Test fixture and test system

Abstract

The application discloses a test fixture and a test system, and relates to the field of chip testing.The test fixture comprises a test plate and a test assembly, the test assembly is arranged on the test plate, the test assembly comprises a test connecting plate, a fixing seat and a pressing head, a chip test site is arranged on the test connecting plate, the fixing seat is arranged on the test connecting plate and surrounds the chip test site, the pressing head is movably connected with the fixing seat, and a heating piece is arranged on the pressing head; when the pressing head covers and presses the chip, the heating piece performs heating test on the chip; and the test efficiency is improved through the above design.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to a test fixture and a test system. Background Technology

[0002] With the rapid development of information technology, memory chips are widely used in computers, servers, and other electronic devices. Before use, chips need to undergo various tests to remove potential defects, thereby screening out qualified and defective products. These tests require testing equipment such as chip test fixtures.

[0003] Currently, existing testing fixtures suffer from problems such as low testing efficiency, poor adaptability, and high cost. Utility Model Content

[0004] The purpose of this application is to provide a test fixture and test system that improves testing efficiency.

[0005] This application discloses a test fixture for testing chips. The test fixture includes a test board and a test component. The test component is disposed on the test board and includes a test connection plate, a fixing base, and a pressure head. The test connection plate is provided with a chip test position. The fixing base is disposed on the test connection plate and surrounds the chip test position. The pressure head is movably connected to the fixing base. The pressure head is provided with a heating element. When the pressure head closes and presses against the chip, the heating element heats and tests the chip.

[0006] Optionally, the test fixture further includes a fixed frame with a hollowed-out portion formed on it, and the test plate is disposed corresponding to the hollowed-out portion and fixedly connected to the fixed frame.

[0007] Optionally, the test fixture further includes a temperature control module, which is disposed within the fixed frame. The pressure head includes a pressure head body and a bump. The bump is disposed on the side of the pressure head body near the chip test position and is fixedly connected to the pressure head body. The heating element is disposed within the bump, and the temperature control module is electrically connected to the heating element.

[0008] Optionally, the test assembly further includes an auxiliary component disposed between the pressure head body and the protrusion, wherein the area of ​​the auxiliary component projected onto the test plate is larger than the area of ​​the protrusion projected onto the test plate.

[0009] Optionally, the auxiliary component includes an auxiliary component body and multiple connecting pads. The heating element is disposed on the auxiliary component body, and the protrusion is disposed corresponding to the heating element. The protrusion is fixed to the pressure head body by the auxiliary component body around its perimeter. The multiple connecting pads are disposed on one side of the auxiliary component body and arranged in an array. The power supply of the test fixture is connected to the multiple connecting pads through a connecting wire.

[0010] Optionally, there are multiple test components, and the multiple test components are arranged in an array on the test board to form a test area.

[0011] Optionally, the test fixture further includes multiple temperature display components, which are disposed on the fixed frame and are arranged opposite to the multiple test components, and are electrically connected to the temperature control module.

[0012] Optionally, multiple temperature display components can be controlled independently.

[0013] Optionally, the temperature display component includes a display element and multiple control elements, wherein the multiple control elements are disposed on one side of the display element and are respectively electrically connected to the display element and the temperature control module.

[0014] Optionally, the test fixture further includes a control switch, which is disposed on one side of the test board and is electrically connected to the test component.

[0015] Optionally, the test area is divided into multiple sub-test areas, and the control switch includes multiple sub-switches, with each sub-switch controlling at least one sub-test area.

[0016] This application also discloses a testing system, including a testing fixture and a display component as described above, wherein the display component is disposed on one side of the testing fixture and is electrically connected to the testing fixture.

[0017] Compared to existing test fixtures which suffer from low testing efficiency, poor adaptability, and high cost, the test fixture proposed in this application includes a test board and a test assembly. The test assembly is set on the test board and includes a test connection plate, a fixing base, and a pressure head. The test connection plate is provided with chip test positions, and the fixing base is set on the test connection plate and surrounds the chip test positions. The pressure head is movably connected to the fixing base and is provided with a heating element on the pressure head. When the pressure head closes and presses down on the chip, the heating element heats the chip for testing. This heating of the chip increases the temperature, making unstable chips more likely to be defective, thus enabling the rapid selection of defective products, improving testing efficiency, and reducing labor costs. Attached Figure Description

[0018] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:

[0019] Figure 1 This is a block diagram of the testing system provided in the embodiments of this application;

[0020] Figure 2 This is a schematic diagram of the structure of the test fixture provided in the embodiments of this application;

[0021] Figure 3 This is a schematic diagram of the open state structure of the test component provided in the embodiments of this application;

[0022] Figure 4 This is a schematic diagram of the structure of the auxiliary component provided in the embodiments of this application.

[0023] The components are as follows: 10. Test system; 100. Test fixture; 110. Test board; 111. Temperature control module; 120. Test component; 121. Test connection board; 122. Fixture; 123. Pressure head; 124. Chip test position; 125. First chip test position; 126. Second chip test position; 127. Pressure head body; 128. Bump; 129. First bump; 130. Second bump; 131. Auxiliary component; 132. Auxiliary component body. ; 133, Heating element; 134, Connecting pad; 135, Connecting wire; 140, Test area; 141, Sub-test area; 150, Temperature display component; 151, Display component; 152, Control component; 153, First control; 154, Second control; 155, Third control; 160, Control switch; 161, Sub-switch; 170, Fixing frame; 171, Cutout section; 180, Support section; 190, Power socket; 200, Display component. Detailed Implementation

[0024] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

[0025] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of indicated technical features. Therefore, unless otherwise stated, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean a non-exclusive inclusion, which may include or add one or more other features, integers, steps, operations, units, components, and / or combinations thereof. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0026] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] Figure 1 This is a block diagram of the test system provided in the embodiments of this application, as shown below. Figure 1 As shown, this application discloses a testing system 10 for chip testing, including a test fixture 100 and a display component 200. The display component 200 is disposed on one side of the test fixture 100 and electrically connected to the test fixture 100. When the chip is placed on the test fixture 100 and connected to the test fixture 100, the chip can be tested, and the test results can be displayed through the display component 200.

[0028] Figure 2 This is a schematic diagram of the structure of the test fixture provided in the embodiments of this application. Figure 3 This is a schematic diagram of the open state structure of the test component provided in the embodiments of this application, combined with... Figures 2-3 The test fixture 100 includes a test plate 110 and a test component 120. The test component 120 is disposed on the test plate 110 and includes a test connection plate 121, a fixing base 122, and a pressure head 123. The test connection plate 121 is provided with a chip test position 124. The fixing base 122 is disposed on the test connection plate 121 and surrounds the chip test position 124. The pressure head 123 is movably connected to the fixing base 122. The pressure head 123 is provided with a heating element 133. When the pressure head 123 closes and presses the chip, the heating element 133 heats and tests the chip.

[0029] Compared to existing test fixtures 100, which suffer from low testing efficiency, poor adaptability, and high cost, the test fixture 100 of this application includes a test board 110 and a test component 120. The test component 120 is disposed on the test board 110 and includes a test connection plate 121, a fixing base 122, and a pressure head 123. The test connection plate 121 is provided with a chip test position 124. The fixing base 122 is disposed on the test connection plate 121 and surrounds the chip test position 124. The pressure head 123 is movably connected to the fixing base 122. The pressure head 123 is provided with a heating element 133. When the pressure head 123 closes and presses down on the chip, the heating element 133 heats the chip for testing. This heating of the chip increases the temperature, making it easier to expose defects in unstable chips, thus enabling the rapid identification of defective products, improving testing efficiency, and reducing labor costs.

[0030] like Figure 2 As shown, the test fixture 100 also includes a fixing frame 170, on which a cutout portion 171 is formed. The test board 110 is disposed corresponding to the cutout portion 171 and is fixedly connected to the fixing frame 170. The fixing frame 170 is made of bakelite, which is heat-resistant and anti-static, ensuring the stability of the testing process. The chip can be a DDR chip; however, it can also be designed according to the actual production testing requirements, and is not limited here.

[0031] The test fixture 100 further includes a temperature control module 111, which is disposed within the fixed frame 170. The pressure head 123 includes a pressure head body 127 and a bump 128. The bump 128 is disposed on the side of the pressure head body 127 near the chip test position 124 and is fixedly connected to the pressure head body 127. The heating element 133 is disposed within the bump 128. The temperature control module 111 and the heating element 133 can be electrically connected via a control circuit. The temperature control module 111 controls the heating temperature of the heating element 133 to meet the requirements of applying different temperatures to the chip for testing.

[0032] like Figure 3 As shown, the test assembly 120 also includes an auxiliary component 131, which is disposed between the pressure head body 127 and the protrusion 128. The auxiliary component 131 is fixedly connected to the heating element 133 for heating the heating element 133. The area of ​​the auxiliary component 131's orthogonal projection on the test plate 110 is larger than the area of ​​the protrusion 128's orthogonal projection on the test plate 110. Figure 3It is known that the auxiliary component 131 protrudes from the bumps 128 on all four sides. When the pressure head 123 is covered, the bumps 128 press the chip. At this time, on the one hand, the heating element transfers heat to the chip through the bumps 128 to heat the chip; on the other hand, the protrusions can assist in fixing the chip, pressing the chip from all sides to ensure that the chip and the conductive adhesive on the test connection board 121 have sufficient pressure, thus ensuring the stability of the chip connection.

[0033] like Figure 3 As shown, the auxiliary component 131, the protrusion 128, and the pressure head body 127 can be fixed together with screws. The auxiliary component 131 includes an auxiliary component body 132 and a plurality of connecting pads 134. The heating element 133 is disposed on the auxiliary component body 132. The protrusion 128 is correspondingly disposed with the heating element 133. The protrusion 128 is fixed to the pressure head body 127 by the auxiliary component body 132 around its perimeter. The plurality of connecting pads 134 are disposed on one side of the auxiliary component body 132. Furthermore, they are arranged in an array, wherein the number of the connecting pads 134 can be 6, arranged in a row at intervals, which can reduce the volume of the auxiliary component 131. Of course, they can also be arranged in two or more rows, depending on the size of the auxiliary component 131. The design should be done to ensure that the volume occupied by the auxiliary component 131 is minimized, and no limitation is made here. The power supply of the test fixture 100 is connected to the multiple connecting pads 134 through a connecting wire 135 to supply power to the test component 120 and ensure the normal movement of the test component 120.

[0034] Figure 4 This is a schematic diagram of the structure of the auxiliary component provided in the embodiments of this application, such as... Figure 4 As shown, the test component 120 also includes a temperature control probe, which is mounted on the auxiliary component body 132 and located on one side of the heating element. The temperature control module 111 is electrically connected to the temperature control probe, which monitors and controls the heating temperature so that the detection temperature can be adjusted at any time, making the operation flexible.

[0035] like Figure 4As shown, the test component 120 includes a first chip test position 125 and a second chip test position 126. The corresponding pressure head 123 is provided with a first bump 129 and a second bump 130, respectively. The first bump 129 corresponds to the first chip test position 125, and the second bump 130 corresponds to the second chip test position 126. Two heating elements 133 are also provided, respectively corresponding to the first bump 129 and the second bump 130. That is, one test component 120 can test two chips at the same time. Multiple test components 120 can be provided, and multiple test components 120 are arranged in an array on the test board 110 to form a test area 140, so as to facilitate the simultaneous detection of more chips and improve the detection efficiency.

[0036] Combination Figure 1 It is understood that the test fixture 100 also includes multiple temperature display components 150, which are disposed on the fixed frame 170 and are arranged one-to-one with the multiple test components 120. The multiple temperature display components 150 are electrically connected to the temperature control module 111. Each temperature display component 150 is independently controlled, meaning one temperature display component 150 controls one corresponding test component 120. This facilitates temperature control during simultaneous testing of multiple chips, allowing for individual chip temperature adjustments. For example, the overall testing temperature can be uniformly set to approximately 75°C, and then adjusted to 85°C or higher for individual chips to more quickly identify defective products. The maximum testing temperature can be adjusted to 100°C, ensuring testing effectiveness without damaging the chips.

[0037] like Figure 1 As shown, the temperature display component 150 includes a display element 151 and a control element 152. The control element 152 includes a first control 153, a second control 154, and a third control 155. The first control 153, the second control 154, and the third control 155 are all located on one side of the display element 151, and are respectively connected to the display element 151 and the temperature control module 111 via a control circuit. The first control 153 can be a confirmation button, and the second control 154 can be a temperature increase adjustment button or a temperature decrease adjustment button. After the temperature display component 150 is powered on, the heating temperature is adjusted by the second control 154 or the third control 155, and then the first control 153 is clicked to confirm. The temperature control module 111 then controls the heating element 133 to heat the chip to be tested at the set temperature. At the same time, the set heating temperature is displayed on the display element 151 for observation.

[0038] The test fixture 100 also includes a control switch 160, which is disposed on one side of the test board 110 and electrically connected to the test component 120. The control switch 160 turns the test component 120 on or off. The test area 140 can be divided into multiple sub-test areas 141. The control switch 160 includes multiple sub-switches 161, and each sub-test area 141 includes at least two test components 120. One sub-switch 161 can control one sub-test area 141. This allows the number of sub-test areas 141 to be opened to determine the number of chips to be tested, resulting in better use and protection of the test fixture 100 and extending its service life. Furthermore, even if some sub-test areas 141 are damaged, chip testing can still be performed in the normal sub-test areas 141, ensuring a certain testing progress.

[0039] like Figure 1 As shown, four support parts 180 can be provided at the four corners of the test fixture 100 to elevate the test fixture 100, so that the back of the test fixture 100 is a certain distance from the table surface on which it is placed, which facilitates heat dissipation of the test board 110. The entire test fixture 100 can be connected to an external power supply through the power socket 190.

[0040] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0041] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A test fixture for testing chips, comprising: Test board; Test components are mounted on the test board; characterized in that, The test assembly includes a test connection plate, a mounting base, and a pressure head. The test connection plate has a chip test position. The mounting base is mounted on the test connection plate and surrounds the chip test position. The pressure head is movably connected to the mounting base. The pressure head is equipped with a heating element. When the pressure head closes and presses down on the chip, the heating element heats the chip for testing.

2. The test fixture of claim 1, wherein, The test fixture also includes a fixed frame with a hollowed-out portion, and the test plate is disposed corresponding to the hollowed-out portion and fixedly connected to the fixed frame.

3. The test fixture of claim 2, wherein, The test fixture also includes a temperature control module, which is disposed within the fixed frame. The pressure head includes a pressure head body and a bump. The bump is disposed on the side of the pressure head body near the chip test position and is fixedly connected to the pressure head body. The heating element is disposed within the bump, and the temperature control module is electrically connected to the heating element.

4. The test fixture of claim 3, wherein, The test assembly also includes an auxiliary component, which is disposed between the pressure head body and the protrusion, and is fixedly connected to the heating element; the area of ​​the auxiliary component projected onto the test plate is larger than the area of ​​the protrusion projected onto the test plate.

5. The test fixture of claim 4, wherein, The auxiliary component includes an auxiliary component body and multiple connecting pads. The heating element is disposed on the auxiliary component body. The protrusion is disposed corresponding to the heating element. The protrusion is fixed to the pressure head body by the auxiliary component body around its perimeter. The multiple connecting pads are disposed on one side of the auxiliary component body and arranged in an array. The power supply of the test fixture is connected to the multiple connecting pads through a connecting wire.

6. The test fixture of claim 5, wherein, The test components are multiple, and the multiple test components are arranged in an array on the test board to form a test area.

7. The test fixture of claim 6, wherein, The test fixture also includes multiple temperature display components, which are disposed on the fixed frame and are positioned opposite to the multiple test components. The multiple temperature display components are also electrically connected to the temperature control module.

8. The test fixture of claim 7, wherein, Multiple temperature display components are controlled independently.

9. The test fixture of claim 8, wherein, The temperature display component includes a display element and multiple control elements. The multiple control elements are disposed on one side of the display element and are respectively electrically connected to the display element and the temperature control module.

10. The test fixture of claim 9, wherein, The test fixture also includes a control switch, which is located on one side of the test board and electrically connected to the test component.

11. The test fixture of claim 10, wherein, The test area is divided into multiple sub-test areas, and the control switch includes multiple sub-switches, each of which controls at least one of the sub-test areas.

12. A test system, characterized by Includes the test fixture and display component as described in any one of claims 1-11, wherein the display component is disposed on one side of the test fixture and is electrically connected to the test fixture.

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