A vehicle head unit architecture
Patent Information
- Application Number
- CN202522227168.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-21
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-10-21
AI Technical Summary
单一板卡上的CPU和GPU性能通常相互制约,难以针对图形处理或通用计算进行独立升级,当需要提升图形性能时,必须更换整个主板,成本高昂且浪费资源
[0015] The beneficial effects of this utility model are as follows: By designing the CPU circuit board and GPU circuit board separately, the performance of the CPU and GPU can be upgraded independently without replacing the entire vehicle host architecture, thereby reducing the cost of optimizing the vehicle host itself. Furthermore, the separate design of the CPU circuit board and GPU circuit board provides a certain physical space for their respective heat dissipation solutions, and the GPU circuit board integrates a water-cooled heat sink, which can efficiently cool the heat generated by the GPU. Therefore, this utility model can reduce its own upgrade costs and optimize heat dissipation efficiency.
Smart Images

Figure CN224773392U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of vehicle host systems, and more specifically, to a vehicle host system architecture. Background Technology
[0002] With the continuous improvement of vehicle intelligence and connectivity, the importance of the in-vehicle host system, as the vehicle's infotainment center, data processing core, and human-machine interaction hub, is becoming increasingly prominent. Modern in-vehicle host systems need to handle high-performance graphics rendering (such as multi-screen displays including the instrument panel, central control screen, and passenger entertainment screen), complex data processing (such as navigation and voice recognition), high-speed data storage, and the integrated management of various vehicle buses (such as CAN and LIN) and wireless communications (such as 5G and Wi-Fi).
[0003] Existing in-vehicle head unit solutions mostly employ a highly integrated system-on-board design. This design integrates the central processing unit (CPU), graphics processing unit (GPU), memory, storage, and various I / O interfaces onto a single motherboard. While this integrated design simplifies the structure to some extent, it also introduces several inherent drawbacks: The performance of the CPU and GPU on a single board is often mutually restrictive, making it difficult to upgrade independently for graphics processing or general computing. When graphics performance needs to be improved, the entire motherboard must be replaced, which is costly and wasteful of resources. Furthermore, the high-performance CPU and GPU are concentrated in a small board space, generating a lot of heat, which places extremely high demands on the heat dissipation design in the automotive environment, limiting the continuous improvement of processor performance and potentially affecting the long-term reliability of the system.
[0004] Therefore, this utility model provides an in-vehicle host architecture that can reduce its own upgrade costs and optimize heat dissipation efficiency. Utility Model Content
[0005] In order to overcome the shortcomings of the existing technology, this utility model provides an in-vehicle host architecture that can reduce its own upgrade costs and optimize heat dissipation efficiency.
[0006] The technical solution adopted by this utility model to solve its technical problem is: an in-vehicle host architecture, the improvement of which is that the in-vehicle host architecture includes a CPU circuit board, a GPU circuit board, an IO expansion circuit board, an SSD storage module and a communication module, wherein the CPU circuit board is electrically connected to the GPU circuit board, the IO expansion circuit board, the SSD storage module and the communication module; and the GPU circuit board integrates a water-cooled heat sink for heat dissipation.
[0007] Furthermore, the CPU circuit board is provided with a PCIe 4.0 x8 interface, which is electrically connected to the GPU circuit board.
[0008] Furthermore, the CPU circuit board is equipped with a USB 4.0 interface, which is electrically connected to the SSD storage module.
[0009] Furthermore, the communication module includes a 4G / 5G module and a WiFi / Bluetooth module. The CPU circuit board is provided with multiple USB 2.0 interfaces and multiple PCIe interfaces. The 4G / 5G module and the WiFi / Bluetooth module are each electrically connected to one USB 2.0 interface and one PCIe interface.
[0010] Furthermore, the IO expansion circuit board integrates at least an MCU control chip, a transceiver, a radio module, a GPS module, a first vehicle display connector, a second vehicle display connector, an audio decoder, an OTG fast charging USB connector, and a fan connector; the MCU control chip is electrically connected to the audio decoder, transceiver, and fan connector; the radio module is electrically connected to the audio encoder; the GPS module, the first vehicle display connector, and the OTG fast charging USB connector are all electrically connected to the CPU circuit board; and the second vehicle display connector is electrically connected to the CPU circuit board.
[0011] Furthermore, the CPU circuit board is provided with multiple sets of IC interfaces, which are electrically connected to the first vehicle display connector, the GPS module, and the OTG fast charging USB port connector, respectively.
[0012] Furthermore, the CPU circuit board is provided with a GPIO interface, a first UART interface, and an SPI interface; the GPIO interface, the first UART interface, and the SPI interface are all electrically connected to the audio decoder.
[0013] Furthermore, the CPU circuit board is provided with a second UART interface, which is electrically connected to the GPS module.
[0014] Furthermore, the OTG fast charging USB connector is electrically connected to a set of USB 2.0 interfaces on the CPU circuit board.
[0015] The beneficial effects of this utility model are as follows: By designing the CPU circuit board and GPU circuit board separately, the performance of the CPU and GPU can be upgraded independently without replacing the entire vehicle host architecture, thereby reducing the cost of optimizing the vehicle host itself. Furthermore, the separate design of the CPU circuit board and GPU circuit board provides a certain physical space for their respective heat dissipation solutions, and the GPU circuit board integrates a water-cooled heat sink, which can efficiently cool the heat generated by the GPU. Therefore, this utility model can reduce its own upgrade costs and optimize heat dissipation efficiency. Attached Figure Description
[0016] Figure 1 This is a block diagram of a vehicle-mounted host architecture according to the present invention; Figure 2 This is a connection principle diagram of an in-vehicle host architecture according to the present invention. Detailed Implementation
[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0018] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.
[0019] Reference Figure 1 and Figure 2 As shown, this utility model discloses an in-vehicle host architecture, which includes a CPU circuit board, a GPU circuit board, an I / O expansion circuit board, an SSD storage module, and a communication module. The CPU circuit board is electrically connected to the GPU circuit board, the I / O expansion circuit board, the SSD storage module, and the communication module. The GPU circuit board integrates a water-cooled heat sink for heat dissipation.
[0020] It should be noted that, in this embodiment, the CPU circuit board integrates a CPU (Central Processing Unit), which serves as the core processing unit of the entire vehicle host architecture, responsible for the vehicle system's computing, data processing, and management tasks; the GPU circuit board integrates a CPU, which serves as the graphics processing unit of the entire vehicle host architecture, used for graphics rendering, and may be involved in tasks such as vehicle display and video processing; the IO expansion circuit board is used to expand input / output interfaces and connect various external devices, such as displays, sensors, and audio systems; the SSD storage module is used to store the operating system, applications, and user data; the communication module is used to provide the vehicle host with communication capabilities with the outside world, including 4G / 5G networks, WiFi, Bluetooth, etc.; the water-cooled radiator is used to dissipate the large amount of heat generated by the GPU during high-load operation. Specifically, the water-cooled radiator has an inlet and an outlet, and the water-cooled radiator contains... Multiple water channels fully leverage the advantages of water cooling. Through the flow of liquid in a closed loop, heat is conducted to a larger heatsink for dissipation. Compared to traditional air cooling, water cooling removes heat from the GPU core more efficiently and quietly, ensuring the GPU operates stably at high performance and preventing overheating-induced throttling or restarts. In implementing this invention, the vehicle-mounted host architecture separates the CPU and GPU circuit boards, allowing for independent upgrades of the CPU and GPU performance without replacing the entire host architecture. This reduces the cost of optimizing the host itself. Furthermore, the separate design provides physical space for each circuit board's heat dissipation, and the integrated water cooling radiator on the GPU circuit board efficiently cools the heat generated by the GPU. Therefore, this embodiment reduces upgrade costs and optimizes heat dissipation efficiency.
[0021] Reference Figure 2 As shown, the CPU circuit board is equipped with a PCIe 4.0 x8 interface, which is electrically connected to the GPU circuit board.
[0022] It should be noted that, in this embodiment, the application of the PCIE 4.0 x8 interface enables the CPU circuit board to connect to the GPU circuit board with extremely high bandwidth (approximately 8GB / s), ensuring that graphics data can be transmitted without bottlenecks.
[0023] Continue to refer to Figure 2 As shown, the CPU circuit board is equipped with a USB 4.0 interface, which is electrically connected to the SSD storage module.
[0024] It should be noted that, in this embodiment, the USB 4.0 interface is used to connect external high-speed devices, which can ensure high-speed data exchange between the CPU and the SSD storage module.
[0025] Reference Figure 2 As shown, the CPU circuit board is provided with multiple USB 2.0 interfaces and multiple PCIe interfaces. All of the multiple USB 2.0 interfaces and multiple PCIe interfaces are connected to the communication module. Furthermore, the communication module includes a 4G / 5G module and a WiFi / Bluetooth module. The CPU circuit board is provided with multiple USB 2.0 interfaces and multiple PCIe interfaces. The 4G / 5G module and the WiFi / Bluetooth module are each electrically connected to one USB 2.0 interface and one PCIe interface.
[0026] It should be noted that, in this embodiment, the multiple USB 2.0 and PCIe interfaces provide ample expansion capabilities for connecting communication modules and other devices requiring medium to high-speed data throughput. Specifically, the communication module includes a 4G / 5G module and a WiFi / Bluetooth module. The 4G / 5G module connects to the Internet via a mobile network to enable online navigation, real-time traffic conditions, online audio and video, and OTA (over-the-air) software upgrades. The WiFi module connects to wireless routers in homes or public places for convenient data synchronization and software upgrades, while Bluetooth connects to mobile phones for hands-free calling and music playback.
[0027] Continue to refer to Figure 2 As shown, the IO expansion circuit board integrates at least an MCU control chip, a transceiver, a radio module, a GPS module, a first vehicle display connector, a second vehicle display connector, an audio decoder, an OTG fast charging USB connector, and a fan connector. The MCU control chip is electrically connected to the audio decoder, transceiver, and fan connector. The radio module is electrically connected to the audio encoder. The GPS module, the first vehicle display connector, and the OTG fast charging USB connector are all electrically connected to the CPU circuit board. The second vehicle display connector is electrically connected to the CPU circuit board. Furthermore, the CPU circuit board is also provided with multiple sets of IC interfaces, GPIO interfaces, a first UART interface, an SPI interface, and a second UART interface. The multiple sets of IC interfaces are electrically connected to the first vehicle display connector, the GPS module, and the OTG fast charging USB connector, respectively. The GPIO interface, the first UART interface, and the SPI interface are all electrically connected to the audio decoder. The second UART interface is electrically connected to the GPS module. The OTG fast charging USB connector is electrically connected to a set of USB 2.0 interfaces on the CPU circuit board.
[0028] It should be noted that in this embodiment, the IO expansion circuit board serves as a central hub for functional integration and signal conversion. It brings together numerous vehicle-specific functions and connects to the CPU circuit board via a standardized interface. Specifically, the IO expansion circuit board integrates at least an MCU control chip, a transceiver, a radio module, a GPS module, a first vehicle display connector, a second vehicle display connector, an audio decoder, an OTG fast charging USB connector, and a fan connector. The MCU control chip is used to handle tasks with high real-time requirements but relatively simple logic, such as controlling the audio decoder according to instructions and managing fan speed. It reduces the burden on the main CPU and improves the real-time response capability of the vehicle host. The transceiver is used to convert the logic signals of the vehicle host into differential signals that can be recognized by the vehicle's CAN bus, thereby enabling communication with other vehicle electronic control units (ECUs) such as the engine, body, and instrument panel to acquire vehicle data or send control commands; the audio decoder is used to convert digital audio signals into analog signals to drive the speakers to emit sound; the GPS module provides accurate positioning and navigation services for the vehicle by receiving satellite signals; the OTG fast charging USB connector is used to support fast charging of vehicle devices, making it convenient for users to charge in the car; the first vehicle display connector and the second vehicle display connector are used to support the connection of vehicle screens, transmit image and video signals, and display navigation, entertainment, and other content.
[0029] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.
Claims
1. A vehicle-mounted host architecture, characterized in that, The vehicle-mounted host architecture includes a CPU circuit board, a GPU circuit board, an I / O expansion circuit board, an SSD storage module, and a communication module. The CPU circuit board is electrically connected to the GPU circuit board, the I / O expansion circuit board, the SSD storage module, and the communication module. The GPU circuit board integrates a water-cooled radiator for heat dissipation.
2. The vehicle-mounted host architecture according to claim 1, characterized in that, The CPU circuit board is equipped with a PCIe 4.0 x8 interface, which is electrically connected to the GPU circuit board.
3. The vehicle-mounted host architecture according to claim 1, characterized in that, The CPU circuit board is equipped with a USB 4.0 interface, which is electrically connected to the SSD storage module.
4. The vehicle-mounted host architecture according to claim 1, characterized in that, The CPU circuit board is equipped with multiple USB 2.0 interfaces and multiple PCIe interfaces, all of which are connected to the communication module.
5. The vehicle-mounted host architecture according to claim 4, characterized in that, The communication module includes a 4G / 5G module and a WiFi / Bluetooth module. The CPU circuit board is provided with multiple USB 2.0 interfaces and multiple PCIe interfaces. The 4G / 5G module and the WiFi / Bluetooth module are each electrically connected to one USB 2.0 interface and one PCIe interface.
6. The vehicle-mounted host architecture according to claim 5, characterized in that, The IO expansion circuit board integrates at least an MCU control chip, a transceiver, a radio module, a GPS module, a first vehicle display connector, a second vehicle display connector, an audio decoder, an OTG fast charging USB connector, and a fan connector. The MCU control chip is electrically connected to the audio decoder, transceiver, and fan connector. The radio module is electrically connected to the audio encoder. The GPS module, the first vehicle display connector, and the OTG fast charging USB connector are all electrically connected to the CPU circuit board. The second vehicle display connector is electrically connected to the CPU circuit board.
7. The vehicle-mounted host architecture according to claim 6, characterized in that, The CPU circuit board is provided with multiple sets of IC interfaces, which are electrically connected to the first vehicle display connector, the GPS module, and the OTG fast charging USB port connector, respectively.
8. The vehicle-mounted host architecture according to claim 6, characterized in that, The CPU circuit board is equipped with a GPIO interface, a first UART interface, and an SPI interface; the GPIO interface, the first UART interface, and the SPI interface are all electrically connected to the audio decoder.
9. The vehicle-mounted host architecture according to claim 6, characterized in that, The CPU circuit board is provided with a second UART interface, which is electrically connected to the GPS module.
10. The vehicle-mounted host architecture according to claim 6, characterized in that, The OTG fast charging USB connector is electrically connected to a set of USB 2.0 interfaces on the CPU circuit board.