A heat dissipating type case assembly

Abstract

This utility model relates to the field of chassis heat dissipation technology, specifically a heat-dissipating chassis assembly, including a chassis panel with a heat dissipation mechanism fixedly installed on it. The heat dissipation mechanism includes a connecting shell, a first cooling fan on one side of the connecting shell, a second cooling fan on the side of the connecting shell away from the first cooling fan, a driving assembly on the connecting shell, and heat dissipation fins rotatably connected inside the connecting shell. A heat dissipation channel is provided inside the connecting shell, with a first mounting slot and a second mounting slot respectively at both ends. A heat dissipation column is fixedly connected inside the heat dissipation channel. The driving assembly includes a driving rod. The beneficial effect is that, during use, the heat dissipation effect of the chassis can be adjusted according to the amount of heat generated by the electronic components inside the chassis, avoiding damage to some electronic components caused by heat accumulation inside the chassis, thereby improving the service life of the electronic components inside the chassis.

Description

Technical Field

[0001] This utility model relates to the field of chassis heat dissipation technology, and in particular to a heat dissipation chassis component. Background Technology

[0002] A space situational awareness system is a comprehensive system that integrates multi-source observation data, technical means, and analytical methods to monitor, dynamically analyze, warn of threats, and predict trends of various targets, environments, and activities in space in real time. Its core objective is to achieve "knowability, judgment, and controllability" of the space situation, providing support for space activity safety, space resource utilization, space traffic management, and space security.

[0003] The chassis assembly of an aerospace situational awareness system refers to the chassis and related internal circuit boards and other components that constitute the hardware platform of the aerospace situational awareness system. During the operation of the aerospace situational awareness system, various electronic components and control modules inside the chassis generate a lot of heat. If the generated heat cannot be dissipated in time, it can easily cause damage to some electronic components inside the chassis.

[0004] Chinese Patent CN207249562U discloses a high-efficiency heat dissipation device and a sealed chassis, which increases the effective heat dissipation area and thermal convection coefficient. Under the action of internal and external cooling fans, the generated airflow flows through the internal and external air guide channels, forming forced convection, which can make the temperature distribution of the chassis walls more uniform, thus improving heat dissipation efficiency. However, compared with existing technologies and comparative solutions, this device still has the following problems in practical use:

[0005] In existing technologies, heat dissipation area is often increased by adding heat sink fins, and convection is improved by adding fans. However, heat sink fins are generally fixed to the parts of the chassis that need heat dissipation. When the fan is turned on, a laminar thermal boundary layer is generated on the surface of the heat sink fins. Heat dissipation is mainly achieved through the heat conduction effect of the heat sink fins. In actual use, the heat generated by the electronic components inside the chassis varies depending on the operation. The heat dissipation method using fins and fans cannot change the heat dissipation effect according to the amount of heat generated by the electronic components inside the chassis. Utility Model Content

[0006] The purpose of this utility model is to overcome the shortcomings of the prior art, solve the problems mentioned in the background art, and provide a heat dissipation chassis component.

[0007] The purpose of this utility model is achieved through the following technical solution: a heat dissipation type chassis assembly, including a chassis wall panel, on which a heat dissipation mechanism is fixedly installed;

[0008] The heat dissipation mechanism includes a connecting shell, a first heat dissipation fan is provided on one side of the connecting shell, a second heat dissipation fan is provided on the side of the connecting shell away from the first heat dissipation fan, a drive component is provided on the connecting shell, and heat dissipation fins are rotatably connected inside the connecting shell.

[0009] The interior of the connecting shell is provided with a heat dissipation channel, and the two ends of the heat dissipation channel are respectively provided with a first mounting slot and a second mounting slot. A heat dissipation column is fixedly connected inside the heat dissipation channel.

[0010] The drive assembly includes a drive rod, the output end of which is fixedly connected to a connecting frame, and a rack is fixedly connected to the connecting frame.

[0011] A connecting shaft is fixedly connected to the heat dissipation fins. A gear is fixedly connected to one end of the connecting shaft, and a limit plate is fixedly connected to the end of the gear away from the connecting shaft.

[0012] Preferably, the connecting shell is fixedly mounted on the chassis wall panel.

[0013] Preferably, the number of the first cooling fan and the number of the second cooling fan correspond to the number of heat dissipation channels. The first cooling fan is fixedly installed inside the first mounting slot, and the second cooling fan is fixedly installed inside the second mounting slot.

[0014] Preferably, the drive rod is fixedly mounted on the connecting shell, and the connecting bracket is slidably connected to the connecting shell.

[0015] Preferably, there are multiple heat dissipation channels, the number of racks is the same as the number of heat dissipation channels, and the gears and racks mesh with each other.

[0016] Preferably, the heat dissipation fins are rotatably connected to the inside of the heat dissipation channel via a connecting shaft. Multiple heat dissipation fins are arranged in the same heat dissipation channel, and the multiple heat dissipation fins in the same heat dissipation channel are distributed in an alternating manner. There are multiple heat dissipation pillars, and the positions of the heat dissipation pillars correspond to the positions of the heat dissipation fins.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] This heat-dissipating chassis component can adjust its heat dissipation effect according to the amount of heat generated by the electronic components inside the chassis during use, avoiding damage to some electronic components caused by heat accumulation inside the chassis, thereby improving the service life of the electronic components inside the chassis.

[0019] The parts of the device not covered herein are the same as or can be implemented using existing technologies. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the outer structure of this utility model;

[0022] Figure 2 This is a cross-sectional view of the heat dissipation mechanism of this utility model.

[0023] Figure 3 This is a cross-sectional structural diagram of the heat dissipation mechanism of this utility model in its first working state;

[0024] Figure 4 This is a cross-sectional structural diagram of the heat dissipation mechanism of this utility model in its second working state;

[0025] Figure 5 This utility model Figure 3 Enlarged structural diagram at point A;

[0026] Figure 6 This utility model Figure 4 Enlarged structural diagram at point B;

[0027] Figure 7 This is a cross-sectional view of the connecting shell of this utility model;

[0028] Figure 8 This is a schematic diagram of the structure of the drive component of this utility model;

[0029] Figure 9 This is a schematic diagram of the heat dissipation fins of this utility model.

[0030] In the diagram: 1. Chassis panel; 2. Heat dissipation mechanism; 21. Connecting shell; 211. Heat dissipation channel; 212. First mounting slot; 213. Second mounting slot; 214. Heat dissipation column; 22. First cooling fan; 23. Second cooling fan; 24. Drive assembly; 241. Drive rod; 242. Connecting bracket; 243. Rack; 25. Heat dissipation fins; 251. Connecting shaft; 252. Gear; 253. Limiting plate. Detailed Implementation

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] Additional aspects and advantages of this invention will be further set forth in the description which follows in conjunction with the accompanying drawings, and in part will be obvious from the description or may be learned by practice of the invention.

[0033] like Figure 1 As shown, a heat dissipation type chassis assembly includes a chassis panel 1, on which a heat dissipation mechanism 2 is fixedly installed;

[0034] like Figures 2 to 6 As shown, the heat dissipation mechanism 2 includes a connecting shell 21, a first heat dissipation fan 22, a second heat dissipation fan 23, a drive assembly 24, and heat dissipation fins 25. The connecting shell 21 is fixedly installed on the chassis wall panel 1 at the part that needs heat dissipation by bolts. The first heat dissipation fan 22 is provided on one side of the connecting shell 21, and the second heat dissipation fan 23 is provided on the side of the connecting shell 21 away from the first heat dissipation fan 22. The drive assembly 24 is provided on the connecting shell 21, and the heat dissipation fins 25 are rotatably connected inside the connecting shell 21.

[0035] like Figure 2 and Figure 7 As shown, the interior of the connecting shell 21 is provided with multiple heat dissipation channels 211, which are linearly arrayed inside the connecting shell 21. The two ends of the heat dissipation channels 211 are respectively provided with a first mounting slot 212 and a second mounting slot 213. The number of first cooling fans 22 and the number of second cooling fans 23 correspond to the number of heat dissipation channels 211. The first cooling fans 22 are fixedly installed inside the first mounting slot 212, and the second cooling fans 23 are fixedly installed inside the second mounting slot 213. Heat dissipation columns 214 are fixedly connected inside the heat dissipation channels 211.

[0036] like Figure 2 and Figure 8 As shown, the drive assembly 24 includes a drive rod 241, a connecting frame 242, and a rack 243. The drive rod 241 is fixedly mounted on the connecting housing 21. The output end of the drive rod 241 is fixedly connected to the connecting frame 242. The connecting frame 242 is slidably connected to the connecting housing 21. A rack 243 is fixedly connected to the connecting frame 242. The number of racks 243 is the same as the number of heat dissipation channels 211, and the position of the racks 243 corresponds to the position of the heat dissipation channels 211.

[0037] like Figures 2 to 4 , Figure 9 As shown, a connecting shaft 251 is fixedly connected to the heat dissipation fin 25. The heat dissipation fin 25 is rotatably connected to the inside of the heat dissipation channel 211 through the connecting shaft 251. Multiple heat dissipation fins 25 are arranged in the same heat dissipation channel 211 and are distributed alternately. There are multiple heat dissipation columns 214. The positions of the heat dissipation columns 214 correspond to the positions of the heat dissipation fins 25. A gear 252 is fixedly connected to one end of the connecting shaft 251. The gear 252 meshes with the rack 243. A limit plate 253 is fixedly connected to the end of the gear 252 away from the connecting shaft 251.

[0038] All electronic components mentioned in this article are electrically connected to an external main controller and 220V AC mains power. The main controller can be a conventional, known device such as a computer. The electronic components, along with their associated control systems, power supply modules, circuits, and piping, can be provided by the manufacturer. Furthermore, all electronic components and control modules involved in this invention are existing technologies, fully capable of being implemented by those skilled in the art, and require no further explanation. This invention does not involve any improvement to the structure or usage of the electronic components.

[0039] The work process is as follows:

[0040] S1. In use, the connecting shell 21 is fixedly installed on the part of the chassis wall panel 1 that needs heat dissipation by bolts;

[0041] S2. When the heat dissipated by the electronic components inside the chassis is relatively low, the drive lever 241 is activated. The drive lever 241 drives the rack 243 to move via the connecting bracket 242. The rack 243 drives the connecting shaft 251 to rotate via the gear 252. The connecting shaft 251 drives the heat sink 25 to rotate, so that the heat sink 25 is parallel to the inner wall of the heat dissipation channel 211. Figure 4 and Figure 6 As shown;

[0042] S3. Start the first cooling fan 22 and the second cooling fan 23. The first cooling fan 22 blows outside air into the heat dissipation channel 211. When passing through the heat dissipation fins 25 and heat dissipation pillars 214, the heat in the chassis wall panel 1 is dissipated through the heat dissipation fins 25 and heat dissipation pillars 214. The second cooling fan 23 drives the air in the heat dissipation channel 211 to blow out, forming convection.

[0043] S4. At this time, the airflow in the heat dissipation channel 211 is relatively smooth. The airflow in the heat dissipation channel 211 is laminar. A laminar thermal boundary layer is formed on the surface of the heat dissipation fins 25 and the heat dissipation pillars 214. Heat is dissipated through the heat conduction effect of the heat dissipation fins 25 and the heat dissipation pillars 214.

[0044] S5. When the heat generated by the electronic components inside the chassis is high, the drive lever 241 is activated. The drive lever 241 drives the rack 243 to move via the connecting bracket 242. The rack 243, through the gear 252, drives the connecting shaft 251 to rotate. The connecting shaft 251 drives the heat sink 25 to rotate, causing the heat sink 25 to tilt. One side of the heat sink 25 contacts the inner wall of the heat dissipation channel 211. Figure 3 and Figure 5 As shown;

[0045] S6. Start the first cooling fan 22 and the second cooling fan 23. Air enters the heat dissipation channel 211 from the first cooling fan 22 and is discharged from the second cooling fan 23, forming convection. The airflow bypasses the angle between the heat dissipation fins 25 and the inner wall of the heat dissipation channel 211 and impacts the subsequent airflow, forming turbulence.

[0046] S7, the heat sink fins 25 and heat sink pillars 214 form a turbulent thermal boundary layer. While heat dissipation is achieved through the thermal conduction effect of the heat sink fins 25 and heat sink pillars 214, heat dissipation is also achieved through airflow convection, which improves the heat dissipation effect. The heat dissipation effect of the chassis can be adjusted according to the amount of heat generated by the electronic components inside the chassis, avoiding damage to some electronic components inside the chassis due to heat accumulation inside the chassis, thereby improving the service life of the electronic components inside the chassis.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A heat dissipating chassis assembly, characterized by: Includes a chassis panel (1), on which a heat dissipation mechanism (2) is fixedly installed; The heat dissipation mechanism (2) includes a connecting shell (21), a first heat dissipation fan (22) is provided on one side of the connecting shell (21), a second heat dissipation fan (23) is provided on the side of the connecting shell (21) away from the first heat dissipation fan (22), a drive assembly (24) is provided on the connecting shell (21), and heat dissipation fins (25) are rotatably connected inside the connecting shell (21). The connecting shell (21) is provided with a heat dissipation channel (211) inside. The two ends of the heat dissipation channel (211) are respectively provided with a first mounting groove (212) and a second mounting groove (213). A heat dissipation column (214) is fixedly connected inside the heat dissipation channel (211). The drive assembly (24) includes a drive rod (241), the output end of which is fixedly connected to a connecting frame (242), and a rack (243) is fixedly connected to the connecting frame (242). A connecting shaft (251) is fixedly connected to the heat dissipation fins (25). A gear (252) is fixedly connected to one end of the connecting shaft (251). A limit plate (253) is fixedly connected to the end of the gear (252) away from the connecting shaft (251).

2. The heat dissipating chassis assembly of claim 1, wherein: The connecting shell (21) is fixedly installed on the chassis wall panel (1).

3. The heat dissipating chassis assembly of claim 1, wherein: The number of the first cooling fan (22) and the number of the second cooling fan (23) correspond to the number of the heat dissipation channels (211). The first cooling fan (22) is fixedly installed inside the first mounting slot (212), and the second cooling fan (23) is fixedly installed inside the second mounting slot (213).

4. The heat dissipating chassis assembly of claim 1, wherein: The drive rod (241) is fixedly installed on the connecting shell (21), and the connecting bracket (242) is slidably connected to the connecting shell (21).

5. The heat dissipating chassis assembly of claim 1, wherein: The number of heat dissipation channels (211) is multiple, the number of racks (243) is the same as the number of heat dissipation channels (211), and the gears (252) mesh with the racks (243).

6. The heat dissipating chassis assembly of claim 1, wherein: The heat dissipation fins (25) are rotatably connected to the interior of the heat dissipation channel (211) via the connecting shaft (251). Multiple heat dissipation fins (25) are provided in the same heat dissipation channel (211), and the multiple heat dissipation fins (25) in the same heat dissipation channel (211) are distributed alternately. There are multiple heat dissipation columns (214), and the positions of the heat dissipation columns (214) correspond to the positions of the heat dissipation fins (25).

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