A fanless industrial computer of the state council innovation using a finned heat dissipation case

Abstract

The utility model relates to industrial computer technical field discloses a kind of fanless signal creation industrial computer of finned heat dissipation machine case, the industrial computer includes a by aluminium alloy integrated extrusion forming, outer wall integrated with large-area heat dissipation fin machine body, and the IPC mainboard of being installed in machine case interior, with domestic multicore processor, CPU radiator of mainboard self-possessed is in close contact with the inner wall of machine body, constitutes heat conduction passage, and the heat of processor is conducted to entire machine body by CPU radiator, and passive heat dissipation is carried out by heat dissipation fin.The utility model uses machine case as only whole machine heat dissipation component, realizes fanless, high reliability heat dissipation to domestic high-performance platform, and it is applicable to severe industrial application environment.

Description

Technical Field

[0001] This utility model belongs to the field of industrial computer equipment technology, specifically relating to a fanless industrial computer that uses a fully domestically produced core platform and passive heat dissipation through a chassis structure. Background Technology

[0002] Industrial PCs are ruggedized computers designed specifically for industrial environments. Their operating environment often presents challenges such as dust, vibration, and wide temperature ranges. To improve the long-term reliability of the equipment, fanless design has become the mainstream. It replaces traditional fans with structural heat dissipation, avoiding system failures caused by problems such as dust being sucked in by the fan and bearing wear.

[0003] With the advancement of information technology application innovation, also known as the Information Technology Innovation Project, the industrial control computer field is accelerating the adoption of hardware platforms based on domestically produced processors. The new generation of domestically produced multi-core processors, such as the Zhaoxin KX-6000 series, while providing powerful computing capabilities, also pose a severe challenge to the overall heat dissipation design due to their power consumption and heat generation. In the fanless passive cooling mode, how to efficiently and reliably conduct and dissipate the concentrated heat of domestically produced processors is directly related to whether the industrial control computer can work stably and continuously in a wide temperature environment of industrial applications. This is a key issue that urgently needs to be solved in the current design field of domestically produced industrial control computers.

[0004] Some existing fanless solutions simply connect the processor to the chassis via a simple heat-conducting medium. This single heat conduction path is inefficient and cannot cope with the heat dissipation pressure under high loads. It can easily lead to processor overheating and frequency reduction, affecting system performance and stability. Summary of the Invention

[0005] The purpose of this invention is to provide a fanless industrial control computer with a finned heat sink chassis, aiming to efficiently solve the heat dissipation problem of domestic high-performance processors in passive cooling mode through a systematic structural integration design.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A fanless industrial control computer using a finned heat dissipation chassis includes a chassis body integrally extruded from a high thermal conductivity metal material such as aluminum alloy. Multiple heat dissipation fins extending along the length of the chassis are integrally integrated on the top and side outer walls of the chassis body. An IPC motherboard equipped with a domestic multi-core processor is installed inside the chassis. The CPU heatsink on the motherboard has a large area of ​​close thermal contact with the inner wall of the chassis body.

[0007] The above solution constitutes a clear and efficient heat dissipation path: the heat generated by the domestic processor is first absorbed by its dedicated CPU cooler, and then quickly conducted to the entire chassis body through the contact surface with the inner wall of the chassis; the huge chassis body acts as a whole heat sink, and then uses its huge outer surface heat dissipation fins to silently and efficiently dissipate the heat to the surrounding environment through natural air convection and thermal radiation; the whole process does not involve any active cooling components such as fans.

[0008] As a further optimization of this utility model, the bottom sides of the chassis body are integrally formed with outwardly extending mounting wings, and mounting holes are provided on the mounting wings to facilitate the stable installation of the whole machine on the cabinet or equipment wall panel.

[0009] Compared with the prior art, this utility model has the following advantages: 1. This utility model has excellent heat dissipation performance. By using the entire one-piece molded finned chassis as the final heat dissipation body and ensuring tight thermal coupling between the CPU heat sink and the chassis, a low thermal resistance system-level heat dissipation path is constructed. This can meet the heat dissipation requirements of domestic high-performance processors under high load and wide temperature environments, and ensure that the system operates stably without frequency reduction.

[0010] 2. The structure of this utility model is robust and reliable. The chassis body is made of one-piece extrusion molding, which has high structural strength and can effectively resist the impact and vibration of the industrial site. The fanless design fundamentally eliminates the risk of failure of moving parts and greatly improves the mean time between failures of the whole machine.

[0011] 3. The interface layout of this utility model is reasonable and abundant. The robust chassis provides a stable and reliable mounting base for a wealth of industrial I / O interfaces, including up to six serial ports, eight USB ports, and dual network ports, which fully meets the connection needs of complex industrial automation scenarios. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the front structure of the entire machine according to an embodiment of the present utility model; Figure 2 This is a schematic diagram of the rear structure of the entire machine according to an embodiment of the present utility model; Figure 3 This is a schematic diagram of the rear panel interface layout according to an embodiment of the present utility model.

[0013] In the diagram: 1-Chassis body, 11-Heater fins, 12-Mounting wings, 2-IPC motherboard, 3-Domestic multi-core processor, 4-CPU cooler, 5-Front panel, 6-Rear panel. Detailed Implementation

[0014] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0015] Please see Figure 1 and Figure 2 This embodiment discloses a fanless industrial control computer with a finned heat dissipation chassis. Its core is a chassis body 1, which is integrally formed from 6000 series aluminum alloy through an extrusion process, and its outer surface is anodized and blackened, which has good thermal conductivity, structural strength and corrosion resistance.

[0016] On the top outer wall and the outer walls of both sides of the chassis body 1, a large number of heat dissipation fins 11 extending along the length of the chassis are integrated. These fins 11 significantly increase the surface area of ​​the chassis. On the bottom of both sides of the chassis body 1, there are outwardly extending mounting wings 12 integrally formed. The mounting wings 12 are provided with mounting holes for fixing the industrial control computer to the work site.

[0017] An IPC motherboard 2 is installed inside the cavity of the chassis body 1. The IPC motherboard 2 is equipped with a domestic multi-core processor 3, which is a Zhaoxin KX-U6780A eight-core processor in this embodiment.

[0018] According to the motherboard specifications, a dedicated CPU heatsink 4 is installed on the processor 3. After the entire machine is assembled, the top or side of the CPU heatsink 4 is tightly attached to the inner wall of the chassis body 1 through a medium such as thermal grease to form an efficient heat conduction interface.

[0019] The front panel 5 and rear panel 6 are fixed to the front and rear ends of the chassis body 1 with screws. Various I / O interfaces integrated on the IPC motherboard 2 are led out through the corresponding openings on these two panels.

[0020] Please see Figure 3 Taking the rear panel 6 as an example, it features a rich array of interfaces, including: a DC 12V / 19V power input interface, one HDMI interface, one VGA interface, two RJ45 Gigabit Ethernet interfaces, four USB interfaces, and two DB9 serial communication interfaces (COM1-2).

[0021] Among them, the four USB ports correspond to two USB 3.0 ports and two USB 2.0 ports respectively. The front panel 5 leads out to another four serial communication ports (COM3-6), audio ports, another four USB ports, and a power switch. This interface configuration fully demonstrates its powerful connectivity as an industrial computer. The two COM1-2 ports can be switched between RS232, RS422 and RS485 level standards through jumpers on the IPC motherboard 2, flexibly adapting to multiple industrial bus standards.

[0022] When the whole machine is working, the domestic multi-core processor 3 is the largest heat source. The heat generated by it is first absorbed by the CPU heat sink 4, and then quickly conducted to the chassis body 1 which is in close contact with it. The heat is evenly diffused in the thick aluminum alloy chassis body 1, and finally exchanged with the surrounding air through the huge heat sink fins 11 on the outer surface. It is quietly and reliably dissipated in the form of natural convection, ensuring that the core temperature of the processor 3 is maintained within a safe range.

[0023] In summary, this utility model successfully constructs a completely passive, stable, and reliable heat dissipation system by deeply integrating a high-performance domestically developed motherboard platform with an optimized integrated finned chassis that combines structural load-bearing and efficient heat dissipation functions. It is a highly practical technical solution in the field of domestic chemical control machinery.

Claims

1. A fanless industrial control computer using a finned heat sink chassis, characterized in that, include: A chassis body (1) is integrally extruded from thermally conductive metal material. The top outer wall and the outer walls of both sides of the chassis body (1) are each equipped with a plurality of heat dissipation fins (11) extending along their length direction. An IPC motherboard (2) is installed inside the chassis body (1); A domestically produced multi-core processor (3) is installed on the IPC motherboard (2); A CPU heatsink (4) that is compatible with the domestic multi-core processor (3) has a top that forms a tight thermal contact with the inner wall of the chassis body (1). The heat generated by the domestic multi-core processor (3) is conducted to the chassis body (1) via the CPU heat sink (4) and is eventually passively dissipated to the surrounding environment through the heat dissipation fins (11). The chassis body (1) is the only whole-machine heat dissipation component of the industrial computer.

2. The fanless industrial control computer with a finned heat dissipation chassis according to claim 1, characterized in that, The bottom sides of the chassis body (1) are integrally formed with mounting wings (12) for fixed installation, and mounting holes are provided on the mounting wings (12).

3. A fanless industrial control computer with a finned heat dissipation chassis according to claim 1, characterized in that, The chassis body (1) is provided with a front panel (5) and a rear panel (6) at the front and rear ends respectively. Multiple I / O interfaces on the IPC motherboard (2) are led out through the openings on the front panel (5) and the rear panel (6).

4. A fanless industrial control computer with a finned heat dissipation chassis according to claim 3, characterized in that, The brought-out I / O interfaces include at least four USB 3.0 interfaces, at least four USB 2.0 interfaces, at least two independent Ethernet interfaces, one HDMI interface, one VGA interface, and at least six serial communication interfaces.

5. A fanless industrial control computer with a finned heat dissipation chassis according to claim 4, characterized in that, Of the at least six serial communication interfaces, at least two interfaces can be switched between RS232, RS422 and RS485 level standards via jumpers on the IPC motherboard (2).

6. A fanless industrial control computer with a finned heat dissipation chassis according to claim 1, characterized in that, The domestically produced multi-core processor (3) is the Zhaoxin KX-U6780A processor.

7. A fanless industrial control computer with a finned heat sink chassis according to claim 1, characterized in that, The chassis body (1) is made of aluminum alloy and its outer surface is anodized and blackened.

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