Wafer vacuum deaeration device

Abstract

The utility model provides a kind of wafer vacuum pumping bubble removing device, it is related to the field of semiconductor manufacturing, including base module, sealing cover plate module and vacuum control module;Base module includes a plate body, the top surface of this plate body is equipped with the sunken circular work bin for supporting wafer, the bottom surface of work bin is provided with multiple upper convex support cushion block for supporting wafer, plate body side is equipped with vacuum pumping hole, to form suction passage in the bottom of work bin;Outer edge is processed with annular sealing groove, for placing sealing ring;Sealing cover plate module includes a transparent cover plate, the cover plate is rotatably connected with the side of base module by hinge assembly, its size can cover work bin;Vacuum control module includes vacuum hose and vacuum control valve, one end of vacuum hose is connected with vacuum pumping hole, the other end is used for connecting external vacuum source;The utility model can carry out fast, efficient vacuum pumping processing, to improve product yield, while simple structure, convenient operation, low in cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a wafer vacuum degassing device for removing bubbles from the surface of a wafer after coating. Background Technology

[0002] In semiconductor wafer manufacturing, photoresist coating is a critical step. Manual coating remains widely used in small-batch production, research, and specialized processes due to its high flexibility and low cost. However, manual operation easily introduces air into the photoresist, forming microbubbles. If these bubbles remain in the photoresist layer, they will cause pattern defects such as pinholes and broken lines in subsequent exposure and development processes, severely affecting the electrical performance of the product and reducing production yield. Currently, the conventional method for removing coating bubbles is to use large vacuum drying ovens or integrated vacuum chambers. While these devices are effective, they have significant drawbacks, including high purchase costs, large footprint, complex operation procedures, and long processing cycles (including vacuuming, pressure holding, and vacuum breaking stages). This is too inefficient for single-wafer or small-batch wafer processing requiring rapid turnover, making it impossible to integrate into specific workstations on the production line and creating a bottleneck in production efficiency.

[0003] Therefore, there is an urgent need in this field for a degassing device that is simple in structure, easy to operate, low in cost, and can process bubbles online in real time. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a wafer vacuum degassing device. This device can quickly and efficiently vacuum the surface of wafers after manual coating, thereby improving product yield. At the same time, it has the advantages of simple structure, convenient operation and low cost.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a wafer vacuum degassing device, characterized in that it includes a base module, a sealing cover module, and a vacuum control module; The base module includes a plate with at least one sunken circular work chamber on its top surface for holding wafers. Multiple raised support pads for supporting the wafers are provided on the bottom surface of the work chamber. A vacuum hole is provided on the side of the plate, extending inward and communicating with the bottom area of ​​the sunken circular work chamber to form a vacuum channel at the bottom of the work chamber. An annular sealing groove is machined along the outer edge of the sunken circular work chamber for placing a sealing ring. The sealing cover module includes a transparent cover plate, which is rotatably connected to one side of the base module via a hinge assembly. Its size is sufficient to cover the sunken circular work chamber. The vacuum control module includes a vacuum hose and a vacuum control valve. One end of the vacuum hose is connected to the vacuum hole, and the other end is used to connect to an external vacuum source. The vacuum control valve is connected in series in the vacuum hose passage to control the opening and closing of the vacuum passage.

[0006] Furthermore, the bottom surface of the working chamber is machined with multiple auxiliary grooves, which are distributed in a circular array on the outer edge of the working chamber.

[0007] Furthermore, the auxiliary groove has a circular cross-section, with its outer edge extending to the outside of the working chamber and close to the inside of the sealing ring.

[0008] Furthermore, the device also includes a safety interlock mechanism, which includes a position sensor disposed on the base module and the sealing cover module. The position sensor is electrically connected to the vacuum control valve and is used to cut off the power supply to the vacuum control valve when the transparent cover is detected to be not in a closed state.

[0009] Furthermore, the position sensor is a magnetic switch or a physical limit switch.

[0010] Furthermore, the vacuum control valve is a solenoid valve located on the vacuum hose passage, which is controlled by a foot switch; the safety interlock mechanism is connected in series in the circuit between the foot switch and the solenoid valve.

[0011] Furthermore, the plate is made of aluminum, the transparent cover is made of tempered glass, and the cover is equipped with a handle.

[0012] Furthermore, the hinge assembly includes a fixed page and a movable page that are hinged to each other via a hinge axis. The fixed page is fixed to the outside of the base module, and the movable page is connected to the cover plate via a clamping assembly.

[0013] Furthermore, the cover plate is located between the movable page and the clamping assembly. The clamping assembly includes a threaded rod fixed to the movable page and a first baffle, a clamping spring, a second baffle, and a clamping nut movably sleeved on the threaded rod. The cover plate has a through hole for the threaded rod to pass through. The first baffle, the clamping spring, the second baffle, and the clamping nut are located sequentially on the outside of the cover plate. The clamping nut is threadedly connected to the threaded rod. Under the action of the clamping spring, the cover plate is clamped onto the movable page by the first baffle and can float axially along the threaded rod under the action of external force.

[0014] Furthermore, multiple convex support pads are provided and are spaced apart at the geometric center near the bottom surface of the working chamber.

[0015] The beneficial effects of this utility model are: 1. This utility model, through its base module, sealing cover module, and vacuum control module, especially the sunken circular working chamber for holding wafers and the quick-sealing cover within the base module, allows for vacuuming of the working chamber using an external vacuum source after the cover is closed. This efficiently and thoroughly removes air bubbles from the adhesive layer, fundamentally improving the problem of poor electrical properties in the product. The hinge assembly opening and closing design, combined with foot switch control, enables smooth operation of "one-handed placement, foot-triggered, and immediate processing," with a single processing time controllable within 30 seconds, greatly improving production cycle time. The overall structure is simple, mainly composed of aluminum plates, glass plates, and standard parts (hinges, valves), with manufacturing costs far lower than large vacuum equipment, facilitating widespread adoption across multiple production lines or workstations. Furthermore, the use of tempered glass as the cover not only safely withstands negative pressure but also allows operators to directly observe the wafer status and vacuuming process, facilitating process monitoring and quality control.

[0016] 2. By further setting auxiliary grooves at specific positions, this utility model can facilitate the operator to pick up and put down wafers in the working chamber, and can also help to quickly remove air bubbles at the edge of the wafers, solving the problem that air bubbles at the edge of the wafers are not easy to eliminate, thus helping to improve product quality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall three-dimensional structure of an embodiment of the present utility model; Figure 2 This is a top view of the base module according to an embodiment of the present invention; Figure 3 This is a cross-sectional view of the base module according to an embodiment of the present invention; Figure 4 This is a side view of an embodiment of the present invention. Figure 5 for Figure 4 A magnified view of a portion of the image.

[0018] Explanation of annotations in the image: 1. Base module; 11. Recessed working chamber; 111. Auxiliary groove; 112. Raised support pad; 12. Annular sealing groove; 121. Sealing ring; 13. Vacuum hole; 2. Sealing cover module; 21. Cover plate; 22. Handle; 3. Vacuum control module; 31. Vacuum hose; 32. Foot switch; 4. Position sensor; 5. Hinge assembly; 51. Fixed page; 52. Moving page; 6. Clamping assembly; 61. Threaded rod; 62. First baffle; 63. Clamping spring; 64. Second baffle; 65. Clamping nut. Detailed Implementation

[0019] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0020] like Figures 1 to 5 As shown, the wafer vacuum degassing device of this embodiment consists of three parts: a base module 1, a sealing cover module 2, and a vacuum control module 3.

[0021] The base module 1 is made of an aluminum plate 200mm long, 400mm wide, and 10mm thick. Its top surface has two recessed circular work chambers 11, each 180mm in diameter and 7mm deep, for holding 8-inch wafers. Three raised support pads 112 are provided on the bottom surface of each work chamber 11 to support the wafers and prevent surface damage from direct hard contact between the wafers and the aluminum plate during vacuuming. On one side of the aluminum plate, two 6mm diameter vacuum holes 13 are drilled, corresponding to the two work chambers 11 respectively. These holes are machined horizontally inward until they connect with the center area of ​​the bottom surface of each work chamber 11, forming a vacuum channel at the bottom of the work chamber. An additional hole is provided on one side of the aluminum plate to allow vacuum communication between the two work chambers 11. On the outer edge of each work chamber 11, a 0.3mm deep and 2.5mm wide annular sealing groove 12 is precision milled, and a 2.5mm diameter O-ring silicone sealing ring 121 is embedded within the groove.

[0022] The sealing cover module 2 uses a tempered glass plate 250mm long, 450mm wide, and 5mm thick as the cover plate 21. The cover plate 21 is connected to one long side of the base module 1 via a hinge assembly 5. A stainless steel handle 22 is installed at the center of the other long side of the cover plate 21. Specifically, the hinge assembly 5 includes a fixed leaf 51 and a movable leaf 52 hinged to each other via a hinge shaft. The fixed leaf 51 is fixed to the outside of the base module, and the movable leaf 52 is connected to the cover plate 21 via a clamping assembly 6. The hinge assembly 5 allows the cover plate 21 to open and close relative to the base module 1.

[0023] The vacuum control module 3 includes a vacuum hose 31 and a foot switch 32. One end of the vacuum hose 31 is tightly connected to the vacuum port 13 of the base, and the other end is connected to the factory's centralized vacuum pipeline (providing a vacuum level of approximately -0.07 MPa). A normally closed solenoid valve (not shown separately in the figure, but a common component in the art) is connected in series in the passage of the vacuum hose 31. The electrical control terminal of this solenoid valve is connected to the foot switch 32. When the foot is pressed down on the foot switch 32, the solenoid valve opens, initiating vacuuming; when the foot is released, the solenoid valve closes, and the vacuum is released.

[0024] The working process of this utility model is as follows: After the operator manually applies adhesive to the wafer, they hold the wafer by its edge and place it into the work chamber 11 of the base, positioning it on the raised support pad 112. They then close the tempered glass cover 21, pressing it against the sealing ring to form a seal. Next, they press the foot switch 32, initiating a vacuum process. Observing through the glass cover 21, after approximately 10-15 seconds, the adhesive bubbles should have largely disappeared. Releasing the foot switch 32 releases the vacuum, and the handle 22 opens the cover, allowing the processed wafer to proceed to the next step.

[0025] In one embodiment of this utility model, the cover plate 21 is located between the movable page 52 and the clamping assembly 6 (see...). Figure 4 , Figure 5 The clamping assembly 6 includes a threaded rod 61 fixed to the movable page 52, and a first baffle 62, a clamping spring 63, a second baffle 64, and a clamping nut 65 movably sleeved on the threaded rod 61. The cover plate 21 has a through hole for the threaded rod 61 to pass through. The first baffle 62, the clamping spring 63, the second baffle 64, and the clamping nut (65) are located on the outside of the cover plate 21 in sequence. The clamping nut 65 is threadedly connected to the threaded rod 61. Under the action of the clamping spring 63, the cover plate 21 is clamped to the movable page 52 by the first baffle 62. Specifically, the cover plate 21 is clamped to the sealing ring 121 (the movable page 52 is set slightly lower than the sealing ring 121) to ensure the sealing of the working chamber (11) so as to facilitate subsequent vacuuming. That is, the cover plate 21 can be quickly sealed by covering it. Furthermore, the cover plate 21 can float slightly along the axial direction of the threaded rod 61 under the action of external force, providing a certain amount of movement for the cover plate 21 to open smoothly.

[0026] In a preferred embodiment of this utility model, the bottom surface of the working chamber 11 is machined with a plurality of auxiliary grooves 111 (see...). Figures 1-3The auxiliary grooves 111 are arranged in a ring array on the outer edge of the working chamber 11. Since the position of the auxiliary grooves 111 corresponds to the outer edge of the vacuum-evacuated wafer, it can significantly improve the evacuation efficiency of the outer edge area of ​​the working chamber (i.e., the wafer edge) during the vacuuming process, ensuring a more uniform vacuum level under the entire wafer, thereby quickly and thoroughly removing edge bubbles. Furthermore, the auxiliary grooves 111 have a circular cross-section, with their outer edge extending to the outside of the working chamber 11 and close to the inside of the sealing ring. In addition to helping remove wafer edge bubbles, their function is to provide space for the operator's fingers when holding the wafer by its outer edge and placing it into the working chamber 11, facilitating the smooth and stable placement of the wafer on the convex support pad 112.

[0027] In a preferred embodiment of this utility model, the device further includes a safety interlock mechanism, which includes a position sensor 4 disposed on the base module 1 and the sealing cover module 2 (see...). Figure 2 The position sensor 4 can be a magnetic switch or a physical limit switch. The position sensor 4 is electrically connected to the vacuum control valve and is used to cut off the power supply to the vacuum control valve when the transparent cover 21 is not in a closed state. This can effectively prevent the vacuuming operation from being performed before the cover is in contact with the sealing ring, thus ensuring good safety.

[0028] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A wafer vacuum deaeration apparatus, comprising: It includes a base module (1), a sealing cover module (2), and a vacuum control module (3); The base module (1) includes a plate. The top surface of the plate is provided with at least one sunken circular work chamber (11) for holding wafers. The bottom surface of the work chamber (11) is provided with an upwardly protruding support pad (112) for supporting wafers. The side of the plate is provided with a vacuum hole (13). The vacuum hole extends inward and communicates with the bottom area of ​​the sunken circular work chamber (11) to form an air extraction channel at the bottom of the work chamber. An annular sealing groove (12) is machined on the outer edge of the sunken circular work chamber (11) for placing a seal. The sealing cover module (2) includes a transparent cover (21), which is rotatably connected to one side of the base module (1) via a hinge assembly (5), and its size can cover the sunken circular working chamber (11); the vacuum control module (3) includes a vacuum hose (31) and a vacuum control valve. One end of the vacuum hose (31) is connected to the vacuum hole (13), and the other end is used to connect to an external vacuum source; the vacuum control valve is connected in series in the passage of the vacuum hose (31) and is used to control the opening and closing of the vacuum passage.

2. The wafer vacuum debubblmg apparatus of claim 1 wherein: The bottom surface of the working chamber (11) is machined with a plurality of auxiliary grooves (111), which are arranged in a ring array at the outer edge of the working chamber (11).

3. The wafer vacuum debubblmg apparatus of claim 2 wherein: The auxiliary groove (111) has a circular cross-section, and its outer edge extends to the outside of the working chamber (11) and close to the inside of the sealing ring (7).

4. The wafer vacuum debubblmg apparatus of claim 1 wherein: The device also includes a safety interlock mechanism, which includes a position sensor (4) disposed on the base module (1) and the sealing cover module (2). The position sensor (4) is electrically connected to the vacuum control valve and is used to cut off the power supply to the vacuum control valve when the transparent cover (21) is detected to be not in a closed state.

5. The wafer vacuum debubblmg apparatus of claim 4 wherein: The position sensor (4) is a magnetic switch or a physical limit switch.

6. The wafer vacuum degassing and bubble removal device according to claim 4, characterized in that: The vacuum control valve is a solenoid valve located in the passage of the vacuum hose (31), which is controlled by a foot switch (32); the safety interlock mechanism is connected in series in the circuit between the foot switch (32) and the solenoid valve.

7. The wafer vacuum debubblmg apparatus of claim 1 wherein: The plate is made of aluminum, and the transparent cover (21) is made of tempered glass. The cover is provided with a handle (22).

8. The wafer vacuum debubblmg apparatus of claim 1 wherein: The hinge assembly (5) includes a fixed page (51) and a movable page (52) that are hinged to each other via a hinge shaft. The fixed page (51) is fixed to the outside of the base module, and the movable page (52) is connected to the cover plate (21) via a clamping assembly (6).

9. The wafer vacuum debubblmg apparatus of claim 8 wherein: The cover plate (21) is located between the movable page (52) and the clamping assembly (6). The clamping assembly (6) includes a threaded rod (61) fixed to the movable page (52) and a first baffle (62), a clamping spring (63), a second baffle (64), and a clamping nut (65) movably sleeved on the threaded rod (61). The cover plate (21) has a through hole for the threaded rod (61) to pass through. The first baffle (62), the clamping spring (63), the second baffle (64), and the clamping nut (65) are located on the outside of the cover plate (21) in sequence. The clamping nut (65) is threadedly connected to the threaded rod (61). Under the action of the clamping spring (63), the cover plate (21) is clamped to the movable page (52) by the first baffle (62) and can float along the axial direction of the threaded rod (61) under the action of external force.

10. The wafer vacuum debubblmg apparatus of claim 1 wherein: Multiple convex support pads (112) are provided and are spaced apart at the geometric center near the bottom surface of the working chamber (11).

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