Resonant inductor with built-in heat sink structure

Abstract

This utility model discloses a resonant inductor with a built-in heat dissipation structure, relating to the field of power electronics technology. It includes an upper magnetic core and a lower magnetic core, with a coil disposed between them. A base plate is disposed on the lower magnetic core, and a heat sink is embedded in the base plate, with the heat sink in contact with the lower magnetic core. As a further embodiment of this utility model, a slot is formed on the base plate, and the heat sink is embedded in the slot and then in contact with the lower magnetic core. During inductor operation, the heat sink directly in contact with the lower magnetic core can quickly absorb and conduct the heat generated by the upper magnetic core, lower magnetic core, and coil to the outside, reducing the heat transfer path, lowering thermal resistance, and improving heat dissipation efficiency, thereby improving the stability of the inductor during operation. Furthermore, the embedded mounting forms an integrated structure with the base plate and lower magnetic core, eliminating the need for an external heat sink, reducing assembly difficulty, and reducing the overall space occupied by the inductor structure, making it suitable for applications requiring small size and high power density.

Description

Technical Field

[0001] This utility model relates to the field of power electronics technology, and in particular to a resonant inductor with a built-in heat dissipation structure. Background Technology

[0002] A resonant inductor is an inductor specifically designed to work with a capacitor to form a resonant circuit. Its core function is to filter signals or convert power at a specific frequency through the periodic exchange of energy between magnetic and electric fields. In power conversion devices such as switching power supplies and inverters, the resonant inductor is a key component in resonant converter topologies. During operation, it generates significant heat due to core losses and coil copper losses. Traditional resonant inductors typically use natural heat dissipation or additional heat sinks for cooling.

[0003] However, traditional heat dissipation methods also have the following problems: 1. Low heat dissipation efficiency leads to increased inductor temperature, affecting system efficiency and reliability; 2. External heat sinks increase size and assembly complexity; 3. Long heat dissipation path and high thermal resistance.

[0004] Therefore, it is necessary to propose a new technical solution to address the above problems. Utility Model Content

[0005] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the aforementioned problems.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a resonant inductor with a built-in heat dissipation structure, comprising an upper magnetic core and a lower magnetic core, wherein a coil is disposed between the upper magnetic core and the lower magnetic core; A base plate is provided on the lower magnetic core, and a heat sink is embedded in the base plate and is attached to the lower magnetic core.

[0007] As a further embodiment of this utility model: a slot is provided on the base plate, and the heat sink is embedded in the slot and then attached to the lower magnetic core.

[0008] As a further embodiment of this utility model: the lower end of the heat sink protrudes from the surface of the base plate.

[0009] As a further embodiment of this utility model: the lower end of the heat sink is provided with heat dissipation grooves arranged in an array.

[0010] As a further embodiment of this utility model: the base plate is also provided with an inlet hole, and the coil has lead wires that can pass through the inlet hole.

[0011] As a further embodiment of this utility model: a boss is provided at the lower end of the base plate.

[0012] As a further embodiment of this utility model: the horizontal height of the lower end face of the heat sink is higher than the lower end face of the boss.

[0013] As a further embodiment of this utility model: an upper core post and a lower core post are respectively provided on opposite sides of the upper magnetic core and the lower magnetic core, and an insulating paper is provided between the upper magnetic core and the lower magnetic core. The insulating paper wraps the upper core post and the lower core post inside, and the coil is wound on the outside of the insulating paper.

[0014] Compared with the existing technology, the beneficial effects of this technical solution are as follows: During the operation of the inductor, the heat sink directly attached to the lower magnetic core can quickly absorb and conduct the heat generated by the upper magnetic core, the lower magnetic core and the coil to the outside, which can reduce the heat transfer path, reduce thermal resistance, improve heat dissipation efficiency, and thus improve the stability of the inductor during operation. The heat sink is embedded in the base plate, forming an integrated structure with the base plate and the lower magnetic core. This not only eliminates the need for an external heat sink, reducing assembly difficulty, but also reduces the space occupied by the overall inductor structure, making it suitable for applications requiring small size and high power density.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a cross-sectional structural diagram of the present invention; Figure 3 This is an exploded structural diagram of the present invention; Figure 4 This is a schematic diagram of the structure of the base plate of this utility model; Figure 5 This is a schematic diagram of the structure of the heat sink of this utility model; The corresponding labels in the attached diagram are explained as follows: 1. Upper magnetic core; 11. Upper core post; 2. Lower magnetic core; 21. Lower core post; 3. Coil; 31. Lead wire; 4. Base plate; 41. Slot; 42. Wire inlet hole; 5. Heat sink; 51. Heat dissipation groove; 6. Boss; 7. Insulating paper. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-5 A resonant inductor with a built-in heat dissipation structure includes an upper magnetic core 1 and a lower magnetic core 2, wherein a coil 3 is disposed between the upper magnetic core 1 and the lower magnetic core 2; A base plate 4 is provided on the lower magnetic core 2, and a heat sink 5 is embedded in the base plate 4 and the heat sink 5 is attached to the lower magnetic core 2.

[0020] Specifically, during the operation of the inductor, the heat sink 5, which is directly attached to the lower magnetic core 2, can quickly absorb and conduct the heat generated by the upper magnetic core 1, the lower magnetic core 2 and the coil 3 to the outside. This can reduce the heat transfer path, reduce thermal resistance, improve heat dissipation efficiency, and thus improve the stability of the inductor during operation. The heat sink 5 is embedded in the base plate 4, forming an integrated structure with the base plate 4 and the lower magnetic core 2. This not only eliminates the need for an external heat sink, reducing assembly difficulty, but also reduces the space occupied by the overall inductor structure, making it suitable for application scenarios with small size and high power density requirements. Meanwhile, the heat sink 5 is attached to the bottom of the lower magnetic core 2 and is also embedded inside the base plate 4, which can completely prevent accidental contact by staff during maintenance when the inductor is working and can prevent the high temperature heat sink 5 from accidentally burning the staff. The heat sink 5 is preferably made of aluminum alloy, which is inexpensive and easy to process and shape, while the base plate 4 is made of epoxy resin.

[0021] Based on the above embodiments, it is further proposed that the base plate 4 has a slot 41, and the heat sink 5 is embedded in the slot 41 and then attached to the lower magnetic core 2.

[0022] Specifically, the slot 41 provides precise positioning for the installation of the heat sink 5, ensuring that the heat sink 5 fits tightly with the lower magnetic core 2 after being embedded in the base plate 4, while allowing the heat of the heat sink 5 to dissipate quickly. Slot 41 also serves to limit the positional displacement of heat sink 5; The heat sink 5 can be fixed to the inner wall of the slot 41 by using epoxy resin adhesive to bond its edges.

[0023] Based on the above embodiments, it is further proposed that the lower end of the heat sink 5 protrudes from the surface of the base plate 4; so that the heat absorbed by the heat sink 5 can be directly and quickly released to the outside air, reducing the heat retention inside the base plate 4.

[0024] Based on the above embodiments, it is further proposed that the lower end of the heat sink 5 is provided with heat dissipation grooves 51 arranged in an array.

[0025] Specifically, the array-type heat dissipation trenches 51 can significantly increase the contact area between the heat sink 5 and the air, transferring heat to the air with higher efficiency. Furthermore, the structural features of the heat dissipation trenches 51 can guide airflow, forming air convection, accelerating heat dissipation, and further improving heat dissipation efficiency.

[0026] Based on the above embodiments, it is further proposed that the base plate 4 is also provided with an inlet hole 42, and the coil 3 is led out with a lead wire 31. The lead wire 31 can pass through the inlet hole 42. After the lead wire 31 passes through the inlet hole 42, it can be soldered to the reserved hole on the PCB board during inductor installation, so that the inductor is connected to the circuit of the PCB board.

[0027] Based on the above embodiments, it is further proposed that the lower end of the base plate 4 is provided with a boss 6. The boss 6 can serve as a positioning reference between the base plate 4 and the PCB board. Precise alignment can be achieved through the boss 6, thereby improving the stability of the base plate 4 on the PCB board and preventing the connection point between the coil 3 and the PCB board from desoldering, which could cause a short circuit.

[0028] Preferably, the lower end face of the heat sink 5 is at a higher level than the lower end face of the boss 6, so that a gap is formed between the heat sink 5 and the PCB board, so that air can flow through the heat dissipation trench to maintain heat dissipation efficiency.

[0029] Based on the above embodiments, it is further proposed that an upper core post 11 and a lower core post 21 are respectively provided on opposite sides of the upper magnetic core 1 and the lower magnetic core 2, and an insulating paper 7 is provided between the upper magnetic core 1 and the lower magnetic core 2. The insulating paper 7 wraps the upper core post 11 and the lower core post 21 inside, and the coil 3 is wound on the outside of the insulating paper 7. The insulating paper 7 is a high-insulation Nomi paper.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A resonant inductor with built-in heat dissipation structure, characterized in that, It includes an upper magnetic core (1) and a lower magnetic core (2), and a coil (3) is provided between the upper magnetic core (1) and the lower magnetic core (2); A base plate (4) is provided on the lower magnetic core (2), and a heat sink (5) is embedded in the base plate (4), and the heat sink (5) is attached to the lower magnetic core (2).

2. The resonant inductor with built-in heat dissipation structure according to claim 1, wherein, The base plate (4) has a slot (41) and the heat sink (5) is embedded in the slot (41) and then attached to the lower magnetic core (2).

3. The resonant inductor with built-in heat dissipation structure according to claim 2, wherein, The lower end of the heat sink (5) protrudes from the surface of the base plate (4).

4. The resonant inductor with built-in heat dissipation structure according to claim 3, wherein, The lower end of the heat sink (5) has heat dissipation grooves (51) arranged in an array.

5. The resonant inductor with built-in heat dissipation structure according to claim 4, wherein, The base plate (4) is also provided with an inlet hole (42), and the coil (3) has a lead wire (31) leading out, which can pass through the inlet hole (42).

6. The resonant inductor with built-in heat dissipation structure according to claim 5, wherein, The bottom plate (4) is provided with a boss (6) at its lower end.

7. The resonant inductor with built-in heat dissipation structure according to claim 6, wherein, The lower end face of the heat sink (5) is at a higher level than the lower end face of the boss (6).

8. The resonant inductor with built-in heat dissipation structure according to any one of claims 1-7, characterized in that, The upper magnetic core (1) and the lower magnetic core (2) are respectively provided with an upper core post (11) and a lower core post (21) on opposite sides. An insulating paper (7) is provided between the upper magnetic core (1) and the lower magnetic core (2). The insulating paper (7) wraps the upper core post (11) and the lower core post (21) inside, and the coil (3) is wound around the outside of the insulating paper (7).

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