An ultra-thin computer host heat dissipation device

Abstract

The utility model discloses a kind of ultra-thin computer mainframe heat dissipation devices, it is related to computer heat dissipation technical field, including mechanism box, the inside middle part of mechanism box is fixedly connected with semiconductor refrigeration flat sheet, the upside of semiconductor refrigeration flat sheet is equipped with temperature guide table, the position of the inside of mechanism box close to bottom is equipped with heat plate, the rear side of mechanism box is fixedly connected with heat dissipation mechanism.The ultra-thin computer mainframe heat dissipation device of the utility model, by semiconductor refrigeration flat sheet directly to heat plate cooling, and with the temperature transfer of temperature guide plate outside, so it can quickly cool, and rely on air guide table, so that heat dissipation fan and mechanism table are horizontally placed, since the form of heat plate is used, the thickness of copper pipe is reduced, relies on juxtaposition, so that the total thickness is the total thickness of heat dissipation fan and air guide table, it is achieved in the total thickness is not big, improves heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation technology, and in particular to an ultra-thin computer host heat dissipation device. Background Technology

[0002] Computer cooling systems typically include components such as fans, heat sinks, and heat pipes. For example, air-cooled heat sinks rely on the rotation of fans to accelerate airflow and remove heat from the CPU or other heat-generating components. Heat pipe heat sinks, on the other hand, use the principle of liquid evaporation and condensation to quickly transfer heat to the heat sink, which is then dissipated by the fan.

[0003] The existing technology has the following problems: Some existing heat pipe cooling methods have a certain thickness, occupying a large portion of the space, while some thinner cooling methods, such as the cooling mechanism inside a laptop, place the fan and copper pipe side by side, resulting in poor heat dissipation. Utility Model Content

[0004] This invention provides an ultra-thin computer host heat dissipation device to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: An ultra-thin computer host heat dissipation device includes a mechanism box, a semiconductor cooling plate fixedly connected to the middle of the inner side of the mechanism box, a temperature guiding platform provided on the upper side of the semiconductor cooling plate, a heat dissipation plate provided near the bottom of the inner side of the mechanism box, a heat dissipation mechanism fixedly connected to the rear side of the mechanism box, and a micro fluid pump fixedly connected to the middle of the left side of the mechanism box. The heat dissipation mechanism includes a platform, the front side of which is fixedly connected to the rear side of the mechanism box near the bottom. Several cooling fans distributed on the left and right are movably sleeved on the inner side of the platform, and an air guide is attached to the upper side of the cooling fans.

[0006] Preferably, two locking strips are fixedly connected to the upper side of the mechanism platform near the left and right sides, and the outer sides of the locking strips are movably sleeved on the inner sides of the bottom of the left and right walls of the air guide platform.

[0007] Preferably, an insert plate is movably sleeved inside the rear side of the air guide platform, and a push plate is slidably connected inside the rear side of the air guide platform, with the push plate located in front of the insert plate. Several horizontally distributed inclined grooves are opened on the front side of the insert plate, and the rear circular shaft of the push plate is slidably connected to the inner side of the inclined grooves. A spring is provided on the left side of the push plate.

[0008] Preferably, a first dustproof plate is embedded in the lower inner surface of the mechanism platform, and a second dustproof plate is fixedly connected to the front side of the mechanism box.

[0009] Preferably, rubber pads are fixedly connected to the upper and lower sides of several cooling fans near the edges.

[0010] Preferably, the inner upper surface of the air guide is rotatably connected with a plurality of rectangularly distributed ball bearings.

[0011] Preferably, the inner wall of the mechanism platform is provided with a heat insulation layer.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. This utility model provides an ultra-thin computer host heat dissipation device. Based on the cooperation of a mechanism box, a semiconductor cooling plate, a temperature conduction platform, a heat dissipation plate, a heat dissipation mechanism, a mechanism platform, a cooling fan, an air guide platform, and a micro fluid pump, the semiconductor cooling plate directly cools the heat spreader and transfers temperature with the external temperature conduction plate, enabling rapid cooling. The air guide platform allows the cooling fan and mechanism platform to be placed horizontally. Due to the use of a heat spreader, the thickness of the copper pipes is reduced. By placing them side by side, the overall thickness is the same as the total thickness of the cooling fan and air guide platform. The thickness of the air guide platform can be provided by the cavity preset for airflow in traditional heat dissipation methods, thus improving heat dissipation efficiency while keeping the overall thickness small.

[0013] 2. This utility model provides an ultra-thin computer host heat dissipation device. Based on the cooperation of the heat dissipation mechanism, mechanism platform, heat dissipation fan, air guide platform, clip, insert plate, push plate, inclined groove, spring and ball bearing, the clip fixes the upper and lower sides of the air guide platform. The mechanism box and insert plate cooperate to prevent the air guide platform from moving left and right, thereby quickly fixing the air guide platform, which facilitates the overall installation and equipment maintenance. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a partial cross-sectional three-dimensional structural schematic diagram of the present invention; Figure 3 This utility model Figure 2 Enlarged structural diagram of part A in the middle; Figure 4 This is an exploded three-dimensional structural diagram of the mechanism platform of this utility model; Figure 5 This is a partial cross-sectional three-dimensional structural diagram of the air guide platform of this utility model; Figure 6 This is an exploded three-dimensional structural diagram of the mechanism box part of this utility model.

[0015] In the diagram: 1. Mechanism box; 2. Semiconductor cooling plate; 3. Temperature conduction stage; 4. Heat spreader; 5. Heat dissipation mechanism; 51. Mechanism platform; 52. Cooling fan; 53. Air guide platform; 54. Locking strip; 55. Insert plate; 56. Push plate; 57. Inclined groove; 58. Spring; 59. First dustproof plate; 510. Second dustproof plate; 511. Ball bearing; 6. Miniature fluid pump. Detailed Implementation

[0016] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0017] like Figures 1-6 As shown, an ultra-thin computer host heat dissipation device includes a mechanism box 1, a semiconductor cooling plate 2 fixedly connected to the middle of the inner side of the mechanism box 1, a temperature guiding platform 3 provided on the upper side of the semiconductor cooling plate 2, a heat dissipation plate 4 provided on the inner side of the mechanism box 1 near the bottom, a heat dissipation mechanism 5 fixedly connected to the rear side of the mechanism box 1, and a micro fluid pump 6 fixedly connected to the middle of the left side of the mechanism box 1. The heat dissipation mechanism 5 includes a mechanism platform 51. The front side of the mechanism platform 51 is fixedly connected to the rear side of the mechanism box 1 near the bottom. Several cooling fans 52 distributed on the left and right are movably sleeved on the inner side of the mechanism platform 51. A guide platform 53 is attached to the upper side of the cooling fans 52.

[0018] It should be noted that when the semiconductor cooling plate 2 is powered on, its hot end heats up and its cold end cools down. The air guide 53 contains coolant, which allows the semiconductor cooling plate 2 to cool the heat spreader 4. The micro fluid pump 6 is used to drive the coolant flow in the heat spreader 4. Temperature guide plates are connected to the left and right sides of the semiconductor cooling plate 2, and their structure is the same as that of the heat spreader 4. The position of the temperature guide plates is arranged according to the specific structure of the reagent. The cooling fan 52 drives the air to flow from the bottom to the top. The air guide 53 is used to turn the air blown out of the cooling fan 52 to blow straight forward, so that it blows over the temperature guide 3 and cools the temperature guide 3.

[0019] like Figure 4 , Figure 5 As shown, two locking strips 54 are fixedly connected to the upper side of the mechanism platform 51 near the left and right sides. The outer side of the locking strips 54 is movably sleeved on the inner side of the bottom of the left and right walls of the air guide platform 53.

[0020] It should be noted that the locking bar 54 is in the shape of an inverted trapezoid, and the mechanism platform 51 slides from back to front, so that the locking bar 54 fixes the mechanism platform 51 and prevents it from moving up and down.

[0021] like Figure 3 , Figure 5As shown, an insert plate 55 is movably sleeved inside the rear side of the air guide 53, and a push plate 56 is slidably connected inside the rear side of the air guide 53. The push plate 56 is located in front of the insert plate 55. Several horizontally distributed inclined grooves 57 are opened on the front side of the insert plate 55. The rear circular shaft of the push plate 56 is slidably connected to the inner side of the inclined grooves 57. A spring 58 is provided on the left side of the push plate 56.

[0022] It should be noted that pushing the push plate 56 causes the round shaft to slide in the inclined groove 57, thereby driving the insert plate 55 to move up and down. The outer side of the insert plate 55 near the bottom is movably fitted into the slot opened in the middle of the upper side of the rear wall of the mechanism table 51, so that the insert plate 55 fixes the air guide table 53. When the insert plate 55 moves up and disengages from the slot, the air guide table 53 can move backward.

[0023] like Figure 4 , Figure 6 As shown, a first dustproof plate 59 is embedded in the lower inner surface of the mechanism platform 51, and a second dustproof plate 510 is fixedly connected to the front side of the mechanism box 1.

[0024] It should be noted that the first dustproof plate 59 is used to isolate dust from the air inlet of the cooling fan 52, and the second dustproof plate 510 is used to isolate dust from the air outlet of the mechanism box 1.

[0025] like Figure 4 As shown, rubber pads are fixedly connected to the upper and lower sides of several cooling fans 52 near the edges.

[0026] It should be noted that the rubber pad is used to fill the gaps between the mechanism platform 51 and the cooling fan 52, as well as between the cooling fan 52 and the air guide platform 53, to prevent the cooling fan 52 from moving.

[0027] like Figure 5 As shown, a number of rectangularly distributed ball bearings 511 are rotatably connected to the inner upper surface of the air guide 53.

[0028] It should be noted that the ball bearings are used to reduce the friction between the air guide 53 and the cooling fan 52, and to prevent the rubber pad from directly rubbing against the air guide 53 during installation.

[0029] like Figure 2 As shown, the inner wall of the mechanism platform 51 is provided with a heat insulation layer.

[0030] It should be noted that the heat insulation layer is used to prevent the temperature generated by the semiconductor cooling plate 2 from being transferred to the outside, and thus rely on the semiconductor cooling plate 2 to conduct heat to the components inside the computer host.

[0031] The working principle of this utility model is as follows: First, when the semiconductor cooling plate 2 is energized, its hot end heats up and its cold end cools down. The air guide platform 53 contains coolant, which allows the semiconductor cooling plate 2 to cool the heat spreader 4. The micro fluid pump 6 is used to drive the flow of coolant in the heat spreader 4. Temperature guide plates are connected to the left and right sides of the semiconductor cooling plate 2, and their structure is consistent with that of the heat spreader 4. The position of the temperature guide plates is arranged according to the specific structure of the reagent. The cooling fan 52 drives the air to flow from the bottom to the top. The air guide platform 53 is used to turn the air blown out of the cooling fan 52 to blow straight forward, so that it blows over the temperature guide platform 3 to cool the temperature guide platform 3. The semiconductor cooling plate 2 directly cools the heat spreader 4 and transfers temperature with the external temperature guide plate, so that it can cool down quickly. The air guide platform 53 makes the cooling fan 52 and the mechanism platform 51 horizontally placed. Due to the use of the heat spreader 4, the thickness of the copper tube is reduced. By placing them side by side, the overall thickness is reduced. The thickness is the total thickness of the cooling fan 52 and the air guide 53. The thickness of the air guide 53 can be provided by the cavity preset for airflow in the traditional heat dissipation method, which improves the heat dissipation efficiency while keeping the overall thickness small. Finally, the retaining strip 54 is inverted trapezoidal. The mechanism platform 51 slides from back to front, so that the retaining strip 54 fixes the mechanism platform 51 and prevents it from moving up and down. Pushing the push plate 56, the round shaft slides in the inclined groove 57, which in turn drives the insertion plate 55 to move up and down. The outer side of the insertion plate 55 near the bottom is movably sleeved in the slot opened in the middle of the upper side of the rear wall of the mechanism platform 51, so that the insertion plate 55 fixes the air guide 53. When the insertion plate 55 moves up and gets out of the slot, the air guide 53 can move backward. The retaining strip 54 fixes the upper and lower sides of the air guide 53. The mechanism box 1 and the insertion plate 55 cooperate to prevent the air guide 53 from moving left and right, so as to quickly fix the air guide 53, which facilitates the overall installation and equipment maintenance.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for an ultra-thin computer host, comprising a housing (1), characterized in that: A semiconductor cooling plate (2) is fixedly connected to the middle of the inner side of the mechanism box (1). A temperature guiding platform (3) is provided on the upper side of the semiconductor cooling plate (2). A heat dissipation plate (4) is provided on the inner side of the mechanism box (1) near the bottom. A heat dissipation mechanism (5) is fixedly connected to the rear side of the mechanism box (1). A micro fluid pump (6) is fixedly connected to the middle of the left side of the mechanism box (1). The heat dissipation mechanism (5) includes a mechanism platform (51). The front side of the mechanism platform (51) is fixedly connected to the rear side of the mechanism box (1) near the bottom. Several heat dissipation fans (52) distributed on the left and right sides are movably sleeved on the inner side of the mechanism platform (51). A guide platform (53) is attached to the upper side of the heat dissipation fan (52).

2. The ultra-thin computer host heat dissipation device according to claim 1, characterized in that: Two locking strips (54) are fixedly connected to the upper side of the mechanism platform (51) near the left and right sides. The outer side of the locking strips (54) is movably sleeved on the inner side of the bottom of the left and right walls of the air guide platform (53).

3. The ultra-thin computer host heat dissipation device according to claim 2, characterized in that: The air guide platform (53) has an insert plate (55) movably sleeved inside its rear side. The air guide platform (53) has a push plate (56) slidably connected inside its rear side. The push plate (56) is located in front of the insert plate (55). The insert plate (55) has several horizontally distributed inclined grooves (57) on its front side. The push plate (56) has a circular shaft slidably connected to the inside of the inclined grooves (57). The push plate (56) has a spring (58) on its left side.

4. The ultra-thin computer host heat dissipation device according to claim 1, characterized in that: The lower inner surface of the mechanism platform (51) is inlaid with a first dustproof plate (59), and the front side of the mechanism box (1) is fixedly connected with a second dustproof plate (510).

5. The ultra-thin computer host heat dissipation device according to claim 1, characterized in that: Rubber pads are fixedly connected to the upper and lower sides of several of the cooling fans (52) near the edges.

6. The ultra-thin computer host heat dissipation device according to claim 1, characterized in that: The inner upper surface of the air guide (53) is rotatably connected with several rectangularly distributed ball bearings (511).

7. The ultra-thin computer host heat dissipation device according to claim 1, characterized in that: The inner wall of the mechanism platform (51) is provided with a heat insulation layer.

Images