Heat dissipation device and electronic device

Abstract

This application relates to the field of heat dissipation technology, providing a heat dissipation device and an electronic device. The heat dissipation device, applied in an electronic device, includes a heat dissipation duct, a cooling fan, and a heat spreader assembly. The heat dissipation duct is disposed within the electronic device, with its two ends connected to a first speaker hole and a second speaker hole, respectively. The first and second speaker holes serve as the air inlet and outlet of the heat dissipation duct. The cooling fan is disposed within the heat dissipation duct. The heat spreader assembly contacts the heat-generating element of the electronic device and is used to transfer heat from the heat-generating element into the heat dissipation duct. By reusing the first and second speaker holes of the electronic device as the air inlet and outlet, the heat dissipation duct eliminates the need for separate air inlets and outlets within the electronic device, ensuring effective heat dissipation while improving its appearance without affecting the overall openings and aesthetics.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and electronic device. Background Technology

[0002] Electronic devices (such as laptops and tablets) generate heat during operation. If this heat is not dissipated in time, it can lead to a decline in the device's performance. Therefore, to improve the heat dissipation capacity of electronic devices, they are usually equipped with cooling channels. Air inlets and outlets connected to these channels are located on both sides of the back cover of the device. However, modern electronic devices pursue a minimalist, non-destructive design (such as avoiding visible openings or gaps) to enhance visual aesthetics. The placement of these air inlets and outlets can affect the visual uniformity of the back cover, thus impacting the overall appearance of the electronic device. Utility Model Content

[0003] This application provides a heat dissipation device and an electronic device that can improve the appearance of the device while ensuring heat dissipation without affecting the overall opening and appearance.

[0004] In a first aspect, a heat dissipation device is provided for use in electronic devices, the heat dissipation device comprising:

[0005] A heat dissipation duct is disposed within the receiving cavity of the electronic device. The two ends of the heat dissipation duct are respectively connected to the first speaker hole and the second speaker hole of the electronic device. One of the first speaker hole and the second speaker hole serves as the air inlet of the heat dissipation duct, and the other serves as the air outlet of the heat dissipation duct.

[0006] A cooling fan is installed inside the cooling duct;

[0007] A heat spreader assembly is provided, which is in contact with the heat-generating element of the electronic device and is used to transfer the heat from the heat-generating element into the heat dissipation duct.

[0008] The heat dissipation device provided in this application reuses the first and second speaker holes of the electronic device as the air inlet and outlet, respectively. This eliminates the need for separate air inlets and outlets within the electronic device, fully utilizing the existing space and improving both heat dissipation and aesthetics without affecting the overall openings or appearance. The first and second speaker holes are typically important openings connecting the electronic device to the outside world, and their placement must consider acoustic effects (e.g., avoiding obstruction). Using these holes as the air inlet and outlet prevents blockage by user hands or external objects, facilitating smooth airflow. A cooling fan within the heat dissipation duct actively drives airflow, and combined with the through-duct structure, creates a directional and continuous air circulation. This quickly carries the heat absorbed by the heat-generating components from the heat-generating elements out of the electronic device, improving heat dissipation efficiency.

[0009] In one possible implementation, the heat spreader assembly includes a first heat sink that contacts a heat-generating element of the electronic device, a portion of the first heat sink is disposed on one side of the heat dissipation duct, and the side of the first heat sink forms the inner wall of the heat dissipation duct.

[0010] The side of the first heat sink directly forms the inner wall of the heat dissipation duct. When airflow passes through the duct, it directly exchanges heat with the surface of the first heat sink. Heat is transferred from the first heat sink to the flowing air and then carried out of the electronic device by the airflow. This reduces intermediate heat transfer steps and significantly improves heat dissipation efficiency. Furthermore, the first heat sink serves as both a heat-conducting element that directly absorbs heat and a structural component (inner wall) of the heat dissipation duct. Therefore, it eliminates the need for a separate inner wall material for the duct and for reserving redundant space between the first heat sink and the duct. This "structural reuse" design of the first heat sink greatly reduces the overall size of the heat dissipation system, allowing the heat dissipation device to fit into more compact internal layouts of electronic devices.

[0011] In one possible implementation, the heat dissipation device further includes heat dissipation fins disposed between the air outlet side of the cooling fan and the air outlet, and the heat dissipation fins are connected to the first heat dissipation plate.

[0012] By placing the heat dissipation fins on the exhaust side of the cooling fan and at the exhaust port of the cooling duct, the airflow from the cooling fan passes directly through the gaps between the fins. Residual heat in the first heat sink that is not carried away by the airflow can be conducted to the heat dissipation fins, and the heat on the surface of the fins is carried away through air convection. Compared to relying solely on the planar heat dissipation of the first heat sink, the "three-dimensional structure" of the heat dissipation fins allows for more thorough contact with the airflow, significantly increasing the heat dissipation per unit time.

[0013] In one possible implementation, at least a portion of the heat dissipation fins is positioned directly opposite the exhaust side of the cooling fan.

[0014] The exhaust side of a cooling fan is where airflow speed and pressure are strongest. With at least a portion of the cooling fins directly aligned with the exhaust side of the fan, most of the airflow from the fan can pass through the gaps between the fins at maximum speed. This significantly increases the contact area and time between the airflow and the fin surface, substantially improving the heat dissipation per unit time.

[0015] In one possible implementation, the heat sink fins have multiple airflow channels, each of which is connected to the air outlet. A portion of the airflow channels is connected to the air outlet side of the cooling fan, and another portion of the airflow channels is connected to the speaker module of the electronic device.

[0016] Part of the heatsink's airflow channels are directly connected to the exhaust side of the cooling fan, efficiently absorbing the fan's strong airflow and quickly removing heat from the fins, ensuring the efficient operation of the core heat dissipation path. Another part of the airflow channels is connected to the speaker module, allowing sound emitted by the speaker module to pass through the channels and be transmitted through the first or second speaker hole, ensuring the sound quality of the electronic device.

[0017] In some embodiments, the speaker module connected to the airflow channel of the heat sink fins can be a woofer module.

[0018] In one possible implementation, the heat spreader assembly further includes a second heat sink, which is in contact with the heat-generating element of the electronic device. The second heat sink and the first heat sink are spaced apart along the thickness direction of the electronic device. A portion of the second heat sink is disposed on one side of the heat dissipation duct, and the side of the second heat sink forms the inner wall of the heat dissipation duct.

[0019] The first and second heat sinks are symmetrically distributed on both sides of the centerline of the heat dissipation duct along the thickness direction of the electronic device. The sides of the first and second heat sinks form the inner walls of the heat dissipation duct. The first and second heat sinks can contact different heat-generating components, thus directly absorbing heat from different components (e.g., the first heat sink contacts the SOC, and the second heat sink contacts the battery). Different heat-generating components can be simultaneously cooled by the first and second heat sinks. Alternatively, the first and second heat sinks can contact different areas of the same heat-generating component, effectively increasing the heat dissipation path and improving efficiency. Since the sides of both the first and second heat sinks serve as the inner walls of the heat dissipation duct, the contact area with airflow is increased. Compared to a single heat sink, the amount of heat carried away by the airflow per unit time is significantly increased, thus improving heat dissipation efficiency.

[0020] In some embodiments, the first heat sink and the second heat sink can respectively contact different areas of the same heat-generating element. For example, when the heat-generating element is a circuit board (such as a motherboard), the first heat sink and the second heat sink can respectively contact the opposite sides of the motherboard. The heat from the motherboard of the electronic device can be transferred to the first heat sink and the second heat sink to the opposite sides, and then dissipated through the first heat sink and the second heat sink into the heat dissipation channel. In other embodiments, a System-on-a-Chip (SOC) is connected to one side of the motherboard. The first heat sink can contact the side of the motherboard opposite to the SOC, and the second heat sink can contact the side of the SOC opposite to the motherboard. In this case, most of the heat from the motherboard is dissipated by the first heat sink, and most of the heat from the SOC is dissipated by the second heat sink.

[0021] In one possible implementation, the first heat sink is annular, and the cooling fan is arranged within the annular area of ​​the first heat sink.

[0022] The inner side of the first heat sink with the annular structure can directly face the exhaust side of the cooling fan, enhancing the heat exchange effect between the airflow and the first heat sink. In addition, the first heat sink with the annular structure can be adapted to the arrangement of components inside electronic devices, so as to transfer the heat generated by the heat-generating components located outside the heat dissipation channel to the heat dissipation channel.

[0023] In other embodiments, the first heat sink is U-shaped, and the cooling fan is arranged within the area enclosed by the first heat sink. In still other embodiments, the first heat sink is L-shaped, and the cooling fan is arranged within the area inside the bend of the first heat sink. The shape of the first heat sink can be varied to ensure effective heat transfer and dissipation for the heat-generating element. In other embodiments, the first heat sink can also be other shapes, which are not limited in this application.

[0024] In some embodiments, the thickness of the first heat sink is 0.3 mm.

[0025] In some embodiments, the second heat sink is annular, and the cooling fan is arranged within the annular area of ​​the second heat sink.

[0026] The inner side of the ring-shaped second heat sink can directly face the exhaust side of the cooling fan, enhancing the heat exchange effect between the airflow and the second heat sink. In addition, the ring-shaped second heat sink can be adapted to the arrangement of components inside electronic devices to transfer the heat generated by heat-generating components located outside the heat dissipation channel to the inside of the heat dissipation channel.

[0027] In some embodiments, the second heat sink may also be U-shaped or L-shaped. The second heat sink and the first heat sink may have the same shape or different shapes. In addition, when the second heat sink and the first heat sink have the same shape, the dimensions of the second heat sink and the first heat sink may be the same or different.

[0028] In some embodiments, the thickness of the second heat sink is 0.3 mm.

[0029] In one possible implementation, at least a portion of the air intake side of the cooling fan is directly opposite the location of the camera decorative empty area of ​​the electronic device.

[0030] The camera decoration area itself has a certain amount of space. When the air intake side of the cooling fan is directly opposite the camera decoration area, the camera decoration area can provide a buffer for the airflow entering the cooling fan, effectively reducing the air pressure on the air intake side of the cooling fan, allowing more airflow to enter the cooling fan more smoothly, reducing the noise caused by airflow disturbance, achieving a balance between heat dissipation efficiency and low-noise operation, and increasing the air intake volume of the cooling fan.

[0031] In other embodiments, the air intake side of the cooling fan may be opposite to other empty areas within the electronic device, which is not limited in this application.

[0032] In one possible implementation, the receiving cavity includes a central region and an edge region surrounding the central region, with the heat dissipation duct arranged in the edge region.

[0033] Understandably, the edge area of ​​the housing is usually a relatively open area inside electronic devices. Placing the heat dissipation duct here reduces space conflicts with other core components (such as batteries and motherboards), simplifies layout, and provides a more complete airflow path, reducing bends or narrowing of the duct due to component obstruction and ensuring smooth airflow. Secondly, the edge area of ​​the housing is often close to the back cover, making it easier for heat from the heat dissipation duct to dissipate indirectly through the edge of the back cover, thus improving overall heat dissipation efficiency.

[0034] In one possible implementation, the inner wall of the heat dissipation duct is provided with a flow guiding structure.

[0035] The airflow guiding structure can guide the airflow along the centerline of the heat dissipation duct, reduce turbulence and irregular flow caused by the irregularity of the inner wall of the heat dissipation duct, reduce airflow resistance, and help improve heat dissipation efficiency.

[0036] In a second aspect, an electronic device is provided, including a frame, a screen, and a back cover. The frame is connected to the screen and the back cover respectively to enclose and form a receiving cavity. The frame is provided with a first speaker hole and a second speaker hole. The receiving cavity is provided with the aforementioned heat dissipation device. The two ends of the heat dissipation air duct of the heat dissipation device are respectively connected to the first speaker hole and the second speaker hole.

[0037] Since the heat dissipation device in the above embodiments uses the first speaker hole and the second speaker hole of the electronic device as the air inlet and air outlet of the heat dissipation air duct, the electronic device does not need to make additional openings. In this way, the space of the original structure of the electronic device can be fully utilized. Therefore, the electronic device containing this heat dissipation device can improve its appearance while ensuring the heat dissipation effect.

[0038] In one possible implementation, the electronic device further includes a battery disposed within the receiving cavity, the battery having a first surface, the frame having a first inner side surface opposite to the first surface, the first surface and the first inner side surface being spaced apart to form a portion of the heat dissipation duct, the first surface and the first inner side surface forming the inner wall of the heat dissipation duct.

[0039] Understandably, batteries are among the largest components in electronic devices. Integrating the gap between the battery and the cavity wall into a heat dissipation duct improves the compactness of the internal component layout and reduces the likelihood of compressing battery volume due to a separate duct design. During charging and discharging, the battery generates heat; its sides, acting as the inner wall of the heat dissipation duct, can directly carry away this heat through the airflow, reducing performance degradation caused by high temperatures. Furthermore, the battery casing (usually made of rigid material) and the cavity wall possess high structural strength. As the inner wall of the heat dissipation duct, both provide stable boundary support, reducing deformation caused by airflow impact or device vibration, thereby reducing airflow resistance.

[0040] In some embodiments, the sidewall of the receiving cavity may also be provided with a limiting member, which may abut against the side of the battery to limit the installation position of the battery.

[0041] In one possible implementation, the electronic device further includes a circuit board, a portion of which is disposed on one side of the heat dissipation duct, the side of which forms the inner wall of the heat dissipation duct.

[0042] Understandably, circuit boards are core components of electronic devices, occupying a certain amount of internal space. Using their sides as the inner walls of heat dissipation channels can improve the compactness of the component layout within the cavity. Circuit boards integrate a large number of heat-generating components; using their sides as the inner walls of heat dissipation channels can shorten the heat dissipation path, quickly transferring heat to the airflow within the channels and reducing fluctuations in circuit performance caused by localized high temperatures.

[0043] In one possible implementation, the back cover has a protrusion on one side away from the screen, and the area of ​​the back cover facing the screen corresponding to the protrusion is recessed to form a camera decorative void. The camera decorative void connects the first speaker hole and the second speaker hole to form part of the heat dissipation duct.

[0044] The camera decorative void itself has a certain amount of space. Connecting the camera decorative void to the first speaker hole and the second speaker hole makes the camera decorative void part of the heat dissipation channel, which allows more space inside the electronic device to participate in heat dissipation, thus helping to improve the heat dissipation effect.

[0045] In one possible implementation, the peripheral side of the protrusion is provided with a ventilation hole, which communicates with the decorative void area of ​​the camera.

[0046] The ventilation holes on the periphery of the protrusion provide an additional air exchange path for the camera module's decorative area: external air can enter the camera module's decorative area through the ventilation holes, merging with the airflow from the heat dissipation duct, increasing the airflow within the duct and accelerating heat dissipation. Furthermore, the protrusion design provides physical protection for the camera module, and placing the ventilation holes on the periphery of the protrusion reduces the impact of opening holes on the device's surface, thus maintaining its aesthetic integrity. The three-dimensional structure of the protrusion also allows for the concealment of any openings, enhancing the electronic device's appearance.

[0047] In one possible implementation, a bracket is provided on the side of the back cover away from the screen, and the orthographic projection of the heat dissipation duct on the side of the back cover avoids the orthographic projection of the bracket on the side of the back cover.

[0048] The bracket needs to have a certain volume and support strength. If the heat dissipation duct and the bracket's orthogonal projection on the side of the back cover overlap, they may encroach on each other's internal space, which is not conducive to reducing the thickness of the electronic device. By making the orthogonal projection of the heat dissipation duct on the side of the back cover avoid the orthogonal projection of the bracket on the side of the back cover, the two can be arranged independently in their respective space areas, which is conducive to reducing the thickness of the electronic device.

[0049] In one possible implementation, the electronic device has at least two heat dissipation ducts, which are spaced apart in a direction parallel to the screen.

[0050] It is understandable that electronic devices typically contain multiple distributed heat-generating components. Two spaced-apart cooling channels can specifically provide heat dissipation for different heat-generating areas, thus improving heat dissipation efficiency. The direction parallel to the screen is the main extension direction of electronic devices (especially tablets and ultrabooks). Arranging cooling channels at intervals along this direction can make full use of the horizontal or vertical space of the device, reducing the thickness of the device caused by stacking cooling channels in the thickness direction, which is beneficial to the thinner and lighter design of electronic devices.

[0051] In one possible implementation, the electronic device further includes an air guide structure disposed within the receiving cavity, the air guide structure being disposed on one side of the heat dissipation duct, and the side of the air guide structure forming the inner wall of the heat dissipation duct.

[0052] The sides of the air guide structure can be designed with specific shapes (such as smooth curved surfaces or gradual slopes) according to heat dissipation requirements. This actively guides airflow within the heat dissipation duct along a preset path, reducing airflow turbulence caused by natural bends in the duct or component obstructions. For example, a sloping air guide structure can be installed at bends in the heat dissipation duct; the sloping surface reduces airflow impact and turbulence. Furthermore, electronic devices have densely packed internal components (such as batteries, motherboards, and camera modules). Heat dissipation ducts often need to pass through the gaps between these components. Irregular shapes of adjacent components can easily create gaps, leading to airflow leakage. This results in some airflow being directly discharged without absorbing heat. The sides of the air guide structure, acting as the inner wall of the heat dissipation duct, can tightly fit around the surrounding components, filling these gaps and forming a relatively closed airflow channel, reducing airflow loss. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0054] Figure 2 A schematic diagram of the heat dissipation device provided in an embodiment of this application applied to an electronic device (with the screen hidden).

[0055] Figure 3 for Figure 2 The diagram shows another view of the heat dissipation device used in an electronic device (with the screen hidden).

[0056] Figure 4 for Figure 2 The diagram shows a heat dissipation device used in an electronic device (hiding the screen and cooling fan).

[0057] Figure 5for Figure 2 The diagram shows a heat dissipation device used in an electronic device (hiding the screen and heat-generating components).

[0058] Figure 6 A schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device.

[0059] Figure 7 This is a partial structural diagram of a heat dissipation device provided in another embodiment of the present application applied to an electronic device.

[0060] Figure 8 This is a schematic diagram of the cooling fan provided in an embodiment of this application.

[0061] Figure 9 A schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device (hiding the screen and heat-generating components).

[0062] Figure 10 A schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device (hiding the screen and heat-generating components).

[0063] Figure 11 A schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device (hiding the screen and heat-generating components).

[0064] Figure 12 This is a schematic diagram of the heat dissipation duct provided in an embodiment of this application.

[0065] Figure 13 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0066] Figure 14 for Figure 13 The diagram shows the structure of the electronic device (with the decorative panel hidden).

[0067] Figure 15 This is a schematic diagram of a heat dissipation device provided in another embodiment of this application, applied to an electronic device.

[0068] Figure 16 This is a schematic diagram of a heat dissipation device provided in another embodiment of this application, applied to an electronic device.

[0069] Figure 17 This is a schematic diagram of a heat dissipation device provided in another embodiment of this application, applied to an electronic device.

[0070] Figure 18 This is a schematic diagram of a heat dissipation device provided in another embodiment of this application, applied to an electronic device.

[0071] Figure label:

[0072] 100. Electronic devices;

[0073] 10. Screen;

[0074] 20. Frame; 201. First speaker hole; 202. Second speaker hole; 203. First inner side surface;

[0075] 30. Back cover; 301. Cover body; 3011. Through hole; 302. Enclosure; 3021. Ventilation hole; 303. Decorative panel; 304. Protrusion; 305. Camera decorative empty area;

[0076] 40. Receiving cavity; 401. Central region; 402. Edge region;

[0077] 50. Speaker module;

[0078] 60. Graphite sheet;

[0079] 70. Heating element; 701. SOC; 702. Circuit board; 703. Battery; 7031. First surface;

[0080] 1. Heat sink assembly; 11. First heat sink; 12. Second heat sink; 13. Heat dissipation fins; 131. Airflow channel;

[0081] 2. Heat dissipation duct; 21. Air outlet; 22. Air inlet;

[0082] 3. Cooling fan; 31. Exhaust side; 32. Intake side;

[0083] 41. Flow guiding structure; 42. Air guiding structure. Detailed Implementation

[0084] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0085] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0086] In the description of this application, it should be understood that the terms "upper", "lower", "side", "front", "rear", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0087] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0088] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0089] In today's era of rapid technological advancement, electronic devices are widely used in all aspects of people's lives and work. From everyday smartphones and tablets to professional servers and high-performance computers, these electronic devices are becoming increasingly powerful and their performance is constantly improving. However, with the increasing integration of electronic devices and the gradual increase in the operating power of functional modules, heat dissipation has become one of the key factors restricting further improvements in the performance of electronic devices.

[0090] Electronic devices (such as laptops and tablets) generate heat during operation. If this heat is not dissipated in time, it may lead to a decline in the performance of the electronic devices. Therefore, in order to improve the heat dissipation capacity of electronic devices, related technologies include internal heat dissipation devices, which include heat dissipation ducts. The back cover of the electronic device has air inlets and outlets on both sides that are connected to the heat dissipation ducts. A cooling fan is also installed inside the heat dissipation duct. When the cooling fan is activated, it generates an air pressure difference by rotating. External cool air is drawn into the heat dissipation duct through the air inlets. Inside the heat dissipation duct, the air flows along a predetermined route and carries away the heat. Finally, the air carrying the waste heat is discharged from the outlet, thereby maintaining the thermal balance inside the electronic device.

[0091] However, the placement of air inlets and outlets can affect the visual uniformity of electronic devices and their overall appearance.

[0092] Based on this, embodiments of this application provide a heat dissipation device and an electronic device to solve the above-mentioned problems.

[0093] The electronic devices provided in this application embodiment can be, for example, mobile phones, tablets, laptops, televisions, in-vehicle devices, wearable devices, personal digital assistants (PDAs), point-of-sale (POS) terminals, video surveillance equipment, and other terminals. Mobile phones can be, for example, conventional candybar phones or foldable phones, such as phones that fold vertically, fold horizontally inwards, or fold horizontally outwards. Wearable devices can be, for example, smart bracelets, smartwatches, wireless headphones, augmented reality (AR) glasses, AR headsets, virtual reality (VR) glasses, or VR headsets, etc.

[0094] This application uses a tablet computer as an example for illustration.

[0095] Figure 1 This is a schematic diagram of the structure of the electronic device 100 provided in the embodiments of this application; Figure 2 A schematic diagram of the heat dissipation device provided in an embodiment of this application applied to an electronic device 100 from one perspective (hidden screen 10).

[0096] Reference Figure 1 (a) and Figure 1 (b) (refer to the reference numerals in the attached figures) Figure 2 The electronic device 100 includes a frame 20, a back cover 30, and a screen 10. The back cover 30 and the screen 10 are opposite to each other and spaced apart. The two sides of the frame 20 are connected to the back cover 30 and the screen 10 respectively, so that the frame 20, the back cover 30, and the screen 10 can enclose a cavity 40. The cavity 40 can house components such as a central processing unit (CPU), a system-on-chip (SOC), a graphics processing unit (GPU), random access memory (RAM), a power supply, a hard disk, a voltage regulator module (VRM), a network interface controller (NIC), and a circuit board 702. For example, the cavity 40 can house an SOC 701, which can be connected to the screen 10 to control the content played on the screen 10.

[0097] In this embodiment of the application, the electronic device 100 is provided with a heat dissipation device, which can reduce the temperature of the components of the electronic device 100 to ensure the normal operation of the electronic device 100.

[0098] Figure 3 for Figure 2 The diagram shows another view of the heat dissipation device applied to electronic device 100 (with screen 10 hidden); Figure 4 for Figure 2 The diagram shows a heat dissipation device applied to an electronic device 100 (hiding the screen 10 and the cooling fan 3); Figure 5 for Figure 2 The diagram shows a heat dissipation device applied to an electronic device 100 (hiding the screen 10 and the heat-generating element 70).

[0099] Reference Figures 2 to 5 The heat dissipation device provided in this application embodiment is applied in an electronic device 100. The heat dissipation device includes a heat dissipation duct 2 and a heat spreader assembly 1. The heat dissipation duct 2 is disposed in the receiving cavity 40 of the electronic device 100. The two ends of the heat dissipation duct 2 are respectively connected to the first speaker hole 201 and the second speaker hole 202 of the electronic device 100. One of the first speaker hole 201 and the second speaker hole 202 serves as the air inlet 22 of the heat dissipation duct 2, and the other serves as the air outlet 21 of the heat dissipation duct 2. A cooling fan 3 is disposed in the heat dissipation duct 2. The heat spreader assembly 1 is in contact with the heating element 70 of the electronic device 100 and is used to transfer the heat of the heating element 70 into the heat dissipation duct.

[0100] Understandably, the heat dissipation duct 2 can be a channel inside the electronic device 100 designed to guide airflow and remove heat from within the electronic device 100. This heat can be absorbed by the heat-generating element 70 by the heat spreader assembly 1 and diffused to the heat dissipation duct 2.

[0101] It should be noted that the straight arrows in the diagram are used to indicate the direction of airflow.

[0102] It should be noted that the first speaker hole 201 and the second speaker hole 202 are respectively connected to the speaker module 50 of the electronic device 100, and the sound emitted by the speaker module 50 can be transmitted to the outside of the electronic device 100 through the first speaker hole 201 and the second speaker hole 202. In this embodiment, the first speaker hole 201 serves as the air outlet 21 of the heat dissipation duct 2, and the second speaker hole 202 serves as the air inlet 22 of the heat dissipation duct 2.

[0103] In some embodiments, the first speaker hole 201 and the second speaker hole 202 may be connected to the same speaker module 50 of the electronic device 100.

[0104] In other embodiments, the first speaker hole 201 and the second speaker hole 202 may be connected to different speaker modules 50 of the electronic device 100, respectively.

[0105] In this embodiment, the heat dissipation duct 2 and the speaker module 50 share the first speaker hole 201 and the second speaker hole 202. By rationally designing the internal structure of the duct (such as reducing direct interference between airflow and the diaphragm of the speaker module 50), the impact of heat dissipation airflow on the acoustic performance (such as sound quality and volume) of the speaker module 50 can be reduced. At the same time, the speaker module 50 itself may generate certain airflow disturbances during operation, which in some scenarios can even assist the airflow of the heat dissipation duct 2, achieving synergy between "heat dissipation" and "acoustics" functions, rather than mutual interference.

[0106] It should be noted that in some embodiments, the first speaker hole 201 and the second speaker hole 202 are respectively disposed at both ends of the electronic device 100, so that air can enter the heat dissipation duct 2 from one side of the electronic device 100 and then leave the heat dissipation duct 2 from the other side of the electronic device 100; in other embodiments, the first speaker hole 201 and the second speaker hole 202 can be disposed on the same side of the electronic device 100, so that the heat dissipation duct 2 is C-shaped as a whole, and the air entering the heat dissipation duct 2 can circulate around the receiving cavity 40 before leaving the electronic device 100.

[0107] It should be noted that when the cooling fan 3 starts, it can generate an air pressure difference to promote the rapid flow of air in the cooling duct 2. The cooling fan 3 can be a centrifugal fan, an axial fan, etc.

[0108] It should be noted that the heat-generating element 70 of the electronic device 100 can be a central processing unit (CPU), a system-on-chip (SOC), a graphics processing unit (GPU), random access memory (RAM), a power supply, a hard disk, a voltage regulator module (VRM), a network interface controller (NIC), a circuit board 702, or other components. In other words, the heat-generating element 70 of the electronic device 100 is any component that generates heat. The heat spreader assembly 1 contacts the heat-generating element 70 of the electronic device 100. This contact can be either a connection between the heat spreader assembly 1 and the heat-generating element 70, or a surface-to-surface contact between the heat spreader assembly 1 and the heat-generating element 70. However, there is no bonding force between them, and external force can separate them.

[0109] It should be noted that the heat dissipation duct 2 can be formed by the spacing between components within the electronic device 100, or it can be formed by a tube. The central empty area of ​​the tube forms the heat dissipation duct 2, and the openings at both ends of the tube are respectively connected to the first speaker hole 201 and the second speaker hole 202. In the embodiments of this application, as shown in the figure, the heat dissipation duct 2 can be formed by the spacing between components within the electronic device 100. For example, the inner side of the frame 20, the side wall of the heat spreader assembly 1, and other structures can serve as the inner wall of the heat dissipation duct 2.

[0110] It should be noted that the heat spreader assembly 1 can be a metal plate, a heat spreader (VC), a heat pipe, thermal grease, etc.

[0111] The heat dissipation device provided in this application embodiment reuses the first speaker hole 201 and the second speaker hole 202 of the electronic device 100 as the air inlet 22 and the air outlet 21. This eliminates the need to separately open the air inlet 22 and the air outlet 21 for the heat dissipation duct 2 in the electronic device 100. This makes full use of the space of the original structure of the electronic device 100, ensuring heat dissipation while improving its appearance without affecting the overall opening and appearance. The first speaker hole 201 and the second speaker hole 202 are usually important openings for the electronic device 100 to communicate with the outside world, and their position design needs to consider acoustic effects (such as avoiding obstruction). Using the first speaker hole 201 and the second speaker hole 202 as the air inlet 22 and the air outlet 21 of the heat dissipation duct 2 makes it less likely for the air inlet 22 and the air outlet 21 to be blocked by the user's hand or external objects, which is conducive to the smooth flow of air. The cooling fan 3 installed in the heat dissipation duct 2 can actively drive the airflow. Combined with the air duct structure that runs through both ends, it can form a directional and continuous air circulation, quickly carrying the heat absorbed by the heat dissipation plate assembly 1 from the heat-generating element 70 out of the electronic device 100 through the airflow, thereby improving the heat dissipation efficiency.

[0112] Reference Figures 2 to 4 The heating element 70 includes a State Optical Packet Charge (SOC) 701, which is mounted on a circuit board 702. In some embodiments, the SOC 701 can contact the heat spreader assembly 1 through the circuit board 702; in other embodiments, the SOC 701 can directly contact the heat spreader assembly 1. The illustrated SOC 701 contacts the heat spreader assembly 1 through the circuit board 702.

[0113] Figure 6 This is a schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device 100.

[0114] Reference Figure 5 and Figure 6In some embodiments, the heat spreader assembly 1 includes a first heat sink 11, which is in contact with the heat-generating element 70 of the electronic device 100. A portion of the first heat sink 11 is disposed on one side of the heat dissipation duct 2, and the side of the first heat sink 11 forms the inner wall of the heat dissipation duct 2.

[0115] It should be noted that the first heat sink 11 can be a metal plate, a vapor chamber (VC), etc. The first heat sink 11 can be directly connected to the SOC 701, or it can be connected to the SOC 701 through the circuit board 702. The first heat sink 11 shown in the figure is connected to the SOC 701 through the circuit board 702.

[0116] It should be noted that, in this embodiment, a portion of the first heat sink 11 is disposed on one side of the heat dissipation duct 2, and the side of this portion of the first heat sink 11 forms the inner wall of the heat dissipation duct 2. Another portion of the first heat sink 11 is disposed outside the heat dissipation duct 2, and this portion of the first heat sink 11 is connected to the heat-generating element 70 of the electronic device 100.

[0117] The side of the first heat sink 11 directly forms the inner wall of the heat dissipation duct 2. When the airflow passes through the heat dissipation duct 2, it can directly exchange heat with the surface of the first heat sink 11. Heat is transferred from the first heat sink 11 to the flowing air and then carried out of the electronic device 100 by the airflow. This reduces intermediate heat transfer links and significantly improves heat dissipation efficiency. In addition, the first heat sink 11 serves as both a heat-conducting element that directly absorbs heat and a structural component (inner wall) of the heat dissipation duct 2. It eliminates the need for additional design of inner wall material for the heat dissipation duct 2 and the need to reserve redundant space between the first heat sink 11 and the heat dissipation duct 2. The "structural reuse" design of the first heat sink 11 can greatly reduce the overall volume of the heat dissipation system, allowing the heat dissipation device to adapt to a more compact internal layout of the electronic device 100.

[0118] Figure 7 This is a partial structural diagram of a heat dissipation device provided in another embodiment of the present application applied to an electronic device 100.

[0119] Reference Figure 7 The heat dissipation plate assembly 1 also includes heat dissipation fins 13, which are disposed between the air outlet side 31 of the cooling fan 3 and the air outlet 21, and are connected to the first heat dissipation plate 11.

[0120] It should be noted that the heat dissipation fins 13 can be metal parts, such as aluminum fins, copper fins, etc., or they can be non-metal parts. In this case, the heat dissipation fins 13 can be made of non-metallic materials with high thermal conductivity, such as graphite.

[0121] It should be noted that the heat dissipation fins 13 can be welded to the first heat dissipation plate 11, or they can be bonded with thermally conductive adhesive.

[0122] Figure 8 This is a schematic diagram of the structure of the cooling fan 3 provided in an embodiment of this application.

[0123] Reference Figure 8 In this embodiment, the cooling fan 3 is a centrifugal fan, and the air outlet side 31 of the cooling fan 3 is located on the side of the cooling fan 3.

[0124] The heat dissipation fins 13 are positioned on the exhaust side 31 of the cooling fan 3 and the exhaust port 21 of the cooling duct. The airflow from the cooling fan 3 passes directly through the gaps in the heat dissipation fins 13. The remaining heat in the first heat sink 11 that is not carried away by the airflow can be conducted to the heat dissipation fins 13, and the heat on the surface of the heat dissipation fins 13 is carried away by air convection. Compared with the planar heat dissipation relying solely on the first heat sink 11, the "three-dimensional structure" of the heat dissipation fins 13 can form more sufficient contact with the airflow, significantly improving the heat dissipation per unit time.

[0125] In some embodiments, at least a portion of the heat sink 13 is positioned directly opposite the exhaust side 31 of the cooling fan 3.

[0126] It should be noted that "at least a portion of the heat dissipation fins 13 is directly opposite the exhaust side 31 of the cooling fan 3" means that a portion of the heat dissipation fins 13 is directly opposite the exhaust side 31 of the cooling fan 3, while another portion of the heat dissipation fins 13 is not directly opposite the exhaust side 31 of the cooling fan 3, or that the heat dissipation fins 13 are completely directly opposite the exhaust side 31 of the cooling fan 3.

[0127] The exhaust side 31 of the cooling fan 3 is the area with the strongest airflow speed and pressure. At least a portion of the heat dissipation fins 13 are directly opposite the exhaust side 31 of the cooling fan 3, which means that most of the airflow blown out by the cooling fan 3 can pass through the gaps between the heat dissipation fins 13 at the highest speed. The contact area and contact time between the airflow and the surface of the heat dissipation fins 13 are significantly increased, which can greatly improve the heat dissipation per unit time.

[0128] Continue to refer to Figure 7 The heat sink 13 has multiple airflow channels 131, each of which is connected to the air outlet 21. A portion of the airflow channels 131 is connected to the air outlet side 31 of the cooling fan 3, and another portion of the airflow channels 131 is connected to the speaker module 50 of the electronic device 100.

[0129] It should be noted that a portion of the airflow channel 131 is connected to the exhaust side 31 of the cooling fan 3, and another portion of the airflow channel 131 is connected to the speaker module 50 of the electronic device 100. At least one airflow channel 131 can be connected to both the exhaust side 31 of the cooling fan 3 and the speaker module 50 of the electronic device 100. A portion of the heat sink fins 13 can be aligned with the exhaust side 31 of the cooling fan 3, and another portion of the heat sink fins 13 can be aligned with the speaker module 50, thus achieving a connection between a portion of the airflow channel 131 and the exhaust side 31 of the cooling fan 3, and a connection between the other portion of the airflow channel 131 and the speaker module 50 of the electronic device 100.

[0130] Part of the airflow channel 131 of the heat sink 13 is directly connected to the exhaust side 31 of the cooling fan 3, which can efficiently receive the strong airflow of the fan and quickly remove the heat from the fins, ensuring the efficient operation of the core heat dissipation path. Another part of the airflow channel 131 is connected to the speaker module 50, which allows the sound emitted by the speaker module 50 to be transmitted through the airflow channel 131 and then through the first speaker hole 201 or the second speaker hole 202, ensuring the sound quality of the electronic device 100.

[0131] In some embodiments, the shape and size of the heat sink 13 can be specifically designed according to the arrangement of the cooling fan 3 and the speaker module 50, and this application embodiment does not impose any limitations on this.

[0132] In some embodiments, the speaker module 50 connected to the airflow channel 131 of the heat sink 13 may be a subwoofer module.

[0133] Figure 9 A schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device 100 (hiding the screen 10 and the heat-generating element 70).

[0134] Reference Figure 9 In some embodiments, the heat spreader assembly 1 further includes a second heat sink 12, which is in contact with the heat-generating element 70 of the electronic device 100. The second heat sink 12 and the first heat sink 11 are spaced apart along the thickness direction of the electronic device 100. A portion of the second heat sink 12 is disposed on one side of the heat dissipation duct 2, and the side of the second heat sink 12 forms the inner wall of the heat dissipation duct 2. The centerline of the heat dissipation duct 2 is located between the first heat sink 11 and the second heat sink 12.

[0135] It should be noted that the second heat sink 12 can be a metal plate, a vapor chamber (VC), etc. The second heat sink 12 can be connected to heat-generating components 70 other than SOC 701 (such as power supplies), or it can be connected to SOC 701 or connected to SOC 701 through circuit board 702. For example, SOC 701 and circuit board 702 can be sandwiched between the first heat sink 11 and the second heat sink 12.

[0136] The first heat sink 11 and the second heat sink 12 are symmetrically distributed on both sides of the center line of the heat dissipation duct 2 along the thickness direction of the electronic device 100. The sides of the first heat sink 11 and the second heat sink 12 form the inner wall of the heat dissipation duct 2. The first heat sink 11 and the second heat sink 12 can contact different heat-generating elements 70 respectively. In this way, the first heat sink 11 and the second heat sink 12 can directly absorb the heat from different heat-generating elements 70 (for example, the first heat sink 11 contacts the SOC 701, and the second heat sink 12 contacts the battery 703). Thus, different heat-generating elements 70 can be simultaneously cooled by the first heat sink 11 and the second heat sink 12. Of course, the first heat sink 11 and the second heat sink 12 can also contact different areas of the same heat-generating element 70 respectively. This is equivalent to increasing the heat dissipation path of the heat-generating element 70 and improving the heat dissipation efficiency. The sides of the first heat sink 11 and the second heat sink 12 both serve as the inner wall of the heat dissipation duct 2, which can increase the contact area with the airflow. Compared with a single heat sink, the heat carried away by the airflow per unit time is significantly increased, thus improving the heat dissipation efficiency.

[0137] In some embodiments, the first heat sink 11 and the second heat sink 12 can respectively contact different areas of the same heat-generating element 70. For example, when the heat-generating element 70 is a circuit board 702 (such as a motherboard), the first heat sink 11 and the second heat sink 12 can respectively contact the opposite sides of the motherboard. The heat of the motherboard of the electronic device 100 can be transferred to the first heat sink 11 and the second heat sink 12 on both sides, and then transferred to the heat dissipation air duct 2 by the first heat sink 11 and the second heat sink 12 to achieve heat dissipation. In other embodiments, a SOC 701 is connected to one side of the motherboard. The first heat sink 11 can contact the side of the motherboard away from the SOC 701, and the second heat sink 12 can contact the side of the SOC 701 away from the motherboard. In this case, most of the heat of the motherboard is dissipated by the first heat sink 11, and most of the heat of the SOC 701 is dissipated by the second heat sink 12.

[0138] Reference Figure 5 In some embodiments, the first heat sink 11 is annular, and the cooling fan 3 is arranged within the annular area of ​​the first heat sink 11.

[0139] It should be noted that components other than the cooling fan 3 can also be arranged in the annular area of ​​the first heat sink 11. The power supply of the electronic device 100 shown in the figure is also arranged in the annular area of ​​the first heat sink 11.

[0140] The inner side of the first heat sink 11 with the annular structure can directly face the air outlet side 31 of the cooling fan 3, which enhances the heat exchange effect between the airflow and the first heat sink 11. In addition, the first heat sink 11 with the annular structure can be adapted to the arrangement of components in the electronic device 100 to transfer the heat generated by the heat-generating component 70 located outside the heat dissipation duct 2 to the heat dissipation duct 2.

[0141] Figure 10 A schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device 100 (hiding the screen 10 and the heat-generating element 70); Figure 11 A schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device 100 (hiding the screen 10 and the heat-generating element 70).

[0142] Reference Figure 10 In other embodiments, the first heat sink 11 is U-shaped, and the cooling fan 3 is arranged within the area enclosed by the first heat sink 11, as shown in the figure. Figure 11 In some embodiments, the first heat sink 11 is L-shaped, and the cooling fan 3 is arranged in the inner area of ​​the bend of the first heat sink 11. The shape of the first heat sink 11 can be varied to ensure the heat transfer and heat dissipation effect of the heat-generating element 70. In other embodiments, the first heat sink 11 can also be other shapes, which are not limited in this application.

[0143] In some embodiments, the thickness of the first heat sink 11 is 0.3 mm.

[0144] In some embodiments, the second heat sink 12 is annular, and the cooling fan 3 is arranged within the annular area of ​​the second heat sink 12.

[0145] The inner side of the second heat sink 12 with the annular structure can directly face the air outlet side 31 of the cooling fan 3, which enhances the heat exchange effect between the airflow and the second heat sink 12. In addition, the second heat sink 12 with the annular structure can be adapted to the arrangement of components in the electronic device 100 to transfer the heat generated by the heat-generating component 70 located outside the heat dissipation duct 2 to the heat dissipation duct 2.

[0146] In some embodiments, the second heat sink 12 may also be U-shaped or L-shaped. The second heat sink 12 and the first heat sink 11 may have the same shape or different shape. In addition, when the second heat sink 12 and the first heat sink 11 have the same shape, the dimensions of the second heat sink 12 and the first heat sink 11 may be the same or different.

[0147] In some embodiments, the thickness of the second heat sink 12 is 0.3 mm.

[0148] Reference Figures 2 to 4 In some embodiments, the receiving cavity 40 includes a central region 401 and an edge region 402 surrounding the central region 401, and the heat dissipation duct 2 is arranged in the edge region 402 of the receiving cavity 40.

[0149] Understandably, the edge area 402 of the receiving cavity 40 is usually a relatively open area inside the electronic device 100. Placing the heat dissipation duct 2 here can reduce space conflicts with other core components (such as the battery 703 and the motherboard), reduce layout difficulty, and at the same time reserve a more complete airflow path for the heat dissipation duct 2, reducing the bending or narrowing of the heat dissipation duct 2 caused by component obstruction, and ensuring smooth airflow. Secondly, the edge area 402 of the receiving cavity 40 is often close to the back cover 30, and the heat in the heat dissipation duct 2 can be more easily dissipated indirectly through the edge of the back cover 30, thus improving the overall heat dissipation efficiency.

[0150] Figure 12 This is a schematic diagram of the heat dissipation duct 2 provided in an embodiment of this application.

[0151] Reference Figure 12 In some embodiments, the inner wall of the heat dissipation duct 2 is provided with a flow guiding structure 41.

[0152] It should be noted that the flow guiding structure 41 can be a protrusion or groove set on the inner wall of the heat dissipation duct 2, and the surface shape of the flow guiding structure 41 can be streamlined, etc.

[0153] The airflow guiding structure 41 can guide the airflow along the centerline of the heat dissipation duct 2, reduce turbulence and turbulence caused by the irregularity of the inner wall of the heat dissipation duct 2, reduce airflow resistance, and help improve heat dissipation efficiency.

[0154] Figure 13 This is a schematic diagram of the structure of the electronic device 100 provided in the embodiments of this application; Figure 14 for Figure 13 A schematic diagram of the structure of the electronic device 100 shown (with hidden decorative panel 303).

[0155] Reference Figure 12 and Figure 13In some embodiments, the back cover 30 of the electronic device 100 has a protrusion 304 on the side facing away from the screen 10, and the area of ​​the back cover 30 facing the screen 10 corresponding to the protrusion 304 is recessed to form a camera decorative empty area 305. In the embodiments of this application, the back cover 30 includes a cover body 301, a surrounding wall 302, and a decorative panel 303. The cover body 301 has a through hole 3011, the surrounding wall 302 is disposed on the side of the cover body 301 facing away from the screen 10 and is connected to the hole wall of the through hole 3011, and the decorative panel 303 is connected to the side of the surrounding wall 302 facing away from the cover body 301. Thus, the surrounding wall 302 and the decorative panel 303 together form the aforementioned protrusion 304, and the empty area in the middle of the surrounding wall 302 forms the aforementioned camera decorative empty area 305.

[0156] In some embodiments, at least a portion of the air intake side 32 of the cooling fan 3 is directly opposite the camera decorative void 305 of the electronic device 100.

[0157] The camera decoration void 305 itself has a certain amount of space. When the air intake side 32 of the cooling fan 3 is directly opposite the camera decoration void 305, the camera decoration void 305 can provide a buffer for the airflow entering the cooling fan 3, effectively reducing the wind pressure on the air intake side 32 of the cooling fan 3, allowing more airflow to enter the cooling fan 3 more smoothly, reducing the noise caused by airflow disturbance, achieving a balance between heat dissipation efficiency and low noise operation, and increasing the air intake volume of the cooling fan 3.

[0158] In other embodiments, the air intake side 32 of the cooling fan 3 may also be opposite to other empty areas within the electronic device 100, which is not limited in this application embodiment.

[0159] In this embodiment, the airflow can first pass through the camera decoration void 305 and then enter the cooling fan 3, thus the camera decoration void 305 forms part of the cooling air duct 2.

[0160] This application embodiment also provides an electronic device 100, including a frame 20, a back cover 30 and a screen 10. The frame 20 is connected to the back cover 30 and the screen 10 to form a receiving cavity 40. The frame 20 is provided with a first speaker hole 201 and a second speaker hole 202. The receiving cavity 40 is provided with a heat dissipation device as described in any of the above embodiments. The two ends of the heat dissipation air duct 2 of the heat dissipation device are respectively connected to the first speaker hole 201 and the second speaker hole 202.

[0161] It should be noted that the frame 20 and the back cover 30 can be two separate parts or a single piece.

[0162] Since the heat dissipation device in the above embodiment uses the first speaker hole 201 and the second speaker hole 202 of the electronic device 100 as the air inlet 22 and the air outlet 21 of the heat dissipation air duct 2, the electronic device 100 does not need to make additional openings. In this way, the space of the original structure of the electronic device 100 can be fully utilized. Therefore, the electronic device 100 containing this heat dissipation device can improve its appearance while ensuring the heat dissipation effect.

[0163] In this embodiment, the heat dissipation duct 2 can be formed by the gaps between components or parts within the electronic device 100. Other components or parts within the electronic device 100 can also form the inner wall of the heat dissipation duct 2. This embodiment does not impose any limitations on this.

[0164] In some embodiments, a protrusion 304 is provided on the side of the back cover 30 away from the screen 10, and a recess is formed in the area of ​​the protrusion 304 on the side of the back cover 30 facing the screen 10 to form a camera decorative void 305. The camera decorative void 305 is connected to the first speaker hole 201 and the second speaker hole 202 to form part of the heat dissipation channel 2.

[0165] The camera decorative void 305 itself has a certain amount of space. Connecting the camera decorative void 305 to the first speaker hole 201 and the second speaker hole 202 makes the camera decorative void 305 form part of the heat dissipation channel 2, which allows more space inside the electronic device 100 to participate in heat dissipation, thus helping to improve the heat dissipation effect.

[0166] In this embodiment of the application, the back cover 30 includes a cover body 301, a surrounding wall 302, and a decorative panel 303. The cover body 301 is provided with a through hole 3011. The surrounding wall 302 is disposed on the side of the cover body 301 away from the screen 10 and is connected to the hole wall of the through hole 3011. The decorative panel 303 is connected to the side of the surrounding wall 302 away from the cover body 301. Thus, the surrounding wall 302 and the decorative panel 303 together form the aforementioned protrusion 304, and the empty area in the middle of the surrounding wall 302 forms the aforementioned camera decorative empty area 305.

[0167] Continue to refer to Figure 13 and Figure 14 The convex part 304 has a ventilation hole 3021 on its peripheral side, and the ventilation hole 3021 is connected to the camera decorative void 305.

[0168] In this embodiment, ventilation holes 3021 are provided on the enclosure wall 302.

[0169] It should be noted that the cross-sectional shape of the ventilation hole 3021 can be a regular or irregular shape such as a circle, ellipse, semicircle, fan shape, waist-shaped hole, triangle, quadrilateral, pentagon, or hexagon.

[0170] The ventilation holes 3021 on the periphery of the protrusion 304 provide an additional air exchange path for the camera decorative void 305: external air can enter the camera decorative void 305 through the ventilation holes 3021, and merge with the airflow from the heat dissipation duct 2, increasing the airflow in the heat dissipation duct 2 and accelerating heat dissipation. In addition, the design of the protrusion 304 can provide physical protection for the camera module, and placing the ventilation holes 3021 on the periphery of the protrusion 304 reduces the impact of opening holes on the device plane on the appearance integrity, and can also use the three-dimensional structure of the protrusion 304 to hide the holes, improving the appearance of the electronic device 100.

[0171] In some embodiments, the enclosure 302 may have only one ventilation hole 3021, while in other embodiments, the enclosure 302 may have two or more ventilation holes 3021. The ventilation holes 3021 may be concentrated in a certain area of ​​the enclosure 302, or they may be evenly spaced around the camera decorative empty area 305.

[0172] Figure 15 This is a schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device 100.

[0173] Reference Figures 2 to 4 , Figure 15 In some embodiments, the electronic device 100 further includes a battery 703 disposed in a receiving cavity 40. The battery 703 has a first surface 7031, and the frame 20 has a first inner side surface 203 opposite to the first surface 7031. The first surface 7031 and the first inner side surface 203 are spaced apart to form a heat dissipation duct 2. The side of the battery 703 and the cavity wall of the receiving cavity 40 form the inner wall of the heat dissipation duct 2.

[0174] Understandably, battery 703 is one of the larger components in electronic device 100. Converting the gap between battery 703 and the cavity wall of housing 40 into part of the heat dissipation duct 2 improves the compactness of the component layout within housing 40 and reduces the possibility of compressing battery 703's volume due to a separate duct design. Battery 703 generates heat during charging and discharging; its side, serving as the inner wall of heat dissipation duct 2, can directly carry away this heat through the flowing air, reducing performance degradation caused by high temperatures. Furthermore, the outer casing of battery 703 (typically made of rigid material) and the cavity wall of housing 40 both possess high structural strength. As the inner wall of heat dissipation duct 2, they provide stable boundary support, reducing deformation caused by airflow impact or device vibration, thereby reducing airflow resistance.

[0175] In some embodiments, the sidewall of the receiving cavity 40 may also be provided with a limiting member, which may abut against the side of the battery 703 to limit the installation position of the battery 703.

[0176] Continue to refer to Figure 15 The electronic device 100 also includes a graphite sheet 60. Two graphite sheets 60 can be provided. The two graphite sheets 60 can be connected to the first heat sink 11 and the second heat sink 12 respectively. A part of the graphite sheet 60 can also be provided on one side of the heat dissipation channel 2 so that the side of the graphite sheet 60 forms the inner wall of the heat dissipation channel 2.

[0177] In some embodiments, the thickness of the graphite sheet 60 may be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, or 0.09 mm.

[0178] Figure 16 This is a schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device 100.

[0179] Reference Figure 16 In some embodiments, the electronic device 100 also includes a circuit board 702, a portion of which is disposed on one side of the heat dissipation duct 2, and the side of the circuit board 702 forms the inner wall of the heat dissipation duct 2.

[0180] It should be noted that circuit board 702 can be the motherboard of electronic device 100, which can be connected to SOC 701, CPU, etc.; circuit board 702 can also be the front camera board of electronic device 100, which can be connected to the camera module of electronic device 100; circuit board 702 can also be the rear camera board of electronic device 100, which can be connected to the camera module of electronic device 100; in addition, circuit board 702 can also be the antenna board, which can be connected to the antenna structure of electronic device 100.

[0181] Understandably, circuit board 702 is a core component of electronic device 100, occupying a certain amount of internal space. Using its side as the inner wall of heat dissipation duct 2 can improve the compactness of the component layout within the housing cavity 40. Circuit board 702 integrates a large number of heat-generating components 70. Using its side as the inner wall of heat dissipation duct 2 can shorten the heat dissipation path, quickly transferring heat to the airflow in heat dissipation duct 2 and reducing circuit performance fluctuations caused by localized high temperatures.

[0182] In this embodiment, the heat dissipation duct 2 can be formed by the gaps between components or parts within the electronic device 100. Other components or parts within the electronic device 100 can also form the inner wall of the heat dissipation duct 2. For example, the surface of the speaker module 50, the surface of the cooling fan 3, etc., can all form the inner wall of the heat dissipation duct 2. This embodiment does not impose any limitations on this.

[0183] In some embodiments, a bracket (not shown in the figure) is provided on the side of the back cover 30 away from the screen 10, and the orthographic projection of the heat dissipation duct 2 on the side of the back cover 30 avoids the orthographic projection of the bracket on the side of the back cover 30.

[0184] It should be noted that when the bracket is unfolded, it can be used to support the electronic device 100 so that the electronic device 100 has a more suitable tilt angle.

[0185] It should be noted that orthographic projection refers to the projection of an object onto a projection plane when the projection lines are perpendicular to the projection plane. Specifically, assuming there is a plane as the projection plane, perpendicular lines (i.e., projection lines) are drawn from various points of the object to this projection plane. The figure formed by connecting the intersections of these perpendicular lines with the projection plane is the orthographic projection of the object. The orthographic projections of the heat dissipation duct 2 and the bracket on the side of the back cover 30 are the projection figures formed on that side after the side of the back cover 30 is used as the projection plane, and the heat dissipation duct 2 and the bracket are each projected perpendicularly onto this side.

[0186] The bracket needs to have a certain volume and support strength. If the projection of the heat dissipation duct 2 on the side of the bracket overlaps with the projection of the bracket on the side of the back cover 30, it may cause the two to encroach on each other's internal space, which is not conducive to reducing the thickness of the electronic device 100. By making the projection of the heat dissipation duct 2 on the side of the back cover 30 avoid the projection of the bracket on the side of the back cover 30, the two can be arranged independently in their respective spatial areas, which is conducive to reducing the thickness of the electronic device 100.

[0187] In this embodiment, along the thickness direction of the electronic device 100 (i.e., the Z-axis direction shown in the figure), the heat dissipation duct 2 can be located closer to the screen 10, that is, the heat dissipation duct 2 is closer to the screen 10, or it can be located closer to the back cover 30, that is, the heat dissipation duct 2 is closer to the back cover 30. In addition, the heat dissipation duct 2 can also be located in the middle area of ​​the electronic device 100, that is, the distance between the heat dissipation duct 2 and the screen 10 and the back cover 30 is similar or equal.

[0188] Figure 17 This is a schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device 100.

[0189] Reference Figure 17 The electronic device 100 has at least two heat dissipation ducts 2, which are arranged at intervals along a direction parallel to the screen 10.

[0190] It should be noted that a cooling fan 3 is provided for each heat dissipation duct 2. When there is one first heat sink 11, different areas of the first heat sink 11 can be located on the sides of the two heat dissipation ducts 2, so that different areas on the sides of the first heat sink 11 respectively form the inner walls of the two heat dissipation ducts 2. The illustrated electronic device 100 has two heat dissipation ducts 2. In other embodiments, the electronic device 100 may also have three, four or even more heat dissipation ducts 2. This application embodiment does not impose any limitations on this.

[0191] It is understandable that electronic devices 100 typically contain multiple distributed heat-generating components 70. Two spaced heat dissipation channels 2 can provide targeted heat dissipation for different heat-generating areas, thereby improving heat dissipation efficiency. The direction parallel to the screen 10 is the main extension direction of electronic devices 100 (especially tablets and ultrabooks). Arranging heat dissipation channels 2 at intervals along this direction can make full use of the horizontal or vertical space of the device, reducing the thickness of the device caused by stacking heat dissipation channels 2 in the thickness direction, which is beneficial to the thinner and lighter design of electronic devices 100.

[0192] Figure 18 This is a schematic diagram of the structure of a heat dissipation device provided in another embodiment of this application applied to an electronic device 100.

[0193] Reference Figure 18 The electronic device 100 also includes an air guide structure 42, which is disposed in the receiving cavity 40 and on one side of the heat dissipation duct 2, and the side of the air guide structure 42 forms the inner wall of the heat dissipation duct 2.

[0194] It should be noted that the air guide structure 42 can be made of soft rubber, foam, etc.

[0195] The sides of the air guide structure 42 can be designed with specific shapes (such as smooth curved surfaces or gradual slopes) according to heat dissipation requirements. This can actively guide the airflow within the heat dissipation duct 2 along a preset path, reducing airflow turbulence caused by natural bends in the heat dissipation duct 2 or component obstructions. For example, an air guide structure 42 with a slope can be installed at the bend of the heat dissipation duct 2. The slope of the air guide structure 42 can reduce airflow impact and turbulence. In addition, the internal components of the electronic device 100 are densely packed (such as the battery 703, motherboard, and camera module). The heat dissipation duct 2 often needs to pass through the gaps between these components. Gaps can easily form due to the irregular shapes of adjacent components, leading to airflow leakage. This causes some airflow to be discharged directly without absorbing heat. The sides of the air guide structure 42, acting as the inner wall of the heat dissipation duct 2, can closely fit the surrounding components, fill these gaps, and form a relatively closed airflow channel, reducing airflow loss.

[0196] In this embodiment, the air guide structure 42 is disposed between the air inlet 22 and the battery 703.

[0197] In this embodiment, when the overall thickness of the electronic device 100 is less than 5mm, the heat dissipation performance can be improved to over 12W.

[0198] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device, used in electronic devices, includes: A heat dissipation duct is disposed within the receiving cavity of the electronic device. The two ends of the heat dissipation duct are respectively connected to the first speaker hole and the second speaker hole of the electronic device. One of the first speaker hole and the second speaker hole serves as the air inlet of the heat dissipation duct, and the other serves as the air outlet of the heat dissipation duct. A cooling fan is installed inside the cooling duct; A heat spreader assembly is provided, which is in contact with the heat-generating element of the electronic device and is used to transfer the heat from the heat-generating element into the heat dissipation duct.

2. The heat dissipating device according to claim 1, wherein The heat spreader assembly includes a first heat sink, which is in contact with the heat-generating element of the electronic device. A portion of the first heat sink is disposed on one side of the heat dissipation duct, and the side of the first heat sink forms the inner wall of the heat dissipation duct.

3. The heat dissipating device according to claim 2, wherein The heat dissipation device further includes heat dissipation fins, which are disposed between the air outlet side of the cooling fan and the air outlet, and are connected to the first heat dissipation plate.

4. The heat dissipating device according to claim 3, wherein At least a portion of the heat dissipation fins are positioned directly opposite the exhaust side of the cooling fan.

5. The heat dissipating device according to claim 3 or 4, characterized in that The heat dissipation fins have multiple airflow channels, each of which is connected to the air outlet. A portion of the airflow channels is connected to the air outlet side of the cooling fan, and another portion of the airflow channels is connected to the speaker module of the electronic device.

6. The heat dissipating device according to any one of claims 2 to 5, wherein The heat spreader assembly further includes a second heat sink, which is in contact with the heat-generating element of the electronic device. The second heat sink and the first heat sink are spaced apart along the thickness direction of the electronic device. A portion of the second heat sink is disposed on one side of the heat dissipation duct, and the side of the second heat sink forms the inner wall of the heat dissipation duct.

7. The heat dissipating device according to any one of claims 2 to 6, wherein The first heat sink is ring-shaped, and the cooling fan is arranged within the ring-shaped area of ​​the first heat sink.

8. The heat dissipating device according to any one of claims 1 to 7, wherein At least a portion of the air intake side of the cooling fan is directly opposite the location of the camera decorative empty area of ​​the electronic device.

9. The heat dissipating device according to any one of claims 1 to 8, wherein The cavity includes a central region and an edge region surrounding the central region, with the heat dissipation duct arranged in the edge region.

10. The heat dissipating device according to any one of claims 1 to 9, wherein The inner wall of the heat dissipation duct is provided with a flow guiding structure.

11. An electronic device, comprising a frame, a screen, and a back cover, wherein the frame is connected to the screen and the back cover respectively to enclose a receiving cavity, and the frame is provided with a first speaker hole and a second speaker hole, characterized in that, The cavity is provided with a heat dissipation device as described in any one of claims 1-10, and the two ends of the heat dissipation air duct of the heat dissipation device are respectively connected to the first speaker hole and the second speaker hole.

12. The electronic device of claim 11, wherein, The electronic device further includes a battery disposed within the receiving cavity, the battery having a first surface, the frame having a first inner side surface opposite to the first surface, the first surface and the first inner side surface being spaced apart to form a portion of the heat dissipation duct, the first surface and the first inner side surface forming the inner wall of the heat dissipation duct.

13. The electronic device of claim 11 or 12, wherein, The electronic device also includes a circuit board, a portion of which is disposed on one side of the heat dissipation duct, and the side of the circuit board forms the inner wall of the heat dissipation duct.

14. The electronic device according to any one of claims 11-13, characterized in that, The back cover has a protrusion on one side away from the screen, and the area of ​​the back cover facing the screen is recessed to form a camera decorative void. The camera decorative void connects the first speaker hole and the second speaker hole to form part of the heat dissipation channel.

15. The electronic device of claim 14, wherein, The convex part has ventilation holes on its peripheral side, and the ventilation holes are connected to the decorative void area of ​​the camera.

16. The electronic device of any of claims 11-15, wherein, A bracket is provided on the side of the back cover away from the screen, and the projection of the heat dissipation duct on the side of the back cover avoids the projection of the bracket on the side of the back cover.

17. The electronic device according to any one of claims 11-16, characterized in that, The electronic device has at least two heat dissipation ducts, which are arranged at intervals along a direction parallel to the screen.

18. The electronic device of any of claims 11-17, wherein, The electronic device further includes an air guide structure disposed within the receiving cavity, the air guide structure being disposed on one side of the heat dissipation duct, and the side of the air guide structure forming the inner wall of the heat dissipation duct.

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