A chip type common mode inductor

Abstract

The utility model discloses a kind of chip mode common mode inductance, the first baffle edge and second baffle edge side are connected with middle column, the first baffle edge top is provided with first recess and second recess, the first baffle plate bottom two sides are respectively provided with first solder pad electrode and second solder pad electrode, the second baffle edge top is provided with third recess and fourth recess, the second baffle edge bottom two sides are respectively provided with third solder pad electrode and fourth solder pad electrode, first enameled wire and second enameled wire are arranged in the first recess and second recess inner portion, the first enameled wire's wire head is fixed in the first electrode side surface plating of the second baffle edge, and first welding spot is formed by flattening. The utility model improves the high-performance reliability of chip mode common mode inductance product in application field, breaks traditional electroplating structure chip mode common mode inductance bottom solder pad electrode hanging wire spot welding broken wire hidden danger, avoids bottom solder pad spot welding to cause tin residue, tin bead residue, enameled wire scalding and other short-circuit risk.

Description

Technical Field

[0001] This utility model relates to the field of inductor manufacturing technology, specifically to a chip common mode inductor. Background Technology

[0002] A common-mode chip inductor is a key electronic component designed to suppress common-mode noise in circuits. Its compact chip structure makes it small, easy to integrate, and readily mountable on various printed circuit boards (PCBs). Its core, formed through a special winding process, has a high permeability magnetic core that effectively filters common-mode interference from power or signal lines, improving electromagnetic compatibility (EMC). With its low DC resistance and high impedance characteristics, common-mode chip inductors are widely used in switching power supplies, communication equipment, automotive electronics, and other fields. They significantly enhance equipment stability and reduce electromagnetic interference to other systems, making them an ideal choice for anti-interference design in modern electronic equipment.

[0003] Currently, existing chip common mode inductors still have some shortcomings. Existing chip common mode inductors use resistance welding design process, which makes the bottom pads prone to cold solder joints and poor flatness. Moreover, chip common mode inductors use bottom pad spot welding design, which makes the bottom leads prone to breakage. The enameled wire is prone to being burned and short-circuited. The high temperature of spot welding can easily cause solder dross and solder balls to remain on the pad plating, leading to short circuits in the product. Furthermore, after the existing chip common mode inductors are surface-mounted and coated with conformal coating, the bottom suspended leads may break due to the expansion and contraction of the adhesive and the tension of the tension. Utility Model Content

[0004] The purpose of this invention is to provide a chip common-mode inductor that solves the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a chip common mode inductor, including a first stop and a second stop, a central column connecting the sides of the first stop and the second stop, a first groove and a second groove being provided on the top of the first stop, and a first pad electrode and a second pad electrode being provided on both sides of the bottom of the first stop.

[0006] The second stop edge has a third groove and a fourth groove at its top, and a third pad electrode and a fourth pad electrode are respectively provided on both sides of its bottom.

[0007] The first groove and the second groove are provided with a first enameled wire and a second enameled wire distributed inside each other.

[0008] The first enameled wire is wound around the surface of the central column to form a first enameled wire coil, and the second enameled wire is wound around the surface of the central column to form a second enameled wire coil. The first enameled wire coil and the second enameled wire coil are respectively provided with a first enameled wire tail and a second enameled wire tail at their side ends.

[0009] The end of the first enameled wire is fixed to the plating layer on the side of the first pad electrode of the second side and flattened to form a first solder joint. The end of the first enameled wire is fixed to the plating layer on the side of the third pad electrode of the first side and flattened to form a third solder joint. The end of the second enameled wire is fixed to the plating layer on the side of the second pad electrode of the second side and flattened to form a second solder joint. The end of the second enameled wire is fixed to the plating layer on the side of the fourth pad electrode of the first side and flattened to form a fourth solder joint.

[0010] A first adhesive is provided at the top midpoint of the first guard edge, and a second adhesive is provided at the top midpoint of the second guard edge. A magnetic chip is connected between the tops of the first guard edge and the second guard edge through the first adhesive and the second adhesive.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] This invention improves the high performance and reliability of chip common mode inductors in application fields.

[0013] This invention overcomes the risk of wire breakage during spot welding of the electrode hanging wires on the bottom pad of the traditional electroplated sheet common mode inductor.

[0014] This invention avoids the risk of short circuits caused by solder dross, solder balls, and burns to the enameled wire due to spot soldering on the bottom pads. Attached Figure Description

[0015] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0016] Figure 1 This is a front view of the bare magnetic core structure of a chip common-mode inductor according to the present invention.

[0017] Figure 2 This is a schematic diagram of the front and back structures of the bare magnetic core of a chip common-mode inductor according to this utility model.

[0018] Figure 3 This is a schematic diagram of the overall front structure of a chip common mode inductor according to the present invention;

[0019] Figure 4 This is a schematic diagram of the overall back structure of a chip common mode inductor according to the present invention;

[0020] Figure 5 This is a schematic side view of the overall structure of a chip common mode inductor according to the present invention;

[0021] Figure 6This is a schematic diagram of the electroplated layer structure on the bottom side of the first and second sides of a chip common mode inductor according to the present invention.

[0022] In the diagram: 1. First baffle; 2. Second baffle; 3. Center post; 4. First pad electrode; 5. Second pad electrode; 6. Third pad electrode; 7. Fourth pad electrode; 8. First groove; 9. Second groove; 10. Third groove; 11. Fourth groove; 12. Magnetic chip; 13. First enameled wire; 14. Second enameled wire; 15. First solder joint; 16. Second solder joint; 17. First enameled wire coil; 18. Second enameled wire coil; 19. First adhesive; 20. Second adhesive; 21. First enameled wire tail; 22. Second enameled wire tail; 23. Third solder joint; 24. Fourth solder joint. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] Please see Figures 1-6 This utility model provides a technical solution: a chip common mode inductor, wherein a central column 3 is connected between the sides of the first baffle 1 and the second baffle 2, the top of the first baffle 1 is provided with a first groove 8 and a second groove 9, and the bottom sides of the first baffle are respectively provided with a first pad electrode 4 and a second pad electrode 5.

[0026] The top of the second retaining edge 2 is provided with a third groove 10 and a fourth groove 11, and the bottom sides of the second retaining edge 2 are respectively provided with a third pad electrode 6 and a fourth pad electrode 7.

[0027] A stable H-shaped skeleton magnetic core support structure is formed by the first stop 1, the second stop 2 and the central column 3. The central column 3 serves as the core load-bearing component, providing a fixed carrier for the subsequent winding of the enameled wire. The grooves (first to fourth grooves 11) on the top of the first stop 1 and the second stop 2 are used to accurately position the routing path of the enameled wire, avoiding offset and crossing during the winding process. The solder pad electrodes (first to fourth solder pad electrodes 7) at the bottom of the stop serve as the connection interface between the inductor and the external circuit, realizing the input and output of current. The overall structure lays the foundation for the electromagnetic performance of the inductor and the implementation of subsequent production processes.

[0028] In an optional embodiment, the end of the first enameled wire 13 is fixed to the plating layer on the side of the first electrode of the second baffle 2 and flattened to form a first solder joint 15; the end of the first enameled wire 13 is fixed to the plating layer on the side of the electrode of the first baffle 1 and flattened to form a third solder joint 23; the end of the second enameled wire 14 is fixed to the plating layer on the side of the second electrode of the second baffle 2 and flattened to form a second solder joint 16; the end of the second enameled wire 14 is fixed to the plating layer on the side of the electrode of the first baffle 1 and flattened to form a fourth solder joint 24.

[0029] It should be noted that by placing the first enameled wire 13 and the second enameled wire 14 in the first groove 8 and the second groove 9 respectively, the physical limiting effect of the grooves is used to achieve precise fixation and routing guidance of the enameled wires on the top of the guard edge. This design can prevent the enameled wires from shifting or loosening during subsequent winding or assembly, ensuring the relative position of the two enameled wires is stable, providing a guarantee for the symmetry and consistency of the subsequent winding coil, and thus ensuring the common mode inductor's suppression effect on common mode noise.

[0030] In an optional embodiment, a first enameled wire 13 is wound around the surface of the central column 3 to form a first enameled wire coil 17, and a second enameled wire 14 is wound around the surface of the central column 3 to form a second enameled wire coil 18. The first enameled wire 13 and the second enameled wire 14 are provided with a first enameled wire tail 21 and a second enameled wire tail 22 distributed on their side ends.

[0031] It should be noted that the ends of the first enameled wire 13 and the second enameled wire 14 are respectively fixed to the side plating of the electrode pads on the second side plate 2 and the first side plate 1. Laser stripping can precisely remove the surface insulation layer of the enameled wire, ensuring reliable contact between the metal conductor and the electrode plating. After tinning and fixing, the wire is flattened to form a solder joint. This not only improves the mechanical strength of the connection and avoids wire breakage, but also eliminates the problem of tin dross and tin beads caused by the high temperature of traditional spot welding. At the same time, it prevents the enameled wire from being burned and short-circuited due to high temperature, ensuring the electrical performance stability and service life of the inductor.

[0032] In an optional embodiment, a first adhesive 19 is provided at the top midpoint of the first edge 1, and a second adhesive 20 is provided at the top midpoint of the second edge 2. A magnetic chip 12 is connected between the tops of the first edge 1 and the second edge 2 through the first adhesive 19 and the second adhesive 20.

[0033] It should be noted that the first enameled wire 13 and the second enameled wire 14 are wound along the surface of the central post 3 to form a symmetrical first enameled wire coil 17 and second enameled wire coil 14. The central post 3 serves as the core channel of the magnetic circuit, providing magnetic core support for the coil, so that the magnetic field generated by the coil can be concentrated through the central post 3, thereby increasing the permeability. The coil parameters (number of turns, winding direction, etc.) formed by the two enameled wires are consistent, which can ensure that the same impedance is generated for common-mode noise in the circuit, thereby efficiently canceling the common-mode current and achieving the purpose of suppressing common-mode noise. The enameled wire tail reserved at the side end of the coil provides conditions for subsequent fixed connection with the side electrode of the other end.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0035] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A chip common mode inductor comprising a first rim (1) and a second rim (2), characterized in that: A central column (3) is connected between the sides of the first stop (1) and the second stop (2). The top of the first stop (1) is provided with a first groove (9) and a second groove (10). The bottom sides of the first stop (1) are respectively provided with a first pad electrode (4) and a second pad electrode (5). The second side (2) is provided with a third groove (10) and a fourth groove (11) at the top, and a third pad electrode (6) and a fourth pad electrode (7) are provided on both sides of the bottom of the second side (2).

2. The chip common mode inductor of claim 1, wherein: The first groove (8) and the second groove (9) are provided with a first enameled wire (13) and a second enameled wire (14).

3. The chip common mode inductor of claim 2, wherein: The first enameled wire (13) is wound around the surface of the central column (3) to form a first enameled wire coil (17), and the second enameled wire (14) is wound around the surface of the central column (3) to form a second enameled wire coil (18). The first enameled wire coil (17) and the second enameled wire coil (18) are respectively provided with a first enameled wire tail (21) and a second enameled wire tail (22) at their side ends.

4. The chip common mode inductor of claim 2, wherein: The end of the first enameled wire (13) is fixed to the side plating of the first pad electrode (4) of the second sidewall (2) and flattened to form the first solder joint (15). The end of the first enameled wire (21) of the first enameled wire (13) is fixed to the side plating of the third pad electrode (6) of the first sidewall (1) and flattened to form the third solder joint (23). The end of the second enameled wire (14) is fixed to the side plating of the second pad electrode (5) of the second sidewall (2) and flattened to form the second solder joint (16). The end of the second enameled wire (22) of the second enameled wire (14) is fixed to the side plating of the fourth pad electrode (7) of the first sidewall (1) and flattened to form the fourth solder joint (24).

5. The chip common mode inductor of claim 1, wherein: The first edge (1) has a first adhesive (19) at the top midpoint, and the second edge (2) has a second adhesive (20) at the top midpoint. A magnetic chip (12) is connected between the tops of the first edge (1) and the second edge (2) through the first adhesive (19) and the second adhesive (20).

Images