A water-cooled heat sink

Abstract

The utility model provides a water -cooled radiator, including water cooling head, water cooling head includes the flow guide plate and the radiating plate of detachable connection, is equipped with the water inlet, the water outlet and the water tank on the flow guide plate, the one end of water tank is connected the water inlet, the other end is connected the water outlet, the radiating plate includes the radiating surface, is equipped with the recess on the radiating surface, is equipped with a plurality of fins on the recess, forms the flow channel between the fin, the opening of water tank and recess butt joint, make water tank and flow channel jointly form the closed cooling liquid flow channel, when the indirect communication between the water inlet and the water outlet, adopt the compact layout of J type water inlet and square water outlet, and the total flow resistance of system is small, and all cooling liquid must flow through the core heat dissipation area, has guaranteed the heat dissipation efficiency, through small section water inlet portion, improve the initial flow velocity of cooling liquid, make it fast access, flow into slightly big section water spray part and distribute cooling liquid evenly to the whole fin area entrance, avoid the uneven flow, reduce energy consumption and noise simultaneously.

Description

Technical Field

[0001] This utility model belongs to the field of chip heat dissipation technology, and specifically relates to a water-cooled heat sink. Background Technology

[0002] In actual production, with the improvement of CPU / GPU performance, their power consumption and heat generation have increased dramatically. Traditional air-cooled heat sinks are gradually becoming unable to meet the demand for efficient heat dissipation, especially in compact computer cases. The flow channel design of traditional water cooling blocks may not be optimized enough, resulting in uneven coolant flow rate, insufficient contact area with heat sink fins, or insufficient heat exchange. At the same time, unreasonable flow channel design can lead to excessive system flow resistance, requiring more powerful water pumps to drive it, thereby increasing system energy consumption and operating noise. When multiple chips (such as dual CPUs / GPUs) need to be cooled, traditional solutions may require multiple independent water cooling radiators, occupying a lot of valuable internal space of the case. Utility Model Content

[0003] (1) Technical problems to be solved This invention provides a water-cooled radiator, which aims to solve the problems of low heat dissipation efficiency, large space occupation, and high flow resistance and noise.

[0004] Technical solution

[0005] This utility model provides a water-cooled radiator, including a water cooling head. The water cooling head includes a detachably connected guide plate and a heat dissipation plate. The guide plate is provided with an inlet, an outlet, and a water tank. One end of the water tank is connected to the inlet, and the other end is connected to the outlet. The heat dissipation plate includes a heat dissipation surface with a groove. Multiple fins are provided on the groove, and flow channels are formed between the fins. The opening of the water tank is connected to the groove, so that the water tank and the flow channels together form a closed coolant flow channel.

[0006] Furthermore, the water tank includes an inlet channel and an outlet channel, with a protrusion between the inlet channel and the outlet channel, and the groove corresponding to the protrusion.

[0007] Furthermore, the water inlet channel is J-shaped, including a water inlet section and a water spray section, and the length extension direction of the water inlet section is parallel to the length extension direction of the water outlet channel.

[0008] Furthermore, the cross-sectional area S1 of the water inlet is smaller than the cross-sectional area S2 of the water spray section.

[0009] Furthermore, the length L1 of the protrusion is less than the length L2 of the fin.

[0010] Furthermore, the heat sink also includes a bonding surface, on which a fixing plate is detachably connected, the fixing plate being used to connect and fix the GPU / CPU.

[0011] Furthermore, a PCB board is detachably connected between the fixing plate and the bonding surface.

[0012] Furthermore, the guide plate is provided with a connecting part one communicating with the water inlet and a connecting part two communicating with the water outlet. The connecting part one and the connecting part two are hollow inside. The connecting part one is connected to a water inlet metal pipe, and the connecting part two is connected to a water outlet metal pipe. The ends of the water inlet metal pipe and the water outlet metal pipe are both connected to a transmission pipe.

[0013] Furthermore, it also includes a water-cooled radiator, with the other end of the transmission pipe connected to the water-cooled radiator.

[0014] Furthermore, one of the water-cooling radiators connects to two of the water-cooling heads.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. The coolant is divided into countless fine streams in the dense fin array, which exchange heat efficiently with the surface area of ​​the fins and is responsible for handling most of the heat. Before and after flowing into and out of the fin area, the coolant directly contacts the heat sink in a large area, which increases the heat dissipation area and improves the overall heat dissipation efficiency.

[0016] 2. When the inlet and outlet channels are indirectly connected, a compact layout of J-shaped inlet and square outlet channels is adopted. This design results in low overall system flow resistance, and all coolant must flow through the core heat dissipation area, ensuring heat dissipation efficiency. The small cross-section inlet increases the initial flow velocity of the coolant, allowing it to enter quickly. The slightly larger cross-section spray nozzle evenly distributes the coolant to the entire fin area inlet, avoiding uneven flow. Utilizing Bernoulli's principle, a suction effect is generated at the end of the flow channel, significantly reducing the overall system flow resistance, thereby reducing energy consumption and noise.

[0017] 3. One radiator serves two water blocks simultaneously, which greatly saves internal chassis space and solves the space occupation problem when cooling multiple chips. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0019] Figure 2 This is an exploded view of the overall structure of this utility model.

[0020] Figure 3 This is a schematic diagram of the guide plate structure of this utility model.

[0021] Figure 4 This is a diagram showing the application state of the guide plate of this utility model.

[0022] Figure 5 This is a schematic diagram of the heat sink structure of this utility model.

[0023] Figure 6 This is an exploded view of the heat sink of this utility model.

[0024] Figure 7 This is a side sectional view of the heat sink of this utility model.

[0025] Figure 8 This is a side sectional view of the air guide plate and heat sink of this utility model.

[0026] Figure 9 This is a front cross-sectional view of the air guide plate and heat sink of this utility model.

[0027] Figure 10 This is a schematic diagram showing the connection between the water cooling radiator and the water cooling head of this utility model.

[0028] Figure 11 This is a schematic diagram of the chassis structure of this utility model.

[0029] Figure reference numerals: 1-Water block, 11-Baffle plate, 111-Inlet, 112-Outlet, 113-Water tank, 1131-Inlet channel, 11311-Inlet section, 11312-Spray section, 1132-Outlet channel, 1133-Protrusion, 12-Heat plate, 121-Heat surface, 1211-Groove, 1212-Fin, 1213-Flow channel, 122-Mating surface, 13-Connection part one, 131-Inlet metal pipe, 14-Connection part two, 141-Outlet metal pipe, 15-Transmission pipe, 2-Chassis, 3-Fixing plate, 4-PCB board, 5-Water radiator, 6-Cooling fan. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0031] See Figure 1-11 .

[0032] like Figure 1-6As shown, this utility model provides a water-cooled radiator. The water cooling head 1 includes a detachably connected guide plate 11 and a heat dissipation plate 12. The guide plate 11 is provided with an inlet 111, an outlet 112, and a water tank 113. One end of the water tank 113 is connected to the inlet 111, and the other end is connected to the outlet 112. The heat dissipation plate 12 includes a heat dissipation surface 121, and a groove 1211 is provided on the heat dissipation surface 121. A plurality of fins 1212 are provided on the groove 1211, and a flow channel 1213 is formed between the fins 1212. The flow channel 1213 communicates with the water tank 113. After the guide plate 11 and the heat dissipation plate 12 are assembled, the opening of the water tank 113 is aligned with the area of ​​the groove 1211, so that the water tank 113 and the flow channel 1213 together form a closed coolant flow channel. When using, such as Figure 4 and Figure 9 As shown, coolant flows into the water tank 113 from the inlet 111, then into the groove 1211 from the water tank 113, passes through the flow channels 1213 formed by the fins 1212, and then flows back into the water tank 113 from the flow channels 1213, and out from the outlet 112. This design allows the coolant to flow faster in the flow head for better heat dissipation, particularly for CPU / GPU cooling on the heat sink 12. Simultaneously, multiple microchannels 1213 formed between the fins 1212 allow the coolant to pass through, resulting in a smoother flow. The dense channel 1213 significantly increases the heat conduction area. The coolant enters the dense channel 1213 of the fins 1212 and is divided into countless fine streams, which exchange heat efficiently with the surface area of ​​the fins 1212. This is the main heat dissipation area, responsible for handling most of the heat. Before and after the coolant flows into and out of the fins 1212, it directly and extensively contacts the heat sink 12 in the water tank 113. This gives the water tank 113 a heat dissipation effect, increasing the contact area with the heat sink 12, rather than just the simple groove 1211 for heat dissipation, thus improving the heat dissipation efficiency.

[0033] Furthermore, such as Figure 3-6 As shown, the water tank 113 includes an inlet channel 1131 and an outlet channel 1132. The inlet channel 1131 and the outlet channel 1132 can be directly or indirectly connected. When the inlet channel 1131 and the outlet channel 1132 are directly connected, the water tank 113 is U-shaped with no obstruction in the middle. The groove 1211 is correspondingly provided at the outlet channel 1132 or the inlet channel 1131. Specifically, when the inlet channel 1131 and the outlet channel 1132 are indirectly connected, a protrusion 1133 is provided between the inlet channel 1131 and the outlet channel 1132. The protrusion 1133 divides the water tank 113 into two parts, namely a J-shaped inlet channel 1131 and a square outlet channel 1132. The groove 1211 is provided corresponding to the protrusion 1133. In use, the coolant flows from the inlet channel 1131 into the groove 1211, flows through the flow channel 1213, and then enters the outlet channel 1132, exiting from the outlet... The water outlet 112 discharges the water. This design has a low overall flow resistance, which helps to reduce the energy consumption and noise of the entire water cooling system. All coolant must flow through the grooves 1211 / flow channels 1213 with dense fins 1212 located below the protrusion 1133. The combination of J-shaped and square layout is very compact, which allows the inlet and outlet water channels 1132 and the core heat dissipation area to be efficiently arranged in a relatively limited planar space. This helps to reduce the overall size of the water block 1, or to integrate a larger effective heat dissipation area within the same size, which is very beneficial for computer cases with limited space.

[0034] Furthermore, such as Figure 3 As shown, the water inlet channel 1131 includes a water inlet section 11311 and a water spray section 11312. The length extension direction of the water inlet section 11311 is parallel to the length extension direction of the water outlet channel 1132. The water spray section 11312 is partially located on the same straight line as the water outlet channel 1132. The protrusion 1133 is located between the water spray section 11312 and the water outlet channel 1132, separating the two. In traditional designs, coolant may flow into the fin 1212 area at different angles and speeds, which can easily lead to a large flow rate near the opening and a small flow rate far from the opening. Here, the water spray section 11312 acts as a unified outlet, which can more evenly "distribute" the coolant to the inlet cross-section of the entire fin 1212 area. This ensures that each fin 1212 can be fully cooled by the coolant, making the heat dissipation performance more balanced and reliable.

[0035] Preferably, such as Figure 8As shown, the cross-sectional area S1 of the inlet section 11311 is smaller than the cross-sectional area S2 of the spray section 11312, and the cross-sectional area S2 of the spray section 11312 is smaller than or equal to the cross-sectional area of ​​the outlet channel 1132. Due to the principle that the smaller the cross-sectional area, the faster the flow rate at a constant flow rate, the coolant quickly enters the water cooling head 1 at a high flow rate. The coolant flows out from the narrow inlet section 11311 and enters the slightly wider spray section 11312. The flow rate will decrease slightly compared to the inlet section 11311, but still maintain a high speed. This area plays a role in stabilizing the flow and guiding the direction, ensuring that the high-speed liquid flow can flow accurately and concentratedly to the fin area 1212. After passing through the complex and high-resistance flow zone of fin 1212, the coolant carries a large amount of heat into the outlet channel 1132 with a larger cross-sectional area. The increased area leads to a significant decrease in flow velocity. According to Bernoulli's principle, the decrease in flow velocity means a decrease in dynamic pressure, and the static pressure will be greatly restored. This is equivalent to providing a suction force at the end of the flow channel 1213, effectively reducing the back pressure flowing through the entire fin 1212 zone. This allows the coolant to flow out of the high-resistance area more smoothly, thereby significantly reducing the total flow resistance of the system. While ensuring that the coolant penetrates the core heat dissipation area at high speed and with great force to improve heat dissipation efficiency, the flow resistance of the entire system is reduced through ingenious pressure management.

[0036] Specifically, such as Figure 9 As shown, the length L1 of the protrusion 1133 is less than the length L2 of the groove 1211, allowing coolant to flow from the inlet channel 1131 into the groove 1211. The shorter length L1 of the protrusion 1133 means that a gap is left at the inlet end of the groove 1211. This gap forms a physical channel connecting the inlet channel 1131 and the groove 1211. With a lateral inlet, the coolant first fills the inlet channel 1131, and then enters each flow channel 1213 almost simultaneously and uniformly along the groove 1211 through the lateral gap. This improves the utilization efficiency of the heat dissipation area and the smoother flow transition, which helps to reduce local pressure loss caused by turbulence and eddies. Thus, while achieving uniform flow, it does not significantly increase the total flow resistance of the system, maintaining low energy consumption and low noise.

[0037] Specifically, the length extension direction of the fin 1212 is parallel to the length extension direction of the outlet channel 1132. After the coolant flows through the fin 1212 area, it can directly and smoothly "merge" into the outlet channel 1132 without a sharp change in the flow direction, thus reducing flow resistance and noise.

[0038] Specifically, such as Figure 2 As shown, the heat sink 12 also includes a bonding surface 122, on which a fixing plate 3 is detachably connected. The fixing plate 3 is used to connect and fix the GPU / CPU.

[0039] Furthermore, such as Figure 2 As shown, a PCB board 4 is detachably connected between the fixing plate 3 and the bonding surface 122. The PCB board 4 can integrate a temperature sensor, which can be placed directly at the position closest to the CPU / GPU core. It can obtain chip surface temperature data faster and more accurately than the motherboard sensor, providing the most critical basis for intelligent control. It can even integrate a miniature flow sensor to directly monitor the real-time flow rate of the coolant in the closed loop, ensuring that the heat dissipation system works normally.

[0040] Specifically, such as Figure 2 and Figure 10 As shown, the guide plate 11 is provided with a connecting part 13 communicating with the water inlet 111 and a connecting part 2 14 communicating with the water outlet 112. The connecting part 13 and the connecting part 2 14 are hollow inside. The connecting part 13 is connected to a water inlet metal pipe 131, and the connecting part 2 14 is connected to a water outlet metal pipe 141. The ends of the water inlet metal pipe 131 and the water outlet metal pipe 141 are connected to a transmission pipe 15. In use, the coolant flows out from the water cooling radiator 5, enters the connecting part 13 of the guide plate 11 through the transmission pipe 15 and the water inlet metal pipe 131, and finally passes through the water inlet. The coolant is injected into the water block 1 through the inlet 111, flows into the inlet channel 1131, and reaches the groove 1211. The coolant flows through the flow channel 1213 formed by the dense fins 1212. At this time, the huge heat generated by the CPU / GPU is conducted to the fins 1212 through the contact surface 122 of the heat sink 12, and performs efficient heat exchange with the flowing coolant. The coolant temperature rises rapidly and absorbs a large amount of heat. The cooled coolant flows into the outlet channel 1132, and then flows through the connecting part 14, the outlet metal pipe 141 and another transmission pipe 15 in sequence. It is pushed by the water pump, leaves the water block 1, and goes to the water radiator 5.

[0041] Furthermore, such as Figure 11 As shown, it also includes a chassis 2 and a water cooling radiator 5. The water cooling radiator 5 and the water cooling head 1 are installed in the chassis 2 to dissipate heat from the chips in the chassis 2. The other end of the transmission pipe 15 is connected to the water cooling radiator 5.

[0042] In this embodiment, one water-cooling radiator 5 connects to two water-cooling heads 1. After the coolant exits from the water-cooling radiator 5, it is split into two streams through a T-joint, flowing simultaneously into the two water-cooling heads 1. Then, after flowing out from the water-cooling heads 1, it merges back into one stream through another T-joint and returns to the water-cooling radiator 5. This reduces the space occupied by the water-cooling radiator 5 within the chassis 2, greatly saving internal space.

[0043] Preferably, a cooling fan 6 is also provided inside the chassis 2. The cooling fan 6 is also located on the back of the water cooling radiator 5 to dissipate heat from the water cooling radiator 5 and at the same time to dissipate heat from the inside of the chassis 2.

[0044] The following is a detailed explanation of the working principle of this utility model; In use, the coolant flows out from the water radiator 5, passes through the transfer pipe 15 and the inlet metal pipe 131, enters the connection part 13 of the guide plate 11, and finally enters the water head 1 through the inlet 111. After flowing into the inlet channel 1131, it reaches the groove 1211. The coolant travels through the flow channel 1213 formed by the dense fins 1212. At this time, the huge heat generated by the CPU / GPU is conducted to the fins 1212 through the contact surface 122 of the heat sink 12, and performs efficient heat exchange with the flowing coolant. The coolant temperature rises rapidly and absorbs a large amount of heat. The cooled coolant after absorbing heat flows into the outlet channel 1132, and then flows through the connection part 14, the outlet metal pipe 141 and another transfer pipe 15 in sequence. It is pushed by the water pump, leaves the water head 1, and goes to the water radiator 5 to dissipate the heat into the air, completing the cycle.

[0045] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

[0046] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A water-cooled radiator, characterized in that, The device includes a water cooling head (1), which includes a detachably connected guide plate (11) and a heat dissipation plate (12). The guide plate (11) is provided with an inlet (111), an outlet (112) and a water tank (113). One end of the water tank (113) is connected to the inlet (111) and the other end is connected to the outlet (112). The heat dissipation plate (12) includes a heat dissipation surface (121), which is provided with a groove (1211). The groove (1211) is provided with multiple fins (1212), and a flow channel (1213) is formed between the fins (1212). The opening of the water tank (113) is connected to the groove (1211), so that the water tank (113) and the flow channel (1213) together form a closed coolant flow channel.

2. The water-cooled radiator according to claim 1, characterized in that, The water tank (113) includes an inlet channel (1131) and an outlet channel (1132). A protrusion (1133) is provided between the inlet channel (1131) and the outlet channel (1132), and the groove (1211) corresponds to the protrusion (1133).

3. The water-cooled radiator according to claim 2, characterized in that, The water inlet channel (1131) is J-shaped and includes a water inlet section (11311) and a water spray section (11312). The length extension direction of the water inlet section (11311) is parallel to the length extension direction of the water outlet channel (1132).

4. A water-cooled radiator according to claim 3, characterized in that, The cross-sectional area S1 of the water inlet (11311) is smaller than the cross-sectional area S2 of the water spray section (11312).

5. A water-cooled radiator according to claim 4, characterized in that, The length L1 of the protrusion (1133) is less than the length L2 of the fin (1212).

6. A water-cooled radiator according to claim 1, characterized in that, The heat sink (12) also includes a bonding surface (122), on which a fixing plate (3) is detachably connected, and the fixing plate (3) is used to connect and fix the GPU / CPU.

7. A water-cooled radiator according to claim 6, characterized in that, A PCB board (4) is detachably connected between the fixing plate (3) and the bonding surface (122).

8. A water-cooled radiator according to claim 1, characterized in that, The guide plate (11) is provided with a first connection part (13) communicating with the inlet (111) and a second connection part (14) communicating with the outlet (112). The first connection part (13) and the second connection part (14) are hollow inside. The first connection part (13) is connected to an inlet metal pipe (131), and the second connection part (14) is connected to an outlet metal pipe (141). The ends of the inlet metal pipe (131) and the outlet metal pipe (141) are both connected to a transmission pipe (15).

9. A water-cooled radiator according to claim 8, characterized in that, It also includes a water-cooled radiator (5), and the other end of the transmission pipe (15) is connected to the water-cooled radiator (5).

10. A water-cooled radiator according to claim 9, characterized in that, One of the water cooling radiators (5) is connected to two of the water cooling heads (1).

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