A single piece liquid jet rotary scraping developer

Abstract

This invention discloses a single-wafer spray-and-scrape developing device, relating to the field of wafer developer processing technology. The invention includes a wafer support assembly and a spray-and-scrape assembly. The injection pipe of the spray-and-scrape assembly is connected to a scraper plate via a rotating beam. A set of nozzles is located at the bottom of the injection pipe. The wafer support assembly carries and rotates the wafer. This invention uses the wafer support assembly to carry and rotate the wafer. First, the array of nozzles on the injection pipe sprays developer onto the rotating wafer surface for initial coverage. Then, the rotating beam plate is driven to rotate, switching the scraper plate above the wafer. The scraper plate scrapes and homogenizes the developer on the wafer surface during continuous rotation, thereby achieving forced and uniform coating of the developer across the entire wafer surface while significantly reducing developer usage. This effectively solves the contradiction between uneven coverage and reagent waste in traditional spray-and-scrape methods.

Description

Technical Field

[0001] This utility model belongs to the field of wafer developer processing technology, and in particular relates to a single-wafer spraying and swirl developing device. Background Technology

[0002] In the photolithography process of semiconductor manufacturing, development is a crucial step in forming precise circuit patterns. As chip integration continues to increase, the requirements for the uniformity and consistency of pattern lines are becoming increasingly stringent. Although traditional batch immersion development methods are highly efficient, they cannot guarantee completely consistent development conditions for each wafer or even different areas of the wafer, resulting in inconsistent line quality and large dispersion of finished product parameters. Therefore, the industry is turning to single-wafer processing equipment. Currently, the mainstream single-wafer development methods mostly use point-drop or spray methods, but they face a dilemma: if the spray volume is too small, the developer cannot evenly cover the wafer edge due to surface tension, easily leading to the quality defect of "not developing the edge"; if the spray volume is increased to ensure coverage, although it can improve uniformity, it significantly increases the consumption of expensive chemical reagents and brings more severe waste liquid treatment and environmental pressure. Existing technologies lack a single-wafer development solution that can balance reagent conservation and high-quality uniform coating.

[0003] To address these issues, we provide a single-piece spray-on spin-scraping developing device. Utility Model Content

[0004] The purpose of this invention is to provide a single-wafer spraying and scraping developing device. A liquid injection pipe is installed above a wafer support assembly. A set of nozzles is arrayed along the length of the liquid injection pipe on its lower end face. The wafer to be immersed is placed on the wafer support assembly. The liquid injection pipe is moved to the upper end face of the wafer. The wafer on the wafer support assembly is rotated, and simultaneously, the nozzles spray developing solution onto the upper end face of the wafer, resulting in multi-point spraying of developing solution onto the wafer. A rotating beam plate is installed on one side wall of the liquid injection pipe, and a scraper plate is installed at one end of the rotating beam plate. Rotating the rotating beam plate moves the scraper plate above the wafer. The wafer on the wafer support assembly continues to rotate, allowing the scraper plate to evenly coat the developing solution onto the wafer.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model is a single-piece spray-and-scrape developing device, including a film support assembly and a spray-and-scrape assembly. The spray-and-scrape assembly includes an injection tube and a scraper. A rotating beam plate is fixedly mounted on the middle section of one side of the injection tube. A plate seat is fixedly mounted on the end of the rotating beam plate away from the injection tube. The scraper plate is vertically fixedly mounted on the lower end face of the plate seat. A set of nozzles is arranged in an array along the length of the injection tube on the lower end face of the injection tube. The film support assembly is located below the injection tube.

[0006] A further feature of this invention is that a motor bracket is provided on one side of the rotating beam plate, a switching motor is installed at one end of the motor bracket, and the output end of the switching motor is fixedly installed in the middle section of the upper end face of the rotating beam plate.

[0007] A further feature of this invention is that the two ends of the injection tube are respectively slidably sleeved with end caps, the upper surface of the lower side plate of the end cap is attached to the lower end surface of the nozzle, and a side-top screw is rotatably provided on the end face of each end of the injection tube. The side-top screw is threaded through the vertical end plate of the end cap, and the end of the side-top screw away from the injection tube is fixedly connected to the output end of the motor.

[0008] A further feature of this invention is that a set of scraping teeth are fixedly arranged on the lower end face of the scraper along the length direction of the scraper.

[0009] A further feature of this invention is that the tray assembly includes a tray tray disk and a rotary motor. A set of support rods is vertically fixed in a circumferential array on the lower end face of the tray tray disk. An upper top disk is fixed on the lower end face of the set of support rods. A bushing is vertically fixed on the center of the lower end face of the upper top disk. A drive shaft is fixedly sleeved on the upper output shaft of the rotary motor. A drive key is fixed in a circumferential array on the outer side wall of the drive shaft. A set of keyways is opened in a circumferential array on the inner side wall of the bushing. The drive shaft is vertically slidably sleeved in the bushing.

[0010] A further feature of this invention is that a support ring is fitted on the outer side of the bushing, and a set of ball bearing seats is fixedly arranged in a circumferential array on the upper end face of the support ring. A hemispherical groove is opened on the upper end face of the ball bearing seat, and a ball is rolled and embedded in the hemispherical groove on the upper end face of the ball bearing seat. A ball ring groove is opened on the lower end face of the upper top plate, and each ball is embedded in the ball ring groove. An upper top plate is fixedly installed on both sides of the support ring, and a telescopic motor is installed on both sides of the rotary motor. The upper telescopic ends of the two telescopic motors are fixedly connected to the lower end faces of the upper top plates on both sides.

[0011] A further feature of this invention is that a lifting sleeve is fixedly provided on the lower end face of the support plate, with the upper and lower ends of the lifting sleeve passing through it. A lifting cylinder is vertically slidably sleeved inside the lifting sleeve, and a rubber gasket is fixedly installed on the upper closed end of the lifting cylinder.

[0012] This utility model has the following beneficial effects: This invention integrates the injection tube and its array of nozzles with a scraper that can rotate above the wafer. First, the nozzles are used to initially spray the rotating wafer, and then the scraper is switched to scrape the wafer surface. This can force the liquid to be evenly spread across the entire wafer surface while significantly reducing the amount of developer used, effectively solving the contradiction between uneven coverage and reagent waste in traditional drop-spraying methods.

[0013] This invention achieves an automated process from positioning and spraying to coating uniformity by rotating the wafer in a wafer support assembly and performing spraying and coating in a coordinated manner in a spraying assembly. This provides a highly controllable and uniform developer treatment environment for a single wafer, fundamentally improving the quality consistency of the developed lines. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of a single-piece spray-on developing device.

[0016] Figure 2 This is a schematic diagram of the liquid spraying treatment component.

[0017] Figure 3 This is a schematic diagram of the injection tube and the end cap.

[0018] Figure 4 This is a side sectional view of the tray assembly.

[0019] Figure 5 This is an exploded view of the tray assembly.

[0020] Figure 6 This is an exploded view of the tray and the lifting cylinder.

[0021] The attached diagram lists the components represented by each number as follows: 1-Support plate assembly, 101-Support plate disc, 101a-Support rod, 101b-Upper top plate, 101b-1-Shaft sleeve, 101b-2-Ball ring groove, 101c-Support ring, 101c-1-Ball seat, 101c-2-Ball, 101c-3-Upper top plate, 101c-4-Telescopic motor, 101d-Lifting sleeve, 101d-1-Lifting cylinder, 101d-2-Rubber pad, 102-Rotary motor, 102a-Drive shaft, 2-Spray treatment assembly, 201-Injection pipe, 201a-Rotating beam plate, 201b-Plate base, 201c-Spray head, 201d-Motor bracket, 201d-1-Switching motor, 201e-End cap sleeve, 201f-Side top screw, 202-Scraper blade, 202a-Scraper teeth. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model. Example

[0023] Please see Figures 1 to 6 This utility model relates to a single-piece spray-and-scrape developing device, comprising a film support assembly 1 and a spray-and-processing assembly 2. The spray-and-processing assembly 2 includes an injection pipe 201 and a scraper 202. A rotating beam plate 201a is fixedly mounted on the middle section of one side of the injection pipe 201. A plate base 201b is fixedly mounted on the end of the rotating beam plate 201a away from the injection pipe 201. The scraper 202 is vertically fixedly mounted on the lower end face of the plate base 201b. A set of nozzles 201c are arrayed along the length of the injection pipe 201 on the lower end face of the injection pipe 201. The film support assembly 1 is disposed on the injection pipe 201. Below 01; the wafer is supported and rotated by the wafer support assembly 1. First, the array nozzles 201c on the injection tube 201 spray developer onto the surface of the rotating wafer for initial coverage. Then, the rotating beam plate 201a is driven to rotate, and the scraper plate 202 is switched to the top of the wafer. The scraper plate 202 is used to scrape and homogenize the developer on the surface of the wafer during continuous rotation. This achieves forced and uniform coating of developer on the entire wafer surface while significantly reducing the amount of developer used, effectively solving the contradiction of uneven coverage and reagent waste in traditional spraying methods.

[0024] Specifically, a motor bracket 201d is provided on one side of the rotating beam plate 201a, and a switching motor 201d-1 is installed at one end of the motor bracket 201d. The output end of the switching motor 201d-1 is fixedly installed in the middle section of the upper end face of the rotating beam plate 201a. The switching motor 201d-1 provides rotational driving power for the rotating beam plate 201a, and can reliably and quickly switch between the spraying position and the scraping position, realizing the automated conversion between the two working modes of spraying and scraping, and ensuring the continuity and control accuracy of the process flow.

[0025] Furthermore, a set of scraping teeth 202a are fixedly arranged on the lower end face of the scraper 202 along the length direction of the scraper 202; the scraping teeth 202a can penetrate deep into the liquid film, and more effectively break the surface tension of the developer and guide its flow during the scraping process, which significantly enhances the ability to spread the liquid from the center area of ​​the wafer to the edge, thereby ensuring the uniformity and consistency of the coating on the entire wafer surface, especially the edge area.

[0026] Furthermore, end caps 201e are slidably sleeved at both ends of the injection tube 201. The upper surface of the lower side plate of the end cap 201e is attached to the lower end surface of the nozzle 201c. A side-mounted screw 201f is rotatably installed on each end face of the injection tube 201. The side-mounted screw 201f is threaded through the vertical end plate of the end cap 201e. The end of the side-mounted screw 201f away from the injection tube 201 is fixedly connected to the output end of the motor. This structure allows the position of the end caps 201e at both ends to be adjusted by driving the side-mounted screw 201f, thereby precisely controlling the effective nozzle array length 201c that actually participates in the spraying, so as to match it with the size of wafers of different diameters, avoiding the developer from being sprayed outside the wafer, realizing precise control of reagent dosage and reducing contamination.

[0027] Furthermore, the wafer tray assembly 1 includes a wafer tray 101 and a rotary motor 102. A set of support rods 101a are vertically fixed in a circumferential array on the lower end face of the wafer tray 101. An upper top plate 101b is fixed in a circumferential array on the lower end face of the set of support rods 101a. A bushing 101b-1 is vertically fixed in a center on the lower end face of the upper top plate 101b. A drive shaft 102a is fixedly sleeved on the upper output shaft of the rotary motor 102. A drive key is fixed in a circumferential array on the outer side wall of the drive shaft 102a. A set of keyways is opened in a circumferential array on the inner side wall of the bushing 101b-1. The drive shaft 102a is vertically slidably sleeved in the bushing 101b-1. The cooperation of the key and the slot ensures that the power of the rotary motor 102 can be stably transmitted to the wafer tray 101, driving the wafer to rotate at high speed. At the same time, it allows the wafer tray 101 to move up and down in the vertical direction without affecting the power transmission, providing the necessary vertical freedom of movement for the loading, processing and unloading of wafers.

[0028] Furthermore, a support ring 101c is fitted on the outer side of the bushing 101b-1. A set of ball bearing seats 101c-1 is circumferentially fixed on the upper end face of the support ring 101c-1. A hemispherical groove is formed on the upper end face of the ball bearing seat 101c-1, and a ball 101c-2 is rolled and fitted in the hemispherical groove on the upper end face of the ball bearing seat 101c-1. A ball ring groove 101b-2 is formed on the lower end face of the upper top plate 101b, and each ball 101c-2 is fitted in the ball ring groove 101b-2. Upper top plates 101c-3 are fixed on both sides of the support ring 101c. A telescopic motor 101c-4 is provided on each side of the rotary motor 102. The upper telescopic ends of the two telescopic motors 101c-4 are fixedly connected to the lower end face of the upper top plate 101c-3 on both sides. Through the synchronous action of the telescopic motors 101c-4 on both sides, the support ring 101c and the upper top plate 101b supported by the ball bearings 101c-2 are driven to rise and fall smoothly as a whole, thereby driving the wafer tray 101 and the wafer to reach the precise process height. The ball bearing structure converts sliding friction into rolling friction, ensuring that the lifting process is smooth, stable and with minimal resistance.

[0029] Furthermore, a lifting sleeve 101d is fixedly provided on the lower end face of the wafer tray 101, with the upper and lower ends of the lifting sleeve 101d passing through it. A lifting cylinder 101d-1 is vertically slidably sleeved inside the lifting sleeve 101d, and a rubber gasket 101d-2 is fixedly installed on the upper closed end of the lifting cylinder 101d-1. When loading wafers, the lifting cylinder 101d-1 can rise and use the rubber gasket 101d-2 on the top to contact and lift the wafer from below, achieving stable support. During processing, the lifting cylinder 101d-1 descends, allowing the wafer to fall smoothly onto the surface of the wafer tray 101 for rotation. This design realizes non-clamping, damage-free automatic loading and unloading of wafers.

[0030] The operation process in this embodiment is as follows: First, an external robotic arm transfers the wafers to be developed to the tray 101. The lifting cylinder 101d-1 rises and catches the wafers via the rubber pad 101d-2. Then, the telescopic motor 101c-4 drives the support ring 101c to rise, raising the entire wafer assembly 1 to the working height. Simultaneously, the lifting cylinder 101d-1 descends, placing the wafers stably on the surface of the tray 101. The rotary motor 102 starts, driving the tray 101 and wafers to rotate at high speed via the keyway between the drive shaft 102a and the bushing 101b-1. Next, the switching motor 201d-1 drives the rotating beam 201a to rotate, causing the injection tube 201... The nozzle array 201c moves to directly above the wafer, and the position of the end cap 201e is adjusted according to the wafer size to match the spray width. The injection tube 201 sprays a layer of developer evenly onto the rotating wafer surface. After spraying, the switching motor 201d-1 operates again, rotating the scraper 202 above the wafer. The scraper teeth 202a at its lower end contact the liquid film on the wafer surface. Under the continuous rotation of the wafer, the scraper 202 scrapes and evenly spreads the developer onto the entire wafer surface. After processing, the wafer support assembly 1 descends, and the lifting cylinder 101d-1 rises to lift the wafer, which is then removed by the robotic arm, completing the single-wafer developing and coating operation.

[0031] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A single piece liquid jet scribe and develop apparatus comprising a carrier sheet assembly (1) and a liquid jet processing assembly (2) characterised in that: The liquid spraying assembly (2) includes an injection pipe (201) and a scraper (202). A rotating beam plate (201a) is fixedly provided on the middle section of one side of the injection pipe (201). A plate seat (201b) is fixedly provided at the end of the rotating beam plate (201a) away from the injection pipe (201). The scraper (202) is vertically fixedly installed on the lower end face of the plate seat (201b). A set of nozzles (201c) are arranged in an array along the length direction of the injection pipe (201) on the lower end face of the injection pipe (201). The support plate assembly (1) is located below the injection pipe (201).

2. A single-piece liquid jet and scribe reveal device according to claim 1, wherein: A motor bracket (201d) is provided on one side of the rotating beam plate (201a), and a switching motor (201d-1) is installed at one end of the motor bracket (201d). The output end of the switching motor (201d-1) is fixedly installed in the middle section of the upper end face of the rotating beam plate (201a).

3. A single-piece liquid jet and scribe reveal device according to claim 2, wherein: Both ends of the injection tube (201) are slidably sleeved with end caps (201e). The upper surface of the lower side plate of the end cap (201e) is attached to the lower end surface of the nozzle (201c). A side-top screw (201f) is rotatably installed on both end faces of the injection tube (201). The side-top screw (201f) is threaded through the vertical end plate of the end cap (201e). The end of the side-top screw (201f) away from the injection tube (201) is fixedly connected to the output end of the motor.

4. A single-piece liquid jet and scribe reveal device according to claim 3, wherein: A set of scraping teeth (202a) is fixedly arranged on the lower end face of the scraper (202) along the length direction of the scraper (202).

5. A single-piece liquid jet and scribe reveal device according to claim 1, wherein: The tray assembly (1) includes a tray tray disk (101) and a rotary motor (102). A set of support rods (101a) is vertically fixed in a circumferential array on the lower end face of the tray tray disk (101). An upper top plate (101b) is fixed in a circumferential array on the lower end face of the set of support rods (101a). A bushing (101b-1) is vertically fixed in a center on the lower end face of the upper top plate (101b). A drive shaft (102a) is fixedly sleeved on the upper output shaft of the rotary motor (102). A drive key is fixed in a circumferential array on the outer side wall of the drive shaft (102a). A set of keyways is opened in a circumferential array on the inner side wall of the bushing (101b-1). The drive shaft (102a) is vertically slidably sleeved in the bushing (101b-1).

6. A single-piece liquid jet and doctor blade developing device according to claim 5, characterized in that: The bushing (101b-1) is fitted with a support ring (101c) on its outer side. A set of ball bearing seats (101c-1) is fixedly arranged in a circumferential array on the upper end face of the support ring (101c). A hemispherical groove is formed on the upper end face of the ball bearing seat (101c-1), and a ball (101c-2) is rolled and embedded in the hemispherical groove on the upper end face of the ball bearing seat (101c-1). A ball ring groove (101c-2) is formed on the lower end face of the upper top plate (101b). (b-2) Each of the ball bearings (101c-2) is fitted into the ball bearing ring groove (101b-2). The upper top plate (101c-3) is fixed on both sides of the support ring (101c). A telescopic motor (101c-4) is provided on both sides of the rotary motor (102). The upper telescopic ends of the two telescopic motors (101c-4) are fixedly connected to the lower end face of the upper top plate (101c-3) on both sides.

7. A single-piece liquid jet and scribe reveal device according to claim 6, wherein: The lower end face of the support plate (101) is fixedly provided with a lifting sleeve (101d), the upper and lower ends of the lifting sleeve (101d) are through, and a lifting cylinder (101d-1) is vertically slidably sleeved inside the lifting sleeve (101d). A rubber gasket (101d-2) is fixedly installed at the upper closed end of the lifting cylinder (101d-1).

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