Vehicle and current sensor module thereof
Patent Information
- Application Number
- CN202521678706.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-07
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-08-07
AI Technical Summary
电流传感器在车载电驱动系统中需要占据一定的空间,且成本相对较高
[0004] To address at least some and/or at least partially the aforementioned technical problems, this utility model is proposed. Specifically, it addresses how to at least partially improve the integration and/or energy density of modules used for current detection.
Smart Images

Figure CN224773110U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of vehicle technology, specifically to a vehicle and its current sensor module. Background Technology
[0002] In current automotive electric drive systems, the control principle of the drive motor is typically as follows: after DC-AC conversion, the power module outputs power to the drive motor via an AC output bus assembly. During the power module's output to the AC output bus assembly, a separately configured current sensor is needed to detect the accuracy of the output current. Traditional current sensors are separate modules; for example, a Hall effect sensor includes a silicon steel core, a Hall chip, a PCB, and pins. Current sensors occupy considerable space in automotive electric drive systems and are relatively expensive. Furthermore, as the current increases, the core of traditional current sensors is prone to saturation. To address this issue, the core's design size needs to be increased.
[0003] With the development of the new energy vehicle industry, the energy density, voltage, and power of on-board electric drive systems are showing a gradual upward trend, and the electrical clearance between modules / products with different functions is also required to be greater. Therefore, while controlling costs as much as possible, it is quite necessary to improve the integration and energy density of modules / products. Utility Model Content
[0004] To address at least some and / or at least partially the aforementioned technical problems, this utility model is proposed. Specifically, it addresses how to at least partially improve the integration and / or energy density of modules used for current detection.
[0005] In a first aspect, the present invention provides a current sensor module for a vehicle, the vehicle including a drive motor and a power module, the current sensor module including: an AC output busbar assembly, which includes at least one set of AC output busbars, the AC output busbars being electrically connected to the drive motor and the power module respectively; and a current detection chip assembly fixedly disposed on the AC output busbar assembly; wherein a detection area is provided on or near the AC output busbar, and the current detection chip assembly is fixedly disposed on the current sensor module at a position corresponding to the detection area.
[0006] With this configuration, the current detection chip assembly can detect the current output by the on-board electric drive system at the location corresponding to the detection area, thereby improving the module's integration while saving on components.
[0007] In one possible implementation of the current sensor module for the aforementioned vehicle, the current detection chip assembly includes a chip, a PCB disposed on the chip, and a connection terminal. The connection terminal is capable of being connected to the PCBA signal of the vehicle's electric drive system, and the chip is fixedly disposed in the current sensor module at a position corresponding to the detection area.
[0008] In one possible implementation of the current sensor module for the aforementioned vehicle, a first mounting structure is provided on the AC output busbar, which can be connected to the PCB.
[0009] In one possible implementation of the current sensor module for the aforementioned vehicle, the detection area is a slot-shaped area formed on the AC output busbar, and the chip is housed in the slot-shaped area.
[0010] In one possible implementation of the current sensor module for the aforementioned vehicle, when viewed along the width direction of the AC output busbar, recessed structures are respectively provided on both sides of the slotted area on the AC output busbar, thereby forming a first narrow band and a second narrow band on both sides of the chip.
[0011] In one possible implementation of the current sensor module for the aforementioned vehicle, the current detection chip assembly is fixedly mounted on the AC output busbar assembly by means of potting colloid.
[0012] In one possible implementation of the current sensor module for the aforementioned vehicle, the current detection chip assembly is fixedly disposed on the AC output busbar assembly by sequentially encapsulating a first colloid and a second colloid, wherein the hardness of the second colloid is greater than that of the first colloid.
[0013] In one possible implementation of the current sensor module for the aforementioned vehicle, the AC output busbar includes multiple sets, which are fixedly connected or integrally formed.
[0014] In one possible implementation of the current sensor module for the aforementioned vehicle, multiple sets of the AC output busbars are integrally molded by injection molding; and / or a second mounting structure is provided on the AC output busbar assembly, and the AC output busbar assembly is mounted on the vehicle through the second mounting structure.
[0015] In a preferred embodiment of this invention, the current sensor module integrates the chip with an AC output busbar assembly comprising multiple AC output busbars (with the vehicle's power module and drive motor connected to both ends of the AC output busbars respectively). This allows the current sensor module, which eliminates the need for a magnetic core, to detect the current in the vehicle's drive system. Compared to traditional Hall sensor modules, the increased integration results in higher space utilization, and consequently, a decrease in cost.
[0016] In a second aspect, the present invention provides a vehicle that includes the current sensor module described in any of the preceding claims.
[0017] It is understood that this vehicle possesses all the technical effects of the current sensor module of any of the aforementioned vehicles, and will not be elaborated further here. Attached Figure Description
[0018] The present invention will now be described with reference to the accompanying drawings. In the drawings:
[0019] Figure 1 This diagram illustrates the structure of a vehicle current sensor module according to an embodiment of the present invention.
[0020] Figure 2 An exploded view of a vehicle current sensor module according to an embodiment of the present invention is shown.
[0021] Figure 3 This diagram illustrates the assembly of the AC output busbar and the current detection chip assembly in a vehicle current sensor module according to an embodiment of the present invention; and
[0022] Figure 4 This diagram illustrates the structure of the detection area in a vehicle current sensor module according to an embodiment of the present invention.
[0023] List of reference numerals
[0024] 1. AC output busbar assembly;
[0025] 11. First current-carrying interface; 12. Second current-carrying interface; 13. Third current-carrying interface;
[0026] 14. Fourth current-carrying interface; 15. Fifth current-carrying interface; 16. Sixth current-carrying interface;
[0027] 17. First mounting structure; 18. Second mounting structure;
[0028] 121. Testing area;
[0029] 122. First narrow band; 123. Second narrow band;
[0030] 2. Current detection chip assembly;
[0031] 21. Chip; 22. PCB; 23. Connector;
[0032] 3. Colloids. Detailed Implementation
[0033] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. For example, although this embodiment is described in conjunction with three substantially identical current detection chip assemblies, this is not intended to limit the scope of protection of the present invention. Without departing from the principles of the present invention, those skilled in the art can flexibly adjust the number of current detection chip assemblies, their structural form, and their placement / method on the AC output busbar assembly. For instance, the structures of multiple current detection chip assemblies may be the same or different.
[0034] It should be noted that in the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," indicating directional or positional relationships, are based on the directional or positional relationships shown in the accompanying drawings. These are merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The singular forms of the terms "a" and "this" may also include plural forms.
[0035] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0036] Furthermore, to better illustrate this utility model, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this utility model can be implemented even without certain specific details. In some examples, the principles of current detection in current sensor modules, which are well-known to those skilled in the art, are not described in detail, in order to highlight the main points of this utility model.
[0037] Main reference Figures 1 to 3 In one possible implementation, the current sensor module mainly includes an AC output busbar assembly 1 (such as an AC output copper busbar assembly) and a current detection chip assembly 2. The AC output busbar assembly 1 includes at least one (or multiple) set of AC output busbars, and the current detection chip assembly 2 is fixedly mounted on the AC output busbars. The current detection chip assembly 2 includes a chip 21, a PCB 22, and a connection terminal 23. The chip 21 and the connection terminal 23 can be fixedly mounted on the PCB 22 by means such as soldering. The connection terminal 23 can be connected to the control board (PCBA) of the electric drive system for signal connection. In this way, after detecting the current, the chip transmits the information to the control board (PCBA) of the electric drive system through the connection terminal 23. In this example, the connection terminal 23 is a pin; obviously, other methods such as connectors or wire harnesses can also be used to achieve the corresponding electrical connection. In this invention, the current sensor module does not have a magnetic core; instead, the current magnitude passing through the AC output busbar is directly detected by the chip of the current detection chip assembly. If you can choose chips with higher sensitivity than Hall effect chips, such as TMR chips or GMR chips, the current will generate a local magnetic field after passing through components such as AC output busbars. The larger the current, the stronger the magnetic field.
[0038] In this example, the AC output busbar is a copper busbar, comprising three sets. One set has current-carrying interfaces (11, 12, 13) for connection to the vehicle's drive motor, and the other set has current-carrying interfaces (14, 15, 16) for connection to the vehicle's power module. Clearly, those skilled in the art can adjust the number and relative positions of the AC output busbars according to the actual design requirements of the electric drive system. Furthermore, multiple sets of AC output busbars in the AC output busbar assembly can be integrated into a single unit using processes such as injection molding.
[0039] In one possible implementation, the AC output busbar assembly is provided with a first mounting structure 17 for mounting the current detection chip assembly 2. In this example, the first mounting structure is a set of high-precision mounting slots on the AC output busbar assembly, corresponding to the current detection chip assembly. The PCB 22 of the current detection chip assembly 2 can be inserted into the mounting slots, thereby providing positioning and pre-fixing for the current detection chip assembly 2. Obviously, the mounting slots can also be adjusted to include features such as snap-fits, depending on actual needs. Furthermore, the AC output busbar assembly is also provided with a second mounting structure 18, through which the current sensor module can be mounted to the installation position on the vehicle. For example, mounting holes. Exemplarily, the second mounting structure is a pair of mounting holes provided on the AC output busbar assembly.
[0040] Main reference Figure 4In one possible implementation, a detection area 121 for cooperating with the chip to detect current is provided on or near the AC output busbar. By placing the current detection chip assembly around the corresponding AC output busbar, the magnitude of the magnetic field of the product can be detected, thereby detecting the magnitude of the current. In this example, the detection area is a slot-shaped area opened on the AC output busbar. Preferably, recessed structures can also be provided on both sides of the slot-shaped area (along the width direction of the AC output busbar), thereby narrowing the AC output busbar. In this way, two narrow bands (122, 123) can be formed between the slot-shaped area and the two recessed structures. Based on this structure, the local magnetic field generated on both sides of the chip in the narrow bands (122, 123) through which the current passes is stronger, making it easier for the chip to detect. In this example, the chip is placed in the slot-shaped area of the AC output busbar in the installed state. Obviously, it can also be placed in any other reasonable position, such as above or to the side of the AC output busbar.
[0041] In one possible implementation, the current detection chip assembly 2 is disposed in the corresponding position of the AC output busbar in the AC output busbar assembly 1 by means of potting colloid 3, thereby completing the current detection sensor module.
[0042] During assembly, the current detection chip assembly 2 and the AC output busbar assembly 1 can be pre-fixed using the first mounting structure, or pre-fixed by introducing tooling from the outside to press them down. After pre-fixing the chip assembly 2, the mounting area of the current detection chip assembly 2 is then locally potted with colloid 3.
[0043] In one possible implementation, the potting process involves two steps: First, a first colloid, such as silicone (if it has low hardness, it can be called a soft colloid), is potted into the mounting area of the current detection chip assembly 2 to reduce the impact of colloid curing stress on the current detection chip assembly 2. Second, a second colloid, such as epoxy resin (if it has high hardness, it can be called a hard colloid), is potted on top of the soft colloid. This is mainly used to protect the internal chip and meet the strength requirements of the component itself. After the colloid cures, the integrated installation of the current detection chip assembly 2 and the AC output busbar assembly 1 is completed. In the assembled state, because the chip of the current detection chip assembly 2 is completely encapsulated within the colloid, the current sampling is protected from subsequent environmental factors such as vibration, temperature / humidity, etc., thus improving the accuracy and reliability of the current sampling.
[0044] It is understandable that those skilled in the art can choose different types of colloids with varying hardness depending on their needs. Alternatively, the same type of colloid can be used for potting. Furthermore, potting is just one specific process for combining the current sensing chip assembly with the AC output busbar assembly; the two can also be fixed using methods such as integral injection molding, snap-fit connection, or welding.
[0045] As can be seen, in the preferred embodiment of this utility model, the current detection sensor module includes an integrated AC output busbar assembly and a current detection chip assembly. Based on this structure, the current magnitude passing through the AC output busbar is directly detected by the current detection chip assembly. Since there is no magnetic core, not only are components saved, but the problem of decreased detection accuracy due to magnetic core saturation (high current) is also eliminated. Integrating the current detection chip assembly with the AC output busbar using a potting compound improves the accuracy of current sampling. The feasibility of detection is ensured by the setting of the detection area. Forming a narrow band in the detection area facilitates chip detection.
[0046] The technical solution of this utility model has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.
Claims
1. A current sensor module for a vehicle, characterized by The vehicle includes a drive motor and a power module, and the current sensor module includes: An AC output busbar assembly (1) includes at least one set of AC output busbars, which are electrically connected to the drive motor and the power module respectively; and A current detection chip assembly (2) is fixedly disposed on the AC output busbar assembly (1); A detection area (121) is provided on or near the AC output busbar, and the current detection chip assembly (2) is fixedly disposed on the current sensor module at the position corresponding to the detection area (121).
2. The current sensor module of claim 1, wherein, The current detection chip assembly (2) includes a chip (21), a PCB (22) disposed on the chip (21), and a connection terminal (23). The connection terminal (23) can be connected to the PCBA signal of the electric drive system of the vehicle. The chip (21) is fixedly disposed at the position of the current sensor module corresponding to the detection area (121).
3. The current sensor module of a vehicle according to claim 2, characterized in that, The AC output busbar is provided with a first mounting structure (17), which can be connected to the PCB (22).
4. The current sensor module of claim 2, wherein, The detection area (121) is a slot-shaped area opened on the AC output busbar, and the chip (21) is housed in the slot-shaped area.
5. The current sensor module of claim 2, wherein, Viewed along the width direction of the AC output busbar, the AC output busbar has recessed structures on both sides of the slotted area, thereby: This causes the AC output bus to form a first narrow band (122) and a second narrow band (123) on both sides of the chip (21).
6. The current sensor module of claim 1, wherein, The current detection chip assembly (2) is fixedly disposed on the AC output busbar assembly (1) by means of potting colloid.
7. The current sensor module of claim 6, wherein, The current detection chip assembly (2) is fixedly disposed on the AC output busbar assembly (1) by sequentially encapsulating it with a first colloid and a second colloid. The second colloid has a higher hardness than the first colloid.
8. The current sensor module of claim 1, wherein, The AC output busbar includes multiple sets, which are fixedly connected or integrally formed.
9. The current sensor module of claim 6, wherein, The multiple sets of AC output busbars are integrally molded by injection molding; And / or The AC output busbar assembly (1) is provided with a second mounting structure (18), and the AC output busbar assembly (1) is mounted on the vehicle through the second mounting structure (18).
10. A vehicle characterized by comprising: The vehicle includes the current sensor module of the vehicle according to any one of claims 1 to 9.