A PCB test interconnection device and PCB test system

Abstract

The application relates to the field of PCB (Printed Circuit Board) testing, and provides a PCB testing interconnection device and a PCB testing system. The PCB testing interconnection device comprises a substrate, the substrate is horizontally arranged, the substrate is provided with an array of mounting holes, and the array of mounting holes comprises a plurality of mounting holes; and a plurality of elastic pins are arranged, the plurality of elastic pins are arranged in at least part of the mounting holes, and the elastic pins are detachably connected with the substrate. The elastic pins which can be detachably connected with the substrate are used to connect corresponding point positions between an AD / DA acquisition board and a to-be-tested circuit board. The mounting positions of the elastic pins correspond to to-be-tested point positions in the to-be-tested circuit board. The elastic pins are in abutment with the to-be-tested circuit board to complete circuit conduction by only pressing the substrate against the to-be-tested circuit board. After testing, the to-be-tested circuit board and the substrate can be directly separated from each other, so that the convenience of replacing the circuit board during PCB testing is improved.

Description

Technical Field

[0001] This application relates to the field of PCB testing technology, and in particular to PCB testing interconnection devices and PCB testing systems. Background Technology

[0002] In multi-channel AD / DA signal acquisition technology, sometimes it is necessary to acquire multiple channels simultaneously. This requires a special board-to-board interconnection technology that can both allow simultaneous acquisition of multiple channels and isolate each channel to avoid mutual interference. Board-to-board interconnection refers to the connection methods between different PCB boards, and under the current technological background, it mainly includes the following two types: The first method is soldering, the most traditional method, which includes wire soldering, ribbon cable soldering, and direct soldering. Wire soldering refers to directly soldering wires to connect the PCB to external components (such as speakers and battery boxes), suitable for low-complexity scenarios. Ribbon cable soldering refers to connecting multiple PCBs with flexible ribbon cables, supporting non-parallel layouts (such as 90° angles), and used for modular controllers. Direct soldering refers to directly butt-jointing the solder joints of two PCBs to form a single structure.

[0003] Secondly, there are connectors, including PCB sockets and standard pins. PCB sockets have gold fingers designed on the edge of the PCB. Inserting a dedicated socket facilitates module replacement. The gold plating thickness of the gold fingers must be >0.3μm to ensure wear resistance. Standard pins connect to parallel or perpendicular PCBs via pin headers / female headers and are widely used in development board expansion and small instruments.

[0004] While the methods described above are low-cost and offer good initial conductivity, they also have significant drawbacks such as the risk of thermal damage, difficulty in maintenance, and mechanical reliability issues. Incompatibility between different types of wire harnesses also leads to difficulties in achieving universality and inflexible wiring. Therefore, there is an urgent need for a technology with more interface channels and more flexible wiring to meet the needs of analog-to-digital conversion testing. Summary of the Invention

[0005] Therefore, it is necessary to provide a PCB testing interconnection device and PCB testing system that can meet the requirements of easy disassembly in digital-to-analog conversion testing, in order to address the above-mentioned technical problems.

[0006] In a first aspect, this application provides an inter-board interconnection device for PCB testing, comprising: A substrate is horizontally positioned and has a through-hole array, which includes multiple mounting holes. The flexible pins are provided in multiple locations, with at least a portion of the mounting holes being provided, and the flexible pins being detachably connected to the substrate.

[0007] In one embodiment, the substrate includes an upper plate and a lower plate, with the mounting hole array of the upper plate corresponding one-to-one with the mounting hole array of the lower plate; the lower plate has stepped holes, with the larger diameter section of the stepped holes located on the side of the lower plate relatively away from the upper plate, and the smaller diameter section of the stepped holes located on the side of the lower plate relatively close to the upper plate.

[0008] In one embodiment, the upper plate is provided with a aligning hole corresponding to the stepped hole, the axis of the aligning hole coinciding with the axis of the stepped hole.

[0009] In one embodiment, the spacing between two adjacent mounting holes in the plurality of mounting holes is greater than or equal to 1.5 mm.

[0010] Secondly, this application also provides a PCB testing system, including: PCB test inter-board interconnection device, the PCB test inter-board interconnection device includes a substrate and flexible pins, the substrate is horizontally arranged, the substrate is provided with a mounting hole array through the substrate, the mounting hole array includes multiple mounting holes, multiple flexible pins are provided, the multiple flexible pins are provided in at least some of the mounting holes, and the flexible pins are detachably connected to the substrate. The adapter board includes a first side and a second side. The second side is provided with solder pad contacts corresponding to the elastic pins. The first side is provided with a first connector, which is electrically connected to the solder pad contacts. The AD / DA acquisition board is equipped with an AD / DA chip and an external interface. A second connector is located on the side of the acquisition board that is relatively close to the adapter board. The second connector is plugged in and electrically connected to the first connector.

[0011] In one embodiment, the first connector is a socket, and the second connector is a pin or a pin of a DIP-packaged AD / DA chip. The socket and the second connector are used in a corresponding manner to achieve electrical connection between the adapter board and the AD / DA acquisition board.

[0012] In one embodiment, the substrate includes an upper plate and a lower plate. The mounting hole array of the upper plate corresponds one-to-one with the mounting hole array of the lower plate. The flexible pin passes through the upper plate and the lower plate. The section of the flexible pin that is closer to the lower plate corresponds to the sampling point of the circuit board under test. The flexible pin abuts against and is electrically connected to the sampling point of the circuit board under test.

[0013] In one embodiment, the end of the flexible pin that is closer to the upper plate abuts against the pad contact and is electrically connected to the pad contact.

[0014] In one embodiment, the adapter board further includes a copper cladding layer located on a first side and / or a second side of the adapter board, the copper cladding layer being used to achieve electrical connection between the pad contacts and the corresponding first connector.

[0015] In one embodiment, a surface mount resistor is electrically connected to the first side of the adapter board. The surface mount resistor is electrically connected to the copper layer and is used to match the impedance between the PCB test board interconnect device, the adapter board, the AD / DA acquisition board, and the circuit board under test.

[0016] The aforementioned PCB testing interconnection device and PCB testing system connect the corresponding points between the AD / DA acquisition board and the circuit board under test via flexible pins that can be detachably connected to the substrate. The installation position of the flexible pins corresponds to the test point in the circuit board under test. Simply pressing the substrate onto the circuit board under test will make the flexible pins contact the circuit board under test and complete the circuit conduction. After the test is completed, the circuit board under test and the substrate can be directly separated, thereby improving the convenience of replacing the circuit board when testing the PCB. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a PCB testing inter-board interconnection device in one embodiment; Figure 2 A top view of a PCB testing interconnection device in one embodiment; Figure 3 A bottom view of a PCB testing interconnect device in one embodiment; Figure 4 This is a front view of a PCB testing interconnect device in one embodiment; Figure 5 This is a schematic diagram of a PCB testing system in one embodiment; Reference numerals: 1. PCB test inter-board interconnect device; 11. Substrate; 111. Upper board; 1111. Alignment hole; 112. Lower board; 1121. Stepped hole; 113. Mounting hole; 12. Flexible pin; 2. Adapter board; 3. AD / DA acquisition board; 4. PCB under test. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0019] Firstly, this application provides an inter-board interconnection device 1 for PCB testing, such as... Figures 1 to 4As shown, the device includes a substrate 11 and flexible pins 12. The substrate 11 is horizontally arranged, and an array of mounting holes 113 is provided through the substrate 11. The array of mounting holes 113 includes a plurality of mounting holes 113, and the distance between two adjacent mounting holes 113 is greater than or equal to 1.5 mm. A plurality of flexible pins 12 are provided, and the plurality of flexible pins 12 are provided in at least some of the mounting holes 113, and the flexible pins 12 are detachably connected to the substrate 11.

[0020] In one specific embodiment, the substrate 11 is an acrylic plate, and the flexible pin 12 is a PogoPin (also commonly translated as a flexible pin). When installing the flexible pin 12, the installation position of the flexible pin 12 can be determined according to the test point of the circuit board under test. That is, the number and position of the flexible pin 12 can be adjusted according to the actual circuit board under test. Not all mounting holes 113 need to be fitted with flexible pins 12. To facilitate the installation of the flexible pin 12, the mounting holes 113 and the flexible pin 12 are set to interference fit.

[0021] like Figures 1 to 3 As shown, the substrate 11 includes an upper plate 111 and a lower plate 112. The mounting holes 113 array of the upper plate 111 correspond one-to-one with the mounting holes 113 array of the lower plate 112. The lower plate 112 has stepped holes 1121. The larger diameter section of the stepped hole 1121 is located on the side of the lower plate 112 that is relatively far away from the upper plate 111, and the smaller diameter section of the stepped hole 1121 is located on the side of the lower plate 112 that is relatively close to the upper plate 111. The upper plate 111 is provided with alignment holes 1111 that correspond to the stepped holes 1121. The axis of the alignment holes 1111 coincides with the axis of the stepped holes 1121.

[0022] Secondly, this application also provides a PCB testing system, such as Figure 4 and Figure 5 As shown, the device includes a PCB test board interconnection device 1, an adapter board 2, and an AD / DA acquisition board 3.

[0023] Specifically, the PCB test inter-board interconnect device 1 includes a substrate 11 and flexible pins 12. The substrate 11 is horizontally arranged and has a through-hole array 113. The through-hole array 113 includes multiple mounting holes 113. Multiple flexible pins 12 are provided, and the multiple flexible pins 12 are provided in at least some of the mounting holes 113. The flexible pins 12 are detachably connected to the substrate 11.

[0024] The adapter board 2 includes a first side and a second side. The first side is the side of the adapter board 2 that is relatively close to the AD / DA acquisition board 3, and the second side is the side of the adapter board 2 that is relatively close to the PCB test inter-board interconnection device 1. The second side is provided with pad contacts corresponding to the elastic pins 12, and the first side is provided with a first connector, which is electrically connected to the pad contacts.

[0025] The AD / DA acquisition board 3 is equipped with an AD / DA chip and an external interface. The AD / DA chip is used to convert between analog and digital signals, and the external interface is used to realize the electrical connection and communication between the AD / DA acquisition board 3 and peripheral hardware devices. Specifically, such as... Figure 4 As shown, the AD / DA acquisition board 3 communicates with the external FPGA and PC via an external interface to transmit the acquired signals, making it easier for testers to process the acquired signals and complete the test.

[0026] Furthermore, the AD / DA acquisition board 3 has a second connector on the side relatively close to the adapter board 2. The second connector is inserted into and electrically connected to the first connector. In one embodiment, the first connector is a socket, and the second connector is a pin or a pin of a DIP-packaged AD / DA chip. The socket and the second connector are used in a corresponding manner to achieve the electrical connection between the adapter board 2 and the AD / DA acquisition board 3.

[0027] By setting the first connector and the second connector, the connection between the AD / DA acquisition board 3 and the adapter board 2 can be realized. This not only ensures a stable connection between the AD / DA acquisition board 3 and the adapter board 2 during testing, but also provides convenience for testers to replace the adapter board 2 with a suitable one after the test object changes.

[0028] In one embodiment, the substrate 11 includes an upper plate 111 and a lower plate 112. The mounting hole 113 array of the upper plate 111 corresponds one-to-one with the mounting hole 113 array of the lower plate 112. The flexible pin 12 passes through the upper plate 111 and the lower plate 112. The section of the flexible pin 12 that is relatively close to the lower plate 112 is set to correspond to the sampling point of the circuit board under test. The flexible pin 12 abuts against and is electrically connected to the sampling point of the circuit board under test.

[0029] By setting up the flexible pins 12, the contact between the circuit board under test (TBT) and the sampling point and the flexible pins 12 is made more stable after the test begins. After the test, the TDT circuit board can be separated from the flexible pins 12 simply by removing the substrate 11, thus ensuring the convenience of replacing the TDT circuit board. When the type of the TDT circuit board changes, it is only necessary to adjust the position of the flexible pins 12 according to the position of the sampling point, pull out some of the flexible pins 12 from the mounting holes 113, and then insert them into the corresponding mounting holes 113. If the flexible pins 12 malfunction, the damaged flexible pins 12 can be replaced accordingly, making the PCB test inter-board interconnect device 1 and the PCB test system have good maintainability.

[0030] In one embodiment, the adapter board 2 further includes a copper-clad layer located on a first side and / or a second side of the adapter board 2. The copper-clad layer is used to achieve electrical connection between the pad contacts and the corresponding first connectors. The end of the flexible pin 12 closest to the upper board 111 abuts against the corresponding pad contact and is electrically connected to the pad contact.

[0031] In this way, the electrical connection between the adapter board 2 and the PCB test inter-board interconnection device 1 can be achieved. When using this PCB test system, first select the corresponding model of the adapter board 2 according to the object being tested, and adjust the position of the elastic pins 12 in the PCB test inter-board interconnection device 1. Then, connect and fix the AD / DA acquisition board 3 and the adapter board 2 through the first connector and the second connector. Finally, align the pad contacts of the adapter board 2 with the elastic pins 12 of the PCB test inter-board interconnection device 1 one by one and fix the adapter board 2. The PCB test inter-board interconnect device 1 is used to make the flexible pin 12 abut against the pad contact. During testing, the position of the PCB 4 under test is first fixed, and the PCB test inter-board interconnect device 1 is placed on the PCB 4 under test, so that the flexible pin 12 abuts against the test point on the PCB 4 under test. At this time, the test point of the PCB 4 under test, the flexible pin 12, the copper layer, the first connector and the second connector form a path, and the test signal can be transmitted between the AD / DA acquisition board 3 and the PCB 4 under test, thereby completing the test.

[0032] In one embodiment, a surface mount resistor is electrically connected to the first side of the adapter board 2. The surface mount resistor is electrically connected to the copper layer and is used to match the impedance between the PCB test inter-board interconnect device 1, the adapter board 2, the AD / DA acquisition board 3, and the circuit board under test.

[0033] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0034] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A PCB testing inter-board interconnection device, characterized in that, include: A substrate (11) is horizontally arranged, and an array of mounting holes (113) is provided through the substrate (11), the array of mounting holes (113) including a plurality of mounting holes (113); A plurality of flexible pins (12) are provided, the plurality of flexible pins (12) are provided in at least a portion of the mounting holes (113), and the flexible pins (12) are detachably connected to the substrate (11).

2. The PCB testing interconnection device according to claim 1, characterized in that, The substrate (11) includes an upper plate (111) and a lower plate (112). The mounting hole (113) array of the upper plate (111) corresponds one-to-one with the mounting hole (113) array of the lower plate (112). The lower plate (112) has a stepped hole (1121). The larger diameter section of the stepped hole (1121) is located on the side of the lower plate (112) that is relatively far away from the upper plate (111), and the smaller diameter section of the stepped hole (1121) is located on the side of the lower plate (112) that is relatively close to the upper plate (111).

3. An inter-board connection device for use in testing a PCB as claimed in claim 2, wherein, The upper plate (111) is provided with a aligning hole (1111) corresponding to the stepped hole (1121), and the axis of the aligning hole (1111) coincides with the axis of the stepped hole (1121).

4. An inter-board connection device for use in testing a PCB according to any one of claims 1 to 3, wherein The distance between two adjacent mounting holes (113) in the plurality of mounting holes (113) is greater than or equal to 1.5 mm.

5. A PCB testing system characterized by, include: PCB test inter-board interconnect device (1), the PCB test inter-board interconnect device (1) includes a substrate (11) and flexible pins (12), the substrate (11) is horizontally arranged, the substrate (11) is provided with a through-hole (113) array, the mounting hole (113) array includes a plurality of mounting holes (113), a plurality of flexible pins (12) are provided, the plurality of flexible pins (12) are provided in at least a portion of the mounting holes (113), and the flexible pins (12) are detachably connected to the substrate (11); The adapter board (2) includes a first side and a second side. The second side is provided with a solder pad contact corresponding to the elastic pin (12). The first side is provided with a first plug-in, which is electrically connected to the solder pad contact. AD / DA acquisition board (3), the acquisition board is provided with AD / DA chip and external interface, the acquisition board is provided with a second plug on the side relatively close to the adapter board (2), the second plug is plugged in and electrically connected to the first plug.

6. The PCB testing system of claim 5, wherein, The first connector is a connector, and the second connector is a pin or a pin of a DIP-packaged AD / DA chip. The connector and the second connector are used in conjunction to achieve electrical connection between the adapter board (2) and the AD / DA acquisition board (3).

7. The PCB testing system of claim 6, wherein, The substrate (11) includes an upper plate (111) and a lower plate (112). The mounting hole (113) array of the upper plate (111) corresponds one-to-one with the mounting hole (113) array of the lower plate (112). The elastic pin (12) passes through the upper plate (111) and the lower plate (112). The section of the elastic pin (12) that is relatively close to the lower plate (112) is set to correspond to the sampling point of the circuit board under test. The elastic pin (12) abuts against and is electrically connected to the sampling point of the circuit board under test.

8. The PCB testing system of claim 7, wherein, The end of the flexible pin (12) that is relatively close to the upper plate (111) abuts against the pad contact and is electrically connected to the pad contact.

9. The PCB testing system of claim 8, wherein, The adapter board (2) further includes a copper cladding layer, which is located on a first side and / or a second side of the adapter board (2) and is used to realize the electrical connection between the pad contacts and the corresponding first connector.

10. The PCB testing system of claim 9, wherein, The first side of the adapter board (2) is electrically connected to a surface mount resistor, which is electrically connected to the copper layer. The surface mount resistor is used to match the impedance between the PCB test board interconnect device (1), the adapter board (2), the AD / DA acquisition board (3), and the circuit board under test.

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