An automatic chip mounter

Abstract

The application relates to an automatic patching machine for patching a wafer on a light device body, which comprises a material placing seat, a wafer station for accommodating the wafer and a patching station for accommodating the light device body; a suction head for sucking the wafer; a driving mechanism comprising a first horizontal moving mechanism for driving the suction head to horizontally move and a first vertical moving mechanism for driving the suction head to vertically move; a correction block arranged on the material placing seat and located between the wafer station and the patching station, and a correction groove is arranged on the correction block; when the suction head carrying the wafer is lowered to the correction groove and horizontally moves, the groove wall of the correction groove is in contact with the wafer, and the wafer is corrected to the center of the suction head. The application does not need to adopt a complicated visual positioning system, and only through the correction block and the correction groove, the correction of the initial position deviation of the wafer is realized, and the manufacturing cost and the maintenance cost of the equipment are greatly reduced.

Description

Technical Field

[0001] This application relates to the field of optical device manufacturing, and more particularly to an automatic chip mounter. Background Technology

[0002] In the manufacturing process of optical devices in fields such as optical communication and lasers, it is necessary to attach glass slides (such as glass cover plates, filters, etc.) to designated positions on the optical device body.

[0003] In automated chip mounting equipment, a suction head is typically used to pick up glass slides. However, when the suction head picks up the glass slide, it is inevitably affected by factors such as feeding accuracy and gripping posture, resulting in an initial positional deviation, meaning that the glass slide is not located at the theoretical center position of the suction head.

[0004] Currently, to ensure final mounting accuracy, the mainstream solution in the industry is to use a vision positioning system for position compensation. This solution uses a camera to capture an image of the slide after the suction head has picked it up, and then uses an image processing algorithm to calculate the positional deviation between the center of the slide and the center of the suction head. This information is then used to control the moving mechanism to compensate for the initial deviation during the subsequent movement path, thus eliminating the impact of the initial deviation.

[0005] However, this vision-based correction system is complex and requires high-resolution cameras, lenses, and processing units, resulting in high equipment costs. Utility Model Content

[0006] The purpose of this application is to provide an automatic chip mounter to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this application provides the following technical solution:

[0008] An automatic chip mounter for mounting glass slides onto an optical device body includes:

[0009] The feeding station is equipped with a glass slide station for accommodating glass slides and a mounting station for accommodating optical device bodies;

[0010] An adsorption head is used to adsorb the glass slide;

[0011] The driving mechanism includes a first horizontal moving mechanism and a first vertical moving mechanism. The first horizontal moving mechanism is used to drive the adsorption head to move horizontally, and the first vertical moving mechanism is used to drive the adsorption head to move vertically.

[0012] A calibration block is disposed on the feeding seat and located between the glass slide station and the mounting station, and a calibration groove is provided on the calibration block;

[0013] When the adsorption head carrying the glass slide descends to the calibration groove and moves horizontally, the wall of the calibration groove contacts the glass slide, calibrating the glass slide to the center of the adsorption head.

[0014] Furthermore, the correction groove is provided with a first slot, and the projection of the first slot in the vertical direction is located within the path range of the horizontal movement of the adsorption head.

[0015] Furthermore, the width of the first groove is greater than the width of the glass slide.

[0016] Furthermore, the correction groove has a second slot on the side facing the first horizontal moving mechanism.

[0017] Furthermore, the correction block is provided with at least one positioning hole, and the feeding seat is provided with a threaded hole corresponding to the positioning hole. The fastener passes through the positioning hole and engages with the threaded hole to fix the correction block to the feeding seat.

[0018] Furthermore, the output end of the first horizontal moving mechanism is connected to a mounting plate, the first vertical moving mechanism is mounted on the mounting plate, and the adsorption head is mounted on the output end of the first vertical moving mechanism.

[0019] Furthermore, it also includes a dispensing mechanism, which is mounted side by side with the first vertical moving mechanism on the mounting plate;

[0020] The dispensing mechanism includes a nozzle and a second vertical moving mechanism, with the nozzle mounted on the output end of the second vertical moving mechanism.

[0021] Furthermore, the slide station is provided with a first placement plate, which has a plurality of rectangularly arranged first positioning grooves;

[0022] The mounting station is provided with a second placement plate, which has multiple rectangularly arranged second positioning slots.

[0023] Furthermore, along the driving direction perpendicular to the first horizontal moving mechanism, a pick-up and put-down gap is formed between two adjacent second positioning slots.

[0024] Furthermore, it also includes a second horizontal moving mechanism, wherein the material feeding seat is installed at the output end of the second horizontal moving mechanism;

[0025] The first horizontal moving mechanism is mounted above the second horizontal moving mechanism, and the driving direction of the first horizontal moving mechanism is perpendicular to the direction of the second horizontal moving mechanism.

[0026] The technical solutions provided in this application have the following advantages compared with the prior art:

[0027] The automatic chip mounter provided in this application embodiment has a feeding station for placing glass slides and a mounting station for placing optical device bodies, respectively. During operation, a first vertical moving mechanism drives the suction head to move vertically downwards to pick up the glass slide. After the suction head picks up the glass slide, the first vertical moving mechanism drives the suction head to move vertically upwards, followed by a first horizontal moving mechanism driving the suction head to move horizontally. When it reaches above the calibration groove, the first vertical moving mechanism drives the suction head to move vertically downwards into the calibration groove. Then, the first horizontal moving mechanism drives the suction head to move horizontally, causing the side of the glass slide on the suction head to contact the groove wall. Utilizing the blocking and guiding effect of the groove wall, the glass slide is calibrated to the center position of the suction head.

[0028] This application eliminates the need for a complex visual positioning system for position compensation, simplifying the system structure and reducing equipment costs. At the same time, it can effectively correct glass slides with initial positional deviations, ensuring subsequent mounting accuracy. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0032] Figure 1 This is a schematic diagram of the structure of the automatic chip mounter provided in the embodiments of this application.

[0033] Figure 2 for Figure 1 A magnified view of a portion of the image.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100. Slide mounting station; 200. Mounting station;

[0036] 1. Feeding seat;

[0037] 2. Adsorption head;

[0038] 3. Drive mechanism; 31. First horizontal moving mechanism; 32. First vertical moving mechanism;

[0039] 4. Correction block; 41. Correction groove; 411. First groove; 412. Second groove; 42. Positioning hole;

[0040] 5. Mounting plate;

[0041] 6. Dispensing mechanism; 61. Dispensing nozzle; 62. Second vertical moving mechanism; 63. Dispensing cartridge;

[0042] 7. First placement plate; 71. First positioning groove;

[0043] 8. Second placement plate; 81. Second positioning groove; 82. Picking and placing gap;

[0044] 9. Second horizontal moving mechanism. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0046] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0047] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0048] Figures 1 to 2 An automatic chip mounter provided in this application embodiment is used to mount glass slides onto an optical device body. It includes a feeding base 1, an adsorption head 2, a driving mechanism 3, and a calibration block 4. The feeding base 1 has a glass slide station 100 for holding glass slides and a mounting station 200 for holding the optical device body. The adsorption head 2 is used to adsorb the glass slides. The driving mechanism 3 includes a first horizontal moving mechanism 31 and a first vertical moving mechanism 32. The first horizontal moving mechanism 31 drives the adsorption head 2 to move horizontally, and the first vertical moving mechanism 32 drives the adsorption head 2 to move vertically. The calibration block 4 is disposed on the feeding base 1 and located between the glass slide station 100 and the mounting station 200. The calibration block 4 has a calibration groove 41.

[0049] When the adsorption head 2 carrying the glass slide descends to the calibration groove 41 and moves horizontally, the groove wall of the calibration groove 41 contacts the glass slide, calibrating the glass slide to the center of the adsorption head 2.

[0050] Specifically, when the automatic chip mounter starts working, it is in the initial state. The glass slide to be mounted is placed on the glass slide station 100 of the feeding seat 1, and the optical device body is placed on the mounting station 200.

[0051] Driven by the first vertical moving mechanism 32, the adsorption head 2 moves downwards, approaching the glass slide on the slide station 100, and uses adsorption force to pick up the glass slide. At this time, due to factors such as feeding accuracy and gripping posture, the glass slide may not be located at the theoretical center position of the adsorption head, and there is an initial position deviation.

[0052] Subsequently, the first horizontal moving mechanism 31 drives the adsorption head 2 (carrying the glass slide) to move horizontally towards the calibration block located between the glass slide station 100 and the mounting station 200. When the adsorption head 2 moves above the calibration groove 41, the first vertical moving mechanism 32 drives the adsorption head 2 to descend, allowing the glass slide to enter the calibration groove 41. At this time, the first horizontal moving mechanism 31 continues to drive the adsorption head 2 to move horizontally, so that the side of the glass slide contacts the groove wall of the calibration groove 41. As the adsorption head 2 continues to move, the groove wall exerts a force on the glass slide, which guides the glass slide to gradually move, eventually calibrating the glass slide to the center position of the adsorption head 2, eliminating the initial positional deviation.

[0053] After the calibration is completed, the first horizontal moving mechanism and the first vertical moving mechanism work together again to drive the adsorption head 2 (carrying the calibrated glass slide) to move above the mounting station 200. Then the adsorption head 2 descends and accurately mounts the glass slide onto the designated position on the optical device body, completing one mounting operation.

[0054] Compared to traditional position compensation solutions based on vision positioning systems, this automated pick and place machine eliminates the need for complex and expensive equipment such as high-resolution cameras, lenses, and processing units. It achieves initial positional deviation correction of the slides using only a simple mechanical structure—the correction block 4 and its correction groove 41—significantly reducing manufacturing and maintenance costs.

[0055] Please refer to Figure 2 In a preferred embodiment, to ensure that the adsorption head 2 can accurately enter the calibration groove 41, the calibration groove 41 is provided with a first groove 411, the projection of the first groove 411 in the vertical direction being located within the path range of the horizontal movement of the adsorption head 2.

[0056] Since the projection of the first slot 411 falls within the path range, the adsorption head 2 will inevitably pass above the corresponding position of the first slot 411 during its horizontal movement. After the adsorption head 2 moves directly above the first slot 411, the first vertical moving mechanism 32 drives the adsorption head 2 to descend, allowing it to carry the slide through the first slot 411 and into the calibration groove 41. Once inside the calibration groove 41, as the adsorption head 2 continues to move horizontally, the groove wall of the calibration groove 41 will come into contact with the slide. Because the adsorption head 2 is restricted and guided by the groove wall of the calibration groove 41 during its horizontal movement, the slide will gradually be corrected to the center position of the adsorption head 2, thereby achieving slide position correction.

[0057] Specifically, the width of the first slot 411 is greater than the width of the glass slide. Because the first slot 411 is wider than the glass slide, the glass slide can pass through the first slot 411 and enter the calibration groove 41 without obstruction during the descent of the adsorption head 2. Even if there is a slight positional deviation of the adsorption head 2 in the horizontal direction, the larger width of the first slot 411 ensures that the glass slide enters smoothly and will not collide with the calibration block 4 due to an excessively narrow slot, thus preventing damage to the glass slide or jamming of the adsorption head 2.

[0058] In one embodiment, there is a precision requirement for the glass slide in the left and right directions on the adsorption head 2 (achieved by the groove wall of the first groove 411), but no precision requirement in other directions. Therefore, in order to avoid interference, the correction groove 41 is provided with a second groove 412 on the side facing the first horizontal moving mechanism 31.

[0059] Please refer to Figure 2 The correction block 4 is provided with at least one positioning hole 42, and the feeding seat 1 is provided with a threaded hole (not shown in the figure) corresponding to the positioning hole 42. The fastener passes through the positioning hole 42 and engages with the threaded hole to fix the correction block 4 to the feeding seat 1.

[0060] The corresponding design of the positioning hole 42 and the threaded hole provides a positioning reference for the installation of the correction block 4. During installation, the operator only needs to align the positioning hole 42 with the threaded hole and then install the fastener, without the need for complex adjustments and measurements, which greatly improves the installation accuracy.

[0061] When the alignment block 4 is damaged, worn, or needs to be replaced according to different production requirements, this fastener-connected fixing method makes the disassembly and replacement process very simple. Operators only need to loosen the fasteners to easily remove the alignment block 4 from the feed seat 1, then install the new alignment block 4 and retighten the fasteners, which greatly shortens the time for equipment maintenance and parts replacement, improves production efficiency, and reduces production costs.

[0062] In a preferred embodiment, the output end of the first horizontal moving mechanism 31 is connected to a mounting plate 5, the first vertical moving mechanism 32 is mounted on the mounting plate 5, and the suction head 2 is mounted on the output end of the first vertical moving mechanism 32. By mounting the first vertical moving mechanism 32 on the mounting plate 5 at the output end of the first horizontal moving mechanism 31, an integrated design of horizontal and vertical moving functions is achieved. This compact structural layout reduces the footprint of the equipment and improves space utilization.

[0063] Please continue to refer to this. Figure 1 This application also includes a dispensing mechanism 6, which and a first vertical moving mechanism 32 are mounted side by side on the mounting plate 5. The dispensing mechanism 6 includes a nozzle 61 and a second vertical moving mechanism 62, with the nozzle 61 mounted at the output end of the second vertical moving mechanism 62.

[0064] Before the automatic placement machine starts working, the parameters of the dispensing mechanism need to be set according to production requirements, such as the glue flow rate and the dispensing time interval. At the same time, the glue cartridge 63 containing glue is installed into the dispensing mechanism 6, and the nozzle 61 is ensured to be in normal working condition.

[0065] When the first horizontal moving mechanism 31 drives the suction head 2, carrying the calibrated glass slide, to the mounting station 200, the first horizontal moving mechanism 31 drives the dispensing mechanism 6 to move above the optical device body that needs dispensing. Then, the second vertical moving mechanism 62 starts working, driving the nozzle 61 to descend to the appropriate dispensing height. Then, the dispensing mechanism 6 begins dispensing according to preset parameters, accurately applying the adhesive to the designated position on the optical device body. After dispensing is completed, the second vertical moving mechanism 62 drives the nozzle to rise back to its initial position.

[0066] The first vertical moving mechanism 32 drives the adsorption head 2 to descend, accurately attaching the glass slide to the optical device body that has already been coated with adhesive. After attachment, the adsorption head 2 rises, completing one attachment operation. The equipment can then continue to cycle through the next glass slide picking, alignment, adhesive dispensing, and attachment operation.

[0067] Please continue to refer to this. Figure 2 The slide station 100 is provided with a first placement plate 7, which has a plurality of rectangular first positioning grooves 71. The mounting station 200 is provided with a second placement plate 8, which has a plurality of rectangular second positioning grooves 81.

[0068] The arrangement of multiple rectangular first positioning slots 71 and second positioning slots 81 enables the automatic placement machine to process multiple glass slides and optical device bodies simultaneously, achieving mass production. Multiple products can be mounted in a single operation cycle, significantly shortening production time and improving efficiency. For example, if 20 first positioning slots 71 are set on a first placement plate 7 and 20 second positioning slots 81 are set on a second placement plate 8, then 20 products can be mounted simultaneously in one operation, resulting in a significant improvement in efficiency compared to single-piece production.

[0069] Furthermore, the first positioning groove 71 and the second positioning groove 81 enable rapid and accurate positioning of the glass slide and the optical device body.

[0070] Specifically, along the driving direction perpendicular to the first horizontal moving mechanism 31, a pick-up and put-down gap 82 is formed between two adjacent second positioning slots 81.

[0071] When the optical device body is placed into the second positioning slot 81, the pick-and-place gap 82 provides sufficient operating space for the operating tools (such as robotic arms, manual tweezers, etc.). Operators or automated equipment can place the optical device body into the second positioning slot 81 more accurately, reducing placement deviations caused by the limited space, ensuring that the optical device body can accurately fall into the second positioning slot 81, and achieving precise positioning.

[0072] After the mounting is completed, when it is necessary to remove the mounted product from the second placement plate 8, the pick-and-place gap 82 also plays an important role. It allows the operating tool to smoothly extend into the vicinity of the second positioning groove 81, accurately grip or absorb the product, and avoid damage to the product during the removal process.

[0073] Please continue to refer to this. Figure 1 This application also includes a second horizontal moving mechanism 9, a feeding seat 1 installed at the output end of the second horizontal moving mechanism 9, a first horizontal moving mechanism 31 mounted above the second horizontal moving mechanism 9, and the driving direction of the first horizontal moving mechanism 31 is perpendicular to the direction of the second horizontal moving mechanism 9.

[0074] The combination of the first horizontal moving mechanism 31 and the second horizontal moving mechanism 9 expands the placement range of the automatic placement machine. The first horizontal moving mechanism 31 can cover a certain distance in its driving direction (X direction), and the second horizontal moving mechanism 9 can also cover a certain distance in its driving direction (Y direction). The two work together to expand the working range of the suction head 2, enabling it to cover a larger placement area and meet the production needs of different sizes and layouts.

[0075] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0076] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0077] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0078] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0079] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0080] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0081] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0082] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An automatic chip mounter for mounting glass slides onto the body of an optical device, characterized in that, include: The feeding station is equipped with a glass slide station for accommodating glass slides and a mounting station for accommodating optical device bodies; An adsorption head is used to adsorb the glass slide; The driving mechanism includes a first horizontal moving mechanism and a first vertical moving mechanism. The first horizontal moving mechanism is used to drive the adsorption head to move horizontally, and the first vertical moving mechanism is used to drive the adsorption head to move vertically. A calibration block is disposed on the feeding seat and located between the glass slide station and the mounting station, and a calibration groove is provided on the calibration block; When the adsorption head carrying the glass slide descends to the calibration groove and moves horizontally, the wall of the calibration groove contacts the glass slide, calibrating the glass slide to the center of the adsorption head.

2. The automatic pick-and-place machine of claim 1, wherein, The calibration groove is provided with a first slot, and the projection of the first slot in the vertical direction is located within the path range of the horizontal movement of the adsorption head.

3. The automatic pick-and-place machine of claim 2, wherein, The width of the first slot is greater than the width of the glass slide.

4. The automatic pick-and-place machine of claim 2, wherein, The correction groove has a second opening on the side facing the first horizontal moving mechanism.

5. The automatic pick-and-place machine of claim 1, wherein, The correction block is provided with at least one positioning hole, and the feeding seat is provided with a threaded hole corresponding to the positioning hole. The fastener passes through the positioning hole and engages with the threaded hole to fix the correction block to the feeding seat.

6. The automatic pick and place machine of claim 1, wherein, The output end of the first horizontal moving mechanism is connected to a mounting plate, the first vertical moving mechanism is mounted on the mounting plate, and the suction head is mounted on the output end of the first vertical moving mechanism.

7. The automatic pick-and-place machine of claim 6, wherein, It also includes a dispensing mechanism, which is mounted side by side with the first vertical moving mechanism on the mounting plate; The dispensing mechanism includes a nozzle and a second vertical moving mechanism, with the nozzle mounted on the output end of the second vertical moving mechanism.

8. The automatic pick and place machine of claim 1, wherein, The glass slide station is provided with a first placement plate, and the first placement plate is provided with a plurality of rectangularly arranged first positioning grooves; The mounting station is provided with a second placement plate, which has multiple rectangularly arranged second positioning slots.

9. The automatic pick-and-place machine of claim 8, wherein, Along the driving direction perpendicular to the first horizontal moving mechanism, a pick-up and put-down gap is formed between two adjacent second positioning slots.

10. The automatic pick and place machine of claim 1, wherein, It also includes a second horizontal moving mechanism, wherein the material feeding seat is installed at the output end of the second horizontal moving mechanism; The first horizontal moving mechanism is mounted above the second horizontal moving mechanism, and the driving direction of the first horizontal moving mechanism is perpendicular to the direction of the second horizontal moving mechanism.

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