A cooling device and server

Abstract

This utility model relates to the field of server cooling technology, and more particularly to a cooling device and a server. The cooling device includes a refrigeration unit, a power unit, and a liquid cooling plate. The liquid cooling plate is adapted to be mounted on the server's motherboard. The refrigeration unit and the power unit are adapted to be arranged outside the server's casing. The power unit is connected between the refrigeration unit and the liquid cooling plate. The power unit is used to deliver a first coolant from the refrigeration unit to the liquid cooling plate. The liquid cooling plate is used to cool the server's components that need heat dissipation. The liquid cooling plate can directly contact the components that need heat dissipation without the need for heat transfer through air, which helps to improve heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of server cooling technology, and in particular to a cooling device and a server. Background Technology

[0002] A server is a dedicated computer in a network environment that provides various services to customers and undertakes key tasks such as data storage, forwarding, and publishing.

[0003] An existing server includes a motherboard, a housing, and an air-cooling component. The motherboard is installed inside the housing and has components such as a processor, memory, and storage installed on it. It can independently run an operating system and applications. The air-cooling component includes a fan installed inside the housing. When the server is working, the processor, memory, and storage on the motherboard will generate a lot of heat, causing the internal temperature of the housing to rise. The fan can transport the hot air inside the housing to the outside of the housing, thereby cooling the processor, memory, storage, and other heat dissipation components inside the housing.

[0004] However, existing servers are small in size and have a high heat flux density, so air cooling cannot effectively dissipate heat from the equipment. Summary of the Invention

[0005] This utility model provides a cooling device and server, aiming to solve the problem that existing servers are small in size, have high heat flux density, and cannot effectively dissipate heat and cool the equipment using air cooling mode.

[0006] This utility model provides a cooling device, including a refrigeration unit, a power unit, and a liquid cooling plate. The liquid cooling plate is adapted to be installed on the motherboard of a server. The refrigeration unit and the power unit are adapted to be arranged outside the server housing. The power unit is connected between the refrigeration unit and the liquid cooling plate. The power unit is used to deliver a first coolant from the refrigeration unit to the liquid cooling plate. The liquid cooling plate is used to cool the heat-dissipating components of the server.

[0007] Optionally, multiple liquid cooling plates are provided, and the number of liquid cooling plates is the same as the number of heat-dissipating components of the server, with each liquid cooling plate corresponding to one heat-dissipating component of the server.

[0008] Optionally, a connecting plate is provided between at least two adjacent liquid cooling plates, and the connecting plate is connected between the two liquid cooling plates.

[0009] Optionally, the cooling device further includes an inlet pipe and an outlet pipe, the inlet pipe and the outlet pipe being adapted to be externally connected to the server housing; The power unit can transport the first coolant in the refrigeration unit to the liquid cooling plate through the liquid inlet pipe, and can transport the first coolant in the liquid cooling plate to the refrigeration unit through the liquid outlet pipe.

[0010] Optionally, the cooling device further includes an inlet branch pipe and an outlet branch pipe, wherein the inlet branch pipe is connected between the liquid cooling plate and the inlet pipe, and the outlet branch pipe is connected between the liquid cooling plate and the outlet pipe.

[0011] Optionally, the liquid cooling plate includes a plate body and a connecting lug. The plate body is provided with a cavity for holding the first coolant, and the connecting lug is detachably connected to the motherboard of the server.

[0012] Optionally, the plate body is provided with a plurality of heat dissipation protrusions.

[0013] According to the cooling device provided in this embodiment of the present invention, the refrigeration unit can cool the first coolant, and the power unit can transport the first coolant in the refrigeration unit to the liquid cooling plate. The first coolant in the liquid cooling plate can absorb the heat from the components to be cooled in the server. The power unit then transports the first coolant in the liquid cooling plate, whose temperature has increased, back to the refrigeration unit for cooling, forming a cycle, thereby cooling the components to be cooled. Compared with the prior art, it does not require a large space to install the air-cooling device, has a simple structure, is easy to arrange, and saves the internal space of the server. In addition, the liquid cooling plate can directly contact the components to be cooled without heat transfer through the air, which is beneficial to improving heat dissipation efficiency.

[0014] This utility model embodiment also provides a server, including a housing, a motherboard, a component to be cooled, and the above-mentioned cooling device. The housing has an installation cavity, which forms the cooling chamber. The motherboard is installed in the mounting cavity, the component to be cooled is electrically connected to the motherboard, the liquid cooling plate is connected to the motherboard, and the side of the liquid cooling plate facing the motherboard contacts the component to be cooled.

[0015] Optionally, the server further includes an injection port and a drain port, which are connected to the mounting cavity and exposed outside the server housing. The mounting cavity contains a second coolant, which is used to cool the components to be cooled.

[0016] Optionally, it also includes a support frame, which is mounted on the motherboard, and the liquid cooling plate is detachably connected to the support frame. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a server provided in one embodiment of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of a server provided in one embodiment of the present invention. Figure 2 (Remove the top shell); Figure 3 This is a schematic diagram of a cooling device provided in one embodiment of the present invention.

[0019] Reference numerals in the accompanying drawings: 1. Housing; 2. Upper housing; 3. Bottom housing; 4. Inlet blind connector; 5. Outlet blind connector; 6. Mounting cavity; 7. Cooling chamber; 8. Liquid cooling plate; 9. Plate body; 10. Connecting lug; 11. First connecting hole; 12. Heat dissipation protrusion; 13. Connecting plate; 14. Inlet branch pipe; 15. Outlet branch pipe; 16. Inlet pipe; 17. First section; 18. Second section; 19. Outlet pipe; 20. Third section; 21. Fourth section; 22. Injection port; 23. Drain port; 24. Refrigeration unit; 25. Power unit; 26. Support frame; 27. Component to be cooled; 28. Main board. Detailed Implementation

[0020] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] like Figures 1 to 3 As shown, one embodiment of the present invention provides a server, including a housing 1, a motherboard 28, a heat dissipation component 27, and a cooling device.

[0023] The housing 1 has an installation cavity 6.

[0024] The motherboard 28 is installed in the mounting cavity 6, and the component to be cooled 27 is electrically connected to the motherboard 28.

[0025] The cooling device includes a refrigeration unit 24, a power unit 25, and a liquid cooling plate 8. The liquid cooling plate 8 is mounted on the main board 28 and connected to the main board 28. The side of the liquid cooling plate 8 facing the main board 28 contacts the component 27 to be cooled.

[0026] The cooling unit 24 and the power unit 25 are arranged outside the housing 1. The power unit 25 is connected between the cooling unit 24 and the liquid cooling plate 8. The power unit 25 is used to deliver the first coolant in the cooling unit 24 to the liquid cooling plate 8. The liquid cooling plate 8 is used to cool the component 27 to be cooled.

[0027] In this embodiment, the cooling unit 24 can cool the first coolant, and the power unit 25 can deliver the first coolant in the cooling unit 24 to the liquid cooling plate 8. The first coolant in the liquid cooling plate 8 can absorb the heat on the component 27 to be cooled inside the housing 1. The power unit 25 delivers the first coolant in the liquid cooling plate 8, whose temperature has increased, back to the cooling unit 24 for cooling, forming a cycle, thereby cooling the component 27 to be cooled. It does not require a large space to install the air cooling device, has a simple structure, is easy to arrange, and saves the internal space of the server. In addition, the liquid cooling plate 8 is in direct contact with the component 27 to be cooled, without the need for heat transfer through the air, which is beneficial to improving heat dissipation efficiency.

[0028] In one embodiment, the server further includes an injection port 22 and an outlet port 23, which are connected to the mounting cavity 6. The injection port 22 and the outlet port 23 are exposed outside the server housing 1. The mounting cavity 6 contains a second coolant, which is used to cool the component 27 to be cooled.

[0029] In this embodiment, the mounting cavity 6 forms a cooling chamber 7, and the motherboard 28 is installed in the cooling chamber 7 so that the second coolant is carried in the cooling chamber 7. The second coolant is a non-conductive liquid, so that the motherboard 28 and the heat-dissipating components 27 on the motherboard 28 are immersed in the second coolant, so that a part of the heat on the heat-dissipating components 27 is transferred to the second coolant, and then transferred to the housing 1 through the second coolant, and then transferred to the air through the housing 1.

[0030] In this embodiment, one end of the injection port 22 and the drain port 23 is connected to the cooling chamber 7, and the other end is exposed on the outer wall of the housing. The injection port 22 and the drain port 23 are normally closed. When the second coolant needs to be replaced, the drain port 23 is opened to drain the second coolant in the cooling chamber 7 out of the housing 1, and then new second coolant is injected into the cooling chamber 7 through the injection port 22.

[0031] In this embodiment, the liquid cooling plate 8 and the second coolant simultaneously dissipate heat from the heat dissipation component 27, further improving the heat dissipation efficiency of the cooling device.

[0032] In one embodiment, multiple liquid cooling plates 8 are provided, and the number of liquid cooling plates 8 is the same as the number of heat-dissipating components 27 of the server, with each liquid cooling plate 8 corresponding to one heat-dissipating component 27 of the server.

[0033] In this embodiment, the number of liquid cooling plates 8 is the same as the number of components 27 to be cooled, and there is a one-to-one correspondence between the liquid cooling plates 8 and the components 27 to be cooled. This reduces the size of the liquid cooling plates 8, saves costs, and further improves heat dissipation efficiency.

[0034] In one embodiment, a connecting plate 13 is provided between at least two adjacent liquid cooling plates 8, and the connecting plate 13 is connected between the two liquid cooling plates 8.

[0035] In this embodiment, a connecting plate 13 is connected between two adjacent liquid cooling plates 8. The connecting plate 13 acts as a bridge, which can tighten the two liquid cooling plates 8, prevent the liquid cooling plates 8 from shaking in the cooling chamber 7, and improve the stability of heat dissipation.

[0036] In one embodiment, the cooling device further includes an inlet pipe 16 and an outlet pipe 19, which are externally connected to the server housing 1.

[0037] The power unit 25 can deliver the first coolant in the refrigeration unit 24 to the liquid cooling plate 8 through the liquid inlet pipe 16, and can deliver the first coolant in the liquid cooling plate 8 to the refrigeration unit 24 through the liquid outlet pipe 19.

[0038] In this embodiment, the housing 1 is provided with a first through hole and a second through hole that communicate with the cooling chamber 7.

[0039] In this embodiment, one end of the inlet pipe 16 extends into the cooling chamber 7 and connects to the liquid cooling plate 8, while the other end protrudes from the housing 1 for connection to the power unit 25. One end of the outlet pipe 19 extends into the cooling chamber 7 and connects to the liquid cooling plate 8, while the other end protrudes from the housing 1 for connection to the power unit 25. The first coolant is delivered through the inlet pipe 16 and the outlet pipe 19, facilitating design and installation.

[0040] In this embodiment, the liquid inlet pipe 16 is externally connected to the server housing 1, meaning that the end of the liquid inlet pipe 16 away from the liquid cooling plate 8 is provided with a liquid inlet blind connector 4. The liquid inlet blind connector 4 is inserted into the first through hole. The end of the liquid inlet blind connector 4 away from the liquid cooling plate 8 has an interface, which is located on the outer surface of the housing 1. The cooling capacity distribution unit is connected to the interface of the liquid inlet blind connector 4.

[0041] In this embodiment, the liquid outlet pipe 19 is externally connected to the server housing 1, meaning that the end of the liquid outlet pipe 19 away from the liquid cooling plate 8 is provided with a liquid outlet blind connector 5. The liquid outlet blind connector 5 is inserted into the second through hole. The end of the liquid outlet blind connector 5 away from the liquid cooling plate 8 has an interface, which is located on the outer surface of the housing 1. The cooling capacity distribution unit is connected to the interface of the liquid outlet blind connector 5.

[0042] In one embodiment, the cooling device further includes an inlet branch pipe 14 and an outlet branch pipe 15, wherein the inlet branch pipe 14 is connected between the liquid cooling plate 8 and the inlet pipe 16, and the outlet branch pipe 15 is connected between the liquid cooling plate 8 and the outlet pipe 19.

[0043] In this embodiment, the liquid inlet pipe 16 includes a first section 17 and a second section 18. The first section 17 is connected between the liquid inlet blind connector 4 and the liquid cooling plate 8 near the first perforation. The liquid outlet pipe 19 includes a third section 20 and a fourth section 21. The third section 20 is connected between the liquid outlet blind connector 5 and the liquid cooling plate 8 near the second perforation.

[0044] In this embodiment, the inlet branch pipe 14 and the outlet branch pipe 15 are respectively arranged on both sides of the liquid cooling plate 8. The inlet branch pipe 14 is connected between the liquid cooling plate 8 and the second section 18. The first coolant is transported to the liquid cooling plate 8 via the inlet pipe 16 and the inlet branch pipe 14. The outlet branch pipe 15 is connected between the liquid cooling plate 8 and the fourth section 21. The liquid cooling plate 8 transports the first coolant to the outlet pipe 19 via the outlet branch pipe 15. This arrangement is convenient.

[0045] In one embodiment, the liquid cooling plate 8 includes a plate body 9 and a connecting lug 10. The plate body 9 is provided with a cavity for holding a first coolant, and the connecting lug 10 is detachably connected to the main board.

[0046] In this embodiment, the plate 9 is provided with a receiving cavity, in which the first coolant is contained. The connecting ear 10 is provided with a first connecting hole 11, which is connected to the main board 28 by screws for easy disassembly and assembly.

[0047] In one embodiment, the server further includes a support frame 26, which is mounted on the motherboard 28, and the liquid cooling plate 8 is detachably connected to the support frame 26.

[0048] In this embodiment, the support frame 26 protrudes from the motherboard 28, and there is a gap between the support frame 26 and the motherboard 28. The support frame 26 is provided with a second connecting hole, and the first connecting hole 11 is connected to the second connecting hole with a screw, making disassembly and assembly simple. In addition, the setting of the support frame 26 can increase the gap between the liquid cooling plate 8 and the motherboard 28, making it easier to install the heat dissipation component 27.

[0049] In one embodiment, the plate 9 is provided with a plurality of heat dissipation protrusions 12.

[0050] In this embodiment, a plurality of heat dissipation protrusions 12 are provided on the side of the plate 9 facing away from the motherboard 28. The heat dissipation protrusions 12 can increase the contact area between the liquid cooling plate 8 and the second coolant, and can increase the heat transfer between the liquid cooling plate 8 and the second coolant.

[0051] In one embodiment, the housing 1 consists of a bottom shell 3 and an upper shell 2, and the cooling chamber 7 is enclosed by the bottom shell 3 and the upper shell 2. This facilitates installation.

[0052] In one embodiment, the refrigeration unit 24 is a cooling tower and the power unit 25 is a cold energy distribution unit. Both the cooling tower and the cold energy distribution unit are existing technologies and will not be described in detail here.

[0053] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] In the server provided by this utility model embodiment, during operation, the power unit 25 can deliver the first coolant in the cooling unit 24 to the liquid cooling plate 8. A portion of the heat on the component to be cooled 27 is transferred to the second coolant, then to the housing 1, and then to the air. The first coolant in the liquid cooling plate 8 can make the temperature of the plate 9 of the liquid cooling plate 8 lower than the temperature of the component to be cooled 27, so that another portion of the heat on the component to be cooled 27 is transferred to the second coolant through the plate 9. The power unit 25 delivers the first coolant in the liquid cooling plate 8, which has increased in temperature, back to the cooling unit 24 for cooling, forming a cycle, thereby cooling the component to be cooled 27.

[0055] According to the server provided in this embodiment of the present invention, the cooling unit 24 can cool the first coolant, and the power unit 25 can transport the first coolant in the cooling unit 24 to the liquid cooling plate 8. The first coolant in the liquid cooling plate 8 can absorb the heat on the component 27 to be cooled in the server. The power unit 25 transports the first coolant in the liquid cooling plate 8, whose temperature has increased, back to the cooling unit 24 for cooling, forming a cycle, thereby cooling the component 27 to be cooled. Compared with the prior art, it does not require a large space to install the air cooling device, has a simple structure, is easy to arrange, and saves the internal space of the server. In addition, the liquid cooling plate 8 can directly contact the component 27 to be cooled without heat transfer through the air, which is beneficial to improving heat dissipation efficiency.

[0056] In addition, one embodiment of the present invention also provides the above-mentioned cooling device.

[0057] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A cooling device, characterized in that, The system includes a cooling unit, a power unit, and a liquid cooling plate. The liquid cooling plate is adapted to be mounted on the motherboard of the server. The cooling unit and the power unit are adapted to be arranged outside the server housing. The power unit is connected between the cooling unit and the liquid cooling plate. The power unit is used to deliver a first coolant from the cooling unit to the liquid cooling plate. The liquid cooling plate is used to cool the server's heat-dissipating components. The liquid cooling plate is provided in multiple quantities, and the number of liquid cooling plates is the same as the number of heat dissipation components of the server. The liquid cooling plate corresponds one-to-one with the heat dissipation components of the server. A connecting plate is provided between at least two adjacent liquid cooling plates, and the connecting plate connects the two liquid cooling plates.

2. The cooling device according to claim 1, characterized in that, The cooling device further includes an inlet pipe and an outlet pipe, which are adapted to be externally connected to the server housing. The power unit can transport the first coolant in the refrigeration unit to the liquid cooling plate through the liquid inlet pipe, and can transport the first coolant in the liquid cooling plate to the refrigeration unit through the liquid outlet pipe.

3. The cooling device according to claim 2, characterized in that, The cooling device further includes an inlet branch pipe and an outlet branch pipe, wherein the inlet branch pipe is connected between the liquid cooling plate and the inlet pipe, and the outlet branch pipe is connected between the liquid cooling plate and the outlet pipe.

4. The cooling device according to claim 1, characterized in that, The liquid cooling plate includes a plate body and a connecting lug. The plate body is provided with a cavity for holding the first coolant. The connecting lug is detachably connected to the motherboard of the server.

5. The cooling device according to claim 4, characterized in that, The plate is provided with multiple heat dissipation protrusions.

6. A server, characterized in that, The device includes a housing, a motherboard, a component to be cooled, and a cooling device as described in any one of claims 2 to 5, wherein the housing has a mounting cavity that forms a cooling chamber. The motherboard is installed in the mounting cavity, the component to be cooled is electrically connected to the motherboard, the liquid cooling plate is connected to the motherboard, and the side of the liquid cooling plate facing the motherboard contacts the component to be cooled.

7. The server according to claim 6, characterized in that, The server also includes an injection port and an exhaust port, which are connected to the mounting cavity. The injection port and the exhaust port are exposed outside the server housing. The mounting cavity contains a second coolant, which is used to cool the components to be cooled.

8. The server according to claim 6, characterized in that, It also includes a support frame, which is mounted on the motherboard, and the liquid cooling plate is detachably connected to the support frame.

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