Display film, display module and display screen

Abstract

The application relates to a display film, a display module and a display screen. The display film is attached to the surface of a display component and comprises an optical substrate, a metal shielding film layer and a conductive film layer. The optical substrate, the metal shielding film layer and the conductive film layer are sequentially stacked. The side of the optical substrate away from the metal shielding film layer is the side close to the display component. The metal shielding film layer is arranged in the display film to improve the electromagnetic protection performance of the display film, which is beneficial to guarantee the stable operation of the display component using the display film in an electromagnetic interference environment and improves the applicability.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display film, a display module, and a display screen. Background Technology

[0002] With the advancement of display technology and the demands of various application scenarios, some display products need to be used in applications with strong electromagnetic interference. Correspondingly, these display products need to have a certain level of electromagnetic interference resistance to achieve electromagnetic protection.

[0003] Currently, commonly used display products typically employ a transparent conductive film on the LED module's LED side, while a PCB board for driving the LEDs is located on the side furthest from the LEDs. Electromagnetic shielding relies on the metallic combination of the transparent conductive film and the PCB board. However, the transparent conductive film is usually made of ITO (Indium Tin Oxide), and its combined electromagnetic shielding effect with the PCB board is inadequate. This results in display products that fail to meet current electromagnetic protection requirements and exhibit poor applicability. Utility Model Content

[0004] Therefore, it is necessary to provide a display film, display module, and display screen that can improve electromagnetic protection performance and thus enhance applicability.

[0005] In a first aspect, this application provides a display film, which is attached to the surface of a display component and includes an optical substrate, a metal shielding film layer and a conductive film layer. The optical substrate, the metal shielding film layer and the conductive film layer are stacked sequentially, wherein the side of the optical substrate away from the metal shielding film layer is the side closer to the display component.

[0006] In one embodiment, the display film further includes a metal mesh disposed on the side of the optical substrate away from the metal shielding film layer.

[0007] In one embodiment, the display film further includes an adhesive layer, and the metal mesh is disposed on the optical substrate based on the adhesive layer.

[0008] In one embodiment, the metal shielding film is a silver film.

[0009] In one embodiment, the conductive film layer is an anti-glare layer, which includes one or more of metal powder, carbon polymer, and resin composite.

[0010] In one embodiment, the metal powder is nano-silver.

[0011] In one embodiment, the metal mesh is an iron mesh or a nickel mesh.

[0012] Secondly, this application also provides a display module, which includes a display component, a display circuit board, and a display film as described in the above embodiments. The display component is disposed on a first side of the display circuit board, and the display film is attached to the side of the display component away from the display circuit board and connected to a second side of the display circuit board.

[0013] In one embodiment, the display film includes a metal mesh, the display circuit board includes a circuit board metal layer, the metal mesh is attached to the side of the display component away from the circuit board metal layer, and is connected to the circuit board metal layer.

[0014] Thirdly, this application also provides a display screen, which includes a plurality of display modules as described in the above embodiments.

[0015] The aforementioned display film, display module, and display screen are described above. The display film, applied to the surface of the display component, includes an optical substrate, a metal shielding film layer, and a conductive film layer. These layers are stacked sequentially, with the side of the optical substrate furthest from the metal shielding film layer being the side closest to the display component. By incorporating a metal shielding film layer into the display film, its electromagnetic shielding performance is enhanced, which helps ensure the stable operation of the display component using the film in electromagnetic interference environments, thus improving its applicability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or in the conventional technology, the accompanying drawings used in the description of the various embodiments or in the conventional technology of this application will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application, which are used to facilitate understanding. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of a display film according to one embodiment;

[0018] Figure 2 This is a schematic diagram of the structure of the display film according to another embodiment;

[0019] Figure 3 This is a schematic diagram of the structure of the display film in yet another embodiment;

[0020] Figure 4 This is a schematic diagram of the structure of a display module according to one embodiment;

[0021] Figure 5 This is a schematic diagram of the structure of a display module according to another embodiment.

[0022] Explanation of reference numerals in the attached drawings: display film 100, optical substrate 101, metal shielding film layer 103, conductive film layer 105, metal mesh 107, adhesive layer 109, display assembly 300, display circuit board 500, circuit board metal layer 501. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description, in conjunction with the accompanying drawings and embodiments, further illustrates this application. It should be understood that the specific embodiments described herein are illustrative of this application and are not intended to limit it. This application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of this application more thorough and comprehensive.

[0024] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0025] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0026] It is understandable that "at least one" refers to one or more, and "multiple" refers to two or more. "At least a part of an element" refers to part or all of an element.

[0027] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0029] In one exemplary embodiment, such as Figure 1 As shown, the display film 100 includes an optical substrate 101, a metal shielding film layer 103, and a conductive film layer 105. The optical substrate 101, the metal shielding film layer 103, and the conductive film layer 105 are stacked sequentially. The side of the optical substrate 101 away from the metal shielding film layer 103 is the side closer to the display component.

[0030] Specifically, the optical substrate 101 is a PET (Polyethylene terephthalate) substrate. PET, short for polyester, is an unsaturated polyester material composed of elements such as carbon, hydrogen, and oxygen. It is a thermoplastic polyester with the molecular formula (C...). 10 H8O4) n It is generally a colorless and transparent (amorphous) or milky white solid (crystalline) with a transmittance of 90%, possessing an optical-grade transparent base that can meet the light transmission requirements of display components. In practical applications, PET material with a thickness of 20 to 50 micrometers is typically used as the optical substrate 101, with a transmittance of 90%-95%.

[0031] The metal shielding film 103 is made of metallic materials and utilizes the electromagnetic induction properties of metals to achieve electromagnetic shielding. In practical applications, different metallic materials can be selected, whose physical properties possess electromagnetic shielding characteristics such as conductivity or magnetic permeability, to facilitate electromagnetic protection. The principle of electromagnetic shielding varies depending on the metal; for example, it can be achieved through electromagnetic reflection, the skin effect, or the eddy current effect. The skin effect and eddy current effect achieve electromagnetic shielding by converting electromagnetic waves into current. These two effects have advantages for electromagnetic waves of different frequencies: when shielding high-frequency electromagnetic waves, the skin effect is considered the dominant effect, primarily utilizing the high conductivity of the metal; when shielding low-frequency electromagnetic waves, the eddy current effect is considered the dominant effect, primarily utilizing the high magnetic permeability of the metal. Furthermore, electromagnetic reflection can also be used to achieve electromagnetic shielding for high-frequency electromagnetic waves.

[0032] Furthermore, in an exemplary embodiment, the metal shielding film 103 can be a film made of a specified metal material, such as a silver film. Optionally, it can also be other metal materials, such as copper. The core principle behind the ability of a silver film or a copper film to shield electromagnetic waves lies in their excellent conductivity and electromagnetic induction characteristics. This highly efficient shielding material blocks electromagnetic wave energy to the outside through reflection and skin effect, and performs well when shielding high-frequency electromagnetic waves.

[0033] Optionally, the metal material of the metal shielding film layer 103 can also be nickel or iron. Nickel and iron can guide magnetic fields and generate eddy current effects. They are magnetic metals with high permeability and have a large application space in low-frequency magnetic field shielding. This is because low-frequency electromagnetic waves are characterized by long wavelengths and low-frequency magnetic fields can easily penetrate conductors. However, materials with high permeability can change the path of the magnetic field and guide it into the shielding layer, thereby reducing the external magnetic field and achieving electromagnetic shielding.

[0034] The conductive film layer 105 is the structure that enables the touch function or anti-glare function of the display film 100. It has conductive properties and can provide feedback on the interaction points when the user interacts. In use, as the layer directly exposed to external light and electromagnetic waves, it provides the first level of electromagnetic protection, which can disperse light to achieve anti-glare and initially consume or reflect electromagnetic waves. At the same time, the side of the conductive film layer 105 away from the external environment is connected to the metal shielding film layer 103. The two are attached to each other and can work together with the metal shielding film layer 103 to achieve electromagnetic protection. The metal shielding film layer 103 serves as the second level of electromagnetic protection, so as to construct a display film 100 with relatively complete electromagnetic protection functions.

[0035] In this embodiment, the display film 100 is attached to the surface of the display component and includes an optical substrate 101, a metal shielding film layer 103, and a conductive film layer 105. The optical substrate 101, the metal shielding film layer 103, and the conductive film layer 105 are stacked sequentially, wherein the side of the optical substrate 101 away from the metal shielding film layer 103 is the side closer to the display component. By providing a metal shielding film layer 103 in the display film 100, the electromagnetic protection performance of the display film 100 is improved, which helps to ensure the stable operation of the display component using the display film 100 in an electromagnetic interference environment and improves its applicability.

[0036] In an exemplary embodiment, the conductive film layer 105 is an anti-glare layer, which includes one or more of metal powder, carbon polymer, and resin composite.

[0037] Specifically, the anti-glare layer can have stable conductivity, electromagnetic reflection and electromagnetic absorption properties. Different anti-glare layers can be made according to the selection or mixing ratio of the mixed metal powder, carbon polymer and resin composite, and the physical properties of the anti-glare layer can be adjusted accordingly.

[0038] For example, carbon polymers may include one or more carbon-containing materials such as graphite, carbon fiber, and carbon nanotubes. For example, carbon nanotubes may be single-walled carbon nanotubes, which can form a three-dimensional conductive network and work synergistically with metal powder to increase conductivity, so that the conductive film layer 105 has excellent conductivity and chemical stability. It can achieve shielding by absorbing electromagnetic waves and also has the advantages of light weight and high temperature resistance, thus improving electromagnetic shielding performance.

[0039] The metal powder can be a powdered metal material with magnetic or electrical conductivity, such as silver. It can improve the conductivity and reflect part of the electromagnetic waves that reach the anti-glare layer of the display film 100, preventing them from passing through the anti-glare layer and approaching and affecting the display component, thus causing electromagnetic interference to the display component and realizing the electromagnetic protection function of the display film 100.

[0040] For example, in one embodiment, the metal powder is nano-silver. Nano-silver is metallic silver with a particle size at the nanometer level. It is powdered silver with a particle size of less than 100 nm, typically between 25-50 nm. Due to its excellent conductivity, it occupies an extremely important position in the field of microelectronics. The conductive film layer 105 made based on this nano-silver metal powder can be called a conductive AG layer.

[0041] The resin composite can be polyurethane resin. Metal powder and carbon polymer are mixed with the resin composite. The metal powder and carbon nanotubes can alter the leveling properties of the resin composite. Through methods such as embossing and coating, the conductive film layer 105 can be microscopically structured with uneven surfaces, thereby giving the display film 100 a textured appearance and achieving anti-glare. This disperses concentrated, intense reflected light into light in multiple directions, reducing the overall light intensity entering the eye and avoiding glaring spots. This satisfies the matte finish requirement in use, ensuring that the display content of the display component can be clearly viewed by the user in application scenarios with strong ambient light, providing convenience and improving display readability. Coating can generate texture by controlling the rheological properties of the slurry, while embossing directly presses out the matte texture using a physical mold. Both are existing anti-glare technologies and will not be detailed in this embodiment.

[0042] For example, the anti-glare layer includes metal powder, carbon polymer, and resin composite. Optionally, the conductive film layer 105, composed of metal powder-filled plastic, carbon fiber-reinforced polymer, or a composite of metal fiber and resin, combines both electromagnetic reflection and electromagnetic absorption mechanisms, achieving both anti-glare and electromagnetic protection. In practical applications, materials can be designed and combined according to different needs to provide a wider range of shielding frequencies, while also improving display performance defects caused by using a single material, such as increasing flexibility and reducing density. Simultaneously, electromagnetic protection capabilities can be enhanced. The conductive film layer 105, made by combining metal powder with magnetic materials and / or conductive polymers, can constitute the display film 100 to improve electromagnetic shielding performance.

[0043] It should be noted that the display film 100 in this application is set up based on the display function of the display component. That is to say, the display film 100 should have a certain light transmittance. When using the solution of this application, it should be ensured that the light emitted by the display component can pass through the display film 100 to reach the external environment so as to realize the display function of the display component.

[0044] In one exemplary embodiment, such as Figure 2 As shown, the display film 100 also includes a metal mesh 107, which is disposed on the side of the optical substrate 101 away from the metal shielding film layer 103. Since the side of the optical substrate 101 away from the metal shielding film layer 103 is the side closer to the display component, the metal mesh 107 is disposed on the side of the optical substrate 101 closer to the display component. Optionally, the metal mesh 107 is bonded to the display component.

[0045] Specifically, the selection of the metal material in the metal mesh 107 is similar to that of the metal shielding film layer 103. The metal mesh 107 is based on a metal material and utilizes the electromagnetic induction characteristics of metal to achieve electromagnetic shielding. In practical applications, different metal materials can be selected, whose physical properties possess electromagnetic shielding characteristics such as conductivity or magnetic permeability, to facilitate electromagnetic protection. The principle of electromagnetic shielding varies depending on the metal material. For example, electromagnetic shielding can be achieved through electromagnetic reflection, the skin effect, or the eddy current effect. The skin effect and eddy current effect achieve electromagnetic shielding by converting electromagnetic waves into current. These two effects have advantages for electromagnetic waves of different frequencies: when shielding high-frequency electromagnetic waves, the skin effect is considered the dominant effect, mainly utilizing the high conductivity of metal; when shielding low-frequency electromagnetic waves, the eddy current effect is considered the dominant effect, mainly utilizing the high magnetic permeability of metal. Furthermore, electromagnetic shielding can also be achieved through electromagnetic reflection when shielding high-frequency electromagnetic waves.

[0046] Optionally, in an exemplary embodiment, the metal mesh 107 can be a mesh structure made of a specified metal material, such as a silver mesh. Alternatively, it can be other metal materials, such as copper. The core principle behind the ability of a silver mesh or a copper mesh to shield electromagnetic waves lies in their excellent conductivity and electromagnetic induction characteristics. This highly efficient shielding material blocks electromagnetic wave energy from the outside through reflection and the skin effect, performing well when shielding high-frequency electromagnetic waves.

[0047] The metal material of the metal mesh 107 can also be nickel or iron. In an exemplary embodiment, the metal mesh 107 is an iron or nickel mesh. Nickel and iron can guide magnetic fields and generate eddy current effects. They are magnetic metals with high permeability and have significant application potential in low-frequency magnetic field shielding. This is because low-frequency electromagnetic waves are characterized by long wavelengths, and low-frequency magnetic fields easily penetrate conductors. However, materials with high permeability can change the path of the magnetic field and guide it into the shielding layer, thereby reducing the external magnetic field and achieving electromagnetic shielding.

[0048] Furthermore, the selection of the metal material for the metal mesh 107 can be related to the selection of the metal material for the metal shielding film layer 103: when the metal material of the metal shielding film layer 103 is selected for electromagnetic protection against high-frequency electromagnetic waves, and is a metal material with high conductivity such as silver or copper, the metal mesh 107 can be selected for electromagnetic protection against low-frequency electromagnetic waves, and is made of a metal material with high magnetic permeability such as iron or nickel; when the metal shielding film layer 103 is selected for electromagnetic protection against low-frequency electromagnetic waves, and is a metal material with high magnetic permeability such as iron or nickel, the metal mesh 107 can be selected for electromagnetic protection against high-frequency electromagnetic waves, and is made of a metal material with high conductivity such as silver or copper.

[0049] This configuration allows the display film 100 to provide electromagnetic protection against both high-frequency and low-frequency electromagnetic waves, resulting in a wider range of electromagnetic protection and greater applicability to complex electromagnetic environments. This helps ensure the reliable and safe operation of the display components and improves their applicability and reliability.

[0050] Meanwhile, by forming a mesh structure from metal material, the metal mesh 107 ensures the light transmittance of the display components. Furthermore, by adjusting the manufacturing parameters of the metal mesh 107, such as mesh size, shape, and the tilt, thickness, width, and shape of the mesh lines, the overall physical parameters of the metal mesh 107 can be altered, including aperture ratio, flexibility, and weight. This allows the metal mesh 107 to possess different properties to meet various application requirements. For example, using a softer metal material or reducing the width or thickness of the mesh lines can achieve a thinner and more flexible metal mesh 107 structure. Optionally, the aperture ratio of the metal mesh 107 is 60%-80%.

[0051] The metal mesh 107 is located closer to the display component than the conductive film layer 105 and the metal shielding film layer 103. In other words, the metal mesh 107 can serve as a third level of electromagnetic protection, together with the conductive film layer 105 and the metal shielding film layer 103, to form a display film 100 with relatively complete electromagnetic protection function.

[0052] Furthermore, in an exemplary embodiment, such as Figure 3 As shown, the display film 100 also includes an adhesive layer 109, and a metal mesh 107 is disposed on the optical substrate 101 based on the adhesive layer 109.

[0053] Specifically, the adhesive layer 109 includes an adhesive material that acts as an adhesive for bonding the metal mesh 107 to the optical substrate 101, ensuring a tight and reliable structure for the display film 100, facilitating use and assembly with display components. Simultaneously, because the mesh structure of the metal mesh 107 provides a connection channel between the adhesive material and the display component, the adhesive layer 109 can also contact the display component through the openings in the metal mesh 107, thus securing the metal mesh 107 to the display component. Therefore, the adhesive layer 109 also connects the metal mesh 107 to the display component, ensuring its fixation, thereby achieving the adhesion and fixation of the display film 100 to the display component.

[0054] Furthermore, the adhesive layer 109 is OCA adhesive, also known as OCA optical adhesive (Optically Clear Adhesive), an optically transparent adhesive used for bonding transparent optical components. It has a substrate-free double-sided lamination tape structure, achieving lamination through a release film. Specifically, the optical acrylic adhesive is made without a substrate, and then a release film is laminated to the top and bottom layers, resulting in a substrate-free double-sided lamination tape. Its characteristics include a light transmittance exceeding 99%, high adhesive strength, low shrinkage, water resistance, high temperature resistance, UV resistance, and room temperature to medium temperature curing properties, which can reduce reflected light to enhance contrast and image clarity.

[0055] Optionally, OCA optical adhesives are divided into two main categories: resistive and capacitive, with thicknesses ranging from 25 to 250 micrometers. Resistive optical adhesives are available in 50μm and 25μm thicknesses, while capacitive optical adhesives are available in 100μm, 175μm, 200μm, and 250μm thicknesses. For example, in this embodiment, the adhesive layer 109 has a thickness of 20μm-50μm.

[0056] To facilitate understanding of the above embodiments, an embodiment will be described below.

[0057] In one embodiment, the display film 100 includes a conductive film layer 105, a metal shielding film layer 103, an optical substrate 101, an adhesive layer 109, and a metal mesh 107. The arrangement and configuration are as follows: first, the optical substrate 101 is used as a substrate, a metal shielding film layer 103 is formed on the first surface of the optical substrate 101, a conductive film layer 105 is formed on the metal shielding film layer 103, an adhesive is coated on the second surface of the optical substrate 101 to form an adhesive layer 109, a metal mesh 107 is attached to the adhesive layer 109, and the adhesive exposed through the opening of the metal mesh 107 is bonded to the display component, so as to realize that the display film 100 is attached to the display component.

[0058] Specifically, the conductive film layer 105 is an anti-glare layer and is a conductive AG layer (composed of nano-silver metal powder, single-walled carbon nanotubes and polyurethane resin); the metal shielding film layer 103 is a silver film; the optical substrate 101 is a PET substrate; the adhesive layer 109 is an OCA adhesive; and the metal mesh 107 is an iron material mesh or a nickel material mesh.

[0059] For example, optical-grade PET with a thickness of 20μm-50μm is selected as the substrate, and the transmittance is generally 90%-95%. The thickness of the silver film is 5nm-10nm. The transmittance of silver films produced by solution method is 60%-80%, while the transmittance of silver films produced by magnetron sputtering can reach 90%.

[0060] Conductive AG layers fabricated using coating processes typically have a thickness of 0.5μm-3μm; those fabricated using texture embossing typically have a thickness of 3μm-15μm. The materials used in these conductive AG layers include, but are not limited to, metal powders (nano-silver, 5%-10%), single-walled carbon nanotubes (0.002%-0.1%), and polyurethane resin blends, resulting in a matte, semi-transparent black finish. The light transmittance of such conductive AG layers is 70%-90%.

[0061] The thickness of optical OCA adhesive is 20μm-50μm, and the light transmittance of OCA adhesive is 90%-95%.

[0062] Iron or nickel mesh is attached to OCA adhesive. The thickness of the iron or nickel mesh is 2μm-5μm (the thickness difference of the metal mesh 107 can be ignored due to the high filling capacity of OCA adhesive). The metal line width is 10μm-50μm, and the aperture ratio is generally set to 60%-80%, so its transmittance is 60%-80%. The manufacturing method of metal mesh 107 includes, but is not limited to, chemical deposition or physical vapor deposition of metal on glass (suitable for single-sheet products) or flexible substrate (suitable for roll materials), etching the mesh pattern through an etching process, and then transferring the metal mesh onto OCA adhesive. This will not be elaborated further here.

[0063] Furthermore, to facilitate encapsulation with the display component, after transferring the metal mesh 107 to the OCA adhesive layer, a release film can be applied to the metal mesh 107 side of the display film 100, which is then removed during encapsulation with the display component. If the metal mesh 107 is on a flexible substrate, release treatment can be performed on the flexible substrate at the holes of the metal mesh 107, and the flexible substrate carrying the metal mesh 107 can be directly attached to the OCA adhesive surface. The flexible substrate is used as a release film (thickness 50μm-100μm).

[0064] Correspondingly, in order to protect the display film 100 during the encapsulation process, a PET protective film with a thickness of 50μm-100μm can be applied to the conductive AG layer to protect the conductive AG layer and prevent the conductive AG layer from being scratched during the encapsulation process between the display film 100 and the display component. The PET protective film is then removed after the encapsulation process.

[0065] In this embodiment, the display film 100 is attached to the surface of the display component and includes a conductive film layer 105, a metal shielding film layer 103, an optical substrate 101, an adhesive layer 109, and a metal mesh 107. The metal shielding film layer 103 is a silver film, and the metal mesh 107 is an iron or nickel mesh. By incorporating a silver film and an iron or nickel mesh into the display film 100, the electromagnetic shielding performance of the display film 100 is improved. This helps ensure the stable operation of the display component using the display film 100 in an electromagnetic interference environment, thus enhancing its applicability.

[0066] Based on the same technical concept, this application also provides a display module, such as... Figure 4 As shown, the display module includes a display component 300, a display circuit board 500, and a display film 100 as described in the above embodiments. The display component 300 is disposed on the first side of the display circuit board 500, and the display film 100 is attached to the side of the display component 300 away from the display circuit board 500 and connected to the second side of the display circuit board 500.

[0067] Specifically, the display component 300 is a light-emitting element that can display different content by combining and adjusting the light source. The adjustment and control of its light source is based on the display circuit board 500. At the same time, the display film 100 is attached to the side of the display component 300 away from the display circuit board 500 to protect the display component 300 and the display circuit board 500 from electromagnetic interference during display and operation.

[0068] To achieve comprehensive electromagnetic protection, the display film 100 is connected to the second side of the display circuit board 500. Essentially, the display film 100 and the display circuit board 500 enclose each other to form a space, allowing the display component 300, located on the first side of the display circuit board 500, to reside within this space, thus achieving multi-directional electromagnetic protection for the display film 100. Simultaneously, the display circuit board 500 includes copper layers and other metallic processes, and the metal mesh 107 is grounded through an electrical connection with the display circuit board 500, forming a space similar to a Faraday cage, thereby improving the reliability of electromagnetic shielding.

[0069] For example, the display component 300 includes LEDs or Mini LEDs, the number of which is not limited. The area of ​​the display component 300 is smaller than the area of ​​the display film 100, and it is sufficient to connect the display film 100 to the display circuit board 500. The display circuit board 500 can be a PCB board, and the number of layers of the PCB board is not limited and can be set according to requirements.

[0070] In one embodiment, such as Figure 5 As shown, the display film 100 includes a metal mesh 107, and the display circuit board 500 includes a circuit board metal layer 501. The metal mesh 107 is attached to the side of the display assembly 300 away from the circuit board metal layer 501 and is connected to the circuit board metal layer 501.

[0071] Specifically, in the LED or Mini LED type display component 300, the corresponding display circuit board 500 includes a driving surface disposed on the second side of the display circuit board 500, and the driving surface includes a metal edge disposed in the edge region of the display circuit board 500. This metal edge is the circuit board metal layer 501, and the circuit board metal layer 501 is electrically grounded. The metal mesh 107 is connected to the circuit board metal layer 501, forming a space similar to a Faraday cage, improving the reliability of electromagnetic shielding.

[0072] Based on the same technical concept, in one embodiment, this application also provides a display screen, which includes multiple display modules described in the above embodiments, and the number of display modules is not limited. The connection relationship between the display modules can be independent, or they can be connected in series or in parallel, and the connection method can be arbitrarily combined according to requirements; this application does not limit this.

[0073] To facilitate understanding of the above embodiments, an embodiment will be described below.

[0074] In one embodiment, the display screen includes multiple display modules, wherein each display module includes a display component 300, a display circuit board 500, and a display film 100. The display circuit board 500 includes a circuit board metal layer 501, and a metal mesh 107 is attached to and connected to the circuit board metal layer 501 on the side of the display component 300 away from the circuit board metal layer 501. The display component 300 is a Mini LED, the display circuit board 500 is a PCB board, and the circuit board metal layer 501 is the metal edge of the driving surface of the PCB board away from the Mini LED, and this metal edge is grounded.

[0075] For example, the Mini LED PCB board has multiple layers, and each layer has multiple copper layers, which facilitates electromagnetic shielding and can also work together with the display film 100 to achieve electromagnetic protection. The driving surface edge of the Mini LED PCB board retains a metal edge and is grounded to GND. The metal mesh 107 of the display film 100 is attached to the Mini LED, and the excess display film 100 around the perimeter (the area of ​​the display film 100 is slightly larger than the area of ​​the Mini LED) covers the driving surface of the PCB board along the side of the Mini LED, so that its metal mesh 107 is electrically connected to the metal edge of the driving surface of the PCB board, grounded to form a Faraday cage, thereby achieving electromagnetic protection.

[0076] In this embodiment, the display film 100 is attached to the surface of the display component 300, and the metal mesh 107 of the display film 100 is attached to the side of the display component 300 away from the circuit board metal layer 501 and connected to the circuit board metal layer 501. The metal shielding film layer 103 of the display film 100 is a silver film, the metal mesh 107 is an iron or nickel material mesh, and the circuit board metal layer 501 has a metal edge. By setting a silver film and an iron or nickel material mesh in the display film 100, and electrically connecting the iron or nickel material mesh to the metal edge of the driving surface of the PCB board to form a Faraday cage, the electromagnetic protection performance of the display film 100 is improved. This helps ensure the stable operation of the display component 300 using the display film 100 in an electromagnetic interference environment, thus improving its applicability.

[0077] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0078] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A display film to be attached to a surface of a display assembly, characterized in that, It includes an optical substrate, a metal shielding film layer, and a conductive film layer, wherein the optical substrate, the metal shielding film layer, and the conductive film layer are stacked sequentially, and the side of the optical substrate away from the metal shielding film layer is the side closer to the display component.

2. The display film of claim 1, wherein, The display film also includes a metal mesh disposed on the side of the optical substrate away from the metal shielding film layer.

3. The display film of claim 2, wherein, The display film further includes an adhesive layer, and the metal mesh is disposed on the optical substrate based on the adhesive layer.

4. The display film according to any one of claims 1-3, wherein, The metal shielding film is a silver film.

5. The display film according to any one of claims 1-3, wherein, The conductive film layer is an anti-glare layer.

6. The display film according to claim 2, wherein, The metal mesh is made of iron or nickel.

7. A display module, characterized by The display module includes a display component, a display circuit board, and a display film as described in any one of claims 1-6. The display component is disposed on a first side of the display circuit board, and the display film is attached to the side of the display component away from the display circuit board and connected to a second side of the display circuit board.

8. The display module of claim 7, wherein, The display film includes a metal mesh, and the display circuit board includes a circuit board metal layer. The metal mesh is attached to the side of the display component away from the circuit board metal layer and is connected to the circuit board metal layer.

9. A display screen, characterized by The display screen includes a plurality of display modules as described in any one of claims 7-8.

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