including the distances and angles between atoms, thus revealing the material's microstructure. In Laue X-ray diffraction, a beam of X-rays shines onto a crystalline sample; due to the ordered arrangement of the crystal, the X-rays produce strong diffraction at specific angles. These diffraction angles can be calculated using Bragg's equations. By analyzing the diffraction peaks on the diffraction pattern, detailed information about the crystal structure can be obtained.
[0003] The quality of semiconductor wafer materials determines the reliability and performance of downstream chips. However, semiconductor materials grow slowly, and crystal defects can only be detected through sampling using destructive and costly KOH (potassium hydroxide) etching. This destructive inspection technique involves slicing the ingot and inspecting the first and last two wafers (top and bottom), rendering the inspected wafers unusable and requiring scrapping, resulting in significant cost losses and greatly extended inspection time. Therefore, a non-destructive and global inspection technology is urgently needed, and the problems with existing technologies are all hardware-related. Utility Model Content
[0004] In view of this, one of the objectives of this utility model is to provide an X-ray Laue diffraction detection device. This utility model uses conventional software and improves the hardware to solve the problems of the traditional detection techniques of first and last sectioning and chemical etching.
[0005] To achieve the aforementioned objectives, this invention proposes an X-ray Laue diffraction detection device comprising at least a stage, an X-ray source, a collimator, and a detector. The stage is used to mount the object under test, and the stage adjusts the orientation of the object under test via a multi-degree-of-freedom (MDOF) object motion mechanism. The collimator provides an X-ray Laue diffraction (Laue-XRD) slit mode and / or an X-ray (Laue-XRT; Laue-X-RayTopography) slit mode and / or an X-ray tomographic Laue morphology (Laue-LXRT; Laue-Laminography X-RayTopography) slit mode, allowing the X-rays provided by the X-ray source to pass through the collimator and irradiate the object under test. The detector is used to acquire diffraction information (e.g., diffraction patterns and / or image data) of the test object after it has been irradiated with X-rays. The detector adjusts its orientation according to the orientation of the test object via a multi-degree-of-freedom detector motion mechanism. By irradiating at least one two-dimensional surface of the test object with X-rays, one of the irradiated sections (or irradiated blocks) of the test object is subjected to one or more detection procedures selected from a group consisting of X-ray Laue diffraction (Laue-XRD) detection procedures, X-ray Laue morphology (Laue-XRT) detection procedures, and X-ray tomographic Laue morphology (Laue-LXRT) detection procedures.
[0006] The collimator is a combination of a first slit assembly and a second slit assembly that can be adjusted via a biaxial (X / Z axis) motion module, or a light-limiting assembly with a plurality of switchable preset openings, used to modulate the area and / or intensity of the X-rays after passing through the collimator in the Laue-XRD slit mode and / or the Laue-XRT slit mode and / or the X-ray tomography Laue morphology slit mode, and then irradiate the object under test with the modulated X-rays.
[0007] Wherein, the area and / or intensity of the X-ray after passing through the collimator of the Laue-XRT slit mode is greater than the area and / or intensity of the X-ray after passing through the collimator of the Laue-LXRT slit mode, or greater than the area and / or intensity of the X-ray after passing through the collimator of the Laue-XRD slit mode.
[0008] The multi-degree-of-freedom object motion mechanism and the multi-degree-of-freedom detector motion mechanism are respectively selected from a group consisting of a yaw motion module, a Z-axis (lifting) motion module and a Y-axis (left and right) motion module.
[0009] The multi-degree-of-freedom motion mechanism for the test object further includes a tumbling (roll direction) motion module.
[0010] In this multi-degree-of-freedom detector motion mechanism, the yaw motion module uses the object to be tested on the support platform as a yaw axis, so that the detector performs a circular motion.
[0011] This circular motion is a local circular motion.
[0012] The yaw motion module of the multi-degree-of-freedom test object motion mechanism and the yaw motion module of the multi-degree-of-freedom detector motion mechanism enable the test object and the detector to perform a coaxial yaw motion.
[0013] In this process, the object under test is subjected to a Z-axis (lifting) motion module and / or a Y-axis (left-right) motion module of the multi-degree-of-freedom object under test motion mechanism to perform a Z-axis linkage motion and / or a Y-axis linkage motion, thereby obtaining the diffraction information of the irradiated area of the object under test corresponding to the two-dimensional surface by irradiating the irradiated area of the object under test with the X-ray scanning of the X-ray source.
[0014] The multi-degree-of-freedom object motion mechanism and the multi-degree-of-freedom detector motion mechanism work together to adjust the orientation of the object and the orientation of the detector, so that the diffraction information of the object obtained by the detector has the best diffraction intensity and the best diffraction distribution.
[0015] The X-ray Laue diffraction detection equipment further includes a base, wherein the stage and the detector are respectively mounted on the base via the multi-degree-of-freedom test object motion mechanism and the multi-degree-of-freedom detector motion mechanism.
[0016] The X-ray source is mounted on the base via a light source movement mechanism.
[0017] The base has at least one shock-absorbing foot at its bottom.
[0018] In the Laue-XRD detection procedure, the wavelength range of the X-ray is 2.48 Å to 0.006 Å, and in the Laue-XRT detection procedure, the wavelength range of the X-ray is 2.48 Å to 0.004 Å.
[0019] The operating power of the X-ray source ranges from 100W to 4,000W, and the X-ray emission mode is either continuous wave (CW) mode or pulsed mode.
[0020] The detector can be a charge-coupled device (CCD), a flat panel detector (FP), or a single-photon counter (HPC).
[0021] The X-ray Laue diffraction detection device further includes a processor for receiving and analyzing the diffraction information of the test object to obtain at least one key parameter of the test object, and the processor for receiving and analyzing the diffraction information of the test object to output a Laue-XRT image and / or a Laue-LXRT image of the test object.
[0022] The diffraction information of the analyte obtained by the detector corresponds to the key parameter of the analyte.
[0023] The key parameter of the analyte is selected from a group consisting of micro-pipe density (MPD), dislocation density (DD), crystallinity, lattice curvature, and residual stress.
[0024] The detector acquires the diffraction information of the irradiated area of the test object in a non-destructive and global manner, and the diffraction information includes diffraction patterns and / or image data.
[0025] The test object is a semiconductor structure selected from the group consisting of silicon, gallium arsenide, indium phosphide, gallium nitride and silicon carbide.
[0026] The object to be tested is a crystal ingot or a crystal wafer.
[0027] Wherein, one of the locations of the irradiated area of the test object is located on one of the projection surfaces of the two-dimensional surface of the test object, and the depth range of one of the irradiated areas covers the entire thickness of the test object or covers the two-dimensional surface of the test object to a depth inside the test object.
[0028] As stated above, the X-ray Laue diffraction detection equipment of this utility model has the following advantages: (1) This utility model uses conventional software and improves the hardware to overcome the problems caused by the hardware in the prior art. This utility model can adjust or switch between multiple slit modes (such as X-ray Laue diffraction (Laue-XRD) slit mode, X-ray Laue morphology (Laue-XRT) slit mode and X-ray tomographic Laue morphology (Laue-LXRT) slit mode) to perform one or more detection programs selected from a family of detection programs composed of X-ray Laue diffraction (Laue-XRD), X-ray Laue morphology (Laue-XRT) and X-ray tomographic Laue morphology (Laue-LXRT) detection programs, either individually or in combination. That is, multiple arbitrarily combinable detection programs can be executed using a single detection device without the need to use multiple detection devices.
[0029] (2) This utility model uses conventional software and improves the hardware to replace the traditional detection technology using head and tail slicing and chemical etching. Therefore, it can obtain the diffraction information of the irradiated area (or irradiated block) of the test object in a non-destructive and global manner.
[0030] (3) This utility model uses conventional software and improves the hardware to make the diffraction information of the test object obtained by the detector have the best diffraction intensity and the best diffraction distribution.
[0031] (4) This invention employs conventional software and improves the hardware to simultaneously possess morphological images (Laue-XRT / Laue-LXRT) and diffraction structure (Laue-XRD) information at each scanning point, thereby overcoming the limitations of a single technology and achieving accurate judgment. Furthermore, it allows for switching between Laue-XRT, Laue-LXRT, and XRD modes at any time based on real-time analysis results. In addition, by introducing the Laue-LXRT mode of X-ray tomography, this invention extends the detection from two-dimensional surfaces to specific depths, thereby obtaining information such as the crystallinity and defect density of the analyte at different depths.
[0032] To enable you to have a better understanding of the technical features and effects of this utility model, preferred embodiments and detailed descriptions are provided below. Attached Figure Description
[0033] Figure 1 This is a three-dimensional schematic diagram of the X-ray Laue diffraction detection equipment of this utility model.
[0034] Figure 2 This is a side view schematic diagram of the X-ray Laue diffraction detection equipment of this utility model.
[0035] Figure 3 This is a top view schematic diagram of the X-ray Laue diffraction detection equipment of this utility model.
[0036] Figure 4 This is a block diagram illustrating the operation of the X-ray Laue diffraction detection device of this utility model.
[0037] Explanation of reference numerals in the attached figures: 10: X-ray Laue diffraction testing equipment 20: Supporting platform 22: Multi-degree-of-freedom test object motion mechanism 23: Yaw Motion Module 24: Z-axis (lifting) motion module 25: Y-axis (left and right) motion module 26: Rolling motion module 30: Base 32: Vibration-damping foot seat 40: X-ray source 41: Light source motion mechanism 42: X-axis displacement mechanism 44: Y-axis displacement mechanism 45: X-ray 50: Processor 60: Collimator 62: First slit assembly 64: Second slit assembly 66: Biaxial motion module 80: Detector 82: Multi-degree-of-freedom detector motion mechanism 83: Yaw Motion Module 84: Z-axis (lifting) motion module 85: Y-axis (left and right) motion module 100: Test Item Detailed Implementation
[0038] To facilitate understanding of the technical features, content, advantages, and effects of this utility model, it is described in detail below with reference to the accompanying drawings and embodiments. The drawings used are for illustrative purposes only and do not necessarily represent the actual proportions and precise configurations of the utility model in practice. Therefore, the proportions and configurations in the accompanying drawings should not be used to interpret or limit the scope of the utility model in actual implementation. Furthermore, for ease of understanding, the same elements in the following embodiments are indicated by the same symbols.
[0039] Furthermore, unless otherwise specified, the terms used throughout this specification and claims generally have their ordinary meaning in the context of this art, the disclosure herein, and the specific content. Certain terms used to describe this utility model will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing this utility model.
[0040] The use of terms such as "first," "second," "third," and "fourth" in this document does not specifically refer to any order or sequence, nor is it intended to limit this utility model. Rather, it is merely used to distinguish components or operations described using the same technical terms.
[0041] Secondly, when this article uses terms such as "contains", "includes", "has", or "contains", these are all open-ended terms, meaning that they include but are not limited to.
[0042] This invention utilizes a high-intensity multi-energy X-ray beam to irradiate ingots / wafers and other objects to be tested, generating multiple diffraction patterns. Numerical analysis is then performed based on the diffraction peaks of different crystal planes, thereby enabling the calculation of information such as crystal quality, crystal orientation, crystal axis, stress, and defect density. Figure 1 This is a three-dimensional schematic diagram of the X-ray Laue diffraction detection equipment of this utility model. Figure 2 This is a side view schematic diagram of the X-ray Laue diffraction detection equipment of this utility model. Figure 3 This is a top view schematic diagram of the X-ray Laue diffraction detection equipment of this utility model. Figure 4 This is a block diagram illustrating the operation of the X-ray Laue diffraction detection equipment of this invention. Please refer to [link / reference]. Figures 1 to 4 The X-ray Laue diffraction (Laue-XRD) detection device 10 of this utility model is suitable for performing at least one test object 100 on one or more detection procedures selected from the group consisting of X-ray Laue diffraction (Laue-XRD) detection procedures, X-ray Laue morphology (Laue-XRT) detection procedures, and X-ray tomographic Laue morphology (Laue-LXRT) detection procedures.
[0043] In terms of operating principle, the Laue-XRD inspection procedure uses a relatively small spot size (e.g., but not limited to, approximately 0.5 x 0.5 mm). 2Parallel X-rays are used to irradiate the two-dimensional surface of the test object 100. The X-rays interact with the irradiated area (or irradiated block or irradiated volume) on the test object 100 corresponding to this two-dimensional surface, generating multiple diffraction patterns. By comparing these diffraction patterns with a standard sample (an ideal stress-free sample) and analyzing the offset, the stress distribution of the test object 100 can be determined. The irradiated area is located on the projection surface of the two-dimensional surface of the test object 100 irradiated by the parallel X-rays, and its depth covers the entire thickness of the test object 100 or reaches any depth. The Laue-XRT detection procedure uses a relatively large spot size (e.g., but not limited to, approximately 5 x 5 mm). 2 Parallel X-rays from the test object 100 interact with the sample to generate multiple diffraction patterns. Since defects within the crystal (such as differential alignments) affect the diffraction intensity, this invention can obtain the diffraction intensity of each irradiated area through scanning. By analyzing the variations in diffraction intensity, the defect location and density can be presented in an image format, thereby analyzing the total defect density of the irradiated area. The Laue-LXRT detection procedure uses a narrow, elongated shape (e.g., but not limited to, approximately 1 x 5 mm). 2 Parallel X-rays interact with the test object 100 to generate multiple diffraction signals. This invention allows diffraction signals from irradiated areas of different thicknesses (depths) of the test object 100 to be projected onto different positions on the detector 80 (described later). Therefore, by capturing and analyzing these spatially differentiated diffraction signals, the defect density distribution of the test object 100 along the depth direction can be deduced, thereby obtaining three-dimensional structural information with depth resolution. Specifically, this invention, by adjusting the relative geometric relationship between the test object 100 and the detector 80, particularly the active yaw motion of the detector 80 and / or the test object 100, allows diffraction signals from different depths of the test object 100 to be projected onto different spatial positions on the detector 80. The processor 50 can then reconstruct defect images at different specific depths based on these spatially separated signals, thereby enabling analysis of two-dimensional surfaces at arbitrary depths. Furthermore, those skilled in the art to which this utility model pertains should be able to understand, upon referring to the technical content and illustrations of this utility model, how the testing equipment of this utility model implements testing procedures such as Laue-XRD, Laue-XRT, and Laue-LXRT, and since its operating principle is known technology, it will not be described in detail here.
[0044] The X-ray Laue diffraction (Laue-XRD) inspection device 10 of this invention includes at least a stage 20, at least one X-ray source 40, a collimator 60, and a detector 80. The stage 20 is used to mount the object under test 100. This stage 20 is connected, for example, to a multi-degree-of-freedom object motion mechanism 22, thereby adjusting the orientation of the object under test 100 according to, for example, an X-ray Laue diffraction (Laue-XRD) inspection procedure and / or an X-ray Laue morphology (Laue-XRT) inspection procedure and / or an X-ray tomographic Laue morphology (Laue-LXRT) inspection procedure. The number of objects under test 100 applicable to this invention is not limited to one or more, and the objects under test 100 are, for example, but not limited to, semiconductor structures selected from the group consisting of silicon, gallium arsenide, indium phosphide, gallium nitride, and silicon carbide. This invention uses crystal ingots or wafers as examples to illustrate the present invention, but is not intended to limit the scope of the invention.
[0045] For example, the support stage 20 is mounted on the multi-degree-of-freedom object motion mechanism 22. The multi-degree-of-freedom object motion mechanism 22 is selected from a group consisting of a yaw motion module, a Z-axis motion module, and a Y-axis motion module, for example, from a group consisting of a yaw motion module 23, a Z-axis (lifting) motion module 24, and a Y-axis (left-right) motion module 25, thereby allowing the object 100 to selectively perform yaw motion, Z-axis (lifting) motion, and Y-axis (left-right) motion in the aforementioned X-ray Laue diffraction (Laue-XRD) inspection procedure and / or X-ray Laue morphology (Laue-XRT) inspection procedure and / or X-ray tomographic Laue morphology (Laue-LXRT) inspection procedure. The yaw motion rotates left and / or right around the Z-axis. The Z-axis (lifting) motion is the upward and / or downward movement along the Z-axis. Y-axis (left-right) movement refers to moving left and / or right along the Y-axis. The multi-degree-of-freedom test object motion mechanism 22 of this invention further includes a roll motion module 26, thereby enabling the test object 100 to selectively perform roll motion in the aforementioned X-ray Laue diffraction (Laue-XRD) detection procedure and / or X-ray Laue morphology (Laue-XRT) detection procedure and / or X-ray tomographic Laue morphology (Laue-LXRT) detection procedure. The roll motion is centered on the Y-axis, performing counterclockwise (leftward) and / or clockwise (rightward) rotation.
[0046] The X-ray source 40 is, for example, an X-ray tube or other suitable light source, for providing X-rays 45 having at least one wavelength. The orientation of the X-rays 45 emitted by the X-ray source 40 is adjusted, for example, by a light source movement mechanism 41 (e.g., an X-axis displacement mechanism 42 and a Y-axis displacement mechanism 44). The X-rays 45 used in this invention are, for example, high-energy X-rays. The X-rays 45 have an adjustable intensity and photon flux, generated by an X-ray tube with an operating power range of about 100W to about 4,000W (e.g., about 600W to about 2,000W, or about 600W to about 3,000W). The emission mode of the X-rays 45 can be continuous wave (CW) or pulsed, with a pulse frequency of up to about 100Hz, and can be any value or range within the aforementioned power and frequency ranges. In the Laue-XRD detection procedure, the wavelength of X-ray 45 ranges from about 2.48 Å to 0.006 Å, preferably from about 1.24 Å to about 0.248 Å, corresponding to photon energies of about 10 keV to 50 keV. Alternatively, in the aforementioned Laue-XRT and / or Laue-LXRT detection procedures, the wavelength of X-ray 45 ranges from about 2.48 Å to 0.004 Å, preferably from about 1.24 Å to about 0.248 Å, and can be any value or range within the aforementioned wavelength range. The X-ray source 40 of this invention is not limited to a specific manufacturer or supplier; any source that can provide any value or range of the aforementioned or equivalent wavelength range, power range, and frequency range is applicable to this invention. Similarly, the wavelength range used in this invention is not limited to the examples mentioned above. Any wavelength range can be applied to this invention as long as it can interact with the object to be tested 100 to produce a diffraction phenomenon.
[0047] Collimator 60 can provide one or more slit modes selected from a family of X-ray Laue diffraction (Laue-XRD) slit modes, X-ray Laue morphology (Laue-XRT) slit modes, and X-ray tomographic Laue morphology (Laue-LXRT) slit modes. For example, in the aforementioned X-ray Laue diffraction (Laue-XRD) detection procedure, X-ray Laue morphology (Laue-XRT) detection procedure, and X-ray tomographic Laue morphology (Laue-LXRT) detection procedure, collimator 60 can provide an X-ray Laue diffraction (Laue-XRD) slit mode (for a smaller spot), an X-ray Laue morphology (Laue-XRT) slit mode (for a larger spot), and an X-ray tomographic Laue morphology (Laue-LXRT) slit mode (for a slit spot), respectively, so that the aforementioned X-rays 45 can pass through collimator 60 and irradiate the object 100. The collimator 60 of this invention has a variable aperture. For example, the collimator 60 includes a combination of a first slit assembly 62 and a second slit assembly 64, which are used to adjust the collimator 60 to XRD slit mode, Laue-XRT slit mode, or XRT slit mode respectively via a biaxial (X / Z axis) motion module 66, thereby correspondingly adjusting the area (e.g., X-ray projection area) and / or intensity (e.g., X-ray flux) of the X-ray 45 after passing through the collimator 60. The biaxial (X / Z axis) motion module 66 achieves the aforementioned adjustment of area and / or intensity by independently adjusting the opening size and relative position of the first slit assembly 62 and the second slit assembly 64. Alternatively, the collimator 60 of this invention can also be, for example, a light-limiting component with a plurality of selectable openings, making it a light-limiting collimator. These preset openings have different shapes and / or sizes. By selecting different openings, the collimator 60 can be adjusted or switched to correspond to the aforementioned XRD slit mode, Laue-XRT slit mode, or XRT slit mode, thereby correspondingly modulating the area (e.g., X-ray projection area) and / or intensity (e.g., X-ray flux) of the X-rays 45 after passing through the collimator 60. For example, in this invention, the area and / or intensity of the X-rays 45 after passing through the collimator 60 in the XRT slit mode is greater than the area and / or intensity of the X-rays 45 after passing through the collimator 60 in the LXRT slit mode, or greater than the area and / or intensity of the X-rays 45 after passing through the collimator 60 in the XRD slit mode. One of the features of the X-ray Laue diffraction detection device 10 of this utility model is that the collimator 60 of this utility model can provide dual-mode detection, and can even change modes in real time, such as three-mode detection.For example, collimator 60 can provide an X-ray Laue diffraction (Laue-XRD) slit mode for small spot single-point scanning, an X-ray Laue morphology (Laue-XRT) slit mode for large spot wide-area parallel light imaging, and an X-ray tomographic Laue morphology (Laue-LXRT) slit mode for parallel light imaging with a slit spot for tomography.
[0048] In the detection procedure (e.g., one or more of the following: Laue-XRD detection procedure, Laue-XRT detection procedure, and Laue-LXRT detection procedure), the detector 80 is used to acquire at least one diffraction information (e.g., diffraction pattern and / or image data) of the test object 100 after irradiation with the aforementioned X-rays 45, wherein the detector 80 is, for example, via a multi-degree-of-freedom detector motion mechanism 82. The orientation of the detector 80 is adjusted according to the orientation of the object under test 100. X-rays 45 are used to scan and irradiate at least one two-dimensional surface (i.e., a designated area) of the object under test 100. Correspondingly, at least one irradiated area of the object under test 100 is subjected to one or more detection procedures selected from a group consisting of X-ray Laue diffraction (Laue-XRD), X-ray Laue morphology (Laue-XRT), and X-ray tomographic Laue morphology (Laue-LXRT). This irradiated area is located on the object under test 100, and its depth range can cover all or part of the thickness of the object under test 100. The irradiated area is located on the projection surface of the aforementioned two-dimensional surface of the object under test 100 scanned by X-rays 45. The detector 80 non-destructively and globally acquires diffraction information of the irradiated area of the object under test 100. The detector 80 of this invention is, for example, a charge-coupled device (CCD), a flat panel detector (FP), or a hybrid photon counter (HPC), but is not limited thereto.
[0049] The multi-degree-of-freedom detector motion mechanism 82 of this invention is selected from a group consisting of a yaw motion module, a Z-axis motion module, and a Y-axis motion module, or from a group consisting of a yaw (Yaw direction) motion module 83, a Z-axis (lifting) motion module 84, and a Y-axis (left and right) motion module 85. The orientation of the detector 80 can be selectively adjusted according to the orientation of the object under test 100. The yaw (Yaw direction) motion module 83 of the multi-degree-of-freedom detector motion mechanism 82 drives the detector 80, causing it to perform a circular motion (e.g., a full circular or partial circular motion) with the object under test 100 on the support platform 20 as the yaw axis. Specifically, since the two-dimensional surface of the object under test 100 scanned by the X-ray 45 is located on the XZ plane, the aforementioned circular motion is, for example, an arc-shaped orbital motion with the Z-axis as the axis.
[0050] Furthermore, in a feasible embodiment of this utility model, the yaw motion module 23 of the multi-degree-of-freedom test object motion mechanism 22 and the yaw motion module 83 of the multi-degree-of-freedom detector motion mechanism 82, for example, cause the test object 100 and the detector 80 to perform coaxial yaw motion. The test object 100 can, for example, perform Z-axis (lifting) motion module 24 and / or Y-axis (left and right) motion module 25 of the multi-degree-of-freedom test object motion mechanism 22 to perform Z-axis linkage motion and / or Y-axis linkage motion, so that the X-ray 45 of the X-ray source 40 scans and irradiates the two-dimensional surface of the test object 100. Since the X-ray 45 can penetrate into the interior of the test object 100 and be diffracted by the test object 100, diffraction information of the irradiated area corresponding to the two-dimensional surface on the test object 100 can be obtained. In a feasible embodiment of this utility model, the multi-degree-of-freedom object motion mechanism 22 and the multi-degree-of-freedom detector motion mechanism 82, for example, cooperatively adjust the orientation of the object 100 and the orientation of the detector 80. That is, the orientation of the object 100 and the orientation of the detector 80 are matched to each other so that the diffraction pattern of the object 100 obtained by the detector 80 has a better (e.g., optimal) diffraction intensity and a better (e.g., optimal) diffraction distribution. The incident light irradiated by the X-ray 45 onto the object 100 and the reflected light (or transmitted light) reflected (or penetrating) the object 100 form an angle, the value of which is determined according to the adjustment of the multi-degree-of-freedom object motion mechanism 22 and the multi-degree-of-freedom detector motion mechanism 82. The optimization of diffraction intensity and diffraction distribution mentioned above includes, but is not limited to, maximizing the intensity of a specific diffraction peak, minimizing the half-width at half-maximum (FWHM) of the diffraction peak (representing better crystallinity), obtaining the maximum number of indexable diffraction points, and achieving a preset standard for the symmetry or clarity of the diffraction pattern.
[0051] In addition, such as Figure 1As shown, the X-ray Laue diffraction detection device of this invention selectively includes a base 30, on which the stage 20, detector 80, and / or X-ray source 40 are selectively disposed. For example, the stage 20 is disposed on the base 30 via the aforementioned multi-degree-of-freedom object motion mechanism 22, and the detector 80 is disposed on the base 30 via the aforementioned multi-degree-of-freedom detector motion mechanism 82. The X-ray source 40 is disposed on the base 30 via a source motion mechanism 41 (e.g., X-axis displacement mechanism 42 and Y-axis displacement mechanism 44), thereby enabling source operations such as optical path alignment and calibration, and / or beam position fine-tuning. In addition, the bottom of the base 30 may selectively have at least one vibration-damping foot 32 to reduce vibration. However, the base 30 may also be selectively omitted, and the vibration-damping foot 32 may be selectively disposed directly on the stage 20, detector 80, and / or X-ray source 40. That is to say, the vibration damping foot 32 can be set in any position, as long as it can reduce vibration, it is within the scope of protection of this utility model.
[0052] The X-ray Laue diffraction detection device 10 of this invention further includes, for example, a processor 50. The processor 50 is a computing, processing, and / or control device used to receive and analyze the diffraction pattern of the test object 100, thereby obtaining at least one key parameter of the test object 100. The processor 50 receives and analyzes the diffraction information of the test object 100 to output Laue-XRT and / or Laue-LXRT images of the test object 100. The diffraction information of the test object 100 obtained by the detector 80 corresponds to the key parameter of the test object 100. Key parameters of the test object 100 are selected from a group consisting of micro-pipe density (MPD), dislocation density (DD) [e.g., the density of threading edge dislocation (TED), threading screw dislocation (TSD), stacking fault (SF), basal plane dislocation (BPD), etc.], crystallinity, lattice curvature (misorientation), and residual stress. This invention can selectively provide real-time data fusion and correlation analysis, as well as dynamic adaptive mode switching.
[0053] For example, taking real-time data fusion and correlation analysis as an example, this invention can selectively and preferably (but is not limited to) integrate XRT image data, LXRT image data, and XRD diffraction pattern data in real time. This not only presents multiple sets of data but also allows for further analysis and judgment of the correlations between these data, such as the relationship between specific morphological features and specific diffraction peak deformations, thereby improving the accuracy and reliability of the aforementioned key parameter calculations. Taking dynamic adaptive mode switching as an example, this invention can selectively switch between Laue-XRT, Laue-LXRT, and Laue-XRD detection modes dynamically based on real-time analysis results. For instance, when the Laue-XRT or Laue-LXRT detection program detects a suspicious morphological feature, the entire system does not need to wait for the entire scan to finish. Instead, it immediately pauses the Laue-XRT or Laue-LXRT detection program at that point and can switch to the XRD detection mode in real time for in-depth analysis. After completion, it switches back to the Laue-XRT or Laue-LXRT detection mode to continue scanning. In addition, based on the data from the LXRT detection procedure obtained using the Laue-LXRT slit mode of X-ray tomography, the Laue diffraction pattern can highlight the depth information of the test object 100 because it restricts the width of one dimension of the light source, thereby obtaining information such as the crystallinity and defect density of the test object 100 at different depths.
[0054] For example, the X-ray Laue diffraction detection device 10 of this invention can, for instance, first adjust the slit width of the collimator 60 to a suitable size, and then adjust the yaw motion module 23 and the roll motion module 26 of the multi-degree-of-freedom test object motion mechanism 22, and in conjunction with adjusting the yaw motion module 83, the Y-axis (left-right) motion module 85, and the Z-axis (lifting) motion module 84 of the multi-degree-of-freedom detector motion mechanism 82, in order to obtain a full-range Laue diffraction pattern of a specific material crystal. Furthermore, by fine-tuning the aforementioned degrees of freedom of the multi-degree-of-freedom test object motion mechanism 22 and the multi-degree-of-freedom detector motion mechanism 82, this invention can achieve optimal diffraction intensity and distribution. This invention can, for example, adjust the slit width of the collimator 60 to XRD slit mode, and then cause the Z-axis (lifting) motion module 24 and Y-axis (left-right) motion module 25 of the multi-degree-of-freedom test object motion mechanism 22 to perform Z-axis and Y-axis linked motion, thereby obtaining the diffraction information of the irradiated area on the test object 100 corresponding to the two-dimensional surface (designated area) by scanning the test object 100 with X-ray 45. The location of the irradiated area corresponds to the two-dimensional surface of the test object 100 scanned by X-ray 45, and the depth range of the irradiated area covers the entire thickness of the test object 100 or covers any depth from the two-dimensional surface of the test object 100 to the interior of the test object 100. Next, this invention can use conventional software, for example, input the above data set into analysis software (e.g., the processor 50 described later), to obtain the above key parameters. Furthermore, when this invention is intended to perform an X-ray Laue morphology (Laue-XRT) inspection procedure or an X-ray tomographic Laue morphology (Laue-LXRT) inspection procedure, this invention can, for example, first adjust the slit width of the collimator 60 to correspond to the Laue-XRT slit mode or the Laue-LXRT slit mode, and then adjust the various motion modules of the multi-degree-of-freedom detector motion mechanism 82 to optimize the intensity and clarity of the diffraction peak image. Subsequently, the Z-axis (lifting) motion module 24 and the Y-axis (left-right) motion module 25 of the multi-degree-of-freedom test object motion mechanism 22 are made to perform Z-axis linked motion and Y-axis linked motion to perform a two-dimensional surface scan of the test object 100, thereby obtaining the diffraction information of the irradiated area on the test object 100 corresponding to this two-dimensional surface. Subsequently, the aforementioned data set is input into analysis software (e.g., the processor 50 described later is installed), and in Laue-XRT detection mode, a two-dimensional Laue-XRT topographic image is output. Alternatively, in Laue-LXRT detection mode, it is used to output a series of two-dimensional surface scan images at different depths, or to reconstruct three-dimensional structural information with depth resolution.This utility model is not limited to one or more of the following: the light source motion mechanism 41, the dual-axis (XZ axis) motion module 66, the multi-degree-of-freedom test object motion mechanism 22, and / or the multi-degree-of-freedom detector motion mechanism 82, which are automatically adjusted by the processor 50 or manually adjusted by the user.
[0055] The various motion mechanisms used in this invention, such as the light source motion mechanism 41 with an X-axis displacement mechanism 42 and a Y-axis displacement mechanism 44, the multi-degree-of-freedom detector motion mechanism 82 with a yaw motion module 83, a Z-axis (lifting) motion module 84 and a Y-axis (left-right) motion module 85, and the multi-degree-of-freedom test object motion mechanism 22 with a yaw motion module 23, a Z-axis (lifting) motion module 24 and a Y-axis (left-right) motion module 25, all include drive mechanisms and guide mechanisms that can perform their respective purposes, and the drive mechanisms can be manually or automatically operated. For example, the guide mechanism is, for example, but not limited to, a guide rail, and the drive mechanism is, for example, but not limited to, various components that can drive the light source, detector, or test object to move along the guide rail, such as screw-type drive components or rack / pinion drive components, etc., and these motion mechanisms can also be selectively equipped with auxiliary components such as limit sensors. Since the structural details of these motion mechanisms are not the focus of this utility model, as long as their default motion function in the detection equipment of this utility model can be performed, any structure or configuration can be applied to this utility model.
[0056] Furthermore, those skilled in the art to which this utility model pertains should understand, based on the foregoing disclosure of this utility model, how the X-ray Laue diffraction detection device 10 of this utility model operates to perform X-ray Laue diffraction (Laue-XRD) detection procedures and / or X-ray Laue morphology (Laue-XRT) detection procedures and / or X-ray tomographic Laue morphology (Laue-LXRT) detection procedures. Therefore, this utility model will not elaborate on its operating steps and procedures.
[0057] This invention provides an X-ray Laue diffraction detection method using the aforementioned X-ray Laue diffraction detection equipment, comprising at least the following steps: providing a test object 100 on a support stage 20; providing an X-ray 45 using an X-ray source 40; providing one or more slit modes selected from a group consisting of an X-ray Laue diffraction (Laue-XRD) slit mode, an X-ray Laue morphology (Laue-XRT) slit mode, and an X-ray tomographic Laue morphology (Laue-LXRT) slit mode via a collimator 60 to modulate the X-ray; irradiating the test object 100 with the modulated X-ray 45; and coordinating the orientation of the test object 100 and a detector 80, and obtaining at least one diffraction information of the test object 100 using the detector 80.
[0058] Before performing the above-mentioned detection process, the present invention may also selectively perform a calibration procedure. For example, a calibration sample (not shown) may be loaded onto the stage 20, the slit opening of the collimator 60 may be adjusted to the finest degree, and the diffraction pattern of the calibration sample may be obtained at a calibration position. Then, this diffraction pattern may be input into the calibration analysis software.
[0059] In summary, the X-ray Laue diffraction detection device of this invention has the following advantages: (1) This utility model uses conventional software and improves the hardware to adjust or switch between multiple slit modes (such as X-ray Laue diffraction (Laue-XRD) slit mode, X-ray Laue morphology (Laue-XRT) slit mode or X-ray tomographic Laue morphology (Laue-LXRT) slit mode) to perform one or more detection programs selected from a family of X-ray Laue diffraction (Laue-XRD) detection programs, X-ray Laue morphology (Laue-XRT) detection programs and X-ray tomographic Laue morphology (Laue-LXRT) detection programs, either individually or in combination. That is, multiple arbitrarily combinable detection programs can be executed using a single detection device without the need to use multiple detection devices.
[0060] (2) This utility model uses conventional software and improves the hardware to replace the traditional detection technology using head and tail slicing and chemical etching. Therefore, it can obtain the diffraction information of the irradiated area of the test object in a non-destructive and global manner.
[0061] (3) This utility model uses conventional software and improves the hardware to make the diffraction information of the test object obtained by the detector have the best diffraction intensity and the best diffraction distribution.
[0062] (4) This invention employs conventional software and improves the hardware to simultaneously possess morphological images (Laue-XRT / Laue-LXRT) and diffraction structure (Laue-XRD) information at each scanning point, thereby overcoming the limitations of a single technology and achieving accurate judgment. Furthermore, the detection modes of Laue-XRT, Laue-LXRT, and Laue-XRD can be switched at any time based on the real-time analysis results. In addition, by introducing the Laue-LXRT X-ray tomography detection mode, this invention allows the detection to extend from two-dimensional surfaces to specific depths, thereby obtaining information such as the crystallinity and defect density of the analyte at different depths.
[0063] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made to this utility model without departing from its spirit and scope should be included in the appended claims.
Claims
1. An X-ray Laue diffraction detection device, characterized in that, At least include: A support platform for loading at least one object to be tested, the support platform adjusting one orientation of the object to be tested via a multi-degree-of-freedom object motion mechanism; An X-ray source for providing X-rays having at least one wavelength; A collimator is used to provide one or more slit modes selected from a group consisting of an X-ray Laue diffraction slit mode, an X-ray Laue morphology slit mode and an X-ray tomographic Laue morphology slit mode, such that the X-rays pass through the collimator and irradiate the object under test. as well as A detector is used to acquire at least one diffraction information of the test object after being irradiated by X-rays, wherein the detector adjusts one orientation of the detector according to the orientation of the test object via a multi-degree-of-freedom detector motion mechanism, and performs one or more detection procedures selected from a group consisting of an X-ray Laue diffraction detection procedure, an X-ray Laue morphology detection procedure, and an X-ray tomographic Laue morphology detection procedure on at least one two-dimensional surface of the test object by irradiating the test object with X-rays.
2. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, The collimator is a combination of a first slit assembly and a second slit assembly that can be adjusted via an X / Z biaxial motion module, or the collimator is a light-limiting assembly with a plurality of selectable openings for adjusting or selecting the area and / or intensity of the X-rays after passing through the collimator, so that the X-rays irradiate the object under test.
3. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, Wherein the area and / or intensity of the X-ray after passing through the collimator of the X-ray Laue morphology slit mode is greater than the area and / or intensity of the X-ray after passing through the collimator of the X-ray tomography Laue morphology slit mode, or greater than the area and / or intensity of the X-ray after passing through the collimator of the X-ray Laue diffraction slit mode.
4. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, The multi-degree-of-freedom test object motion mechanism and the multi-degree-of-freedom detector motion mechanism are respectively selected from a group consisting of a yaw motion module, a Z-axis motion module and a Y-axis motion module.
5. The X-ray Laue diffraction detection equipment as described in claim 4, characterized in that, The multi-degree-of-freedom motion mechanism for the test object further includes a tumbling motion module.
6. The X-ray Laue diffraction detection equipment as described in claim 4 or 5, characterized in that, The yaw motion module of the multi-degree-of-freedom detector motion mechanism uses the object to be tested on the support platform as a yaw axis, so that the detector performs a circular motion.
7. The X-ray Laue diffraction detection equipment as described in claim 6, characterized in that, The circular motion is a local circular motion.
8. The X-ray Laue diffraction detection equipment as described in claim 4, characterized in that, The yaw motion module of the multi-degree-of-freedom test object motion mechanism and the yaw motion module of the multi-degree-of-freedom detector motion mechanism enable the test object and the detector to perform coaxial yaw motion.
9. The X-ray Laue diffraction detection equipment as described in claim 4, characterized in that, The test object is subjected to a Z-axis motion module and / or a Y-axis motion module of the multi-degree-of-freedom test object motion mechanism to perform a Z-axis linkage motion and / or a Y-axis linkage motion, thereby obtaining the diffraction information of the irradiated area on the test object corresponding to the two-dimensional surface by irradiating the two-dimensional surface with the X-ray scan using the X-ray source.
10. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, The multi-degree-of-freedom object motion mechanism and the multi-degree-of-freedom detector motion mechanism work together to adjust the orientation of the object under test and the orientation of the detector, so that the diffraction information of the object under test obtained by the detector has the best diffraction intensity and the best diffraction distribution.
11. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, It also includes a base, wherein the support platform and the detector are respectively mounted on the base via the multi-degree-of-freedom test object motion mechanism and the multi-degree-of-freedom detector motion mechanism.
12. The X-ray Laue diffraction detection equipment as described in claim 11, characterized in that, The X-ray source is mounted on the base via a light source movement mechanism.
13. The X-ray Laue diffraction detection equipment as described in claim 11, characterized in that, The base has at least one shock-absorbing foot at its bottom.
14. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, In this X-ray Laue diffraction detection procedure, the wavelength range of the X-ray is... to In this X-ray Laue morphology detection procedure and / or this X-ray tomographic Laue morphology detection procedure, the wavelength range of the X-ray is [missing information]. to 15. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, The operating power of the X-ray source ranges from 100W to 4,000W, and the X-ray emission mode is either continuous wave mode or pulsed mode.
16. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, The detector can be a charge-coupled device, a flat panel detector, or a single-photon counter.
17. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, It further includes a processor for receiving and analyzing the diffraction information of the test object to obtain at least one key parameter of the test object, and the processor for receiving and analyzing the diffraction information of the test object to output an X-ray Laue morphology image and / or an X-ray tomographic Laue morphology image of the test object.
18. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, The diffraction information of the analyte obtained by the detector corresponds to at least one key parameter of the analyte.
19. The X-ray Laue diffraction detection equipment as described in claim 18, characterized in that, The key parameter of the test object is selected from a group consisting of microtubule density, dislocation density, crystallinity, lattice curvature, and residual stress.
20. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, The detector nondestructively and globally acquires the diffraction information of the irradiated area of the test object, and the diffraction information includes diffraction patterns and / or image data.
21. The X-ray Laue diffraction detection equipment as described in claim 1, characterized in that, The test object is a semiconductor structure selected from the group consisting of silicon, gallium arsenide, indium phosphide, gallium nitride, and silicon carbide.
22. The X-ray Laue diffraction detection equipment as described in claim 1 or 21, characterized in that, The object to be tested is a crystal ingot or a crystal wafer.
23. The X-ray Laue diffraction detection equipment as described in claim 1, 9, or 20, characterized in that, The location of one of the irradiated areas of the test object is located on one of the projection surfaces of the two-dimensional surface of the test object irradiated by the X-ray, and the depth range of the irradiated area covers the entire thickness of the test object or covers the two-dimensional surface of the test object to a depth inside one of the test objects.