Composite thermistor

Abstract

The utility model relates to resistance technical field discloses a kind of composite thermistor, including resistance main body, the inside of resistance main body is provided with composite function module, the composite function module includes substrate material layer, substrate material layer is set in the middle part of resistance main body, the outside of substrate material layer is provided with semiconductor ceramic layer, the outside of semiconductor ceramic layer is provided with high-molecular composite layer, the outside of high-molecular composite layer is provided with Cr transition layer, the outside of Cr transition layer is provided with Ag conductive layer, the outside of Ag conductive layer is provided with high-temperature resistant packaging layer, the inside of high-molecular composite layer is provided with carbon nanotube and graphene, Cr transition layer is made of high-purity metal chromium material.In the utility model, through the composite function module being equipped, both realize wide temperature range response and commonly used interval high sensitivity, solve the performance limitation of traditional single material, also ensure electrode firm and signal transmission stable.

Description

Technical Field

[0001] This utility model relates to the field of resistance technology, and in particular to a composite thermistor. Background Technology

[0002] As a temperature-sensitive semiconductor device, thermistors have become a core component in industrial control, automotive electronics, smart home and other fields due to their small size and controllable cost. They are mainly used in temperature monitoring, over-temperature protection and intelligent temperature control. For example, in industrial motor windings, thermistors are needed to track the heating status in real time to prevent equipment damage. In new energy vehicle battery packs, thermistors are needed to sense changes in cell temperature to ensure charging and discharging safety.

[0003] However, existing thermistor technology has significant shortcomings and cannot meet the high-performance requirements of various scenarios: traditional single-material thermistors either have a narrow temperature response range, making them unsuitable for high-temperature industrial environments or low-temperature cold chain monitoring scenarios, or they have low sensitivity in commonly used temperature ranges, making it difficult to capture subtle temperature changes. Although some wide-temperature-range thermistors can cover a wide temperature range, they have poor long-term working stability, are prone to resistance drift in high-temperature environments, and have slow response speeds, making it impossible to respond to sudden temperature anomalies in a timely manner.

[0004] Therefore, those skilled in the art have provided a composite thermistor to solve the problems mentioned in the background art. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a composite thermistor. Through its composite functional components, it utilizes alumina ceramic as a substrate to ensure structural stability and uniform temperature conduction. The semiconductor ceramic layer, in synergy with a polyimide polymer composite layer containing carbon nanotubes and graphene, achieves both wide-temperature response and high sensitivity in commonly used ranges, overcoming the performance limitations of traditional single materials. Combined with a Cr transition layer and an Ag conductive layer, it ensures electrode stability and stable signal transmission. The outer encapsulation layer isolates external interference, protecting the component for long-term operation. Overall, it is adaptable to various application scenarios.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A composite thermistor includes a resistor body, a composite functional component disposed inside the resistor body, the composite functional component including a substrate material layer disposed in the middle of the resistor body, a semiconductor ceramic layer disposed outside the substrate material layer, a polymer composite layer disposed outside the semiconductor ceramic layer, a Cr transition layer disposed outside the polymer composite layer, an Ag conductive layer disposed outside the Cr transition layer, and a high-temperature resistant encapsulation layer disposed outside the Ag conductive layer.

[0008] Through the above technical solution, a multi-layered synergistic structure of "substrate-functional layer-electrode-packaging" is constructed. The substrate material layer provides stable support for the whole, the semiconductor ceramic layer and the polymer composite layer form a composite functional core, which can synergistically achieve a wide temperature range resistance-temperature response and high sensitivity sensing. The Cr transition layer and Ag conductive layer ensure a stable connection between the electrode and the functional layer and low impedance signal transmission. The high-temperature resistant packaging layer provides environmental protection for the internal structure. This multi-layered structure breaks through the performance limitations of traditional single-material thermistors, which can cover a wider temperature range and take into account sensitivity, stability and environmental adaptability. At the same time, the layers are tightly bonded, reducing temperature conduction hysteresis and improving the device response speed.

[0009] Furthermore, the interior of the polymer composite layer is provided with carbon nanotubes and graphene, the Cr transition layer is made of high-purity metallic chromium, and the Ag conductive layer is made of high-purity metallic silver.

[0010] Through the above technical solution, the synergistic effect of carbon nanotubes (high conductivity sensitivity) and graphene (high specific surface area and excellent conductivity) in the polymer composite layer can significantly improve the temperature sensitivity in the commonly used temperature range, solving the problem of insufficient sensitivity of traditional thermistors in this range. The Cr transition layer made of high-purity metallic chromium has strong adhesion, which can effectively prevent the Ag conductive layer from falling off from the polymer composite layer in the high-temperature environment, ensuring the stability of the electrode structure. The Ag conductive layer made of high-purity metallic silver has extremely low volume resistivity, which can reduce the impedance loss of the electrode itself, ensure that the resistance change signal of the functional layer is accurately transmitted to the external circuit, and reduce measurement errors.

[0011] Furthermore, the semiconductor ceramic layer is made of MnO2-ZnO-Co2O3 material;

[0012] Through the above technical solutions, the MnO2-ZnO-Co2O3 system ceramic material has excellent wide-temperature resistance-temperature response characteristics, which solves the problem that traditional single ceramic thermistors can only cover a narrow temperature range. The crystal structure of this system material is stable and the internal porosity is low after sintering, which can reduce resistance drift during temperature cycling and lay the foundation for the long-term working stability of the device.

[0013] Furthermore, the polymer composite layer is made of polyimide material;

[0014] Through the above technical solutions, polyimide materials possess high-temperature resistance, which can match the wide-temperature range operating requirements of semiconductor ceramic layers. This avoids the failure of functional layers caused by the softening or degradation of polymer materials at high temperatures. At the same time, polyimide has good flexibility, which can buffer the brittle defects of semiconductor ceramic layers, reduce cracks caused by vibration and impact during device assembly or use, and improve mechanical reliability. In addition, polyimide has excellent chemical stability and can form a uniform composite system with carbon nanotubes and graphene, ensuring the consistency of the conductivity of functional layers.

[0015] Furthermore, the high-temperature resistant encapsulation layer is made of high-temperature resistant epoxy resin material;

[0016] Through the above technical solutions, high-temperature resistant epoxy resin materials can effectively isolate external moisture and corrosive gases (such as acidic gases in industrial environments and oil stains in automotive electronics) from contact with internal functional layers and electrodes, preventing abnormal resistance or electrode oxidation caused by environmental corrosion. This not only ensures the protective effect but also does not significantly hinder the conduction of external temperature to internal functional layers, avoiding response delays caused by encapsulation.

[0017] Furthermore, the substrate material layer is made of alumina ceramic material;

[0018] Through the above technical solutions, alumina ceramic materials have high insulation properties, which can avoid interference of the substrate's own conductivity on the functional layer resistance signal. They have excellent high temperature resistance and can maintain structural stability at the highest operating temperature of 300℃ without softening or deformation. At the same time, the thermal conductivity of alumina ceramics is stable, which can realize the uniform and rapid conduction of external temperature to the semiconductor ceramic layer and reduce the measurement deviation caused by temperature gradient.

[0019] Furthermore, two resistor pins are fixedly connected to one side of the Ag conductive layer;

[0020] Through the above technical solution, the two resistor pins are directly connected to the Ag conductive layer, establishing an electrical path between the device and external circuits (such as temperature detection modules and control systems), enabling the functional layer resistance change signal collected by the Ag conductive layer to be transmitted to external devices, realizing the core function of "temperature change → resistance signal → electrical signal output".

[0021] This utility model has the following beneficial effects:

[0022] This invention proposes a composite thermistor that, through its composite functional components, uses alumina ceramic as a substrate to ensure structural stability and uniform temperature conduction. The semiconductor ceramic layer and the polyimide polymer composite layer containing carbon nanotubes and graphene work together to achieve a wide temperature range response and high sensitivity in commonly used ranges, overcoming the performance limitations of traditional single materials. Combined with a Cr transition layer and an Ag conductive layer, it ensures electrode stability and stable signal transmission. The outer encapsulation layer isolates external interference and protects the component for long-term operation, making it suitable for various application scenarios. Attached Figure Description

[0023] Figure 1 This is an isometric schematic diagram of a composite thermistor proposed in this utility model;

[0024] Figure 2 for Figure 1 Enlarged structural diagram at point A;

[0025] Figure 3 This is a schematic diagram of the internal structure of the polymer composite layer of a composite thermistor proposed in this utility model.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1. Resistor body; 2. Composite functional component; 3. Base material layer; 4. Semiconductor ceramic layer; 5. Polymer composite layer; 6. Cr transition layer; 7. Ag conductive layer; 8. High temperature resistant encapsulation layer; 9. Carbon nanotube; 10. Graphene; 11. Resistor leads. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of specific embodiments. Obviously, the described specific embodiments are only a part of the specific embodiments of the present invention, and not all of them. Based on the specific embodiments of the present invention, all other specific embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Reference Figure 1-3This utility model provides a specific embodiment: a composite thermistor, including a resistor body 1, with a composite functional component 2 disposed inside the resistor body 1. The composite functional component 2 includes a substrate material layer 3, which is disposed in the middle of the resistor body 1. The substrate material layer 3 is made of alumina ceramic material. Alumina ceramic material has high insulation properties, which can avoid interference of the substrate's own conductivity on the resistance signal of the functional layer. It has excellent high temperature resistance and can maintain structural stability at the maximum operating temperature of 300℃ without softening or deformation. At the same time, the thermal conductivity of alumina ceramic is stable, which can realize uniform and rapid conduction of external temperature to the semiconductor ceramic layer 4, reducing measurement deviation caused by temperature gradient. A semiconductor ceramic layer is disposed on the outer side of the substrate material layer 3. 4. The semiconductor ceramic layer 4 is made of MnO2-ZnO-Co2O3 material. The MnO2-ZnO-Co2O3 ceramic system possesses excellent wide-temperature resistance-temperature response characteristics, overcoming the limitation of traditional single-ceramic thermistors that can only cover a narrow temperature range. This system has a stable crystal structure and low internal porosity after sintering, reducing resistance drift during temperature cycling and laying the foundation for long-term device stability. A polymer composite layer 5 is disposed on the outer side of the semiconductor ceramic layer 4. The polymer composite layer 5 is made of polyimide material. Polyimide has high-temperature resistance, matching the wide-temperature operating requirements of the semiconductor ceramic layer 4 and preventing softening or degradation of the polymer material at high temperatures, which could lead to functional layer failure. Simultaneously, polyimide exhibits good... Good flexibility can buffer the brittle defects of the semiconductor ceramic layer 4, reduce cracks caused by vibration and impact during device assembly or use, and improve mechanical reliability. In addition, the excellent chemical stability of polyimide can form a uniform composite system with carbon nanotubes 9 and graphene 10, ensuring the consistency of the conductivity of the functional layer. A Cr transition layer 6 is set on the outside of the polymer composite layer 5, an Ag conductive layer 7 is set on the outside of the Cr transition layer 6, and a high-temperature resistant encapsulation layer 8 is set on the outside of the Ag conductive layer 7. The high-temperature resistant encapsulation layer 8 is made of high-temperature resistant epoxy resin material. The high-temperature resistant epoxy resin material can effectively isolate external moisture and corrosive gases (such as acidic gases in industrial environments and oil stains in automotive electronics) from contact with the internal functional layer and electrodes, avoiding device... To address resistance anomalies or electrode oxidation caused by environmental corrosion, this multi-layered synergistic structure ensures protection without significantly hindering the conduction of external temperature to the internal functional layers, thus avoiding response delays due to encapsulation. The composite functional component 2 constructs a multi-layered synergistic structure of "substrate—functional layer—electrode—encapsulation." The substrate material layer 3 provides stable support for the entire structure. The semiconductor ceramic layer 4 and the polymer composite layer 5 form a composite functional core, synergistically achieving a wide temperature range resistance-temperature response and high-sensitivity sensing. The Cr transition layer 6 and the Ag conductive layer 7 ensure a stable connection between the electrodes and the functional layers and low-impedance signal transmission. The high-temperature resistant encapsulation layer 8 provides environmental protection for the internal structure. This multi-layered structure breaks through the performance limitations of traditional single-material thermistors, covering a wider temperature range.It balances sensitivity, stability, and environmental adaptability, while ensuring tight adhesion between layers to reduce temperature conduction hysteresis and improve device response speed. The polymer composite layer 5 incorporates carbon nanotubes 9 and graphene 10. The Cr transition layer 6 is made of high-purity chromium, and the Ag conductive layer 7 is made of high-purity silver. The synergistic effect of carbon nanotubes 9 (high conductivity sensitivity) and graphene 10 (high specific surface area, excellent conductivity) in the polymer composite layer 5 significantly improves temperature sensitivity in commonly used temperature ranges, solving the problem of insufficient sensitivity in this range for traditional thermistors. The high-purity chromium Cr transition layer 6 has strong adhesion, effectively preventing Ag from... The conductive layer 7 and the polymer composite layer 5 detach at high temperatures, ensuring the stability of the electrode structure. The Ag conductive layer 7, made of high-purity silver, has extremely low volume resistivity, reducing the electrode's own impedance loss and ensuring accurate transmission of the resistance change signal of the functional layer to the external circuit, minimizing measurement errors. Two resistor pins 11 are fixedly connected to one side of the Ag conductive layer 7, directly connecting to it and establishing an electrical path between the device and external circuits (such as temperature detection modules and control systems). This allows the functional layer resistance change signal collected by the Ag conductive layer 7 to be transmitted to external devices, realizing the core function of "temperature change → resistance signal → electrical signal output".

[0030] Working principle: When the external ambient temperature changes, the temperature signal is quickly transmitted to the internal composite functional layer through the high-temperature resistant encapsulation layer 8. The semiconductor ceramic layer 4 serves as the core of the wide-temperature-range response, and its resistance value shows a stable and regular change with temperature, covering a wide temperature range. The carbon nanotubes 9 and graphene 10 in the polymer composite layer 5, with their high conductivity sensitivity, further amplify the resistance response to temperature in the commonly used temperature range, improving the temperature sensing sensitivity. The substrate material layer 3 ensures stable support and uniform temperature conduction for each functional layer, avoiding the impact of local temperature deviations on measurement. The Cr transition layer 6 ensures a stable connection between the Ag conductive layer 7 and the polymer composite layer 5. The Ag conductive layer 7 converts the resistance change signal of the composite functional layer into an electrical signal, which is transmitted to the external circuit through the resistor pin 11. The high-temperature resistant encapsulation layer 8 isolates external moisture, corrosion and other interference factors throughout the process, ensuring the stable operation of the internal structure, and ultimately achieving stable sensing and signal output of ambient temperature.

[0031] The following points should be noted in this article:

[0032] 1. The accompanying drawings of the embodiments disclosed herein only relate to the structures involved in the embodiments disclosed herein; other structures can be referred to in general design.

[0033] 2. Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0034] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing specific embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A composite thermistor, comprising a resistor body (1), characterized in that: The resistor body (1) is provided with a composite functional component (2) inside. The composite functional component (2) includes a base material layer (3). The base material layer (3) is disposed in the middle of the resistor body (1). A semiconductor ceramic layer (4) is disposed on the outside of the base material layer (3). A polymer composite layer (5) is disposed on the outside of the semiconductor ceramic layer (4). A Cr transition layer (6) is disposed on the outside of the polymer composite layer (5). An Ag conductive layer (7) is disposed on the outside of the Cr transition layer (6). A high-temperature resistant encapsulation layer (8) is disposed on the outside of the Ag conductive layer (7).

2. A composite thermistor according to claim 1, wherein: The polymer composite layer (5) is provided with carbon nanotubes (9) and graphene (10) inside. The Cr transition layer (6) is made of high-purity metallic chromium material, and the Ag conductive layer (7) is made of high-purity metallic silver material.

3. A composite thermistor according to claim 1, wherein: The semiconductor ceramic layer (4) is made of MnO2-ZnO-Co2O3 material.

4. The composite thermistor of claim 1 wherein: The polymer composite layer (5) is made of polyimide material.

5. The composite thermistor of claim 1 wherein: The high-temperature resistant encapsulation layer (8) is made of high-temperature resistant epoxy resin material.

6. The composite thermistor of claim 1 wherein: The substrate material layer (3) is made of alumina ceramic material.

7. The composite thermistor of claim 1 wherein: Two resistor pins (11) are fixedly connected to one side of the Ag conductive layer (7).

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