A precise lifting adjusting device for a spin coater wafer

Abstract

This utility model discloses a precision lifting and adjusting device for wafers in a coating and developing machine, including a base, a first cylinder seat fixedly connected to the surface of the base, a lifting cylinder mounted on the surface of the first cylinder seat, a lifting top plate fixedly connected to the top of the piston rod of the lifting cylinder, a lifting side plate fixedly connected to one side of the lifting top plate, a slider fixedly connected to the surface of the lifting side plate, a sliding frame fixedly connected to the surface of the first cylinder seat, and the sliders on both sides slidably connected to the sliding frame; an adjusting mechanism is provided on the back of the lifting side plate, the adjusting mechanism including a mounting groove on the back of the lifting side plate, a cylinder base located in the mounting groove, a push cylinder located on the surface of the cylinder base, a support frame located on the top of the piston rod of the push cylinder, and a steering mechanism on the surface of the support frame.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor lifting technology, and more specifically, it relates to a precision lifting adjustment device for wafers in a coating and developing machine. Background Technology

[0002] In the semiconductor manufacturing process, photoresist coating and developing machines are used for photoresist coating and developing. The wafer is transferred to a vacuum rotary chuck in the process chamber through an upgrade mechanism, and the high-speed rotation of the motor drives the wafer to rotate for various processes.

[0003] Currently, most wafer lifting mechanisms lack adjustment capabilities, and the few adjustable mechanisms can only be adjusted in one direction. This limited adjustment capability makes adjustment operations difficult, and relying solely on their own adjustment functions cannot ensure accurate handover between the wafer lifting mechanism and the clamping device. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a precision lifting and adjusting device for wafers in a coating and developing machine, thereby solving the problems mentioned in the background section.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a precision lifting and adjusting device for wafers in a coating and developing machine, comprising a base, a first cylinder seat fixedly connected to the surface of the base, a lifting cylinder mounted on the surface of the first cylinder seat, a lifting top plate fixedly connected to the top of the piston rod of the lifting cylinder, a lifting side plate fixedly connected to one side of the lifting top plate, a slider fixedly connected to the surface of the lifting side plate, a sliding frame fixedly connected to the surface of the first cylinder seat, and the sliders on both sides slidably connected to the sliding frame; an adjusting mechanism is provided on the back of the lifting side plate, the adjusting mechanism comprising a mounting groove on the back of the lifting side plate, a cylinder base located in the mounting groove, a pushing cylinder located on the surface of the cylinder base, a support frame located on the top of the piston rod of the pushing cylinder, and a steering mechanism on the surface of the support frame.

[0006] Preferably, the steering mechanism includes a pivot seat located at the center of the support frame, a rotating rod rotatably connected within the pivot seat, a wafer placement plate fixedly connected to the top of the rotating rod, a drive rack slidably connected to the surface of the support frame, an electric telescopic rod connected to one end of the drive rack, and a driven gear sleeved on the surface of the rotating rod, wherein the drive rack meshes with the driven gear.

[0007] Preferably, the surface of the lifting top plate is provided with a fixedly connected support column, the top of the support column is fitted with a support spring, the top of the support spring is provided with a buffer plate, and the bottom of the support frame is provided with a buffer pad.

[0008] Preferably, the surface of the support frame is slidably connected to the back of the lifting side plate.

[0009] Preferably, the base surface is provided with a switch assembly, which is controlled and connected to the lifting cylinder, the pushing cylinder, and the electric telescopic rod.

[0010] This utility model provides a precision lifting and adjusting device for wafers in a coating and developing machine, which has the following advantages: This device ensures that wafer products can be precisely and independently adjusted in height and angle during lifting, improving the convenience and operability of adjustment, enhancing the compatibility with the clamping device, and ensuring accurate docking and smooth transfer of wafers.

[0011] The system employs lifting cylinders to control the overall assembly's lifting and lowering, push cylinders to precisely adjust the height of the wafer products, and electric telescopic rods to drive rack and pinion gears to achieve reciprocating rotation of the wafer products for multi-angle adjustment. It is simple to operate, convenient to use, and greatly improves the efficiency of wafer product transfer and docking.

[0012] The combination of support springs, buffer plates, and buffer pads reduces impact and prevents shaking during the lifting and lowering of the support frame, ensuring the stability of wafer product transportation and improving the efficiency of wafer product transfer and docking. Attached Figure Description

[0013] Figure 1 This is a front structural diagram of the present invention.

[0014] Figure 2 This is a schematic diagram of the overall structure of this utility model.

[0015] Figure 3 This is a schematic diagram of the overall structure of this utility model.

[0016] In the diagram, 1. Base; 2. First cylinder seat; 3. Lifting cylinder; 4. Lifting top plate; 5. Lifting side plate; 6. Slider; 7. Sliding frame; 8. Support column; 9. Support spring; 10. Buffer plate; 11. Buffer pad; 12. Adjustment mechanism; 1201. Mounting slot; 1202. Cylinder base; 1203. Push cylinder; 1204. Bearing frame; 13. Steering mechanism; 1301. Rotary shaft seat; 1302. Rotating rod; 1303. Wafer placement board; 1304. Drive rack; 1305. Electric telescopic rod; 1306. Driven gear; 14. Switch assembly. Detailed Implementation

[0017] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0018] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] Please see Figures 1 to 3 This utility model provides a technical solution: a precision lifting and adjusting device for wafers in a coating and developing machine, comprising a base 1, a first cylinder seat 2 fixedly connected to the surface of the base 1, a lifting cylinder 3 mounted on the surface of the first cylinder seat 2, a lifting top plate 4 fixedly connected to the top of the piston rod of the lifting cylinder 3, a lifting side plate 5 fixedly connected to one side of the lifting top plate 4, a slider 6 fixedly connected to the surface of the lifting side plate 5, a sliding frame 7 fixedly connected to the surface of the first cylinder seat 2, and sliders 6 on both sides slidably connected to the sliding frame 7. A support column 8 fixedly connected to the surface of the lifting top plate 4, a support spring 9 sleeved on the top of the support column 8, a buffer plate 10 on the top of the support spring 9, and a buffer pad 11 at the bottom of the support frame 1204.

[0021] An adjustment mechanism 12 is provided on the back of the lifting side plate 5. The adjustment mechanism 12 includes a mounting groove 1201 located on the back of the lifting side plate 5, a cylinder base 1202 located in the mounting groove 1201, a push cylinder 1203 located on the surface of the cylinder base 1202, and a support frame 1204 located on the top of the piston rod of the push cylinder 1203. A steering mechanism 13 is also provided on the surface of the support frame 1204. The surface of the support frame 1204 is slidably connected to the back of the lifting side plate 5.

[0022] The steering mechanism 13 includes a pivot seat 1301 located at the center of the support frame 1204, a rotating rod 1302 rotatably connected within the pivot seat 1301, a wafer placement plate 1303 fixedly connected to the top of the rotating rod 1302, a drive rack 1304 slidably connected to the surface of the support frame 1204, an electric telescopic rod 1305 driven to one end of the drive rack 1304, and a driven gear 1306 sleeved on the surface of the rotating rod 1302. The drive rack 1304 and the driven gear 1306 are meshed together.

[0023] The base 1 has a switch assembly 14 on its surface, which is connected to the lifting cylinder 3, the pushing cylinder 1203, and the electric telescopic rod 1305.

[0024] The specific usage and function of this embodiment: First, the wafer product is placed on the wafer placement plate 1303. Then, the lifting cylinder 3 below drives the lifting top and lifting side plate 5 to move up and down, thereby realizing the up and down movement of the adjustment mechanism 12 fixedly connected to the lifting side plate 5 on one side and the wafer placement plate 5. This can ensure the lifting requirements of a large height range. After reaching the approximate height of the clamping device on one side, the height position can be precisely controlled and adjusted by the adjustment mechanism 12: By pushing the cylinder 1203, the bearing frame 1204 at the top of the piston rod moves up and down, within a small range of height. The wafer placement plate 1303 is adjustable to ensure that it can be precisely aligned with the clamping device on one side, maintaining the same height. At the same time, the electric telescopic rod 1304 on the surface of the support frame 1204 can drive the drive rack 1304 to move back and forth, thereby realizing the forward and reverse rotation of the driven gear 1305 that meshes with it, and adjusting the angle of the wafer placement plate 1303. This facilitates precise alignment with the clamping device on one side. The multi-dimensional adjustable wafer lifting mechanism can achieve independent adjustment in multiple dimensions, improving the convenience and operability of adjustment, enhancing the fit with the clamping device, and ensuring accurate docking and smooth transfer of the wafer.

[0025] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A precise lifting adjustment device for a wafer of a gumming and developing machine, comprising a base (1), characterized in that: The base (1) has a first cylinder seat (2) fixedly connected to its surface. A lifting cylinder (3) is installed on the surface of the first cylinder seat (2). A lifting top plate (4) is fixedly connected to the top of the piston rod of the lifting cylinder (3). A lifting side plate (5) is fixedly connected to one side of the lifting top plate (4). A slider (6) is fixedly connected to the surface of the lifting side plate (5). A sliding frame (7) is fixedly connected to the surface of the first cylinder seat (2). The sliders (6) on both sides are slidably connected to the sliding frame (7). An adjustment mechanism (12) is provided on the back of the lifting side plate (5). The adjustment mechanism (12) includes an installation groove (1201) on the back of the lifting side plate (5), a cylinder base (1202) in the installation groove (1201), a push cylinder (1203) on the surface of the cylinder base (1202), and a support frame (1204) on the top of the piston rod of the push cylinder (1203). A steering mechanism (13) is also provided on the surface of the support frame (1204).

2. The precision lifting and adjusting device for wafers in a coating and developing machine according to claim 1, characterized in that: The steering mechanism (13) includes a rotating shaft seat (1301) located at the center of the support frame (1204), a rotating rod (1302) rotatably connected within the rotating shaft seat (1301), a wafer placement plate (1303) fixedly connected to the top of the rotating rod (1302), a drive rack (1304) slidably connected to the surface of the support frame (1204), an electric telescopic rod (1305) rotatably connected to one end of the drive rack (1304), and a driven gear (1306) sleeved on the surface of the rotating rod (1302). The drive rack (1304) and the driven gear (1306) are meshed together.

3. The precise lifting adjustment device for wafer in the coating and developing machine according to claim 1, wherein: The lifting top plate (4) is provided with a fixedly connected support column (8), the top of the support column (8) is fitted with a support spring (9), the top of the support spring (9) is provided with a buffer plate (10), and the bottom of the support frame (1204) is provided with a buffer pad (11).

4. The precise lifting adjustment device for wafer in the coating and developing machine according to claim 1, wherein: The surface of the support frame (1204) is slidably connected to the back of the lifting side plate (5).

5. The precise lifting adjustment device for wafer in the coating and developing machine according to claim 1, wherein: The base (1) is provided with a switch group (14) on its surface. The switch group (14) is connected to the lifting cylinder (3), the pushing cylinder (1203), and the electric telescopic rod (1305) for control.

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