Wafer test probe

Abstract

The utility model provides a kind of wafer test probe, belong to probe technical field.A kind of wafer test probe, including probe main part, probe main part includes thimble, bottom needle, spring and tube seat;Thimble is located on the upper end of tube seat, the top of thimble has claw shape contact part, the minimum inside diameter of claw shape contact part is Φ0.05mm;Bottom needle is located at the lower end of tube seat, and bottom needle below has first contact end, the spring is located inside tube seat, one end of spring is connected with thimble, the other end of spring is connected with bottom needle;Tube seat is made by electroforming tube process, the maximum outside diameter of tube seat is Φ0.12mm, the inside diameter of tube seat is equal to the maximum outside diameter of thimble and the maximum outside diameter of bottom needle, so that thimble and bottom needle are just clamped into inside tube seat.The utility model has the advantage that practicality is stronger.

Description

Technical Field

[0001] This invention belongs to the field of probe technology, specifically a wafer testing probe. Background Technology

[0002] As chip manufacturing processes become increasingly miniaturized and packaging density increases, conventional probes struggle to meet the requirements for conductivity and contact stability in extremely fine-pitch applications. Traditional structures, due to size limitations, cannot achieve high-precision positioning and low contact impedance, impacting measurement accuracy and efficiency during wafer testing. Furthermore, existing probes have excessively large outer diameters, making them difficult to place at tiny pads in testing scenarios, resulting in lower testing accuracy and limited practicality. Summary of the Invention

[0003] The purpose of this utility model is to address the aforementioned problems in existing technologies and propose a solution. A wafer testing probe with greater practicality.

[0004] The objective of this utility model can be achieved through the following technical solution: a wafer test probe, comprising a probe body, the probe body including a top pin, a bottom pin, a spring, and a tube base; The ejector pin is located at the upper end of the tube seat, and the top of the ejector pin has a claw-shaped contact portion with a minimum inner diameter of Φ0.05mm. The bottom pin is located at the lower end of the tube seat, and there is a first contact end below the bottom pin. The spring is located inside the tube seat, one end of the spring is connected to the top pin, and the other end of the spring is connected to the bottom pin. The tube seat is made using an electroforming process. The maximum outer diameter of the tube seat is Φ0.12mm. The inner diameter of the tube seat is equal to the maximum outer diameter of the ejector pin and the maximum outer diameter of the base pin, so that the ejector pin and the base pin can be precisely inserted into the tube seat.

[0005] Preferably, the top pin and bottom pin are made of high-hardness palladium alloy.

[0006] Preferably, the end of the first contact end is designed with a rounded head.

[0007] Preferably, the claw-shaped contact portion adopts a crown-shaped structure design.

[0008] Preferably, the surface of the spring is plated with a nickel-gold material.

[0009] Preferably, the probe body has a single-action structure.

[0010] Compared with the prior art, the advantages of this utility model are: the tube seat adopts an extremely fine outer diameter structure, which is suitable for micro pad contact scenarios, can adapt to even smaller test contact scenarios, has good spatial compatibility, and is more practical. Attached Figure Description

[0011] Figure 1 This is the official drawing of this utility model.

[0012] Figure 2 This is an internal view of the present invention.

[0013] In the diagram, 2 is the ejector pin; 21 is the claw-shaped contact part; 3 is the bottom pin; 31 is the first contact end; 4 is the spring; and 5 is the tube seat. Detailed Implementation

[0014] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0015] like Figures 1 to 2 As shown, a wafer test probe includes a probe body, which includes a top pin 2, a bottom pin 3, a spring 4, and a tube base 5. The ejector pin 2 is located at the upper end of the tube seat 5. The top of the ejector pin 2 has a claw-shaped contact portion 21, and the maximum outer diameter of the claw-shaped contact portion 21 is 0.05 mm. The bottom pin 3 is located at the lower end of the tube seat 5, and the bottom pin 3 has a first contact end 31 below it. The spring 4 is located inside the tube seat 5. One end of the spring 4 is connected to the top pin 2, and the other end of the spring 4 is connected to the bottom pin 3. The tube seat 5 is made using an electroforming tube process. The maximum outer diameter of the tube seat 5 is 0.12 mm. The inner diameter of the tube seat 5 is equal to the maximum outer diameter of the ejector pin 2 and the maximum outer diameter of the bottom pin 3, so that the ejector pin 2 and the bottom pin 3 can be precisely inserted into the tube seat 5.

[0016] The claw-shaped contact part 21 adopts a crown-shaped structure design.

[0017] With the above structure, the tube base 5 adopts an ultra-fine outer diameter structure, which is suitable for micro pad contact scenarios and can adapt to even smaller test contact scenarios. It is suitable for high-frequency, low contact impedance and high-precision test requirements in wafer CP testing, has good spatial compatibility and is more practical. The claw-shaped contact part 21 can effectively grasp the micro pads and improve contact stability. The spring 4 structure ensures that the probe maintains good contact under different pressures, and the tube base 5 provides stable support. The overall structure optimizes the performance of the probe in high-density wafer testing. The claw-shaped contact part 21 of the ejector pin 2 adopts a crown-shaped structure design, which helps to reduce the contact area with the object under test while enhancing the stability of the contact point, which helps to accurately position the probe.

[0018] Specifically, such as Figures 1 to 2 As shown, the top pin 2 and the bottom pin 3 are made of high-hardness palladium alloy. The use of high-hardness palladium alloy provides high conductivity and wear resistance.

[0019] like Figures 1 to 2 As shown, the end of the first contact end 31 adopts a rounded design.

[0020] The above structure and rounded head design reduce contact impedance and improve measurement accuracy.

[0021] like Figures 1 to 2 As shown, the surface of the spring 4 is plated with nickel and gold material, which helps to provide higher working strength and rebound force, and helps to extend the service life of the device.

[0022] like Figures 1 to 2 As shown, the probe body has a single-action structure. This single-action design makes it suitable for use in high-density probe modules or high-precision fixtures.

[0023] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0024] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Meanwhile, the word "and / or" throughout the text means including three solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0025] All of the above components are general standard parts or components known to those skilled in the art. Their structure and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0026] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

Claims

1. A wafer test probe, comprising a probe body, the probe body including a top pin (2), a bottom pin (3), a spring (4) and a socket (5); The ejector pin (2) is located at the upper end of the tube seat (5). The top of the ejector pin (2) has a claw-shaped contact part (21) with a minimum inner diameter of Φ0.05mm. The bottom pin (3) is located at the lower end of the tube seat (5), and the bottom pin (3) has a first contact end (31) below it. The spring (4) is located inside the tube seat (5). One end of the spring (4) is connected to the top pin (2), and the other end of the spring (4) is connected to the bottom pin (3). The tube seat (5) is made using electroforming tube technology. The maximum outer diameter of the tube seat (5) is Φ0.12mm. The inner diameter of the tube seat (5) is equal to the maximum outer diameter of the ejector pin (2) and the maximum outer diameter of the bottom pin (3), so that the ejector pin (2) and the bottom pin (3) are just inserted into the tube seat (5).

2. A wafer testing probe according to claim 1, characterized in that, The top pin (2) and bottom pin (3) are made of high-hardness palladium alloy.

3. A wafer testing probe according to claim 1, characterized in that, The end of the first contact end (31) is designed with a rounded head.

4. A wafer testing probe according to claim 1, characterized in that, The claw-shaped contact part (21) adopts a crown-shaped structure design.

5. A wafer testing probe according to claim 1, characterized in that, The surface of the spring (4) is plated with nickel and gold material.

6. A wafer testing probe according to claim 1, characterized in that, The probe body has a single-action structure.

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