A batched chip burn-in test device

Abstract

The utility model discloses a kind of batched chip aging test device, comprising: test bin and the test station being set in test bin, test station is set along the length direction of test bin;Several chip test modules with test bin movable connection are evenly installed on test station, the position corresponding test station below inside test bin is equipped with temperature control module along the length direction of test bin setting;Each chip test module is used to carry multiple chips to carry out aging test;Temperature control module is used to control the test temperature in aging test process;The utility model can carry batched chip aging test requirement by chip test module, support the test condition requirement when batched chip aging test by temperature control module, adopt the design of automatic alignment connection in chip test module, can improve the test efficiency, test accuracy and stability of entire test, reduce certain manpower cost, with higher application value.

Description

Technical Field

[0001] This utility model relates to the field of chip testing, and in particular to a batch chip aging test device. Background Technology

[0002] As semiconductor manufacturing processes continue to shrink to the nanometer scale, the complexity and integration of chip functions are increasing exponentially, leading to increasingly stringent requirements for reliability verification. Burn-in testing (BI), a core technology for screening early-failure devices and ensuring long-term chip stability, has become an indispensable part of the semiconductor manufacturing supply chain. Traditional burn-in testing equipment accelerates the exposure of potential chip defects by applying high temperatures, high pressures, and electrical stresses (such as bias voltage and data mode cycling), and its effectiveness has been validated by the industry for decades.

[0003] However, in recent years, the global semiconductor market has experienced explosive growth in demand, especially in the fields of 5G communication, artificial intelligence, and automotive electronics, which have driven chip manufacturing to evolve towards large-scale and diversified directions, making the limitations of traditional aging test equipment increasingly prominent.

[0004] First, existing equipment is insufficient to meet the needs of batch testing. Traditional aging test systems mostly adopt single-channel or small-scale architecture designs, which cannot meet the current large-scale testing needs of several chips per batch. Second, weak automation control capabilities have become another core bottleneck of existing equipment. The testing process of existing equipment is highly dependent on manual intervention: from chip loading and unloading to test module alignment, all require manual operation by engineers. Due to its cumbersome structure, it is difficult to achieve fast or efficient aging test control, and the flexibility is seriously insufficient. Utility Model Content

[0005] The main objective of this invention is to provide a batch chip aging test device to address the aforementioned problems in the prior art, thereby solving all or one of the aforementioned problems in the prior art.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: providing a batch chip aging test device, comprising: A test chamber and a test station set within the test chamber, the test station being arranged along the length of the test chamber; The test station is uniformly equipped with several chip test modules that are movably connected to the test chamber. Inside the test chamber, a temperature control module is provided along the length of the test chamber, corresponding to the position below the test station. Each of the chip testing modules is used to carry multiple chips for aging tests; The temperature control module is used to control the test temperature during the aging test.

[0007] As an improved solution, the temperature control module includes: a support plate, which is horizontally disposed inside the test chamber at the lower surface of the inner cavity of the test chamber; The support plate has a medium flow channel inside, and an inlet and an outlet connected to the medium flow channel are opened on one side of the support plate. The inlet and the outlet are respectively used to connect to the input end and the output end of the pump body. The pump body is used to input liquid medium into the medium flow channel. The liquid medium includes: heated liquid or cryogenic liquid.

[0008] As an improved solution, several of the chip testing modules are arranged horizontally side by side on the support plate, corresponding to the width direction of the testing chamber; The front surface of the test chamber has a clearance opening corresponding to the position of each chip test module, and the chip test module is set one-to-one with the clearance opening.

[0009] As an improved solution, each of the chip testing modules includes: a slide rail, a limiting part, a lifting control part, and a detection part; The limiting part is located on the upper surface of the bearing plate and away from the clearance opening, corresponding to the clearance opening; The slide rail is disposed on the upper surface of the support plate between the limiting part and the clearance opening. One end of the slide rail is movably engaged with the limiting part, and the other end of the slide rail extends to the outside of the clearance opening and is connected to a vertically arranged baffle. The baffle is used to close the clearance opening, and a handle is provided on the front surface of the baffle. A chip placement part is horizontally provided on the upper surface of the slide rail. The chip placement part is arranged along the length direction of the slide rail, and several chip mounting areas are provided on both sides of the chip placement part. There are two lifting control units, and the two lifting control units are respectively vertically arranged on the upper surface of the bearing plate on both sides of the slide rail. The detection unit is horizontally positioned above the chip placement unit, and its two sides are respectively connected to the two lifting control units on both sides of the slide rail unit. Detection probes are vertically provided on the lower surface of the detection unit corresponding to the positions of several chip mounting areas. The two lifting control units are used to control the vertical displacement of the detection unit.

[0010] As an improved solution, each of the lifting control units includes: a lifting cylinder; The lifting cylinder is vertically upward, and the top piston end of the lifting cylinder is connected to the upper surface of the detection unit through a horizontally arranged connecting plate. The upper surface of the support plate has a vertical through hole corresponding to the position of the lifting cylinder. The lifting cylinder corresponds to the through hole one by one, and the lifting cylinder passes through the corresponding through hole. The bottom of the lifting cylinder is connected to the inner bottom of the test chamber.

[0011] As an improved solution, each of the limiting parts includes: a concave elastic female retainer; the concave elastic female retainer is horizontally oriented toward the corresponding clearance opening, and the rear end of the concave elastic female retainer is connected to the upper surface of the bearing plate.

[0012] As an improved solution, each of the slide rails includes: a sliding base, a slide rail, and a sliding plate; The sliding base is fixed on the upper surface of the support plate in the width direction corresponding to the position between the limiting part and the clearance opening on the upper surface of the support plate; The slide rail is disposed on the upper surface of the sliding base along the length direction of the sliding base; The slide plate is horizontally and slidably connected to the slide rail. One end of the slide plate facing the concave elastic female latch is provided with a convex sub-latch corresponding to the concave elastic female latch. The end of the convex sub-latch is used to movably engage with the concave elastic female latch. The other end of the slide plate extends through the corresponding clearance opening and connects to the baffle.

[0013] As an improved solution, the chip placement part is horizontally mounted on the upper surface of the slide plate, and a plurality of chip test slots are formed on both sides of the upper surface of the chip placement part, and the plurality of chip test slots are respectively the plurality of chip mounting areas; The chip test slots are used to place a number of chips to be tested.

[0014] As an improved solution, in each chip test module, there is a distance between the two lifting control units and the slide rail, and vertically arranged limiting plates are installed on both sides of the slide rail along the length direction of the slide rail.

[0015] As an improved solution, the test chamber is a sealed shell, and several heat dissipation holes are provided on both sides of the test chamber.

[0016] The beneficial effects of this utility model are: the chip testing module supports the batch chip aging test requirements, the temperature control module supports the test conditions required for batch chip aging tests, and the chip testing module adopts an automated alignment connection design, which can improve the test efficiency, test accuracy and stability of the whole test, reduce certain labor costs, and has high application value. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of a batch chip aging test device according to an embodiment of the present invention; Figure 2 This is a three-dimensional structural diagram of a batch chip aging test device after removing part of the outer shell in an embodiment of this utility model; Figure 3 This is a three-dimensional structural diagram of a batch chip aging test device after removing part of the outer shell, as shown in another perspective, according to an embodiment of this utility model. Figure 4 This is a three-dimensional structural diagram of a batch chip aging test device after removing another part of the outer shell in an embodiment of this utility model; Figure 5 This is a three-dimensional structural diagram of a batch chip aging test device after removing another part of the outer shell, as shown in another perspective, according to an embodiment of this utility model. Figure 6 This is a three-dimensional structural diagram of the chip testing module in a batch chip aging test device according to an embodiment of the present invention; Figure 7 This is a three-dimensional structural diagram of the chip testing module after the detection part is removed in a batch chip aging test device according to an embodiment of the present invention; Figure 8 This is a three-dimensional structural diagram of the detection unit in a batch chip aging test device according to an embodiment of the present invention; Figure 9 This is a three-dimensional structural diagram of the carrier plate in a batch chip aging test device according to an embodiment of the present invention; Figure 10 This is a side view of the carrier plate in a batch chip aging test device according to an embodiment of the present invention. Figure 11 yes Figure 10 AA section view; The components in the attached diagram are labeled as follows: 1. Carrier plate; 2. Test chamber; 3. Medium flow channel; 4. Input port; 5. Output port; 6. Through hole; 7. Baffle; 8. Handle; 9. Lifting cylinder; 10. Connecting plate; 11. Concave elastic female bayonet; 12. Bayonet mounting base; 13. Sliding base; 14. Slide plate; 15. Convex sub-clamp; 16. Chip placement part; 17. Chip test slot; 18. Limiting plate; 19. Detection part; 20. Detection probe; 21. Honeycomb heat dissipation hole; 22. Clearance opening; 23. Chip test module. Detailed Implementation

[0018] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0019] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0021] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0022] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0023] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0024] Please see Figures 1-11 The embodiments of this utility model include: A batch chip aging test device includes: a test chamber 2 and a test station disposed in the test chamber 2, wherein the test station is disposed along the length direction of the test chamber 2; The test station is uniformly equipped with several chip test modules 23 that are movably connected to the test chamber 2. Inside the test chamber 2, corresponding to the position below the test station, there is a temperature control module arranged along the length of the test chamber 2. Each chip test module 23 is used to carry multiple chips for aging tests, and the temperature control module is used to control the test temperature index during the aging test process.

[0025] As one embodiment of this utility model, the temperature control module includes: a support plate 1, which is horizontally disposed within the test chamber 2 at the lower surface of the inner cavity of the test chamber 2. A medium flow channel 3 is formed inside the support plate 1. An input port 4 and an output port 5 communicating with the medium flow channel 3 are formed on one side of the support plate 1. The input port 4 and the output port 5 are respectively connected to the input end and output end of a pump body through pipelines. The pump body is used to input liquid medium into the medium flow channel 3. The pump body stores the liquid medium and supports temperature control of the liquid medium, such as a heating pump or a cooling pump. The liquid medium input into the medium flow channel 3 is a heated liquid or a low-temperature coolant, used to simulate the high-temperature or low-temperature environment in aging tests.

[0026] Optionally, a number of through holes 6 that penetrate the carrier plate 1 vertically are provided at the position of the medium flow channel 3. The through holes 6 can further improve the lightweight of the carrier plate 1 and the heat dissipation performance of the device, while being compatible with the structural form of the chip test module 23.

[0027] In one embodiment of this utility model, a plurality of chip testing modules 23 are arranged horizontally side by side on the support plate 1, corresponding to the width direction of the test chamber 2; the front surface of the test chamber 2 is provided with a clearance opening 22 corresponding to the position of each chip testing module 23, and the chip testing module 23 can slide along the bottom of the test chamber 2 to enter and exit the clearance opening 22; the chip testing module 23 and the clearance opening 22 are arranged in a one-to-one correspondence. Optionally, each chip testing module 23 comprises a slide rail, a limiting part, a lifting control part, and a detection part 19. The limiting part is positioned on the upper surface of the support plate 1 away from the clearance opening 22, corresponding to the clearance opening 22. Each slide rail is positioned on the upper surface of the support plate 1 between the limiting part and the clearance opening 22. One end of the slide rail is movably engaged with the limiting part, and the other end extends beyond the clearance opening 22 and is connected to a vertically positioned baffle 7. The baffle 7 is used to close the clearance opening 22, and a handle 8 is provided on the front surface of the baffle 7 for easy pulling to check the chip testing status. A chip placement part 16 is horizontally positioned on the upper surface of the slide rail, extending along the length of the slide rail, and several chip mounting points are provided on both sides of the chip placement part 16. The area includes two lifting control units, which are vertically arranged on both sides of the slide rail. The detection unit 19 is horizontally arranged above the chip placement unit 16, and the two sides of the detection unit 19 are connected to the two lifting control units on both sides of the slide rail. The lower surface of the detection unit 19 is vertically provided with detection probes 20 corresponding to several chip mounting areas. The two lifting control units can control the detection unit 19 to move vertically, i.e., move up and down. The purpose is to control the detection probes 20 of the detection unit 19 to move away from the chip placement unit 16 before aging test. After the chip to be tested is installed on the chip placement unit 16 and the slide rail enters the test chamber 2, the two lifting control units control the detection unit 19 to descend until the detection probes 20 establish a connection with the chip in the chip mounting area.

[0028] Optionally, each lifting control unit adopts a lifting cylinder 9, and each lifting cylinder 9 is vertically arranged on the upper surface of the support plate 1. The top piston end of each lifting cylinder 9 is connected to the upper surface of the detection unit 19 through a horizontally arranged connecting plate 10. Optionally, each of the aforementioned support plates 1 has a through hole 6 corresponding to a number of lifting control parts, that is, the lifting control parts are arranged one-to-one with the through holes 6, each lifting control part passes through the through hole 6, and the bottom of each lifting control part is connected to the inner bottom of the test chamber 2. Optionally, each limiting part adopts a concave elastic female bayonet 11, with its concave opening horizontally facing the clearance opening 22, and its rear end is connected to the upper surface of the bearing plate 1 through the bayonet mounting seat 12. Optionally, each slide rail consists of a sliding base 13, a slide rail, and a slide plate 14. The sliding base 13 is fixed in the width direction of the support plate 1 at the position between the limiting part and the clearance opening 22 on the upper surface of the support plate 1. The slide rail is arranged on the upper surface of the sliding base 13 along the length direction of the sliding base 13. The slide plate 14 is horizontally and slidably connected to the slide rail. One end of the slide plate 14 facing the concave elastic female latch 11 is provided with a convex sub-latch 15 corresponding to the concave elastic female latch 11. The convex sub-latch 15 can be movably engaged with the concave elastic female latch 11. The other end of the slide plate 14 passes through its corresponding clearance opening 22 and is connected to the aforementioned baffle 7. Under the action of the handle 8 of the corresponding baffle 7, the slide plate 14 can slide along the slide rail, thereby realizing entry and exit from the clearance opening 22. Optionally, the aforementioned chip placement part 16 is horizontally mounted on the upper surface of the slide plate 14, and a plurality of chip test slots 17 are provided on both sides of the upper surface of the chip placement part 16. These chip test slots 17 are the aforementioned chip mounting areas; the chip to be tested is placed in the chip test slots 17. Optionally, to improve stability, a distance is provided between the two lifting control units and their corresponding slide rails. Vertically arranged limiting plates 18 are installed on both sides of the slide rails along the length of the slide rails. The two limiting plates 18 ensure the sliding direction of the slide plate 14 on the slide rails. When the detection probe 20 of the detection unit 19 is connected to the chip to be detected, the height from the upper surface of the carrier plate 1 to the lower surface of the detection unit 19 matches the height of the limiting plate 18.

[0029] As one embodiment of this utility model, in order to ensure the airtightness of the test environment, the test chamber 2 is a sealed shell with the opening only being the aforementioned clearance opening 22; in order to ensure the basic heat dissipation requirements during a certain aging test process, the test chamber 2 is provided with several honeycomb heat dissipation holes 21 on both sides.

[0030] As one embodiment of this utility model, this application focuses on discussing the structure of the chip test module 23 and its structural cooperation with the test station of the test chamber 2. Other parts are other circuit structures of the chip aging test equipment, which are not the focus of this application, and therefore will not be described in detail here.

[0031] As one embodiment of this utility model, the working principle of this device is as follows: When chip testing is required, the lifting control unit raises the detection unit 19. At this time, the handle 8 is pulled to make the slide plate 14 pass through the clearance opening 22 along the slide rail until several chip test slots 17 on the chip placement unit 16 are exposed. During this process, the concave female buckle and the convex female buckle 15 that were originally locked together separate from each other. Then, the chip to be tested is loaded into the corresponding chip test slot 17, and the handle 8 is pushed so that the slide plate 14 enters the clearance opening 22 along the slide rail. When the convex female buckle 15 and the concave female buckle are locked together again, the chip placement unit 16 moves into place. Then, the two lifting control units are controlled to drive the detection unit 19 to fall, and the probe at the bottom of the detection unit 19 contacts and connects with the chip. Subsequently, the pump body can be controlled to pump the liquid medium at the temperature required for aging test into the medium flow channel 3, and then the corresponding aging test process is started.

[0032] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structure made using the contents of this utility model specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A batch chip aging test apparatus, characterized in that, include: The test chamber (2) and the test station set in the test chamber (2), the test station being set along the length direction of the test chamber (2); The test station is uniformly equipped with several chip test modules (23) that are movably connected to the test chamber (2). Inside the test chamber (2), corresponding to the position below the test station, there is a temperature control module arranged along the length of the test chamber (2). Each of the chip test modules (23) is used to carry multiple chips for aging tests; The temperature control module is used to control the test temperature during the aging test.

2. The mass production chip aging test apparatus according to claim 1, characterized in that: The temperature control module includes: a support plate (1), which is horizontally disposed in the test chamber (2) at the lower surface of the inner cavity of the test chamber (2); The support plate (1) has a medium flow channel (3) inside. The support plate (1) has an inlet (4) and an outlet (5) connected to the medium flow channel (3) on one side. The inlet (4) and the outlet (5) are respectively used to connect the input end and the output end of the pump body. The pump body is used to input liquid medium into the medium flow channel (3). The liquid medium includes: heated liquid or cryogenic liquid.

3. The mass production chip aging test apparatus according to claim 2, characterized in that: Several chip test modules (23) are arranged horizontally side by side on the carrier plate (1) in the width direction of the test chamber (2); The front surface of the test chamber (2) is provided with a clearance opening (22) corresponding to the position of each chip test module (23), and the chip test module (23) and the clearance opening (22) are set in a one-to-one correspondence.

4. The mass production chip aging test apparatus according to claim 3, characterized in that: Each of the chip test modules (23) includes: a slide rail, a limiting part, a lifting control part, and a detection part (19). The limiting part is disposed on the upper surface of the bearing plate (1) and away from the clearance opening (22) corresponding to the clearance opening (22); The slide rail is disposed on the upper surface of the support plate (1) between the limiting part and the clearance opening (22). One end of the slide rail is movably engaged with the limiting part, and the other end of the slide rail extends to the outside of the clearance opening (22) and is connected to a vertically arranged baffle (7). The baffle (7) is used to close the clearance opening (22), and a handle (8) is provided on the front surface of the baffle (7). A chip placement part (16) is horizontally provided on the upper surface of the slide rail. The chip placement part (16) is arranged along the length direction of the slide rail, and several chip mounting areas are provided on both sides of the chip placement part (16). There are two lifting control units, and the two lifting control units are respectively vertically arranged on the upper surface of the bearing plate (1) on both sides of the slide rail; The detection unit (19) is horizontally positioned above the chip placement unit (16), and the two sides of the detection unit (19) are respectively connected to the two lifting control units on both sides of the slide rail. The lower surface of the detection unit (19) is vertically provided with detection probes (20) corresponding to the positions of several chip mounting areas. The two lifting control units are used to control the displacement of the detection unit (19) in the vertical direction.

5. The mass production chip aging test apparatus according to claim 4, characterized in that: Each of the lifting control units includes: a lifting cylinder (9); The lifting cylinder (9) is set vertically upward, and the top piston end of the lifting cylinder (9) is connected to the upper surface of the detection part (19) through a horizontally set connecting plate (10). The upper surface of the support plate (1) is provided with a vertical through hole (6) corresponding to the position of the lifting cylinder (9). The lifting cylinder (9) corresponds to the through hole (6) one by one, and the lifting cylinder (9) is inserted in the corresponding through hole (6). The bottom of the lifting cylinder (9) is connected to the inner bottom of the test chamber (2).

6. The mass production chip aging test apparatus according to claim 5, characterized in that: Each of the limiting parts includes: a concave elastic female bayonet (11); the concave elastic female bayonet (11) is horizontally oriented toward the corresponding clearance opening (22), and the rear end of the concave elastic female bayonet (11) is connected to the upper surface of the bearing plate (1).

7. The mass production chip aging test apparatus according to claim 6, characterized in that: Each of the slide rails includes: a sliding base (13), a slide rail, and a slide plate (14). The sliding base (13) is fixed on the upper surface of the support plate (1) in the width direction corresponding to the position between the limiting part and the clearance opening (22); The slide rail is disposed on the upper surface of the sliding base (13) along the length direction of the sliding base (13); The slide plate (14) is horizontally and slidably connected to the slide rail. One end of the slide plate (14) facing the concave elastic female latch (11) is provided with a convex sub-latch (15) corresponding to the concave elastic female latch (11). The end of the convex sub-latch (15) is used to movably engage with the concave elastic female latch (11). The other end of the slide plate (14) extends through the corresponding clearance opening (22) and is connected to the baffle (7).

8. The mass production chip aging test apparatus according to claim 7, characterized in that: The chip placement part (16) is horizontally mounted on the upper surface of the slide plate (14). A plurality of chip test slots (17) are provided on both sides of the upper surface of the chip placement part (16), and the plurality of chip test slots (17) are respectively the plurality of chip mounting areas. Several of the chip test slots (17) are used to place several chips to be tested.

9. The mass production chip aging test apparatus according to claim 8, characterized in that: In each of the chip test modules (23), there is a distance between the two lifting control units and the slide rail, and vertically arranged limit plates (18) are installed on both sides of the slide rail along the length direction of the slide rail.

10. The mass production chip aging test apparatus according to claim 9, characterized in that: The test chamber (2) is a sealed shell, and several heat dissipation holes are provided on both sides of the test chamber (2).

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