thermostatic device

Abstract

The application relates to a thermostat device, which comprises a thermostat assembly, a heat pipe and a heat dissipation component. The thermostat assembly comprises a thermoelectric refrigerator, a heat conduction component and a heat dissipation component. One side of the thermoelectric refrigerator is attached to the heat conduction component, and the other side of the thermoelectric refrigerator is attached to the heat dissipation component. The thermoelectric refrigerator can be connected to opposite current directions. The heat pipe is arranged around the heat conduction component. When the thermoelectric refrigerator is connected to a forward current, the thermoelectric refrigerator can form a hot end on the side facing the heat conduction component and generate heat, thereby heating the heat conduction component. The heat conduction component transmits the heat to the heat pipe, and the heat pipe can heat the fluid in the passage. When the thermoelectric refrigerator is connected to a reverse current, the thermoelectric refrigerator can form a cold end on the side facing the heat conduction component and generate cold, thereby cooling the heat conduction component. The heat conduction component transmits the cold to the heat pipe, and the heat pipe can cool the fluid in the passage.

Description

Technical Field

[0001] This application relates to the field of temperature control technology, and in particular to a constant temperature device. Background Technology

[0002] By controlling the temperature of fluids, multiple functions such as fluid density measurement and biological storage can be achieved. Among them, the constant temperature device can realize the function of temperature control of the fluid flowing through it, and is widely used in various fields such as biology, chemical industry, medicine and home appliances.

[0003] In related technologies, existing temperature control devices all place the heat tracing pipe outside the fluid pipeline to achieve enclosed temperature control. However, the heat tracing pipes in existing temperature control devices are mostly for heating and cannot achieve low-temperature control. Utility Model Content

[0004] Based on this, this application provides a constant temperature device to solve the problem that constant temperature devices in related technologies cannot achieve low temperature control.

[0005] This application provides a temperature control device, which includes: a temperature control component, including a thermoelectric cooler, a heat-conducting element, and a heat-dissipating element, one side of the thermoelectric cooler being in contact with the heat-conducting element, and the other side of the thermoelectric cooler being in contact with the heat-dissipating element, and the thermoelectric cooler being able to receive current in the opposite direction; and a temperature control tube, which is wound around the heat-conducting element.

[0006] In one embodiment, the heat sink includes a cooling fan, with the other side of the thermoelectric cooler attached to the cooling fan.

[0007] In one embodiment, the heat sink further includes a heat sink with a cooling fan located on one side of the heat sink and the other side of the heat sink being in contact with the other side of the thermoelectric cooler. The heat dissipation area of ​​the heat sink is larger than that of the thermoelectric cooler.

[0008] In one embodiment, the temperature control component further includes thermal insulation cotton located between the thermal conductive element and the radiator to isolate the thermal conductive element and the radiator; and / or, the radiator includes a heat dissipation plate and a plurality of heat dissipation columns, one side of the heat dissipation plate being in contact with the other side of the thermoelectric cooler, the plurality of heat dissipation columns being disposed on the other side of the heat dissipation plate, and a cooling fan being located on the side of the plurality of heat dissipation columns away from the heat dissipation plate.

[0009] In one embodiment, the thermostatic tube includes a spiral tube wound around the outer periphery of the heat-conducting element.

[0010] In one embodiment, the pitch of the spiral tube is L, the outer diameter of the spiral tube is D, and the ratio between L and D is greater than or equal to 1.2 and less than or equal to 1.8.

[0011] In one embodiment, the outer periphery of the heat-conducting element is provided with a spiral groove, and the spiral tube is located inside the spiral groove.

[0012] In one embodiment, the temperature control component further includes a heat-spreading ring, which is sleeved on the outer periphery of the spiral tube and is in contact with both the spiral tube and the heat-conducting component.

[0013] In one embodiment, the heat-conducting component includes a heat-conducting cylinder and a heat-conducting plate connected together, with the heat-conducting plate covering the heat-conducting cylinder; one side of the thermoelectric cooler is attached to the heat-conducting plate, and a spiral tube is wound around the outer periphery of the heat-conducting cylinder; the temperature-regulating component also includes columnar insulation cotton and cylindrical insulation cotton, with the columnar insulation cotton inserted into the heat-conducting cylinder and attached to the end of the heat-conducting cylinder away from the heat-conducting plate; and the cylindrical insulation cotton is sleeved on the outer periphery of the spiral tube and the heat-conducting plate.

[0014] In one embodiment, the temperature control device further includes a temperature measuring element and a pressure plate. The heat-conducting element is provided with a mounting groove. The temperature measuring element is located in the mounting groove and abuts against the heat-conducting element. The pressure plate is placed over the opening of the mounting groove and connected to the heat-conducting element.

[0015] By applying the technical solution of this application, when a forward current is passed through the thermoelectric cooler of the thermostatic component, the side of the thermoelectric cooler facing the heat-conducting element forms a hot end, generating heat. This heat heats the heat-conducting element, which then transfers the heat to the thermostatic tube wound around it, causing the thermostatic tube to heat up. The thermostatic tube then heats the fluid within its channel, maintaining the fluid at a certain temperature. When a reverse current is passed through the thermoelectric cooler, a cold end is formed on the side facing the heat-conducting element, generating cooling. This cooling cools the heat-conducting element, which then transfers the cooling to the thermostatic tube, causing it to cool down. The thermostatic tube then cools the fluid within its channel, maintaining the fluid at a certain temperature. Simultaneously, the side of the thermoelectric cooler facing the heat sink forms a hot end, which is cooled by the heat sink, maintaining a temperature difference between the hot and cold ends of the thermoelectric cooler, thus maintaining the fluid within the thermostatic tube at a certain temperature. Compared with existing temperature control devices, the temperature control device of this application can achieve both high temperature control and low temperature control, which expands the application scenarios of temperature control devices and improves their practicality. Attached Figure Description

[0016] Figure 1 A cross-sectional view of the temperature control device provided in an embodiment of this application is shown.

[0017] Figure 2 It shows Figure 1 A magnified view of a portion of point A in the middle.

[0018] Figure 3 A schematic diagram of the structure of the constant temperature device provided in the embodiment of this application is shown.

[0019] Explanation of reference numerals in the attached figures:

[0020] 10. Constant temperature component; 11. Thermoelectric cooler; 12. Heat-conducting component; 121. Spiral groove; 122. Heat-conducting cylinder; 123. Heat-conducting plate; 13. Heat dissipation component; 131. Cooling fan; 132. Radiator; 1321. Heat dissipation plate; 1322. Heat dissipation column; 14. Insulation cotton; 15. Heat dissipation ring; 16. Column-type insulation cotton; 17. Cylindrical insulation cotton; 20. Constant temperature tube; 30. Temperature measuring component; 40. Pressure plate. Detailed Implementation

[0021] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0022] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0023] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0027] See Figures 1 to 3 , Figure 1 A cross-sectional view of the temperature control device provided in an embodiment of this application is shown. Figure 2 It shows Figure 1 A magnified view of a portion of point A in the middle. Figure 3 A schematic diagram of the structure of the temperature control device provided in an embodiment of this application is shown. One embodiment of this application provides a temperature control device including a temperature control component 10 and a temperature control tube 20. The temperature control component 10 includes a thermoelectric cooler 11, a heat-conducting element 12, and a heat dissipation element 13. One side of the thermoelectric cooler 11 is attached to the heat-conducting element 12, and the other side of the thermoelectric cooler 11 is attached to the heat dissipation element 13. The thermoelectric cooler 11 can be connected to currents in opposite directions. The temperature control tube 20 is wound around the heat-conducting element 12.

[0028] By applying the technical solution of this application, when a positive current is passed through the thermoelectric cooler 11 of the thermostatic component 10, the thermoelectric cooler 11 can form a hot end on the side facing the heat conduction element 12 and generate heat, thereby heating the heat conduction element 12. The heat conduction element 12 transfers heat to the thermostatic tube 20 wound around it, causing the thermostatic tube 20 to heat up. The thermostatic tube 20 can heat the fluid in its channel and keep the fluid at a certain temperature. When a reverse current is applied to the thermoelectric cooler 11, the side of the thermoelectric cooler 11 facing the heat conduction element 12 forms a cold end, generating cooling energy. This cooling energy then cools the heat conduction element 12, which transfers the cooling energy to the thermostatic tube 20, causing it to cool down. The thermostatic tube 20 then cools the fluid within its channels, maintaining the fluid at a constant temperature. Simultaneously, the side of the thermoelectric cooler 11 facing the heat sink 13 forms a hot end. The heat sink 13 cools the hot end of the thermoelectric cooler 11, maintaining a temperature difference between the cold and hot ends, thus maintaining the fluid within the thermostatic tube 20 at a constant temperature. Compared to existing thermostatic devices, the thermostatic device of this application can achieve both high-temperature and low-temperature control, expanding the application scenarios of thermostatic devices and improving their practicality.

[0029] The thermoelectric cooler 11 is a semiconductor device manufactured based on the Peltier effect, or thermoelectric effect. It contains a pair of units composed of P-type and N-type semiconductors. When a forward current is applied, electron-hole pairs are generated on one side of the thermoelectric cooler 11, reducing its internal energy and thus lowering its temperature, forming a cold junction. On the other side, electron-hole recombination increases the internal energy and raises the temperature, forming a hot junction. When a reverse current is applied, the cold and hot junctions are interchanged. Therefore, when a forward current is applied to the thermoelectric cooler 11, its hot junction can heat the heat-conducting element 12; when a reverse current is applied, its cold junction can cool the heat-conducting element 12.

[0030] It should be noted that the cooling capacity of the thermoelectric cooler 11 depends on the temperature difference between its hot and cold ends. Therefore, if the cooling capacity of the thermoelectric cooler 11 is to be used to cool the heat-conducting component 12, the hot end of the thermoelectric cooler 11 needs to be cooled in a timely manner to ensure that the cooling capacity of the thermoelectric cooler 11 meets the requirements.

[0031] The structure and material of the heat-conducting element 12 are not limited, as long as it can quickly transfer cold or heat to the thermostatic tube 20. In some embodiments, the heat-conducting element 12 can be made of C10100 copper, which has a high thermal conductivity of approximately 401 W / (m·K). Furthermore, the outer surface of the heat-conducting element 12 can be nickel-plated to improve its corrosion and oxidation resistance.

[0032] The installation method of the thermostatic tube 20 on the heat-conducting component 12 is not limited, as long as it can quickly transfer cold or heat to the thermostatic tube 20. By winding the thermostatic tube 20, the contact area between the thermostatic tube 20 and the heat-conducting component 12 can be increased, which is conducive to improving the speed of cold or heat transfer between the heat-conducting component 12 and the thermostatic tube 20.

[0033] In some embodiments, the thermostatic tube 20 may include multiple irregularly shaped tube structures with continuous reverse bends. Each irregularly shaped tube includes multiple continuous U-shaped segments, and a straight segment connects two adjacent irregularly shaped tubes at the last U-shaped segment of each irregularly shaped tube. The multiple irregularly shaped tubes are arranged in a winding manner around the heat-conducting element 12. This design fully utilizes the circumferential space of the heat-conducting element 12, significantly increasing the contact area between the thermostatic tube 20 and the heat-conducting element 12. In some embodiments, the thermostatic tube 20 may also be configured as a spiral tube structure. The spiral tube can also fully utilize the circumferential space of the heat-conducting element 12, significantly increasing the contact area between the thermostatic tube 20 and the heat-conducting element 12. Regardless of the form of the thermostatic tube 20, any form that facilitates the improvement of the cold or heat transfer rate between the heat-conducting element 12 and the thermostatic tube 20 is acceptable.

[0034] In this application, by winding the thermostatic tube 20 around the heat-conducting element 12, the contact area between the thermostatic tube 20 and the heat-conducting element 12 is increased through the winding structure, which can improve the temperature response speed and is more suitable for the control of micro fluids.

[0035] Combination Figure 1 As shown, the heat sink 13 includes a cooling fan 131, and the other side of the thermoelectric cooler 11 is in contact with the cooling fan 131. Using the above design, the cooling fan 131 is used to cool the hot end of the thermoelectric cooler 11, which has the advantages of simple structure, readily available materials, and low cost.

[0036] In other embodiments, liquid cooling can also be used to cool the hot end of the thermoelectric cooler 11. Heat is dissipated from the thermoelectric cooler 11 by placing a liquid cooling component, through which a liquid cooling medium flows, in contact with the other side of the thermoelectric cooler 11.

[0037] Combination Figure 1 As shown, the heat sink 13 also includes a heat sink 132, with a cooling fan 131 located on one side of the heat sink 132. The other side of the heat sink 132 is in contact with the other side of the thermoelectric cooler 11. The heat dissipation area of ​​the heat sink 132 is larger than that of the thermoelectric cooler 11. By adopting the above design, the heat dissipation area of ​​the thermoelectric cooler 11 is increased by utilizing the heat sink 132, which can accelerate the heat dissipation rate of the thermoelectric cooler 11 and thus improve the heat dissipation efficiency of the thermoelectric cooler 11 for the fluid in the thermostatic tube 20.

[0038] In some embodiments, the thermoelectric cooler 11 adopts a plate-like structure, and the heat dissipation area of ​​the thermoelectric cooler 11 is the contact area of ​​the side of the thermoelectric cooler 11 that is in contact with the heat sink 132. The heat dissipation area of ​​the heat sink 132 is larger than that of the thermoelectric cooler 11, and the heat dissipation area of ​​the heat sink 132 can be different values ​​depending on its structural form. In some embodiments, the heat sink 132 can adopt a plate-like structure, and the area of ​​the side of the heat sink 132 that is in contact with the thermoelectric cooler 11 is its heat dissipation area. In this case, it is sufficient that the cross-sectional area of ​​the heat sink 132 is larger than that of the thermoelectric cooler 11. In some embodiments, the heat sink 132 may include a heat dissipation plate 1321 and multiple heat dissipation columns 1322. Using multiple heat dissipation columns 1322 can increase the heat dissipation area of ​​the heat sink 132. Of course, the heat dissipation columns 1322 can also be configured in other forms, such as heat dissipation fins, as long as the heat dissipation area of ​​the thermoelectric cooler 11 can be increased using the heat sink 132.

[0039] Combination Figure 1 As shown, the thermostatic component 10 also includes thermal insulation cotton 14, which is located between the heat-conducting element 12 and the heat sink 132 to isolate them. The thermal insulation cotton 14 isolates the heat-conducting element 12 and the heat sink 132, preventing mutual interference between them and avoiding mutual interference between the hot and cold ends of the thermoelectric cooler 11. This allows the heat-conducting element 12 to maintain the temperature of the fluid inside the thermostatic tube 20.

[0040] In some embodiments, the heat-conducting element 12 has a positioning groove on the side facing the thermoelectric cooler 11, the thermoelectric cooler 11 is located in the positioning groove, and the side of the thermoelectric cooler 11 facing the heat sink 132 protrudes from the positioning groove. The heat sink 132 has a boss on the side facing the thermoelectric cooler 11, and the boss is in contact with the thermoelectric cooler 11. The outer perimeter of the boss is smaller than the outer perimeter of both the heat-conducting element 12 and the heat sink 132. This creates a gap between the heat-conducting element 12 and the heat sink 132, with the insulation cotton 14 located within the gap, thereby isolating the heat-conducting element 12 and the heat sink 132 and preventing their temperatures from affecting each other.

[0041] In one specific embodiment, thermally conductive silicone grease can be applied to the side of the thermoelectric cooler 11 facing the positioning groove to improve the heat transfer rate between the thermoelectric cooler 11 and the heat-conducting component 12. Thermally conductive silicone grease can also be applied to the side of the thermoelectric cooler 11 facing the heat sink 132 to further improve the heat transfer rate between the thermoelectric cooler 11 and the heat sink 132.

[0042] Among them, the heat insulation cotton 14 is made of ethylene-vinyl acetate copolymer foam material, abbreviated as EVA foam. The above material has a low thermal conductivity, usually between 0.035 W / (m·K) and 0.090 W / (m·K), and has good flexibility.

[0043] Combination Figure 1 As shown, the radiator 132 includes a heat sink 1321 and multiple heat sink columns 1322. One side of the heat sink 1321 is in contact with the other side of the thermoelectric cooler 11. The multiple heat sink columns 1322 are disposed on the other side of the heat sink 1321, and the cooling fan 131 is located on the side of the multiple heat sink columns 1322 away from the heat sink 1321. Compared with a single heat sink 1321, the heat sink 132's heat dissipation area can be increased by using multiple heat sink columns 1322, thereby increasing the heat dissipation rate of the radiator 132 and thus improving the heat dissipation rate of the hot end of the thermoelectric cooler 11.

[0044] In some embodiments, the cooling fan 131 is connected to the heat sink 1321 by screws.

[0045] Among them, the heat sink 132 is made of C10100 copper, which has a large heat dissipation area and good thermal conductivity.

[0046] In some embodiments, the thermostatic tube 20 includes a spiral tube wound around the outer periphery of the heat-conducting element 12. The spiral tube configuration described above offers advantages such as simple structure and ease of manufacturing.

[0047] Combination Figure 1 As shown, the pitch of the spiral tube is L, and the outer diameter of the spiral tube is D. The ratio between L and D is greater than or equal to 1.2 and less than or equal to 1.8. By adopting the above design, the number of turns of the spiral tube around the heat-conducting element 12 can be increased, thereby increasing the contact area between the spiral tube and the heat-conducting element 12, and further improving the temperature response rate of the fluid in the spiral tube.

[0048] The ratio between L and D can be 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, or any value greater than or equal to 1.2 and less than or equal to 1.8.

[0049] Combination Figure 1 As shown, a spiral groove 121 is provided on the outer periphery of the heat-conducting component 12, and the spiral tube is located in the spiral groove 121. The spiral groove 121 can be used to install and position the spiral tube, while also further increasing the contact area between the spiral tube and the heat-conducting component 12, thereby improving the temperature response rate of the fluid in the spiral tube.

[0050] In some embodiments, the cross-section of the spiral groove 121 is a U-shaped groove structure, and the outer diameter of the spiral tube is equal to the depth of the spiral groove 121. Furthermore, the spiral groove 121 is coated with thermally conductive silicone grease to improve the heat transfer rate between the thermally conductive component 12 and the spiral tube.

[0051] Combination Figure 1 As shown, the thermostatic assembly 10 also includes a heat-spreading ring 15, which is sleeved on the outer circumference of the spiral tube and is in contact with both the spiral tube and the heat-conducting element 12. The heat-spreading ring 15 enables heat or cold to be conducted between the heat-conducting element 12 and the spiral tube, as well as between the turns of the spiral tube, thereby achieving a uniform heat distribution between the heat-conducting element 12 and the spiral tube, and between the turns of the spiral tube. This improves the thermostatic effect of the fluid inside the thermostatic tube 20 and prevents the fluid temperature at the outlet of the thermostatic tube 20 from decreasing.

[0052] In some embodiments, on the cross-section of the spiral tube axis, the heat-spreading ring 15 is located on the outer periphery of multiple tube segments and fits against each tube segment, so that the heat-spreading ring 15 can form a heat-spreading effect from the inlet to the outlet of the spiral tube.

[0053] Combination Figure 1 and Figure 2 As shown, the heat-conducting component 12 includes a heat-conducting cylinder 122 and a heat-conducting plate 123 connected together, with the heat-conducting plate 123 covering the heat-conducting cylinder 122. One side of the thermoelectric cooler 11 is in contact with the heat-conducting plate 123, and a spiral tube is wound around the outer periphery of the heat-conducting cylinder 122.

[0054] By using the aforementioned heat-conducting component 12, the heat-conducting cylinder 122 can increase the contact area with the spiral tube, and the heat-conducting plate 123 can increase the contact area with the thermoelectric cooler 11, which has the advantage of simple structure.

[0055] In some embodiments, the heat-conducting cylinder 122 adopts a circular cylindrical structure, and the heat-conducting plate 123 adopts a rectangular plate structure.

[0056] In some embodiments, the constant temperature component 10 further includes columnar insulation cotton 16 and cylindrical insulation cotton 17. The columnar insulation cotton 16 is inserted into the heat-conducting cylinder 122 and is attached to the end of the heat-conducting cylinder 122 away from the heat-conducting plate 123. The cylindrical insulation cotton 17 is sleeved on the outer periphery of the spiral tube and the heat-conducting plate 123. With the above structure, the columnar insulation cotton 16 can isolate the inner wall and end face of the heat-conducting cylinder 122 from the outside, thereby forming a heat insulation effect on the inner wall and end face of the heat-conducting cylinder 122, preventing the heat-conducting cylinder 122 from exchanging heat with the outside through its inner wall and end face, and avoiding heat and cold loss. The cylindrical insulation cotton 17 can isolate the outer wall of the heat-conducting cylinder 122 and the spiral tube from the outside, thereby forming a heat insulation effect on the outer wall of the heat-conducting cylinder 122 and the spiral tube, respectively, preventing heat exchange with the outside through the outer wall of the heat-conducting cylinder 122 and the spiral tube, and avoiding heat and cold loss.

[0057] In some embodiments, one end of the cylindrical insulation cotton 17 protrudes from the heat-conducting plate 123 and fits against the outer wall of the insulation cotton 14, so that the exposed part of the entire heat-conducting element 12 is wrapped to prevent heat exchange between the heat-conducting element 12 and the outside.

[0058] Combination Figure 1 As shown, the thermostatic device also includes a temperature measuring element 30 and a pressure plate 40. The heat-conducting element 12 is provided with a mounting groove. The temperature measuring element 30 is located in the mounting groove and abuts against the heat-conducting element 12. The pressure plate 40 covers the opening of the mounting groove and is connected to the heat-conducting element 12. With the above structure, the temperature measuring element 30 can detect the temperature of the heat-conducting element 12, thereby enabling real-time control and switching of the operating state of the thermoelectric cooler 11 to ensure that the fluid temperature in the thermostatic tube 20 meets the requirements.

[0059] The pressure plate 40 can be used to fix the temperature measuring element 30 in the mounting groove so that the temperature measuring element 30 can stably detect the temperature of the heat-conducting element 12.

[0060] In some embodiments, the pressure plate 40 is connected to the heat-conducting element 12 by screws.

[0061] Among them, the temperature measuring element 30 adopts the principle of thermistor, and the thermistor provides real-time feedback on the temperature of the heat-conducting element 12.

[0062] The temperature control device of this application utilizes a host computer connected to a temperature control board via a serial port. The temperature sensor 30 and the thermoelectric cooler are connected to the temperature control board. After the device is started, the host computer operating software controls the temperature control board to send temperature control commands and temperature settings (default 35℃). The temperature control board then begins to work, automatically adjusting through a PID temperature compensation algorithm to achieve an accuracy of <±0.5℃. Once the temperature data from the temperature control module stabilizes, the liquid pump is started for detection.

[0063] In one specific embodiment, the inlet of the thermostatic tube 20 is connected to the pump outlet, and the outlet of the thermostatic tube 20 is connected to the density detector. The temperature control system is turned on, and the temperature of the thermoelectric cooler is set to 35°C (the temperature can be set arbitrarily within the range of 5°C-50°C). After the temperature data of the temperature control module stabilizes, the pump is turned on to pump liquid for density detection. The data using the thermostatic tube 20 and not using the thermostatic tube 20 are compared. The data using the thermostatic tube 20 is more stable.

[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A thermostat device, characterized by, The temperature control device includes: A constant temperature component includes a thermoelectric cooler, a heat-conducting component, and a heat-dissipating component. One side of the thermoelectric cooler is in contact with the heat-conducting component, and the other side of the thermoelectric cooler is in contact with the heat-dissipating component. The thermoelectric cooler can be connected to an electric current in the opposite direction. A thermostatic tube is wound around the heat-conducting component.

2. The thermostatic device according to claim 1, characterized in that The heat dissipation component includes a cooling fan, and the other side of the thermoelectric cooler is in contact with the cooling fan.

3. The constant temperature device according to claim 2, characterized in that, The heat dissipation component also includes a radiator, the cooling fan is located on one side of the radiator, the other side of the radiator is in contact with the other side of the thermoelectric cooler, and the heat dissipation area of ​​the radiator is larger than the heat dissipation area of ​​the thermoelectric cooler.

4. The constant temperature device according to claim 3, characterized in that, The temperature control component further includes thermal insulation cotton, which is located between the heat-conducting element and the heat sink to isolate the heat-conducting element and the heat sink; and / or, The radiator includes a heat sink and multiple heat sink columns. One side of the heat sink is in contact with the other side of the thermoelectric cooler. The multiple heat sink columns are located on the other side of the heat sink, and the cooling fan is located on the side of the multiple heat sink columns away from the heat sink.

5. The constant temperature device according to any one of claims 1 to 4, characterized in that, The thermostatic tube includes a spiral tube, which is wound around the outer periphery of the heat-conducting element.

6. The constant temperature device according to claim 5, characterized in that, The pitch of the spiral tube is L, and the outer diameter of the spiral tube is D. The ratio between L and D is greater than or equal to 1.2 and less than or equal to 1.

8.

7. The constant temperature device according to claim 5, characterized in that, The outer periphery of the heat-conducting component is provided with a spiral groove, and the spiral tube is located in the spiral groove.

8. The constant temperature device according to claim 5, characterized in that, The constant temperature component also includes a heat-spreading ring, which is sleeved on the outer periphery of the spiral tube and is in contact with both the spiral tube and the heat-conducting component.

9. The constant temperature device according to claim 5, characterized in that, The heat-conducting component includes a heat-conducting cylinder and a heat-conducting plate connected together, with the heat-conducting plate covering the heat-conducting cylinder; one side of the thermoelectric cooler is in contact with the heat-conducting plate, and the spiral tube is wound around the outer periphery of the heat-conducting cylinder; the constant temperature component also includes columnar insulation cotton and cylindrical insulation cotton, with the columnar insulation cotton inserted into the heat-conducting cylinder and in contact with the end of the heat-conducting cylinder away from the heat-conducting plate; the cylindrical insulation cotton is sleeved around the outer periphery of the spiral tube and the heat-conducting plate.

10. The constant temperature device according to any one of claims 1 to 4, characterized in that, The constant temperature device also includes a temperature measuring element and a pressure plate. The heat-conducting element is provided with a mounting groove. The temperature measuring element is located in the mounting groove and abuts against the heat-conducting element. The pressure plate covers the opening of the mounting groove and is connected to the heat-conducting element.

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