A projector light engine and heat dissipation mechanism thereof
Patent Information
- Application Number
- CN202521593457.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-29
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-07-29
AI Technical Summary
[0004]上述公开的专利技术,尽管减小了投影仪整体体积,但是投影机光机的壳体部件较为琐碎,为多层嵌套组装结构,例如:壳体由散热顶壳、中壳、底壳组装而成,三层精密拼合组成,其结构复杂,不利于组装,无法实现大批量生产
一方面,本实用新型匀光整形部与分色合光部共用同一个光学腔体壳,光学腔体壳的表面装配激光壳盖,成像腔体壳与光学腔体壳装配固定,彼此之间实现直接装配,无需复杂的嵌套式装配,结构简单,利于组装,能够实现大批量生产;
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Figure CN224773315U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of projection equipment technology, and in particular to a projector optical engine and a projection maintenance structure. Background Technology
[0002] The projector optical engine is the core component of a laser projector, used to focus, reflect, and modulate the light generated by the laser source, ultimately projecting a clear image onto the screen. During this complex optical transmission and processing, the projector optical engine contains optical reflection components, focusing components, and modulation / demodulation components. A significant amount of heat is generated within the projector optical engine's casing. To address this issue, various heat dissipation components need to be incorporated inside the projector optical engine to effectively dissipate this heat. This results in a large and complex projector optical engine architecture, posing a significant challenge to the projector optical engine's casing: the casing structure cannot be too intricate, otherwise assembly will be difficult, while simultaneously meeting the heat dissipation requirements of the projector optical engine.
[0003] Existing patent technology, Chinese utility model patent, authorization announcement number: CN222914021U, discloses a closed-loop optical engine and projector with multi-channel high-efficiency heat dissipation. The closed-loop optical engine includes: an optical engine housing, an internal circulation fan unit, a heat dissipation module, and an external circulation fan unit; a first heat dissipation duct is located on the first side of the LCD screen, and a second heat dissipation duct is located on the second side of the LCD screen; the first end of the first heat dissipation duct, the second heat exchange cavity, the middle heat exchange cavity, the first heat exchange cavity, and the second end of the first heat dissipation duct are sequentially connected to form a horizontal circulation heat dissipation channel; the first end of the second heat dissipation duct, the middle heat exchange cavity, the first vent, the second accommodating cavity, the second vent, and the second end of the second heat dissipation duct are sequentially connected to form a vertical circulation heat dissipation channel. Through the design of the heat dissipation channels, the positions of each fan and the heat sink, and their mutual cooperation, the heat dissipation of the closed-loop optical engine is completed, which not only improves the heat dissipation efficiency of the projector and reduces the overall power consumption and size of the projector, but also ensures that the projector can operate safely and stably.
[0004] Although the aforementioned patented technologies reduce the overall size of the projector, the projector's optical engine housing components are quite fragmented, consisting of a multi-layered nested assembly structure. For example, the housing is assembled from a heat dissipation top shell, a middle shell, and a bottom shell, forming a complex three-layered structure that is difficult to assemble and cannot be mass-produced. Utility Model Content
[0005] To address the problems existing in the prior art, this utility model provides a projector optical engine and its heat dissipation mechanism. With this projector optical engine and its heat dissipation mechanism, on the one hand, the light homogenizing and shaping part and the color separation and combining part of this utility model share the same optical cavity shell. The surface of the optical cavity shell is equipped with a laser shell cover. The imaging cavity shell is assembled and fixed with the optical cavity shell, and direct assembly is achieved between them. There is no need for complex nested assembly. The structure is simple, easy to assemble, and can achieve mass production. On the other hand, the laser source unit of this utility model is assembled on both sides of the end of the optical cavity shell. The optical cavity shell is provided with a first hollow groove at the position corresponding to the laser source unit to ensure that the laser beam is emitted without being affected by structural interference. In addition, a DMD control board is assembled on one side of the imaging cavity shell. A DMD chip is welded to the side of the DMD control board near the imaging cavity shell. A second hollow groove is provided on the side of the imaging cavity shell near the DMD control board. The DMD chip is accommodated in the second hollow groove, which further simplifies the overall shell structure and volume of the projector optical engine. Furthermore, the end surface of the optical cavity shell of this invention is fixedly fitted with a first heat dissipation fin, a second heat dissipation fin is fitted on the side of the DMD control board away from the imaging cavity shell, and a conductive heat dissipation structure is provided at the end of the laser source unit away from the optical cavity shell, which can achieve high-temperature conductive heat dissipation for the optical cavity shell, DMD control board, and laser source unit. To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: This utility model proposes a projector optical engine, including a laser light source unit, a light homogenizing and shaping unit, a color separation and combining unit, and an imaging unit. The light homogenizing and shaping unit and the color separation and combining unit share the same optical cavity shell. The laser light source unit is assembled on both ends of the optical cavity shell. The optical cavity shell has a first hollowed-out groove at the position corresponding to the laser light source unit for laser beam emission. A laser shell cover is assembled on the surface of the optical cavity shell, and the surface of the laser shell cover is provided with several metal protrusions. The imaging unit is assembled with an imaging cavity shell, and the imaging cavity shell is assembled and fixed to the optical cavity shell. A DMD control board is assembled on one side surface of the imaging cavity shell. A DMD chip is welded to the side of the DMD control board near the imaging cavity shell. A second hollowed-out groove is formed on the side of the imaging cavity shell near the DMD control board, and the DMD chip is accommodated in the second hollowed-out groove.
[0006] To solve its technical problem, the further technical solution adopted by this utility model is as follows: Optionally, the above-mentioned projector optical engine further includes a projection unit, which includes an imaging front cover, a lens mount, and a projection lens. The imaging front cover is respectively assembled and fixed to the lens mount and the imaging cavity shell, and the lens mount is also assembled and fixed to the projection lens. Further optionally, in the above-mentioned projector optical engine, the imaging front cover, lens mount and projection lens are all provided with beam through holes, and the centers of the beam through holes are all located on the same axis.
[0007] Further optionally, in the above-mentioned projector optical engine, when the imaging front cover is assembled and fixed with the imaging cavity shell, the imaging front cover does not protrude from the outer surface of the imaging cavity shell.
[0008] Optionally, in the above-mentioned projector optical engine, the laser source unit includes a laser body, a laser mount, and a laser PCBA board. The laser mount has a mounting slot corresponding to the laser body. The laser PCBA board is mounted on the side of the laser mount near the optical cavity shell. The laser body is mounted on the inner edge of the mounting slot. The pins of the laser body are soldered and fixed to the pads of the laser PCBA board.
[0009] Alternatively, in the aforementioned projector optical engine, a connector is soldered and fixed to the side of the laser PCBA board away from the laser mount.
[0010] This utility model also proposes a heat dissipation mechanism, which is disposed on the outer surface of the projector optical engine in any of the above-mentioned solutions, and the surface of the laser housing cover is provided with a plurality of metal protrusions.
[0011] To solve its technical problem, the further technical solution adopted by this utility model is as follows: Optionally, in the above-mentioned heat dissipation mechanism, a first heat dissipation fin is fixedly mounted on the end surface of the optical cavity shell, and a second heat dissipation fin is mounted on the side of the DMD control board away from the imaging cavity shell, wherein the first heat dissipation fin and the second heat dissipation fin are orthogonally arranged in space.
[0012] Optionally, in the above-mentioned heat dissipation mechanism, a conductive heat dissipation structure is provided at the end of the laser source unit away from the optical cavity shell. The conductive heat dissipation structure includes a cold copper plate, a first thermal pad, a TEC cooling chip, a second thermal pad, a TEC limiting seat, and a laser holder, which are assembled and connected by long-headed bolts.
[0013] Further optionally, in the above-mentioned heat dissipation mechanism, the cold copper plate, the first thermal pad, the TEC cooling chip, the second thermal pad, and the laser body are sequentially surface-mounted and connected, and the TEC limiting seat is provided with a clearance hole, which accommodates the first thermal pad, the TEC cooling chip, and the second thermal pad.
[0014] Compared with the prior art, the present invention has the following technical effects: On the one hand, the light-uniform shaping part and the color-separating and light-combining part of this utility model share the same optical cavity shell. The surface of the optical cavity shell is equipped with a laser shell cover. The imaging cavity shell and the optical cavity shell are assembled and fixed together, and direct assembly is achieved between them. There is no need for complex nested assembly. The structure is simple, easy to assemble, and can achieve mass production. On the other hand, the laser source unit of this utility model is assembled on both sides of the end of the optical cavity shell. The optical cavity shell is provided with a first hollow groove at the position corresponding to the laser source unit to ensure that the laser beam is emitted without being affected by structural interference. In addition, a DMD control board is assembled on one side of the imaging cavity shell. A DMD chip is welded to the side of the DMD control board near the imaging cavity shell. A second hollow groove is provided on the side of the imaging cavity shell near the DMD control board. The DMD chip is accommodated in the second hollow groove, which further simplifies the overall shell structure and volume of the projector optical engine. In addition, the end surface of the optical cavity shell of this utility model is fixedly equipped with a first heat dissipation fin, the side of the DMD control board away from the imaging cavity shell is equipped with a second heat dissipation fin, and the end of the laser source part away from the optical cavity shell is provided with a conductive heat dissipation structure, which can achieve the high temperature conductive heat dissipation effect of the optical cavity shell, the DMD control board and the laser source part.
[0015] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0016] Figure 1 This is one of the structural schematic diagrams of the projector optical engine according to an embodiment of this utility model; Figure 2 This is the second schematic diagram of the projector optical engine according to an embodiment of the present invention; Figure 3 This is the third schematic diagram of the projector optical engine according to an embodiment of this utility model; Figure 4 This is the fourth schematic diagram of the projector optical engine according to an embodiment of this utility model; Figure 5 This is an exploded three-dimensional structural diagram of the projection part according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the assembly structure of the DMD control board, the second heat sink fins, and the DMD chip according to an embodiment of the present invention. Figure 7 This is one of the exploded three-dimensional structural diagrams of the conductive heat dissipation structure according to an embodiment of this utility model; Figure 8 This is the second exploded three-dimensional structural diagram of the conductive heat dissipation structure according to an embodiment of this utility model; Figure 9 This is one of the three-dimensional structural assembly diagrams of the conductive heat dissipation structure according to an embodiment of this utility model; Figure 10 This is the second three-dimensional structural assembly diagram of the conductive heat dissipation structure according to an embodiment of this utility model; The parts in the attached diagram are labeled as follows: Optical cavity shell 1, first hollow groove 11, laser shell cover 12, metal protrusion 121, first heat dissipation fin 13, imaging cavity shell 2, second hollow groove 21, DMD control board 3, DMD chip 31, projection part 4, imaging front cover 41, lens mount 42, projection lens 43, beam through hole 44, laser body 5, laser mount 6, mounting slot 61, laser PCBA board 7, connector 71, second heat dissipation fin 8, conductive heat dissipation structure 9, long head bolt 91, cold copper plate 92, first thermal pad 93, TEC cooling chip 94, second thermal pad 95, TEC limit seat 96 and clearance hole 961. Detailed Implementation
[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0018] Example 1 like Figures 1 to 4 and Figure 6 As shown in the embodiment, a projector optical engine includes a laser light source, a light homogenizing and shaping section, a color separation and combining section, and an imaging section (all not shown in the figure). The light homogenizing and shaping section and the color separation and combining section share the same optical cavity shell 1. The laser light source is mounted on both ends of the optical cavity shell 1. The optical cavity shell 1 has a first hollowed-out groove 11 at the position corresponding to the laser light source for laser beam emission. A laser shell cover 12 is mounted on the surface of the optical cavity shell 1. The surface of the laser shell cover 12 is provided with a plurality of metal protrusions 121. The imaging section is mounted on an imaging cavity shell 2. The imaging cavity shell 2 is fixedly mounted to the optical cavity shell 1. A DMD control board 3 is mounted on one side of the imaging cavity shell 2. A DMD chip 31 is welded to the side of the DMD control board 3 near the imaging cavity shell 2. A second hollowed-out groove 21 is opened on the side of the imaging cavity shell 2 near the DMD control board 3. The DMD chip 31 is accommodated in the second hollowed-out groove 21. On the one hand, in this embodiment, the light homogenizing and shaping part and the color separation and combining part share the same optical cavity shell. The surface of the optical cavity shell is equipped with a laser shell cover. The imaging cavity shell and the optical cavity shell are assembled and fixed together, and direct assembly is achieved between them. There is no need for complex nested assembly. The structure is simple, easy to assemble, and can achieve mass production. On the other hand, in this embodiment, the laser light source is mounted on both sides of the end of the optical cavity shell. The optical cavity shell has a first hollowed-out groove at the position corresponding to the laser light source to ensure that the laser beam is emitted without being affected by structural interference. In addition, a DMD control board is mounted on one side of the imaging cavity shell. A DMD chip is welded to the side of the DMD control board near the imaging cavity shell. A second hollowed-out groove is opened on the side of the imaging cavity shell near the DMD control board. The DMD chip is accommodated in the second hollowed-out groove, which further simplifies the overall shell structure and volume of the projector optical engine.
[0019] In the above embodiments, optionally, as shown... Figure 5 As shown, it also includes a projection unit 4, which includes an imaging front cover 41, a lens mount 42 and a projection lens 43. The imaging front cover 41 is assembled and fixed to the lens mount 42 and the imaging cavity shell 2 respectively. The lens mount 42 is also assembled and fixed to the projection lens 43. Here, "assembly and fixing" refers to screw assembly and fixing connection. In this embodiment, the imaging front cover, lens mount, and projection lens are assembled and fixed together to ensure the overall structural stability of the projection unit.
[0020] In the above embodiments, such as Figure 5 As shown, optionally, both the imaging front cover 41 and the lens mount 42 are provided with beam through holes 44, and the beam through holes 44 and the projection lens 43 are located on the same optical path; In this embodiment, both the imaging front cover and the lens mount have beam apertures. The beam apertures and the projection lens are located on the same optical path, ensuring that the imaging light source is emitted smoothly without interference.
[0021] In the above embodiments, more optionally, such as Figure 1 , Figure 3 and Figure 5 As shown, when the imaging front cover 41 is assembled and fixed with the imaging cavity shell 2, the imaging front cover 41 does not protrude from the outer surface of the imaging cavity shell 2. In this embodiment, the imaging front cover is assembled and fixed with the imaging cavity shell, and the imaging front cover does not protrude from the outer surface of the imaging cavity shell. This design further increases and expands the external space of the projector optical engine, avoids structural interference, and improves the overall aesthetics of the projector optical engine.
[0022] In the above embodiments, optionally, as shown... Figures 7 to 10As shown, the laser source unit includes a laser body 5, a laser holder 6, and a laser PCBA board 7. The laser holder 6 has a mounting slot 61 corresponding to the laser body 5. The laser PCBA board 7 is mounted on the side of the laser holder 6 near the optical cavity shell 1. The laser body 5 is mounted on the inner edge of the mounting slot 61. The pins of the laser body 5 are soldered and fixed to the pads of the laser PCBA board 7. In this embodiment, the laser holder has mounting slots corresponding to the laser body. The laser body is fixedly mounted on the inner edge of the mounting slots of the laser holder, and the pins of the laser body are soldered and fixed to the pads of the laser PCBA board. On the one hand, this ensures the relative structural stability between the laser body and the laser PCBA board. On the other hand, the laser source unit is compactly designed on both sides of the end of the optical cavity shell. The mounting slots corresponding to the laser body ensure normal laser emission while making the overall structure of the laser source unit more compact and space-saving.
[0023] In the above embodiments, more optionally, such as Figures 7 to 10 As shown, a connector 71 is welded and fixed on the side of the laser PCBA board 7 away from the laser base 6. In this embodiment, a connector required for the expansion function is provided. On the one hand, it ensures the stable transmission of drive current and modulation signal. On the other hand, the operating current of high-power laser modules (such as blue lasers) can reach more than 10A. The connector can carry the high current transmission between the power board and the laser PCBA board, reducing energy loss.
[0024] Example 2 like Figures 1 to 3 As shown, in an embodiment, a heat dissipation mechanism is disposed on the outer surface of the projector optical engine of any of the embodiments 1, and the surface of the laser housing 12 is provided with a plurality of metal protrusions 121; In this embodiment, the heat dissipation structure is set on the outer surface of the projector optical engine, which can conduct heat dissipation of the projector optical engine, reduce the thermal load of the projector optical engine, improve the working environment of the projector optical engine, and improve working efficiency.
[0025] In the above embodiments, optionally, as shown... Figures 1 to 3 As shown, a first heat dissipation fin 13 is fixedly mounted on the end surface of the optical cavity shell 1, and a second heat dissipation fin 8 is mounted on the side of the DMD control board 3 away from the imaging cavity shell 2. The first heat dissipation fin 13 and the second heat dissipation fin 8 are orthogonally arranged in space. In this embodiment, the first heat dissipation fins rapidly conduct heat to the optical cavity shell, and the second heat dissipation fins rapidly conduct heat to the DMD control board. Overall, this ensures the heat dissipation requirements of the projector's optical engine. In particular, with the heat dissipation of the DMD control board guaranteed, the working efficiency of the projector's optical engine can be significantly improved.
[0026] In the above embodiments, optionally, as shown... Figure 7 and Figure 8 As shown, a conductive heat dissipation structure 9 is provided at the end of the laser source unit away from the optical cavity shell 1. The conductive heat dissipation structure 9 includes a cold copper plate 92, a first thermal pad 93, a TEC cooling chip 94, a second thermal pad 95, a TEC limiting seat 96, and a laser holder 6, which are assembled and connected by long-headed bolts 91. In this embodiment, a conductive heat dissipation structure is provided at the end of the laser source unit away from the optical cavity shell. This structure can quickly conduct and dissipate the heat from the laser source unit, ensuring the working stability of the laser body. Specifically, the heat on the laser body is transferred sequentially by means of a cold copper plate, a first thermal pad, a TEC cooling chip, and a second thermal pad, ultimately conducting the heat from the laser body to the outside of the projector's optical engine, greatly improving the efficiency of conductive heat dissipation. Furthermore, the combination of the cold copper plate, the first thermal pad, the TEC cooling chip, and the second thermal pad enables rapid conductive heat dissipation and cooling, resulting in high heat dissipation efficiency.
[0027] In the above embodiments, optionally, as follows: Figure 7 and Figure 8 As shown, the cold copper plate 92, the first thermal pad 93, the TEC cooling chip 94, the second thermal pad 95 and the laser body 5 are sequentially surface-mounted and connected. The TEC limiting seat 96 has a clearance hole 961, which accommodates the first thermal pad 93, the TEC cooling chip 94 and the second thermal pad 95. In this embodiment, the cold copper plate, the first thermal pad, the TEC cooling chip, the second thermal pad, and the laser body are sequentially surface-mounted and connected, which can increase the conductive contact area, realize conductive heat dissipation, and improve heat dissipation efficiency. The TEC limiting seat has a clearance hole to accommodate the first thermal pad, the TEC cooling chip, and the second thermal pad, thereby improving the compactness of the conductive heat dissipation structure.
[0028] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structure made using the contents of this utility model specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A projector light engine comprising a laser light source section, a light homogenizing and shaping section, a color separation and combination section, and an imaging section, characterized in that: The uniform light shaping part and the color separation and light combining part share the same optical cavity shell (1). The laser light source part is assembled on both sides of the end of the optical cavity shell (1). The optical cavity shell (1) has a first hollow groove (11) at the position corresponding to the laser light source part for laser beam emission. The surface of the optical cavity shell (1) is equipped with a laser shell cover (12). The surface of the laser shell cover (12) is provided with a number of metal protrusions (121). The imaging part is equipped with an imaging cavity shell (2). The imaging cavity shell (2) is assembled and fixed with the optical cavity shell (1). A DMD control board (3) is assembled on one side of the imaging cavity shell (2). A DMD chip (31) is welded on the side of the DMD control board (3) near the imaging cavity shell (2). A second hollow groove (21) is opened on the side of the imaging cavity shell (2) near the DMD control board (3). The DMD chip (31) is accommodated in the second hollow groove (21).
2. The projector of claim 1, wherein: It also includes a projection unit (4), which includes an imaging front cover (41), a lens mount (42) and a projection lens (43). The imaging front cover (41) is assembled and fixed to the lens mount (42) and the imaging cavity shell (2) respectively. The lens mount (42) is also assembled and fixed to the projection lens (43).
3. The projector of claim 2, wherein: Both the imaging front cover (41) and the lens mount (42) are provided with beam through holes (44), and the beam through holes (44) and the projection lens (43) are located on the same optical path.
4. The projector of claim 2, wherein: When the imaging front cover (41) is assembled and fixed with the imaging cavity shell (2), the imaging front cover (41) does not expose the outer surface of the imaging cavity shell (2).
5. The projector of claim 1, wherein: The laser source unit includes a laser body (5), a laser mount (6), and a laser PCBA board (7). The laser mount (6) has a mounting slot (61) corresponding to the laser body (5). The laser PCBA board (7) is mounted on the side of the laser mount (6) near the optical cavity shell (1). The laser body (5) is mounted on the inner edge of the mounting slot (61). The pins of the laser body (5) are welded and fixed to the pads of the laser PCBA board (7).
6. The projector of claim 5, wherein: A connector (71) is welded and fixed on the side of the laser PCBA board (7) away from the laser mount (6).
7. A heat dissipating mechanism characterized by: The laser housing (12) is provided with a plurality of metal protrusions (121) on the outer surface of the projector optical engine as described in any one of claims 1-6.
8. The heat dissipating mechanism according to claim 7, wherein: The end surface of the optical cavity shell (1) is fixedly fitted with a first heat dissipation fin (13), and the side of the DMD control board (3) away from the imaging cavity shell (2) is fitted with a second heat dissipation fin (8). The first heat dissipation fin (13) and the second heat dissipation fin (8) are orthogonally arranged in space.
9. The heat dissipating mechanism of claim 7, wherein: The laser source unit is provided with a conductive heat dissipation structure (9) at one end away from the optical cavity shell (1). The conductive heat dissipation structure (9) includes a cold copper plate (92), a first thermal pad (93), a TEC cooling chip (94), a second thermal pad (95), a TEC limiting seat (96), and a laser holder (6) assembled and connected by long head bolts (91).
10. The heat dissipating mechanism of claim 9, wherein: The cold copper plate (92), the first thermal pad (93), the TEC cooling chip (94), the second thermal pad (95) and the laser body (5) are sequentially surface-mounted and connected. The TEC limiting seat (96) has a clearance hole (961) which accommodates the first thermal pad (93), the TEC cooling chip (94) and the second thermal pad (95).
Citation Information
Patent Citations
Multi-wind-path high-efficiency heat dissipation closed optical machine and projector
CN222914021U