Chip receiving table assembly and chip testing platform

Abstract

The utility model discloses a kind of piece bearing table assembly and chip test platform, it is related to chip test technical field, wherein, including pedestal, piece bearing table and two driving components, driving component includes first drive motor and the cam of the output shaft of first drive motor, first drive motor is installed to pedestal, two driving components are symmetrically arranged, and two driving components are respectively arranged in the two sides of piece bearing table, cam is contacted with the bottom of piece bearing table. By the characteristics that cam profile radius changes with rotation, the stable up-down movement of piece bearing table is realized, so that three-dimensional seat multi-core pin can be fixedly arranged, the number and size required by first drive motor are reduced, the test cost is greatly reduced, the production capacity and work efficiency are greatly increased;And three-dimensional seat multi-core pin does not need to set motor driving part, so that three-dimensional seat multi-core pin space is larger than before, can test smaller core particle size, fixed position distance needle tip distance is smaller, and test efficiency is higher.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a wafer stage assembly and a chip testing platform. Background Technology

[0002] With the rapid growth in demand for LED products, the demand for existing LED chips is also constantly increasing, and multiple stages require quality inspection of the chips; in particular, the requirements for the function and performance of large-scale chip testing equipment will continue to improve.

[0003] In existing large-scale chip testing platforms, the platform itself does not move up and down. Instead, large pin headers move up and down to test photoelectric parameters. However, because the large pin headers occupy a lot of space, the motors that drive them also need to be larger and more numerous, which leads to high testing costs.

[0004] Therefore, it is necessary to provide a new wafer stage assembly and chip testing platform to solve the above-mentioned technical problems. Utility Model Content

[0005] The main purpose of this invention is to propose a wafer stage assembly and a chip testing platform, aiming to improve the technical problem of high testing costs in the prior art.

[0006] To achieve the above objectives, according to one aspect of the present invention, a plate support assembly is provided, comprising: Base; Film receiving platform; Two driving components are provided, each including a first driving motor and a cam sleeved on the output shaft of the first driving motor. The first driving motor is mounted on the base. The two driving components are symmetrically arranged and respectively located on both sides of the plate support stage. The cam is in contact with the bottom of the plate support stage.

[0007] In one embodiment, the cam includes a cam body and a mounting portion disposed at the center of the cam body. The mounting portion is sleeved on the output shaft of the first drive motor. The outer circumferential radius of the cam body changes continuously along the circumferential direction to drive the plate support stage to rise and fall.

[0008] In one embodiment, the outer peripheral contour of the cam body includes an ascending section, a far-dwelling section, a descending section, and a near-dwelling section, wherein the initial radius of the ascending section is [missing information]. The radius of the ascending segment increases linearly, and the central angle corresponding to the ascending segment is... ; The initial radius of the descent segment is The radius of the descending segment decreases linearly, and the central angle corresponding to the descending segment is... ; The radius of the far rest segment remains The radius of the near-rest segment remains at 1. The central angle corresponding to the far rest segment is The central angle corresponding to the near-rest segment is ; in, + + + =360°.

[0009] In one embodiment, the stage assembly further includes a controller, and both of the first drive motors are signal-connected to the controller.

[0010] In one embodiment, the plate-bearing stage assembly further includes a base, a second drive motor, and a rotary motor. The base is mounted on the base and has a track. The second drive motor is mounted on the base. The rotary motor is connected to the output shaft of the second drive motor and is slidably connected to the track. The rotary motor is connected to the plate-bearing stage to drive the plate-bearing stage to rotate.

[0011] In one embodiment, the plate-bearing stage assembly further includes a sensing component, the rotary motor is provided with a sensing plate, the sensing component is used to sense whether the sensing plate passes through the sensing component, and both the sensing component and the second drive motor are signal-connected to the controller.

[0012] In one embodiment, the rotary motor is provided with a mounting plate, the mounting plate is provided with a waist-shaped groove extending along the length direction of the track, the induction plate is provided with a mounting hole, and the plate support assembly further includes a fixing member, the fixing member passing through the mounting hole and being installed in the waist-shaped groove.

[0013] In one embodiment, the sensing element includes two opposing protrusions, wherein an infrared sensor is disposed on one side of one of the protrusions opposite to the other protrusion, and the sensing sheet can be moved between the two protrusions to block the infrared sensor.

[0014] In one embodiment, there are multiple sensing elements, which are spaced apart along the length of the track.

[0015] According to another aspect of the utility model, the present utility model also provides a chip testing platform, including a frame, a horizontal motion component, an integrating sphere component, a three-dimensional pin header component, and the aforementioned wafer stage component. The horizontal motion component is disposed on the frame, the wafer stage component is fixed to the horizontal motion component, and both the integrating sphere component and the three-dimensional pin header component are fixed to the horizontal motion component. The integrating sphere component includes a front-facing integrating sphere capable of moving in a vertical direction for front-facing light collection. The wafer stage component is used to carry the chip and to drive the chip to contact the three-dimensional pin header component.

[0016] In the above scheme, the substrate stage assembly includes a base, a substrate stage, and two drive components. The drive components include a first drive motor and a cam sleeved on the output shaft of the first drive motor. The first drive motor is mounted on the base. The two drive components are symmetrically arranged and are respectively located on both sides of the substrate stage. The cam contacts the bottom of the substrate stage. Specifically, after the two first drive motors start, their output shafts begin to rotate. The output shafts of the first drive motors directly drive the cams sleeved on the output shafts to rotate synchronously. The two cams rotate synchronously, pushing the wafer support platform up and down. Since the two cams are symmetrically arranged on both sides of the wafer support platform and rotate synchronously, their contours will change their contact position with the bottom of the wafer support platform as they rotate, thereby driving the wafer support platform to rise or fall along the extension and retraction direction of the base. When the cam rotates to the area with a larger contour radius and contacts the bottom of the wafer support platform, the cam generates an upward thrust on the bottom of the wafer support platform, lifting the wafer support platform and achieving upward movement, so that the chip on the wafer support platform contacts the multi-core pin header, realizing chip performance testing. After the test is completed, when the cam rotates to the area with a smaller contour radius and contacts the bottom of the wafer support platform, the cam's support force on the wafer support platform decreases, and the wafer support platform descends along the base under its own gravity, returning to the initial position. Then the chip on the wafer support platform is replaced, the drive component continues to output power, and the cam continues to rotate synchronously. Through the periodic change of the contour radius, the wafer support platform is driven to achieve a reciprocating cycle of rising, falling, and rising again, and the test is performed again. This invention utilizes the characteristic that the cam profile radius changes with rotation to achieve smooth up-and-down movement of the plate support stage. This allows for a fixed setting of the three-dimensional multi-core pin header, reducing the number and size of the first drive motor, significantly lowering testing costs, and greatly increasing production capacity and work efficiency. Furthermore, the three-dimensional multi-core pin header does not require a motor drive component, resulting in a larger space for testing smaller core sizes. The fixed position is also closer to the pin tip, leading to higher testing efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of an embodiment of the plate support assembly provided by this utility model; Figure 2 A schematic diagram of the structure of an embodiment of the cam provided by this utility model; Figure 3 A schematic diagram of an embodiment of the chip testing platform provided by this utility model.

[0019] Explanation of icon numbers: 100. Plate receiving stage assembly; 1. Base; 2. Plate receiving stage; 3. Drive component; 31. First drive motor; 32. Cam; 321. Cam body; 322. Mounting part; 321a. Rising section; 321b. Far rest section; 321c. Falling section; 321d. Near rest section; 4. Base; 5. Second drive motor; 6. Rotary motor; 41. Track; 7. Sensing component; 61. Sensing plate; 62. Mounting plate; 621. Waist-shaped groove; 611. Mounting hole; 71. Protrusion; 101. Chip testing platform; 101a. Rack; 101b. Horizontal motion assembly; 101c. Integrating sphere assembly; 101d. Three-dimensional pin header assembly.

[0020] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0022] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0023] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0024] To achieve the above objectives, please refer to Figure 1 and Figure 2According to one aspect of this utility model, a substrate support assembly 100 is provided, including a base 1, a substrate support 2, and two driving components 3. Each driving component 3 includes a first driving motor 31 and a cam 32 sleeved on the output shaft of the first driving motor 31. The first driving motor 31 is mounted on the base 1. The two driving components 3 are symmetrically arranged and respectively located on both sides of the substrate support 2. The cam 32 contacts the bottom of the substrate support 2. Specifically, after the two first driving motors 31 are started, their output shafts begin to rotate. The output shafts of the first driving motors 31 directly drive the cams 32 sleeved on the output shafts to rotate synchronously. The synchronous rotation of the two cams 32 pushes the substrate support 2 up and down. Since the two cams 32 are symmetrically arranged on both sides of the substrate support 2 and rotate synchronously, their contours change with rotation, causing their contact position with the bottom of the substrate support 2 to change, thereby driving the substrate support 2 to rise or fall along the extension / retraction direction of the base 1. When the cam 32 rotates to a region with a larger contour radius and contacts the bottom of the substrate support 2, the cam 32 generates an upward thrust on the bottom of the substrate support 2. The chip carrier 2 is lifted, allowing it to rise and contact the chip with the multi-core pin header for performance testing. After testing, when the cam 32 rotates to a region with a smaller radius and contacts the bottom of the chip carrier 2, the supporting force of the cam 32 on the chip carrier 2 decreases, and the chip carrier 2 descends along the base 1 under its own gravity, returning to its initial position. Then, the chip on the chip carrier 2 is replaced, and the drive component 3 continues to output power, causing the cam 32 to rotate synchronously. Through the periodic change of the radius, the cam carrier 2 is driven to achieve a reciprocating cycle of rising, falling, and rising again for testing. This invention utilizes the characteristic that the radius of the cam 32 changes with rotation to achieve smooth up and down movement of the chip carrier 2. This allows the three-dimensional multi-core pin header to be fixed, reducing the number and size of the first drive motor 31 required, significantly reducing testing costs, and greatly increasing production capacity and work efficiency. Furthermore, the three-dimensional multi-core pin header does not require a motor drive component, resulting in a larger space for testing smaller chip sizes. The fixed position is also closer to the pin tip, leading to higher testing efficiency.

[0025] Please see Figure 1 and Figure 2In one embodiment, the cam 32 includes a cam body 321 and a mounting portion 322 located at the center of the cam body 321. The mounting portion 322 is sleeved on the output shaft of the first drive motor 31. The outer circumferential radius of the cam body 321 continuously varies circumferentially to drive the lifting and lowering of the wafer stage 2. The cam 32 is directly sleeved on the output shaft of the first drive motor 31 through the central mounting portion 322, resulting in a compact structure without additional transmission components, simplifying the assembly process. The cam body 321 and the mounting portion 322 are integrated, reducing the number of parts, avoiding the risk of multiple parts loosening, and improving the stability of long-term operation. The continuous circumferential radius of the cam body 321 ensures a smooth transition of the support force at the contact point between the wafer stage 2 and the cam 32 during lifting or lowering, avoiding the impact load caused by traditional rigid transmission. By designing the profile curve of the cam 32, the lifting speed, acceleration, and stroke of the wafer stage 2 can be precisely controlled to adapt to the different requirements of contact pressure and contact time during different chip testing, improving test compatibility.

[0026] Please see Figure 2 In one embodiment, the outer periphery of the cam body 321 includes an ascending segment 321a, a far-rest segment 321b, a descending segment 321c, and a near-rest segment 321d, wherein the initial radius of the ascending segment 321a is [missing information]. The radius of the ascending segment 321a increases linearly, and the central angle corresponding to the ascending segment 321a is... ; The initial radius of the descent segment 321c is The radius of the descending segment 321c decreases linearly, and the central angle corresponding to the descending segment 321c is... ; The radius of the far rest segment 321b remains unchanged. The radius of the near rest segment 321d remains unchanged. The central angle corresponding to the far rest segment 321b is The central angle corresponding to the near rest segment 321d is ; in, + + + =360°.

[0027] The outer periphery of the cam body 321 is segmented into an ascending section 321a, a far-end section 321b, a descending section 321c, and a near-end section 321d. This segmentation, combined with a combination of linear radius variation and a fixed radius, achieves multiple optimizations in motion control, testing stability, and operational efficiency. The linearly increasing radius of the ascending section 321a means that the supporting force of the cam 32 on the substrate 2 changes uniformly with the rotation angle, making the ascending speed and acceleration of the substrate 2 controllable. The linearly decreasing radius of the descending section 321c, symmetrical to the ascending section 321a, ensures that the substrate 2 descends at a uniform speed or with uniform deceleration under gravity assistance, avoiding vibration caused by rapid falls and protecting the stability of chip placement.

[0028] When cam 32 rotates to the far rest segment 321b, the contour radius remains at its maximum, the die holder 2 is stably supported at its highest position, and the chip is in complete contact with the multi-pin header. At this time, the central angle... The angle directly corresponds to the test duration. This avoids the problem of slight wobbling of the stage 2 caused by the continuous rotation of cam 32 in traditional continuous design, ensuring that the contact pressure and position between the chip and the pin header are completely stable during the test, reducing test data errors caused by poor contact, and improving the consistency and reliability of test results.

[0029] When cam 32 rotates to the near-resting section 321d, the contour radius remains at its minimum, and the support platform 2 stably stops at its initial low position. At this time, the central angle... The angle corresponds to the chip replacement time.

[0030] Operators or automated equipment are provided with an interference-free material changing window to prevent the wafer carrier 2 from accidentally rising or falling during chip replacement, thereby reducing the risk of chip falling and improving material changing efficiency.

[0031] In one embodiment, the wafer stage assembly 100 further includes a controller, and both first drive motors 31 are signal-connected to the controller. The smooth lifting and lowering of the wafer stage 2 depends on the synchronous rotation of the two side cams 32; otherwise, the wafer stage 2 may tilt, leading to misalignment between the chip and the multi-pin header. The controller, through its signal connection with the two first drive motors 31, enables synchronous control. The controller sends unified start and stop signals to both motors, avoiding the problem of one side moving first and the other lagging due to individual motor differences, ensuring that the two side cams 32 rotate synchronously from the initial state. The controller monitors and adjusts the speed of the two motors in real time to ensure that the rotational angular velocity of the output shafts of both motors is consistent; simultaneously, through a phase calibration algorithm, it ensures that the contour contact positions of the two side cams 32 are completely synchronized, preventing the wafer stage 2 from tilting due to the difference in support height on both sides.

[0032] Please see Figure 1In one embodiment, the wafer stage assembly 100 further includes a base 4, a second drive motor 5, and a rotary motor 6. The base 1 is mounted on the base 4, which is provided with a track 41. The second drive motor 5 is mounted on the base 4, and the rotary motor 6 is connected to the output shaft of the second drive motor 5. The rotary motor 6 is slidably connected to the track 41 and connected to the wafer stage 2 to drive the wafer stage 2 to rotate. By driving the rotary motor 6 to slide along the track 41 via the second drive motor 5, the wafer stage 2 can achieve linear movement, meeting the material transfer requirements between different workstations. At the same time, the rotary motor 6 drives the wafer stage 2 to rotate, so that the chip on the wafer stage 2 can accurately correspond to the test probe holder.

[0033] Please see Figure 1 In one embodiment, the tray assembly 100 further includes a sensing component 7. The rotary motor 6 is equipped with a sensing plate 61. The sensing component 7 is used to sense whether the sensing plate 61 passes through the sensing component 7. Both the sensing component 7 and the second drive motor 5 are connected to the controller via signals. When the sensing component 7 detects that the rotary motor 6 has moved into position along the track 41, the controller immediately sends a signal to the second drive motor 5, and the second drive motor 5 stops running, thus stopping the rotary motor 6 from moving. This achieves automatic limiting and prevents the rotary motor 6 from moving outside the track 41.

[0034] Please see Figure 1 In one embodiment, the rotary motor 6 is provided with a mounting plate 62, which has a waist-shaped groove 621 extending along the length of the track 41. The sensing plate 61 has a mounting hole 611. The plate support assembly 100 also includes a fixing member that passes through the mounting hole 611 and is installed in the waist-shaped groove 621. If there is a slight deviation between the mounting hole 611 of the sensing plate 61 and the fixing hole of the mounting plate 62, it may result in the sensing plate 61 being unable to be installed or being misaligned after installation. The waist-shaped groove 621 structure provides a linear adjustment margin in the length direction. During installation, it is not necessary to strictly align the holes. Simply pass the fixing member through the mounting hole 611 of the sensing plate 61 and let it fall into the waist-shaped groove 621. This greatly reduces the alignment difficulty of manual or automated assembly and reduces assembly time. If the fixing member is forcibly screwed in when the fixing hole is misaligned, it may cause deformation of the mounting plate 62 or the sensing plate 61. The adjustment margin of the waist-shaped groove 621 can avoid such hard interference and protect the integrity of the components.

[0035] Please see Figure 1In one embodiment, the sensing component 7 includes two opposing protrusions 71. An infrared sensor is mounted on one side of one protrusion 71 opposite to the other. When the sensing plate 61 moves between the two protrusions 71, it blocks the infrared sensor. The infrared sensor switches signals by blocking the optical path. The sensing plate 61 triggers a signal through the optical path. When the infrared optical path is not blocked, the receiver continuously receives the signal. After the sensing plate 61 is blocked, the signal is momentarily interrupted, with a steep signal transition edge, allowing the controller to quickly identify the signal. Compared to Hall effect sensors or photoelectric reflective sensors, the blocking-type infrared beam scheme is less susceptible to environmental interference.

[0036] Please see Figure 1 In one embodiment, there are multiple sensing elements 7, which are spaced apart along the length of the track 41. Different chip testing processes may require different station spacings. The multiple sensing elements 7 can be programmed via a controller to select specific points for activation, or their triggering logic can be adjusted, quickly adapting to the testing requirements of different chips and avoiding the tedious operation of mechanically adjusting the physical positions of the sensing elements 7.

[0037] According to another aspect of the utility model, please refer to Figure 3This utility model also provides a chip testing platform 101, including a frame 101a, a horizontal motion component 101b, an integrating sphere component 101c, a three-dimensional pin holder component 101d, and the aforementioned wafer stage component 100. The horizontal motion component 101b is disposed on the frame 101a, and the wafer stage component 100 is fixed to the horizontal motion component 101b. The integrating sphere component 101c and the three-dimensional pin holder component 101d are both fixed to the horizontal motion component 101b. The integrating sphere component 101c includes a front-facing integrating sphere capable of moving vertically to achieve front-facing light collection. The wafer stage component 100 is used to carry the chip and to drive the chip to contact the three-dimensional pin holder component 101d. An external robotic arm or manual placement of the chip to be tested onto the bearing surface of the wafer stage component 100 activates the vacuum adsorption device of the wafer stage 100 to ensure that the chip does not shift. The three-dimensional pin header assembly 101d is located directly above the chip. Then, two first drive motors 31 are activated, driving two cams 32 to rotate synchronously, pushing the wafer support stage 2 up and down. Since the two cams 32 are symmetrically positioned on both sides of the wafer support stage 2, their contours change their contact position with the bottom of the wafer support stage 2 as they rotate, thus driving the wafer support stage 2 to rise or fall. When the cams 32 rotate to a region with a larger contour radius and contact the bottom of the wafer support stage 2, the cams 32 generate an upward thrust on the bottom of the wafer support stage 2, lifting the wafer support stage 2 and achieving upward movement. The front integrating sphere... The chip is lowered vertically until it is flush with the test area on the chip surface, ensuring that the light-collecting lens is directly facing the chip's light-emitting area. The chip receives the test signal through a three-dimensional pin header. After the chip emits light, the front integrating sphere collects the front light signal, converts it into an electrical signal, and transmits it to the test system to measure optical parameters such as luminous flux, color coordinates, and color temperature. After the test is completed, when the cam 32 rotates to a region with a smaller radius of curvature and contacts the bottom of the substrate 2, the supporting force of the cam 32 on the substrate 2 decreases, and the substrate 2 descends under its own gravity, returning to its initial position. Then, the chip on the substrate 2 is replaced. Since the chip test platform 101 includes all the embodiments of the above-described substrate assembly 100, it has at least all the beneficial effects brought by all the above-described embodiments, which will not be described in detail here.

[0038] The above are merely exemplary embodiments of this utility model and do not limit the scope of protection of this utility model. Any equivalent structural transformations made based on the technical concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of this utility model.

Claims

1. A sheet support assembly, characterized by include: Base; Film receiving platform; Two driving components are provided, each including a first driving motor and a cam sleeved on the output shaft of the first driving motor. The first driving motor is mounted on the base. The two driving components are symmetrically arranged and respectively located on both sides of the plate support stage. The cam is in contact with the bottom of the plate support stage.

2. The sheet receiving station assembly of claim 1, wherein, The cam includes a cam body and a mounting part located at the center of the cam body. The mounting part is sleeved on the output shaft of the first drive motor. The outer circumferential radius of the cam body changes continuously along the circumferential direction to drive the plate support platform to rise and fall.

3. The sheet receiving station assembly of claim 2, wherein, The outer peripheral contour of the cam body comprises a rising section, a far rest section, a falling section and a near rest section, the initial radius of the rising section is , the radius of the rising section increases linearly, and the central angle corresponding to the rising section is ; The initial radius of the descending section is , the radius of the descending section linearly decreases, and the corresponding central angle of the descending section is ; The radius of the far rest section is kept The radius of the near rest section is kept The central angle corresponding to the far rest section is The central angle corresponding to the near rest section is ; wherein + + + = 360°.

4. The sheet receiving station assembly of claim 1, wherein The plate-bearing stage assembly also includes a controller, and both of the first drive motors are signal-connected to the controller.

5. The sheet receiving station assembly of claim 4, wherein, The plate-bearing stage assembly further includes a base, a second drive motor, and a rotary motor. The base is mounted on the base, and the base is provided with a track. The second drive motor is mounted on the base, and the rotary motor is connected to the output shaft of the second drive motor. The rotary motor is slidably connected to the track and is connected to the plate-bearing stage to drive the plate-bearing stage to rotate.

6. The sheet receiving station assembly of claim 5, wherein, The plate-bearing stage assembly also includes a sensing component. The rotary motor is equipped with a sensing plate. The sensing component is used to sense whether the sensing plate passes through the sensing component. Both the sensing component and the second drive motor are signal-connected to the controller.

7. The substrate stage assembly as described in claim 6, characterized in that, The rotary motor is provided with a mounting plate, and the mounting plate is provided with a waist-shaped groove extending along the length direction of the track. The induction plate is provided with a mounting hole. The plate support assembly also includes a fixing member, which passes through the mounting hole and is installed in the waist-shaped groove.

8. The sheet receiving station assembly of claim 6, wherein, The sensing component includes two opposing protrusions, one of which has an infrared sensor on one side opposite to the other. When the sensing sheet moves between the two protrusions, it can block the infrared sensor.

9. The sheet receiving station assembly of claim 6, wherein, The number of the sensing components is multiple, and the multiple sensing components are spaced apart along the length direction of the track.

10. A chip testing platform, characterized by, The device includes a frame, a horizontal motion assembly, an integrating sphere assembly, a three-dimensional pin header assembly, and a wafer stage assembly as described in any one of claims 1 to 9. The horizontal motion assembly is disposed on the frame, the wafer stage assembly is fixed to the horizontal motion assembly, and both the integrating sphere assembly and the three-dimensional pin header assembly are fixed to the horizontal motion assembly. The integrating sphere assembly includes a front-facing integrating sphere capable of moving in a vertical direction for front-facing light collection. The wafer stage assembly is used to carry the chip and to drive the chip into contact with the three-dimensional pin header assembly.

Images