A pre-pressure shaping fixture for chip aging

Abstract

This application relates to a pre-pressure shaping fixture for chip aging, comprising: a pressing mechanism mounted on a machine base, including a pressing drive mechanism and a movable plate; and a fixture structure mounted on the machine base and located below the pressing mechanism, having several fixture bases. The fixture bases are used to hold and fix chip aging test fixtures, with an aging cover on top of each fixture base. The pressing mechanism's pressure plate presses down the aging cover, thereby pressing and positioning the chip. The pressing drive mechanism drives the movable plate downwards, causing the pressure plate to press firmly against the aging cover on the fixture base. This, in turn, pushes the chip held by the chip aging test fixture in the fixture base through the aging cover, thus pre-pressure shaping the chip. This ensures that all chips held by the chip aging test fixture are tightly fitted to the fixture base, facilitating identical testing conditions for each chip during subsequent testing and aging processes, thereby guaranteeing stable and reliable test data.

Description

Technical Field

[0001] This application relates to the field of chip processing aging test technology, and in particular to a chip pre-pressure shaping fixture before aging. Background Technology

[0002] During the chip manufacturing process, aging tests are generally required to verify and calibrate the chip's performance.

[0003] In the existing technology, when performing chip aging tests, the chip is generally clamped and fixed by a chip aging test fixture, and then the chip aging test fixture with the chip is placed in a jig so that the chip can be sent into the aging test equipment for the corresponding test.

[0004] However, this assembly method makes it difficult to ensure that each chip on the chip aging test fixture is attached to the base plate of the fixture, which in turn leads to differences in the testing conditions of each chip during the testing and aging process, resulting in deviations in the final test data. Utility Model Content

[0005] This application provides a pre-pressure shaping fixture for chip aging to solve the technical problem in the prior art where inaccurate test data is caused by clamping deviations during chip aging testing.

[0006] This application provides a pre-pressure shaping fixture for chips before aging, including:

[0007] The pressing mechanism, mounted on the machine base, includes a pressing drive mechanism and a movable plate. The pressing drive mechanism pushes the movable plate downward, so that the pressure plate located on the bottom surface of the movable plate presses against the fixture structure below.

[0008] The fixture structure is set on the machine platform and located below the pressing mechanism. It is provided with several fixture bases. The fixture bases are used to place the chip aging test fixtures that clamp and fix the chips. An aging cover is closed on the fixture base. The pressure plate of the pressing mechanism presses down the aging cover to press down and position the chip.

[0009] Furthermore, positioning pins are provided on both sides of the interior of the fixture base, and positioning grooves are provided on both sides of the chip aging test fixture and the aging cover. The positioning pins are sequentially embedded into the positioning grooves of the chip aging test fixture and the aging cover.

[0010] Furthermore, a linear motion module is provided on the machine base, and the fixture structure is located on the moving end of the linear motion module. When the fixture structure moves to the extreme positions at both ends driven by the linear motion module, it is respectively located at the loading / unloading station and the pre-pressing station. The pre-pressing station is below the pressing mechanism, and the loading / unloading station is at the end away from the pressing mechanism.

[0011] Furthermore, the linear motion module includes a linear drive mechanism and a sliding plate. The linear drive mechanism is mounted on the machine base, the sliding plate is connected to the output end of the linear drive mechanism, and the fixture structure is mounted on the sliding plate.

[0012] Furthermore, several guide rails are arranged in parallel on the machine base, and a slider is mounted on the guide rail. The top surface of the slider is connected to the bottom surface of the sliding plate, and the extension direction of the guide rail is parallel to the direction in which the linear drive mechanism drives the sliding plate to move.

[0013] Furthermore, the machine base is provided with adjustment and limiting mechanisms at the two extreme positions of the sliding plate. The adjustment and limiting mechanisms include: a fixed base, an adjustment and limiting bolt, a locking nut, and a buffer. The fixed base is disposed on the machine base, the adjustment and limiting bolt is screwed into the threaded hole on the fixed base, the locking nut is tightened on the adjustment and limiting bolt and fits against the side of the fixed plate, and the buffer is disposed on the fixed base and parallel to the locking nut. The threaded section of the locking nut and the buffer section of the buffer face towards the sliding plate.

[0014] Furthermore, the machine base is equipped with two sets of photoelectric sensor switches, and the side of the sliding plate is equipped with a sensing plate. The two sets of photoelectric sensor switches are respectively located at the two extreme positions of the sliding plate. When the sliding plate moves to the extreme positions of the two ends, the photoelectric sensor switches are respectively located in the detection area of ​​the corresponding photoelectric sensor switches.

[0015] Furthermore, the pressing mechanism also includes a support frame structure, the pressing drive mechanism is disposed on the support frame structure, and the output end of the pressing drive mechanism passes through the support frame structure and is connected to the movable plate.

[0016] Furthermore, the support frame structure includes: a plurality of support columns and a fixed plate. The plurality of support columns are vertically arranged on the machine platform. The bottom surface of the fixed plate is connected to the top of the support columns. The pressing drive mechanism is arranged on the fixed plate. The output end of the pressing drive mechanism passes through the fixed plate and is connected to the movable plate. The four inner corners of the movable plate are respectively provided with linear bearings, and the linear bearings are sleeved on the support columns.

[0017] Furthermore, buffer modules are respectively provided on both sides of the movable plate, with the buffer section of the buffer module facing the machine platform. During the downward movement of the movable plate, the buffer module comes into contact with the machine platform.

[0018] The technical solutions provided in this application have the following advantages compared with the prior art:

[0019] In the embodiments provided in this application, the movable plate is driven downward by the pressure drive mechanism, so that the pressure plate presses against the aging cover of the fixture base. In turn, the aging cover pushes the chip held by the chip aging test fixture in the fixture base, thereby pre-pressing and shaping the chip. This ensures that all the chips held by the chip aging test fixture are in close contact with the fixture base, so that the test conditions of each chip are the same during the subsequent testing and aging process, thereby ensuring that the test data is stable and reliable. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0023] Figure 1 This is a schematic diagram of a chip pre-pressure shaping fixture provided in an embodiment of this application.

[0024] Figure 2 This is a schematic diagram of the fixture structure.

[0025] Figure 3 A schematic diagram of the fixture structure for removing the aged top cover.

[0026] Figure 4 for Figure 1 A magnified view of a portion of point A in the middle.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Machine base; 2. Pressing mechanism; 21. Pressing drive mechanism; 22. Movable plate; 23. Pressure plate; 24. Support frame structure; 241. Support column; 242. Fixed plate; 243. Linear bearing; 25. Buffer module; 26. Floating joint; 3. Fixture structure; 31. Fixture base; 311. Positioning pin; 312. Directional pin; 32. Chip aging test fixture; 33. Aging cover; 331. Positioning groove; 4. Linear motion module; 41. Linear drive mechanism; 42. Sliding plate; 43. Guide rail; 44. Slider; 45. Photoelectric sensor switch; 5. Adjustment limit mechanism; 51. Fixed seat; 52. Adjustment limit bolt; 53. Locking nut; 54. Buffer component. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0031] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0032] To address the technical problem of inaccurate test data caused by clamping deviations during chip aging testing in existing technologies, this application provides a pre-pressure shaping fixture for chip aging. This fixture uses a downward-pressing drive mechanism to move a movable plate downwards, pressing a pressure plate against the aging cover of the fixture base. The aging cover then pushes the chip held by the chip aging test fixture in the fixture base, thus pre-pressure shaping the chip. This ensures that all chips held by the chip aging test fixture are tightly fitted to the fixture base, guaranteeing identical testing conditions for each chip during subsequent testing and aging processes, thereby ensuring stable and reliable test data.

[0033] Please see Figure 1 , Figure 2 as well as Figure 3 This application provides a pre-pressure shaping fixture for chip aging, comprising:

[0034] The pressing mechanism 2 is mounted on the machine base 1 and includes a pressing drive mechanism 21 and a movable plate 22. The pressing drive mechanism 21 pushes the movable plate 22 downward, so that the pressure plate 23 located on the bottom surface of the movable plate 22 presses against the fixture structure 3 below.

[0035] The fixture structure 3 is set on the machine base 1 and located below the pressing mechanism 2. It is provided with several fixture bases 31. The fixture bases 31 are used to place the chip aging test fixture 32 that clamps and fixes the chip. An aging cover 33 is covered on the fixture base 31. The pressure plate 23 of the pressing mechanism 2 presses down the aging cover 33 to press down and position the chip.

[0036] Before performing chip aging tests, the chips to be tested are clamped and fixed sequentially on the chip aging test fixture 32. The chip aging test fixture 32 is then placed in the fixture base 31, and the aging cover 33 is closed over the top opening of the fixture base 31, so that the bottom surface of the aging cover 33 is in contact with the chip aging test fixture 32 in the fixture base 31. After the chips are clamped and placed, the fixture structure 3 is placed below the pressing mechanism 2. The pressing drive mechanism 21 is activated, driving the movable plate 22 to move downward, thereby causing the pressure plate 23 to contact the aging cover 33. Under the continued push of the downward driving mechanism 21, the pressure plate 23 applies a downward force to the aging cover 33, thereby pushing the aging cover 33 downward so that the bottom surface of the aging cover 33 contacts the chip, pushing the chip towards the inner bottom surface of the fixture base 31, thereby pressing the chip tightly between the pressure plate 23 and the fixture base 31, so that each chip is tightly attached to the inner bottom surface of the fixture base 31, thereby ensuring that the test conditions for all chips are the same, controlling the test variables, and effectively ensuring the accuracy and stability of the chip aging test data.

[0037] In some embodiments, positioning pins 311 are respectively provided on both sides of the interior of the fixture base 31, and positioning grooves 331 are respectively provided on both sides of the chip aging test fixture 32 and the aging cover 33. The positioning pins 311 are sequentially embedded into the positioning grooves 331 of the chip aging test fixture 32 and the aging cover 33. When the chip aging test fixture 32 is installed onto the fixture base 31, the positioning grooves 331 on both sides of the chip aging test fixture 32 are aligned with the positions of the positioning pins 311, and the positioning pins 311 are embedded into the positioning grooves 331 of the chip aging test fixture 32, so that the chip aging test fixture 32 is installed into the fixture base 31 along the direction of the positioning pins 311. Then, the positioning grooves 331 on both sides of the aging cover 33 are aligned with the positioning pins 311 of the fixture base 31, and the positioning pins 311 are inserted into the positioning grooves 331 of the aging cover 33. The aging cover 33 is then installed into the fixture base 31 along the direction of the positioning pins 311, and the bottom surface of the aging cover 33 contacts the chip aging test fixture 32 or the chip.

[0038] During the process of pushing the aging cover 33 downward by the pressing mechanism 2, the positioning pin 311 cooperates with the aging cover 33 to provide guidance for the movement of the aging cover 33. This avoids the situation where the aging cover 33 shifts or deflects during the movement, which would affect the pushing effect on different chips held on the chip aging test fixture 32 and thus affect the accuracy of the chip aging test.

[0039] In some specific embodiments, a directional pin 312 is provided on one side of the fixture base 31, and a directional groove is provided on the chip aging test fixture 32 corresponding to the directional pin 312. When the chip aging test fixture 32 is assembled onto the fixture base 31, if the directional groove of the chip aging test fixture 32 corresponds to the position of the directional pin 312 of the fixture base 31, the directional pin 312 can be inserted into the directional groove, so that the chip aging test fixture 32 can fit against the inner bottom surface of the fixture base 31 after being installed into the fixture base 31. If the directional groove of the chip aging test fixture 32 does not correspond to the position of the directional pin 312 of the fixture base 31, the directional pin 312 cannot be properly inserted into the directional groove, thus lifting one side of the chip aging test fixture 32 to remind the operator of the assembly abnormality, and then adjust the assembly direction of the chip aging test fixture 32 to ensure the pre-pressure shaping effect of the subsequent pressing mechanism 2 on the chip clamped and fixed on the chip aging test fixture 32.

[0040] In some embodiments, the machine tool 1 is equipped with a linear motion module 4, and the fixture structure 3 is disposed on the moving end of the linear motion module 4. When the fixture structure 3 moves to its two extreme positions driven by the linear motion module 4, it is respectively located at the loading / unloading station and the pre-pressing station. The pre-pressing station is below the pressing mechanism 2, and the loading / unloading station is at the end away from the pressing mechanism 2. The fixture structure 3 is transported by the linear motion module 4, so that the fixture structure 3 can move between the pre-pressing station and the loading / unloading station. This satisfies the requirement that after the chip aging test fixture 32 in the fixture structure 3 is clamped and fixed for pre-pressing and shaping, the fixture structure 3 is sent to the loading / unloading station to unload the fixture structure 3 that has completed the pre-pressing work, and the fixture structure 3 to be pre-pressed is placed on the linear motion module 4, so as to realize the cyclical operation of chip pre-pressing and shaping.

[0041] In some embodiments, the linear motion module 4 includes a linear drive mechanism 41 and a sliding plate 42. The linear drive mechanism 41 is mounted on the machine base 1, the sliding plate 42 is connected to the output end of the linear drive mechanism 41, and the fixture structure 3 is mounted on the sliding plate 42. During operation, the linear drive mechanism 41 is activated, thereby driving the sliding plate 42 to move, thus realizing the movement of the fixture structure 3. In some optional embodiments, the linear drive mechanism 41 is a cylinder. Since the fixture structure 3 only has two stations—the loading / unloading station and the pre-pressing station—driving the sliding plate 42 with a cylinder can meet the movement requirements of the fixture structure 3, and the response speed is fast, which can effectively improve the overall work efficiency.

[0042] In some embodiments, a plurality of guide rails 43 are arranged in parallel on the machine base 1, and a slider 44 is mounted on the guide rails 43. The top surface of the slider 44 is connected to the bottom surface of the sliding plate 42, and the extension direction of the guide rails 43 is parallel to the direction in which the linear drive mechanism 41 drives the sliding plate 42 to move. By setting the guide rails 43, the movement of the sliding plate 42 connected to the slider 44 is guided, reducing the friction force on the sliding plate 42 during movement, ensuring the stability of the movement of the fixture structure 3, so that the fixture structure 3 can move stably to the position below the pressing mechanism 2, and effectively press down the aging cover 33 of the fixture structure 3 through the pressure plate 23, thereby pre-pressing and shaping the chip held on the chip aging test fixture 32.

[0043] In some embodiments, adjustment limiting mechanisms 5 are respectively provided on the machine base 1 at the two extreme positions of the sliding plate 42. The adjustment limiting mechanism 5 includes: a fixed base 51, an adjustment limiting bolt 52, a locking nut 53, and a buffer 54. The fixed base 51 is disposed on the machine base 1. The adjustment limiting bolt 52 is screwed into the threaded hole on the fixed base 51. The locking nut 53 is tightened on the adjustment limiting bolt 52 and fits against the side of the fixed plate 242. The buffer 54 is disposed on the fixed base 51 and is parallel to the locking nut 53. The threaded section of the locking nut 53 and the buffer section of the buffer 54 face towards the sliding plate 42. When the linear drive mechanism 41 drives the sliding plate 42 to move to the loading / unloading station or the pre-pressing station, due to inertia, the sliding plate 42 and the fixture base 31 will continue to move forward, causing a deviation in the relative position between the fixture base 31 and the pressure plate 23, affecting the pushing effect of the pressure plate 23 on the aging cover 33. Therefore, by setting adjustment limiting mechanisms 5 at both ends, the maximum movement of the sliding plate 42 is specifically limited, ensuring that the fixture base 31 can be correctly positioned below the pressure plate 23. This effectively pushes the aging cover 33 through the pressure plate 23, thereby achieving the pre-pressure shaping of the chip. When the sliding plate 42 moves to the position of the adjustment limiting mechanism 5, the side of the sliding plate 42 first contacts the buffer 54, which absorbs the kinetic energy of the sliding plate 42. Then, the sliding plate 42 moves to contact the adjustment limiting bolt 52, which restricts the continued movement of the sliding plate 42, keeping it stationary. By absorbing the kinetic energy of the sliding plate 42 through the buffer 54, excessive kinetic energy is avoided when the sliding plate 42 contacts the adjustment limiting bolt 52, preventing damage to the sliding plate 42 or the fixture base 31.

[0044] When the position of the limit needs to be adjusted, first loosen the locking nut 53 and rotate the adjusting limit bolt 52 to change the relative distance between the end face of the threaded section of the adjusting limit bolt 52 and the fixed seat 51. Then tighten the locking nut 53 so that the locking nut 53 is pressed against the fixed seat 51, thereby limiting the movement of the adjusting limit bolt 52.

[0045] In some alternative embodiments, the buffer 54 is a spring or a gas spring, which absorbs and buffers the kinetic energy of the sliding plate 42, and avoids damage caused by rigid collision between the sliding plate 42 or the fixture base 31 and the adjusting limit bolt 52.

[0046] In some embodiments, the machine base 1 is provided with two sets of photoelectric sensor switches 45, and the side of the sliding plate 42 is provided with a sensor sheet. The two sets of photoelectric sensor switches 45 are respectively located at the two extreme positions of the sliding plate 42. When the sliding plate 42 moves to the extreme positions of the two extreme positions, the photoelectric sensor switches 45 are respectively located in the detection area of ​​the corresponding photoelectric sensor switches 45.

[0047] When the sliding plate 42 moves to the loading / unloading station or the pre-pressing station, the sensing element located on the side of the sliding plate 42 is precisely within the detection area of ​​the photoelectric sensor switch 45, thereby detecting the position of the sliding plate 42 through the photoelectric sensor switch 45. When the photoelectric sensor switch 45 located next to the pressing mechanism 2 detects the sensing element, it sends a corresponding control signal to the control system, thereby starting the working program of the pressing mechanism 2 and reducing manual intervention. When the photoelectric sensor switch 45 located next to the loading / unloading station detects the sensing element, it sends a corresponding control signal to the control system, thereby issuing a corresponding loading / unloading reminder or controlling the robot arm to perform the corresponding loading / unloading work.

[0048] In some embodiments, the pressing mechanism 2 further includes a support frame structure 24, and the pressing drive mechanism 21 is disposed on the support frame structure 24. The output end of the pressing drive mechanism 21 passes through the support frame structure 24 and is connected to the movable plate 22. The support frame structure 24 provides support for the pressing drive mechanism 21, allowing the pressing drive mechanism 21 to drive the movable plate 22 downward from a high position, thereby pressing down the aging cover 33 through the pressure plate 23, thus achieving a pre-pressing and shaping effect on the chip.

[0049] In some optional embodiments, the pressing drive mechanism 21 employs a cylinder, thereby effectively ensuring that the movable plate 22 has sufficient thrust to push the aging cover 33 downward during the pressing process, ensuring the stability of the pre-pressing and shaping effect on the chip clamped and fixed on the chip aging test fixture 32. A floating joint 26 connects the pressing drive mechanism 21 and the movable plate 22, thereby preventing the pressing drive mechanism 21 from being unable to effectively drive the movable plate 22 to rise and fall due to the unstable operation of the movable plate 22 during its movement. The floating joint 26 allows for a certain range of relative movement between the output end of the pressing drive mechanism 21 and the movable plate 22, ensuring the stability of the driving effect on the movable plate 22.

[0050] In some embodiments, the support frame structure 24 includes: a plurality of support columns 241 and a fixed plate 242. The plurality of support columns 241 are vertically arranged on the machine base 1. The bottom surface of the fixed plate 242 is connected to the top of the support columns 241. The pressing drive mechanism 21 is arranged on the fixed plate 242. The output end of the pressing drive mechanism 21 passes through the fixed plate 242 and is connected to the movable plate 22. Linear bearings 243 are respectively arranged at the four inner corners of the movable plate 22. The linear bearings 243 are sleeved on the support columns 241. The linear bearings 243 sleeved on the support columns 241 provide a guiding function for the movable plate 22, thereby making the lifting process of the movable plate 22 smooth and reliable.

[0051] In some embodiments, buffer modules 25 are respectively provided on both sides of the movable plate 22, with the buffer section of the buffer module 25 facing the machine base 1. During the downward movement of the movable plate 22, the buffer module 25 contacts the machine base 1. Since the downward driving mechanism 21 outputs a relatively large force when driving the movable plate 22 downward, directly applying this output force to the aging cover 33 could easily damage the chip due to impact. Therefore, buffer modules 25 are provided on both sides of the movable plate 22, allowing the buffer section of the buffer module 25 to make contact with the machine base 1, thereby absorbing the impact force and preventing excessive instantaneous impact force from being applied to the chip, thus ensuring the safety and stability of the overall pre-pressing operation. In some optional embodiments, the buffer module 25 uses a spring or gas spring to absorb and buffer the kinetic energy of the movable plate 22, preventing excessive instantaneous impact force from being applied to the chip and causing chip damage.

[0052] In the embodiments provided in this application, the movable plate 22 is driven downward by the pressing drive mechanism 21, so that the pressure plate 23 presses against the aging cover 33 of the fixture base 31. The aging cover 33 then pushes the chip held by the chip aging test fixture 32 in the fixture base 31 to pre-press and shape the chip, so that all the chips held by the chip aging test fixture 32 are tightly attached to the fixture base 31. This ensures that the test conditions for each chip are the same during the subsequent testing and aging process, thereby ensuring that the test data is stable and reliable.

[0053] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0054] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0055] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0056] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0057] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0058] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0059] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0060] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A pre-pressure shaping fixture for chip aging, characterized in that, include: The pressing mechanism, mounted on the machine base, includes a pressing drive mechanism and a movable plate. The pressing drive mechanism pushes the movable plate downward, so that the pressure plate located on the bottom surface of the movable plate presses against the fixture structure below. The fixture structure is set on the machine platform and located below the pressing mechanism. It is provided with several fixture bases. The fixture bases are used to place the chip aging test fixtures that clamp and fix the chips. An aging cover is closed on the fixture base. The pressure plate of the pressing mechanism presses down the aging cover to press down and position the chip.

2. The chip pre-pressing and shaping fixture according to claim 1, characterized in that, The fixture base has positioning pins on both sides inside, and the chip aging test fixture and the aging cover have positioning grooves on both sides. The positioning pins are sequentially embedded into the positioning grooves of the chip aging test fixture and the aging cover.

3. The chip pre-pressing and shaping fixture according to claim 1 or 2, characterized in that, The machine base is equipped with a linear motion module, and the fixture structure is located on the moving end of the linear motion module. When the fixture structure moves to the two extreme positions driven by the linear motion module, it is respectively located at the loading / unloading station and the pre-pressing station. The pre-pressing station is below the pressing mechanism, and the loading / unloading station is at the end away from the pressing mechanism.

4. The chip pre-pressing and shaping fixture according to claim 3, characterized in that, The linear motion module includes a linear drive mechanism and a sliding plate. The linear drive mechanism is mounted on the machine base, the sliding plate is connected to the output end of the linear drive mechanism, and the fixture structure is mounted on the sliding plate.

5. The chip pre-pressing and shaping fixture according to claim 4, characterized in that, Several guide rails are arranged in parallel on the machine base, and a slider is mounted on the guide rail. The top surface of the slider is connected to the bottom surface of the sliding plate, and the extension direction of the guide rail is parallel to the direction in which the linear drive mechanism drives the sliding plate to move.

6. The chip pre-aging shaping fixture according to claim 4, characterized in that, Adjustable limiting mechanisms are respectively provided at the two ends of the sliding plate on the machine base at their respective movement limit positions. The adjustable limiting mechanism includes: a fixed base, an adjusting limiting bolt, a locking nut, and a buffer component. The fixed base is provided on the machine base, the adjusting limiting bolt is screwed into the threaded hole on the fixed base, the locking nut is tightened on the adjusting limiting bolt and fits against the side of the fixed plate, and the buffer component is provided on the fixed base and is parallel to the locking nut. The threaded section of the locking nut and the buffer section of the buffer component face towards the sliding plate.

7. The chip pre-pressing and shaping fixture according to claim 4, characterized in that, The machine base is equipped with two sets of photoelectric sensor switches, and the side of the sliding plate is equipped with a sensing plate. The two sets of photoelectric sensor switches are respectively located at the two extreme positions of the sliding plate. When the sliding plate moves to the extreme positions of the two ends, the photoelectric sensor switches are respectively located in the detection area of ​​the corresponding photoelectric sensor switches.

8. The chip pre-pressing and shaping fixture according to claim 1, characterized in that, The pressing mechanism also includes a support frame structure, and the pressing drive mechanism is disposed on the support frame structure. The output end of the pressing drive mechanism passes through the support frame structure and is connected to the movable plate.

9. The chip pre-pressing and shaping fixture according to claim 8, characterized in that, The support frame structure includes: a plurality of support columns and a fixed plate. The plurality of support columns are vertically arranged on the machine platform. The bottom surface of the fixed plate is connected to the top of the support columns. The pressing drive mechanism is arranged on the fixed plate. The output end of the pressing drive mechanism passes through the fixed plate and is connected to the movable plate. The four inner corners of the movable plate are respectively provided with linear bearings, and the linear bearings are sleeved on the support columns.

10. The chip pre-pressing and shaping fixture according to claim 1 or 9, characterized in that, Buffer modules are provided on both sides of the movable plate, with the buffer section of the buffer module facing the machine platform. The buffer module comes into contact with the machine platform during the downward movement of the movable plate.

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