An interface busbar and board card for power test

Abstract

The application discloses an interface busbar and a board card for power testing, and the interface busbar comprises a first insulating layer, a first pole busbar, a second insulating layer, a second pole busbar, a third insulating layer, an O-terminal busbar and a fourth insulating layer which are sequentially arranged from top to bottom. The main body parts of the first pole busbar and the second pole busbar form a laminated structure, the first side edge of the main body of the first pole busbar and the first side edge of the main body of the second pole busbar are located on the same side, the two first side edges are respectively provided with outwardly extending connecting transition parts, the concave surfaces of the two connecting transition parts are oppositely arranged, and the outer ends of the two connecting transition parts are respectively provided with outwardly extending and staggered first connecting terminals. The O-terminal busbar is in a strip structure and is arranged on the outer side of the corresponding position of the laminated structure. The first side edge of the O-terminal busbar and the first side edge of the main body of the second pole busbar are located on the same side, and the first side edge is provided with an outwardly extending first connecting terminal. The application can reduce the parasitic / spurious inductance, inhibit the voltage overshoot and ensure that the measured device is not easily damaged.

Description

Technical Field

[0001] This application relates to the field of power device / module testing technology, specifically to an interface busbar and a board for power testing. Background Technology

[0002] In high-power power electronic devices, semiconductor switching devices are connected to busbar capacitors and AC output terminals via busbars. Traditional busbar structures have large parasitic inductance, which generates voltage overshoot at the moment the switching devices are turned off, posing a threat to the safe operation of the switching devices.

[0003] Multilayer busbars, also known as composite busbars, are connection components with a multi-layer composite structure design. Compared to traditional discrete busbars, multilayer busbars exhibit significant advantages: higher reliability and safety, lower stray inductance, lower impedance, stronger current carrying capacity, and superior heat dissipation and lower temperature rise. These characteristics have led to the widespread application of multilayer busbars in numerous industries. Particularly in the field of ATE (Automatic Test Equipment) for semiconductor devices, multilayer busbars, as a key component, effectively reduce voltage spikes due to their low stray inductance, thereby ensuring that the device under test is less susceptible to damage and further improving the stability and safety of the test.

[0004] To reduce parasitic inductance, existing patent publication number CN109494507A discloses a stacked busbar suitable for testing power semiconductor devices. This stacked busbar includes a capacitor busbar and a negative electrode plate. The capacitor busbar comprises five layers, from bottom to top: a lower insulating plate, a lower conductor plate with a positive input terminal and a positive output terminal, a middle insulating plate, an upper conductor plate with a negative electrode input terminal, and an upper insulating plate. The negative electrode plate is an exposed copper busbar, connected to the capacitor busbar via a current sensor and fasteners. While this stacked busbar can effectively reduce parasitic inductance in the power semiconductor device testing circuit, the negative electrode plate, as an independent component connected only by fasteners and a sensor, has poor mechanical stability. Furthermore, the exposed negative electrode plate may become a radiation source during high-frequency switching, generating electromagnetic interference, and parasitic inductance is easily generated at the connection point between the negative electrode plate and the capacitor busbar.

[0005] Existing patent publication number CN114883876B discloses a high-power stacked busbar structure with stacked terminals. This stacked busbar includes a positive busbar, a negative busbar, and an AC interface busbar. Each of the positive and negative busbars includes a capacitor connection terminal, and they are fully stacked. This patent reduces the parasitic inductance of the busbar commutation circuit and lowers the peak overvoltage during commutation by stacking the capacitor connection terminals. However, in this patent, the positive and negative busbars extend from their ends, and the positive and negative busbar capacitor connection terminals are pressed together to form a stack, which is then inserted between the positive and negative terminals of the capacitor module. This assembly is difficult, alignment is challenging, and mechanical stability is poor.

[0006] In existing semiconductor device testing equipment, traditional multilayer busbars are used to connect busbar capacitors and AC output terminals. Existing busbars and PCBs are usually fixed to one side of the PCB with one positive and one negative terminal. This structure introduces high parasitic inductance, usually above 20nH, which can easily damage the device under test under high power conditions. Utility Model Content

[0007] In view of this, the main purpose of this application is to provide an interface busbar and a power test board to reduce its parasitic / stray inductance, thereby suppressing voltage overshoot under high power test conditions, ensuring that the device under test is not easily damaged, and thus improving the stability and safety of the test.

[0008] This application provides an interface busbar, which includes:

[0009] The first insulating layer, the first pole busbar, the second insulating layer, the second pole busbar, the third insulating layer, the O-terminal busbar, and the fourth insulating layer are arranged sequentially from top to bottom.

[0010] The main body of the first busbar and the second busbar form a stacked structure. The first side of the main body of the first busbar and the first side of the main body of the second busbar are located on the same side, and the two first sides are respectively provided with outwardly extending connecting transition parts. The concave surfaces of the two connecting transition parts are arranged opposite to each other, and the outer ends of the two connecting transition parts are respectively provided with outwardly extending and staggered first connecting terminals.

[0011] The O-end busbar is a strip structure and is located on the outside of the corresponding position of the stacked structure; the first side of the O-end busbar and the first side of the second pole busbar body are located on the same side and are provided with an outwardly extending first connection terminal.

[0012] As described above, the main bodies of the first and second busbars are identical in shape and size, symmetrically distributed vertically, forming a stacked structure. This ensures the current loops are antiparallel, and the stacked busbar serves as the output interface, enabling connection to the PCB board (capacitor board and DUT interface board) and the DUT. The concave surfaces of the two connection transition sections are opposite each other, and the gap they form allows the capacitor board to be inserted. The larger stacked area allows the first connection terminals on the same side of the interface busbar to be staggered on the front and back of the capacitor board. By providing mounting holes on the connection terminals of the interface busbar, the interface busbar can be connected and fixed to the PCB board and capacitor board through the connection terminals, avoiding additional... External connectors are added to connect various boards, thereby avoiding an increase in stray inductance of the interface busbar and meeting the test requirement of stray inductance within the range of 5nH. The first connection terminals are arranged side by side and staggered, which maximizes the area of ​​the first connection terminals while ensuring the 2kV creepage requirement. This results in lower parasitic inductance introduced at the connection between the interface busbar and the capacitor board and the interface board of the device under test, making the device under test less prone to damage even under high power conditions. The O-terminal busbar is set on the outside of the stacked structure and does not participate in the stacked design of the first and second pole busbars. This reduces waveform oscillation and glitches, thereby improving the test waveform quality.

[0013] Optionally, the second side of the first busbar body and the second side of the second busbar body are located on the same side, and the two second sides are respectively provided with outwardly extending and staggered second connection terminals.

[0014] As shown above, the second connection terminal extends outward and is staggered, which means that the positive and negative connection terminals are arranged alternately. This makes the paths of the outflow current and the return current close, forming multiple small-area current loops, which can significantly reduce parasitic inductance. The second connection terminal is located on the same side and extends outward, which facilitates the single-sided docking of the interface busbar with the interface board of the device under test, and supports vertical plug-in or side-mounted structure.

[0015] Optionally, the second side of the first busbar body and the second side of the second busbar body are located on the same side, and the two second sides are respectively provided with outwardly extending connecting transition portions. The concave surfaces of the two connecting transition portions are arranged opposite to each other, and the outer ends of the two connecting transition portions are respectively provided with outwardly extending and staggered second connecting terminals.

[0016] As shown above, the concave surfaces of the two connecting transition sections are arranged opposite each other. That is, the arc-shaped structure with the concave surfaces opposite each other makes the current path form an anti-parallel loop, which can significantly reduce parasitic inductance. The second connecting terminal extends outward and is staggered, further compressing the current loop area and realizing a compact output on one side.

[0017] Optionally, the second side of the O-end busbar and the second side of the second pole busbar body are located on the same side, and are provided with an outwardly extending second connection terminal.

[0018] The second connecting terminal extending outward from the O-end busbar enables dual-sided connection of the O-end.

[0019] Optionally, the first connection terminals of the first pole busbar, the second pole busbar and the O terminal busbar extend outward along the extension direction of their respective planes.

[0020] As shown above, each first connection terminal extends outward along the extension direction of its respective plane, pushing the connection point of the first connection terminal away from the stacked area, so that the middle gap of each first connection terminal can be directly inserted into the front and back of the capacitor plate.

[0021] Optionally, the second connection terminals of the first pole busbar, the second pole busbar, and the O-terminal busbar are extended outward in such a way that they are bent to the same side along their respective planes.

[0022] As described above, each of the second connection terminals extends outward by bending its plane to the same side. The angle of the bend on the same side can be adapted to the shape of the product. For example, when the capacitor plate is set perpendicular to the interface board of the device under test, the angle of the bend on the same side can be set to 90°.

[0023] Optionally, the first side and the second side are positioned opposite each other.

[0024] As shown above, the first and second sides of the interface busbar are arranged opposite each other, so that the capacitor plate and the interface board of the device under test are placed relatively parallel or perpendicular.

[0025] Optionally, a pad is provided on the outer side of the main body of the first and second pole busbars, corresponding to the position of the O-end busbar; a pad is provided on the outer side of the O-end busbar, corresponding to the position of the stacked structure.

[0026] As described above, the pad, as a structural compensation, makes up for the height difference that is missing in the overall structure of the first pole busbar, the second pole busbar, and the O-end busbar, so that the overall structure is of equal pressure, improves the flatness of the assembly, and thus improves the mechanical stability.

[0027] Optionally, the O-end busbar body has a bent portion near its second side that extends into the corresponding position of the laminated structure, and the bent portion is provided with the second connection terminal of the O-end busbar.

[0028] As mentioned above, considering the compatibility of the hole positions of the second connecting terminal and the structural processing strength, a certain overlapping area is required. That is, there is an overlapping area between the bent part and the stacked structure formed by the first pole busbar and the second pole busbar.

[0029] This application also provides a power testing board, which includes:

[0030] The capacitor board, the interface board of the device under test, and the interface busbar described in any of the above;

[0031] The first connection terminal of the interface busbar is connected to the capacitor board, and the second connection terminal of the interface busbar is connected to the interface board of the device under test.

[0032] In summary, the interface busbar provided in this application adopts a stacked busbar form as the output interface, which can realize its connection with the PCB board and the device under test, and helps to reduce parasitic inductance. Through the stacked structure design of the first busbar and the second busbar, the two oppositely arranged connection transition parts are separated only by the second insulating layer, and the top and bottom are symmetrically designed, so that the stacked area is larger, which can reduce the stray inductance of the interface busbar, so that the stray inductance meets the test requirement of 5nH or less. The two connection transition parts can fix the current probe without the need for additional slots to fix the probe, and the structural design is both functional. By designing the first busbar and the second busbar into an arc surface structure, each first connection terminal is alternately arranged on both sides of the capacitor board. The connection between the first busbar and the second busbar and the capacitor board adopts the form of three positive and three negative terminals, which are alternately arranged on both sides of the capacitor board. At the same time, while ensuring the 2kV creepage requirement, the total area of ​​the first connection terminals is maximized (theoretically allowed). (The projection directions overlap), which can reduce the parasitic inductance introduced at the connection between the first and second busbars and the capacitor board; the connection between the first and second busbars and the interface board of the device under test adopts the form of alternating positive and negative second connection terminals. In the application of this application, the connection direction between the first and second busbars and the interface board of the device under test is perpendicular. Therefore, after connection, the second connection terminals of the first and second busbars are located on the same side of the interface board of the device under test. Under the premise of ensuring 2kV creepage requirement, the total area of ​​the second connection terminals is maximized, which can reduce the parasitic inductance introduced at the connection between the first and second busbars and the interface board of the device under test; if the relative position of the interface board of the device under test and the positive and negative busbars is parallel, then the second connection terminal can also adopt a semi-circular arc structure, which can further reduce the introduced parasitic inductance; the O-terminal busbar does not participate in the stacking design of the first and second busbars, which can reduce waveform oscillation and glitches and improve the test waveform quality. Attached Figure Description

[0033] The various technical features of this application and their relationships will be further explained below with reference to the accompanying drawings. The drawings are exemplary; some technical features are not shown to scale, and some drawings may omit technical features commonly used in the art to which this application pertains that are not essential for understanding and implementing this application, or additionally show technical features that are not essential for understanding and implementing this application. In other words, the combination of various technical features shown in the drawings is not intended to limit this application. Furthermore, throughout this application, the same reference numerals refer to the same things. Specific descriptions of the drawings are as follows:

[0034] Figure 1 This is a front view of an interface busbar in this application;

[0035] Figure 2 This is a top view of an interface busbar in this application;

[0036] Figure 3 This is a perspective view of an interface busbar in this application;

[0037] Figure 4 This is an assembly structure diagram of the negative busbar and negative pad in this application;

[0038] Figure 5 This is a structural diagram of the negative busbar in this application;

[0039] Figures 6a-6b This is an assembly structure diagram of the O-end busbar and O-end pad in this application;

[0040] Figures 7a-7b This is an assembly structure diagram of the positive busbar and positive pad in this application;

[0041] Figure 8 This is a structural diagram of the power testing board used in this application.

[0042] Explanation of reference numerals in the attached figures

[0043] 1-First insulating layer, 2-Negative busbar, 201-First connection transition part, 202-Negative input connection terminal, 203-Negative output connection terminal, 204-Negative pad, 3-Second insulating layer, 4-Positive busbar, 401-Second connection transition part, 402-Positive input connection terminal, 403-Positive output connection terminal, 404-Positive pad, 5-Third insulating layer, 6-O-end busbar, 601-O-end input connection terminal, 602-O-end output connection terminal, 603-O-end pad, 604-Bending part, 7-Fourth insulating layer.

[0044] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0045] The preferred embodiments of this application will now be described in detail with reference to the accompanying drawings, so that the advantages and features of this application can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of this application.

[0046] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0047] It should be noted that in the description herein, the terms "middle," "front," "back," "top," "bottom," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0048] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linked," "socketed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection; they can refer to a direct connection, or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0049] To clearly illustrate the implementation of this application, the structures shown in the accompanying drawings are merely illustrative of preferred embodiments of this application and are not intended to limit the technical solutions of this application. Some details (such as specific dimensions, shapes, or connection methods) may be simplified or omitted, and should not be presumed to be an undue limitation on the scope of protection of this application. For the omitted parts or details that are not precisely represented, those skilled in the art can understand and implement them based on the content of this application and conventional technical means.

[0050] The technical solutions of this application and how they solve the aforementioned technical problems will be described in detail below with specific embodiments. The specific embodiments described below can be combined with each other to form new embodiments. The same or similar ideas or processes described in one embodiment may not be repeated in other embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0051] This application provides an interface busbar, which includes:

[0052] Specifically, from top to bottom, the following are arranged in sequence: first insulating layer, first pole busbar, second insulating layer, second pole busbar, third insulating layer, O-terminal busbar, and fourth insulating layer;

[0053] The main body of the first busbar and the second busbar form a stacked structure. The first side of the main body of the first busbar and the first side of the main body of the second busbar are located on the same side, and the two first sides are respectively provided with outwardly extending connecting transition parts. The concave surfaces of the two connecting transition parts are arranged opposite to each other, and the outer ends of the two connecting transition parts are respectively provided with outwardly extending and staggered first connecting terminals.

[0054] The O-end busbar is a strip structure and is located on the outside of the corresponding position of the stacked structure; the first side of the O-end busbar and the first side of the second pole busbar body are located on the same side and are provided with an outwardly extending first connection terminal.

[0055] Specifically, the main bodies of the first and second busbars are identical in shape and size, symmetrically distributed vertically, forming a stacked structure. This ensures the current loops are antiparallel, and the stacked busbar serves as the output interface, enabling connection to the PCB board (capacitor board and DUT interface board) and the DUT. The concave surfaces of the two connection transition sections are opposite each other, and the gap they form allows the capacitor board to be inserted. The larger stacked area allows the first connection terminals on the same side of the interface busbar to be staggered on the front and back of the capacitor board, reducing the parasitic inductance at the connection between the interface busbar and the capacitor board, thereby reducing the... The stray inductance of the interface busbar meets the test requirements of stray inductance within the range of 5nH. The first connection terminals are arranged in a staggered manner, which maximizes the area of ​​the first connection terminals while ensuring the 2kV creepage requirement. This results in lower parasitic inductance introduced at the connection between the interface busbar and the capacitor board and the interface board of the device under test, making the device under test less prone to damage even under high power conditions. The O-terminal busbar is located on the outside of the stacked structure and does not participate in the stacked design of the first and second pole busbars. This reduces waveform oscillation and glitches, thereby improving the test waveform quality.

[0056] It should be noted that in the prior art, the connection between the interface busbar and the PCB board is that one terminal is set on each of the positive and negative busbars and fixed side by side on the same side of the PCB board. This structure has no stacking effect and introduces a high parasitic inductance at the connection point, usually above 20nH. In this application, the first side of the first busbar body and the first side of the second busbar body are located on the same side, and each of the two first sides is provided with an outwardly extending connection transition part. The concave surfaces of the two connection transition parts are arranged opposite each other, and the outer ends of the two connection transition parts are respectively provided with outwardly extending and staggered first connection terminals. This reduces the parasitic inductance at the connection point between the interface busbar and the PCB board, controlling it to within 5nH, thus ensuring the safety of the test equipment to the greatest extent.

[0057] Optionally, the second side of the first busbar body and the second side of the second busbar body are located on the same side, and the two second sides are respectively provided with outwardly extending and staggered second connection terminals.

[0058] Specifically, the second connection terminals extend outward and are staggered, meaning that the positive and negative connection terminals are arranged alternately. This makes the paths of the outflow current and the return current close together, forming multiple small-area current loops, which can significantly reduce parasitic inductance. The second connection terminals are located on the same side and extend outward, which facilitates the single-sided docking of the interface busbar with the interface board of the device under test, supporting vertical plug-in or side-mounted structures.

[0059] Optionally, the second side of the first busbar body and the second side of the second busbar body are located on the same side, and the two second sides are respectively provided with outwardly extending connecting transition portions. The concave surfaces of the two connecting transition portions are arranged opposite to each other, and the outer ends of the two connecting transition portions are respectively provided with outwardly extending and staggered second connecting terminals.

[0060] Specifically, the concave surfaces of the two connecting transition sections are arranged opposite each other. That is, the arc-shaped structure with the concave surfaces opposite each other makes the current path form an anti-parallel loop, which can significantly reduce parasitic inductance. The second connecting terminal extends outward and is staggered, further compressing the current loop area and realizing a compact output on one side.

[0061] Optionally, the second side of the O-end busbar and the second side of the second pole busbar body are located on the same side, and are provided with an outwardly extending second connection terminal.

[0062] Specifically, the second connecting terminal extending outward on the O-end busbar enables dual-sided connection of the O-end.

[0063] Optionally, the second connection terminals of the first pole busbar, the second pole busbar, and the O-terminal busbar are extended outward in such a way that they are bent to the same side along their respective planes.

[0064] Specifically, each of the second connection terminals extends outward by bending its plane to the same side. The angle of the bend on the same side can be adapted to the shape of the product. For example, when the capacitor plate is set perpendicular to the interface board of the device under test, the angle of the bend on the same side can be set to 90°.

[0065] In the embodiments of this application, when the capacitor plate and the interface board of the device under test are arranged parallel to each other, a connection transition portion can be provided at the output end of the interface busbar, and an outwardly extending second connection terminal is provided on the connection transition portion structure. The second connection terminal extends outward along the extension direction of its respective plane, just like the first connection terminal. When the capacitor plate and the interface board of the device under test are arranged at 45° or 135°, the bending angle of each second connection terminal on the same side can be set to 45° or 135°. In this application, the bending angle of the second connection terminal on the same side is limited by the angle between the capacitor plate and the interface board of the device under test. This application can also flexibly set the bending angle of each second connection terminal on the same side according to the positional relationship between the capacitor plate and the interface board of the device under test.

[0066] Optionally, the first side and the second side are positioned opposite each other.

[0067] Specifically, the first and second sides of the interface busbar are arranged opposite each other, so that the capacitor plate and the interface board of the device under test are placed relatively parallel or perpendicular.

[0068] Optionally, the O-end busbar body has a bent portion near its second side that extends into the corresponding position of the laminated structure, and the bent portion is provided with the second connection terminal of the O-end busbar.

[0069] Specifically, considering the hole position compatibility of the second connection terminal and the structural processing strength, a certain overlapping area is required, that is, there is an overlapping area between the bent part and the stacked structure formed by the first pole busbar and the second pole busbar.

[0070] Optionally, a pad is provided on the outer side of the main body of the first and second pole busbars, corresponding to the position of the O-end busbar; a pad is provided on the outer side of the O-end busbar, corresponding to the position of the stacked structure.

[0071] Specifically, the pad, as a structural compensation, makes up for the height difference that is missing in the overall structure of the first pole busbar, the second pole busbar and the O-end busbar, so that the overall structure is equally stressed, improving the flatness of the assembly, and thus improving the mechanical stability.

[0072] The embodiments in this application are as follows: Figure 1-8 Taking the example of the above, the first busbar and the second busbar are the positive and negative busbars, respectively. There is no distinction between the positive and negative order. The first busbar can be either a positive or a negative busbar. Similarly, the second busbar can be either a positive or a negative busbar. However, the first busbar and the second busbar must be configured with one positive and one negative.

[0073] For ease of description, in this application, the first busbar is designated as the negative busbar, and the first side and the second side of the first busbar are arranged opposite to each other. It is hereby declared that the first side of the first busbar is designated as the input terminal of the negative busbar, the second side of the first busbar is designated as the output terminal of the negative busbar, the connection transition portion provided on the first side of the first busbar is designated as the first connection transition portion of the negative busbar, the first connection terminal provided on the first side of the first busbar is designated as the negative input connection terminal, the second connection terminal provided on the second side of the first busbar is designated as the negative output connection terminal, and the pad provided on the same row and at the same height as the first busbar is designated as the negative pad.

[0074] Similarly, as can be seen from the above, in this application, the second busbar is designated as the positive busbar, and the first and second sides of the second busbar are arranged opposite to each other. It is hereby declared that the first side of the second busbar is designated as the input terminal of the positive busbar, the second side of the second busbar is designated as the output terminal of the positive busbar, the connection transition portion provided on the first side of the second busbar is designated as the second connection transition portion of the positive busbar, the first connection terminal provided on the first side of the second busbar is designated as the positive input connection terminal, the second connection terminal provided on the second side of the second busbar is designated as the positive output connection terminal, and the pad provided on the same row and at the same height as the second busbar is designated as the positive pad.

[0075] Similarly, as can be seen from the above, in this application, the first side and the second side of the O-end busbar are arranged opposite to each other. It is hereby declared that the first side of the O-end busbar is set as the input end of the O-end busbar, the second side of the O-end busbar is set as the output end of the O-end busbar, the first connection terminal set on the first side of the O-end busbar is set as the O-end input connection terminal, the second connection terminal set on the second side of the O-end busbar is set as the O-end output connection terminal, and the pad set in the same row and at the same height as the O-end busbar is set as the O-end pad.

[0076] In summary, the interface busbar in this embodiment is composed of the first pole busbar, the second pole busbar, and the O-terminal busbar. The first side of the interface busbar is its input terminal, and the second side of the interface busbar is its output terminal.

[0077] Figure 1-3 This embodiment shows structural diagrams of an interface busbar from various perspectives. Figure 1-3 Taking the orientation shown as an example, bend upwards at a 90° angle as the reference point, such as... Figure 1-3 As shown, the semi-circular arc structure of the negative busbar 2 is set downwards, and the semi-circular arc structure of the positive busbar 4 is set upwards.

[0078] like Figure 1 The interface busbar, from top to bottom, includes:

[0079] First insulating layer 1;

[0080] The negative busbar 2 is located below the first insulating layer 1. The input end of the negative busbar 2 is provided with a first connection transition part 201 with a semi-circular arc structure. The outside of the first connection transition part 201 is provided with a negative input connection terminal 202. The output end of the negative busbar 2 is provided with a negative output connection terminal 203.

[0081] The second insulating layer 3 is disposed below the negative busbar 2;

[0082] The positive busbar 4 is disposed below the second insulating layer 3 and forms a stacked structure with the main body of the negative busbar 2. The input end of the positive busbar 4 has a semi-circular arc-shaped second connection transition portion 401, and a positive input connection terminal 402 is disposed on the outer side of the second connection transition portion 401. The output end of the positive busbar 4 has a positive output connection terminal 403. The concave surfaces of the first connection transition portion 201 and the second connection transition portion 401 are arranged opposite each other. The positive and negative terminals of the positive input connection terminal 402 and the negative input connection terminal 202 are arranged alternately on both sides of the capacitor plate (see [reference]). Figure 2 and Figure 8 As shown, where Figure 2 The capacitor plate in the diagram is not shown. The positive output connection terminal 403 and the negative output connection terminal 203 are arranged alternately on the same side of the interface board of the device under test (see [reference]). Figure 3 and Figure 8 As shown, where Figure 3 The interface board of the device under test (not shown) is shown in the diagram.

[0083] The third insulating layer 5 is disposed below the positive busbar 4;

[0084] The O-terminal busbar 6 is disposed on the outer side of the laminated structure and below the third insulating layer 5. The input end of the O-terminal busbar 6 is provided with an O-terminal input connection terminal 601, and the output end of the O-terminal busbar 6 is provided with an O-terminal output connection terminal 602. Only one O-terminal input connection terminal 601 is provided, located in front of the positive input connection terminal 402 and the negative input connection terminal 202. Only one O-terminal output connection terminal 602 is provided, located in front of the positive output connection terminal 403 and the negative output connection terminal 203 (see [reference]). Figure 3 As shown, and with Figure 3 The orientation of the busbar with the O terminal is the front side, and the orientation of the positive and negative busbars is the rear side.

[0085] The fourth insulating layer 7 is disposed below the O-end busbar 6 and covers the overall structure of the laminated structure and the O-end busbar 6.

[0086] like Figure 8 As shown, the input terminals of the positive and negative busbars are connected to the front-end PCB board, which is the capacitor board inside the ATE tester. The output terminals of the positive and negative busbars are connected to the rear-end PCB board, which is usually the THB board or DIB board of the ATE tester. The THB board is the Test Head Board (THB), which is located between the test head and the DIB board and plays the roles of signal conversion, power distribution, and mechanical support. The DIB board is the Device Interface Board (DIB), which is directly connected to and tests the device under test.

[0087] In one specific embodiment, the closer the interface board of the device under test is to the capacitor board, the better. That is, the shorter the distance between the input and output terminals of the positive and negative busbars, the better. Theoretically, the interface board of the device under test can be omitted, and the output terminal of the interface busbar can be directly connected to the device under test.

[0088] In one specific embodiment, when the capacitor plate is set perpendicular to the interface board of the device under test, the positive output connection terminal 403, the negative output connection terminal 203 and the O-end output connection terminal 602 can be set as a 90° bent structure. The 90° bent structure makes all the above connection terminals fixed on the same side of the interface board of the device under test to adapt to the product structure and form a compact design.

[0089] When the positive output connection terminal 403, the negative output connection terminal 203, and the O-terminal output connection terminal 602 are bent structures arranged at a 90° angle, all three are positioned on the same side of the device under test (DUT) interface board to accommodate the product structure. Furthermore, the DUT interface board is preferably positioned near the energy storage capacitor, and its output terminals can be directly connected to the pins or terminals of the power device under test to minimize the high-frequency current loop path and reduce system parasitic inductance.

[0090] In one specific embodiment, when the capacitor plate is arranged parallel to the interface board of the device under test, the positive output connection terminal 403, the negative output connection terminal 203 and the O-end output connection terminal 602 can be set as a semi-circular arc structure. The semi-circular arc structure makes the positive and negative current paths naturally bend and maintain tight coupling, forming a high-frequency current loop that is parallel to each other. The magnetic fields cancel each other out, thereby effectively reducing the overall loop inductance, as well as smaller voltage spikes and oscillations.

[0091] When the positive output connection terminal 403, the negative output connection terminal 203, and the O-terminal output connection terminal 602 are semi-circular arc structures, they are alternately arranged on both sides of the interface board of the device under test. In this case, the relative position of the interface board of the device under test and the interface busbar is parallel, which can further reduce the introduced parasitic inductance. The semi-circular arc structure can be referenced from the semi-circular arc structure of the first connection transition section 201 and the second connection transition section 401.

[0092] In one specific embodiment, the first connection transition portion 201 and the second connection transition portion 401 of the semi-circular arc structure can be used to hook the negative and positive current probes, avoiding the introduction of additional stray inductance by adding extra structures in the PCB board, thereby reducing the stray inductance of the system; in addition, by adjusting the length, diameter and other parameters of the semi-circular arc shape, while ensuring the 2kV withstand voltage between the positive and negative busbars, the distance between the positive and negative busbars in the vertical direction can be minimized as much as possible, which can further reduce the stray inductance at this point to 3nH.

[0093] In one specific embodiment, the bent sides of the first connecting transition portion 201 and the second connecting transition portion 401 can be configured as arc shape, rectangular shape, square shape, or triangular shape, and the concave surfaces of the bent sides of the two are arranged opposite to each other.

[0094] like Figure 2 and Figure 4As shown, three negative input connection terminals 202 are provided on the outer side of the first connection transition section 201, and three positive input connection terminals 402 are provided on the outer side of the second connection transition section 401. The three positive input connection terminals 402 and the three negative input connection terminals 202 are alternately and staggered on the front and back sides of the capacitor plate, that is, the first positive input connection terminal 402 is soldered on the front side of the capacitor plate, and the first negative input connection terminal 202 is soldered on the back side of the capacitor plate. The projection positions of the first positive input connection terminal 402 and the first negative input connection terminal 202 on the capacitor plate are staggered, one positive and one negative, staggered on both sides of the capacitor plate (see reference). Figure 8 The structure shown, wherein, Figure 8 The first connection terminal (indicated by the dashed line on the reverse side of the capacitor board) constitutes the input terminal of the interface busbar. The staggered design avoids the position of the mounting hole on the first connection terminal. Each positive input connection terminal is adjacent to a negative input connection terminal, forming multiple small-area current loops to reduce stray inductance. The staggered layout of the positive and negative sides makes the magnetic field highly canceled inside the PCB board.

[0095] To meet the creepage distance requirements, the adjacent positive input connection terminal 402 and negative input connection terminal 202 can partially overlap, as long as their mounting holes do not overlap.

[0096] In one specific embodiment, such as Figures 6a-6b As shown, the main body of the O-terminal busbar 6 is arranged in a strip-like structure on the outside of the stacked structure. The main body of the O-terminal busbar 6 does not participate in the stacked design, which can reduce waveform oscillations and glitching, and improve the quality of the test waveform. However, considering the compatibility of the output terminal hole positions and the structural processing strength, the O-terminal busbar 6 needs to have a certain overlap with the positive busbar 4 and the negative busbar 2. Therefore, the output end of the O-terminal busbar 6 is provided with a bent portion 604 (see...). Figure 6a The dashed rectangular area overlaps with the layered structure.

[0097] In one specific embodiment, mounting holes are provided on the positive input connection terminal 402, negative input connection terminal 202, O-end input connection terminal 601, positive output connection terminal 403, negative output connection terminal 203, and O-end output connection terminal 602, respectively, for screw connection with the capacitor board and the interface board of the device under test. Screw connection makes the connection between the interface busbar and the capacitor board and the interface board of the device under test more convenient and facilitates disassembly.

[0098] In one specific embodiment, the connection terminals on both sides of the positive busbar 4, negative busbar 2, and O-terminal busbar 6 are not covered by an insulating layer. The connection terminals are processed into a structure with mounting holes for screw connection with the capacitor board and the interface board of the device under test.

[0099] The mounting hole can be set as a circular mounting hole or a triangular mounting hole; this application does not make a specific limitation here.

[0100] It should be noted that the mounting holes on the input connection terminals connected to the capacitor board (front-end PCB board) are preferably set to be circular, and there needs to be a certain distance between the two input connection terminals. For example, while ensuring a 2kV withstand voltage between the positive and negative busbars, the distance between two adjacent positive and negative input connection terminals is 26mm. At the same time, the shape of the mounting holes can also be set to other shapes, such as triangles, while meeting the requirements for spacing and strength.

[0101] It should be noted that, according to Figure 3 As can be seen, the output connection terminals on the right side of this interface busbar are designed at a 90° vertical angle. This design is intended to be compatible with the product, therefore, it is not limited to a vertical design and can be set at other angles as needed. The main body of this interface busbar is a rectangular structure. Its size is limited by the product, and its length and width have little impact on parasitic inductance, so they do not need to be specifically limited.

[0102] In one specific embodiment, the first insulating layer 1, the second insulating layer 3, the third insulating layer 5, and the fourth insulating layer 7 are each configured as two layers, with the thickness of each insulating layer limited to within 0.5 mm. Controlling the thickness of the insulating layers reduces the loop area, thereby reducing the stray inductance of the interface busbar.

[0103] Figure 4 This application illustrates the positional connection between the negative electrode pad 204 and the negative electrode busbar 2. Figure 5 The structure of negative busbar 2 is shown.

[0104] Optionally, a pad is provided on the outer side of the main body of the first busbar (negative busbar 2) and the second busbar (positive busbar 4), corresponding to the position of the O-end busbar 6. That is, a negative pad 204 is provided on the outer side of the main body of the negative busbar 2, corresponding to the position of the O-end busbar 6. Figure 4 (The diagram illustrates the positional relationship between the negative busbar 2 and the negative pad 204). Since the main body of the negative busbar 2 is rectangular, the outer side of the main body of the negative busbar 2 is the perimeter of the rectangle. However, since the input and output terminals of the negative busbar 2 are positioned opposite each other on the left and right sides of the negative busbar 2, the outer side of the main body of the negative busbar 2 can only be the top and bottom sides of the rectangle. Figure 4 In the illustrated embodiment, with Figure 4 Based on the indicated up, down, left, and right orientations, the outer side of the main body of the negative busbar 2 is the lower side of the rectangle.

[0105] like Figure 4-5As shown, a negative busbar 2 is provided in the middle main body of the second insulating layer 3. A negative pad 204 is provided on the lower side of the negative busbar 2. The negative pad 204 is set at the same height as the negative busbar 2. The negative pad 204 compensates for the missing height difference of the negative busbar 2 above the main body of the O-end busbar 6, so that the overall structure is evenly aligned, improving the assembly flatness and thus improving the mechanical stability. Three negative input connection terminals 202 are equally spaced on the left side of the negative busbar 2, and two negative output connection terminals 203 are equally spaced on the right side of the negative busbar 2. The negative output connection terminals 203 are set at a 90° angle vertically outward. The bending direction of the first connection transition portion 201 of the negative busbar 2 is opposite to the 90° bending direction of the positive output connection terminal 403, and the bending direction of the first connection transition portion 201 of the negative busbar 2 is opposite to the bending direction of the second connection transition portion 401 of the positive busbar 4. That is, the bending of the first connection transition portion 201 and the bending of the second connection transition portion 401 are arranged opposite to each other, and there is a tendency to form a closed pattern.

[0106] Figures 6a-6b This demonstrates the positional connection between the O-end pad 603 and the O-end busbar 6 in this application.

[0107] Optionally, an O-end pad 603 is provided on the outer side of the O-end busbar 6 at a position corresponding to the stacked structure. That is, an O-end pad 603 is provided on the outer side of the main body of the O-end busbar 6 at a position corresponding to the stacked structure of the positive busbar 4 and the negative busbar 2. Figures 6a-6b (The diagram illustrates the positional relationship between the O-end busbar 6 and the O-end pad 603). Since the main body of the O-end busbar 6 is a long rectangular strip, and its output end has an upward-facing bend 604, the outer periphery of the O-end busbar 6 is the long rectangular strip and the bend 604. However, since the input and output ends of the O-end busbar 6 are positioned opposite each other on the left and right sides, the outer periphery of the O-end busbar 6 can only be the upper and lower sides of the long rectangular strip and the bend 604. Figures 6a-6b In the illustrated embodiment, with Figures 6a-6b Based on the indicated up, down, left, and right orientations, the outer side of the O-end busbar 6 is a long rectangular strip and the lower side of the bent portion 604.

[0108] like Figures 6a-6bAs shown, on the fourth insulating layer 7, that is, below the third insulating layer 5, in the middle main part of the fourth insulating layer 7, at the projection of the main part of the stacked structure, an O-end pad 603 is provided. The O-end pad 603 is set at the same height as the O-end busbar 6. The O-end pad 603 serves as structural compensation, making up for the height difference missing below the main part of the positive and negative busbars of the O-end busbar 6, so that the overall structure is evenly aligned, improving the assembly flatness, and thus improving the mechanical stability. The O-end busbar 6 is provided at the lower end of the O-end pad 603. The O-end input connection terminal 601 is provided at the input end on the left side of the O-end busbar 6, and the O-end output connection terminal 602 is provided at the output end on the right side of the O-end busbar 6. The O-end output connection terminal 602 is set at a 90° vertical outward.

[0109] Figures 7a-7b This demonstrates the positional connection between the positive electrode pad 404 and the positive electrode busbar 4 in this application.

[0110] Optionally, a pad is provided on the outer side of the main body of the first busbar (negative busbar 2) and the second busbar (positive busbar 4), corresponding to the position of the O-end busbar 6. That is, a positive pad 404 (corresponding to the position of the O-end busbar 6) is provided on the outer side of the main body of the positive busbar 4. Figures 7a-7b (The diagram illustrates the positional relationship between the positive busbar 4 and the positive pad 404). Since the main body of the positive busbar 4 is rectangular, the outer side of the main body of the positive busbar 4 is the perimeter of the rectangle. However, since the input and output terminals of the positive busbar 4 are positioned opposite each other on the left and right sides of the positive busbar 4, the outer side of the main body of the positive busbar 4 can only be the top and bottom sides of the rectangle. Figures 7a-7b In the illustrated embodiment, with Figures 7a-7b The indicated up, down, left, and right orientations are used as a reference; the outer side of the main body of the positive busbar 4 is the lower side of the rectangle. For example... Figures 7a-7b As shown, a positive busbar 4 is provided in the middle main body of the third insulating layer 5. A positive pad 404 is provided on the lower side of the positive busbar 4. The positive pad 404 is set at the same height as the positive busbar 4. The positive pad 404 compensates for the missing height difference of the positive busbar 4 above the main body of the O-end busbar 6, so that the overall structure is evenly aligned, improving the assembly flatness and thus improving mechanical stability. Three positive input connection terminals 402 are equally spaced on the left input end of the positive busbar 4, and two positive output connection terminals 403 are equally spaced on the right output end of the positive busbar 4. The positive output connection terminals 403 are set at a 90° angle vertically outward. The 90° bending direction of the positive output connection terminals 403 is the same as the bending direction of the second connection transition part 401.

[0111] It should be noted that the number of input connection terminals and output connection terminals of the positive and negative busbars may be equal or unequal. The above description is only a specific embodiment of this application, and this application does not impose any specific limitations.

[0112] In one specific embodiment of this application, the dimensions of the first insulating layer 1, the second insulating layer 3, the third insulating layer 5 and the fourth insulating layer 7 are squares of 195×195mm. Two insulating papers are provided between each insulating layer, and the thickness of each insulating layer is controlled at 0.5mm. With this design, the simulated stray inductance is low.

[0113] Taking the second connection terminal at the output end facing upwards at 90° as the standard orientation, the overall structure of this interface busbar from top to bottom consists of: first insulating layer 1, negative busbar 2, negative pad 204, second insulating layer 3, positive busbar 4, positive pad 404, third insulating layer 5, O-end busbar 6, O-end pad 603, and fourth insulating layer 7. The positive busbar 4 and positive pad 404 are arranged in the same row at the same height; the negative busbar 2 and negative pad 204 are arranged in the same row at the same height; and the O-end busbar 6 and O-end pad 603 are arranged in the same row at the same height. The connection terminals on both sides of the positive busbar 4, negative busbar 2, and O-end busbar 6 are not covered by insulating layers, and screw holes are machined on the connection terminals for connection to the PCB board and the device under test.

[0114] The input end of the positive busbar 4 is provided with a second connection transition portion 401 with a semi-circular arc structure. Three positive input connection terminals 402 are provided on the outer side of the second connection transition portion 401. Each positive input connection terminal 402 has dimensions of 20.34 × 16 mm, and the diameter of the circular threaded hole of the positive input connection terminal 402 is 5.5 mm. The output end of the positive busbar 4 is provided with two positive output connection terminals 403 bent upwards at 90°, each with dimensions of 21 × 19.5 mm. The diameter of the circular threaded hole of the positive output connection terminal 403 is 7 mm. However, while ensuring withstand voltage and current requirements and low stray inductance, the dimensions of the positive input connection terminals 402 and the positive output connection terminals 403 can be the same, either both 20.34 × 16 mm or both 21 × 19.5 mm. But in this embodiment... The best effect is achieved when the dimensions of the two components are slightly different from those of the actual result. It should be noted that the size and shape of the input and output connection terminals of the negative busbar 2 and the positive busbar 4 can be adjusted according to the actual modeling and simulation results. For example, the wider each connection terminal is, the smaller the stray inductance. However, due to the creepage distance limitation, the width of each connection terminal cannot be increased indefinitely, and the shape of each connection terminal is not limited to a rectangle. The arrangement of the negative busbar 2 is similar to that of the positive busbar 4. From the top view, a negative input connection terminal 202 is inserted between every two positive input connection terminals 402. The spacing between two adjacent positive and negative input connection terminals is 26mm. The two positive output connection terminals 403 and the two negative output connection terminals 203 are staggered to form three gaps, which are 28mm, 56mm and 28mm respectively. It should be noted that the spacing between the staggered output connection terminals of the negative busbar 2 and the positive busbar 4, and the spacing between the staggered input connection terminals, can be adjusted according to the actual modeling and simulation results. Generally, while ensuring the withstand voltage and current requirements, the stray inductance at the connection point of each terminal is further reduced. The O-end input connection terminal 601 of the O-end busbar 6 is horizontally arranged with its body. The width of the O-end input connection terminal 601 is 15mm. The main body of the O-end busbar 6 is elongated and bends upward near the output end of the O-end busbar 6, forming a partial stack with the positive and negative busbars. The conductor material of the positive and negative busbars and the O-end busbar 6 is copper. In this embodiment, the designed electrical clearance is >2mm and the creepage distance is ≥10mm, which meets the creepage distance requirements.

[0115] It should be noted that the layered design of the interface busbar in this application involves changing its structure by designing a semi-circular arc structure on the end sides of the positive and negative busbars. The connection terminals on the outer side of the semi-circular arc structure are processed into terminals with screw holes to serve as positions for installing current probes, thus avoiding additional processing on the product PCB board and preventing the introduction of more stray inductance. By adjusting the length and diameter of the semi-circular arc, the stray inductance in this local area is minimized, thereby controlling the overall stray inductance of the interface busbar.

[0116] It should be noted that the interface busbar provided in this application has mounting holes on the first and second connection terminals of the first and second busbars for fixing capacitor boards, test device interface boards, etc., which are inserted into the interface busbar. Moreover, the capacitor board can be inserted into the middle of the two semi-circular arc structures on the same side of the first and second busbars. The connection terminals are alternately arranged to reduce the parasitic inductance at the connection between the PCB board and the interface busbar, thus meeting the testing requirements of high-power devices in ATE.

[0117] In summary, the interface busbar provided in this application adopts a stacked busbar form as the output interface. It connects to the PCB board and the device under test (DUT) through mounting holes on the connection terminals, which helps reduce parasitic inductance. The stacked structure design of the first and second busbars, with two oppositely positioned transition sections separated only by a second insulating layer and symmetrically designed, increases the area of ​​the stacked region, reducing stray inductance and achieving the test requirement of 5nH or less. The two transition sections allow for current probe fixation without additional slotting, demonstrating both structural functionality and practicality. The arc-shaped design of the first and second busbars allows each first connection terminal to be alternately positioned on both sides of the capacitor board. The connection between the first and second busbars and the capacitor board uses three terminals each for positive and negative terminals, alternately arranged on both sides of the capacitor board. While ensuring 2kV creepage requirements, the overall area of ​​the first connection terminals is maximized (theoretically allowing for overlap in projection direction), enabling… The parasitic inductance introduced at the connection between the first and second busbars and the capacitor board is lower. The connection between the first and second busbars and the interface board of the device under test adopts the form of alternating positive and negative second connection terminals, which compresses the current loop area and reduces the parasitic inductance at the connection between the interface busbars and the interface board of the device under test. In the application of this application, the connection direction of the first and second busbars and the interface board of the device under test is perpendicular. Therefore, after connection, the second connection terminals of the first and second busbars are located on the same side of the interface board of the device under test. Under the premise of ensuring 2kV creepage requirement, the overall area of ​​the second connection terminals is maximized, which can reduce the parasitic inductance introduced at the connection between the first and second busbars and the interface board of the device under test. If the relative position of the interface board of the device under test and the positive and negative busbars is parallel, the second connection terminals can also adopt a semi-circular arc structure, which can further reduce the introduced parasitic inductance. The O-terminal busbar does not participate in the stacking design of the first and second busbars, which can reduce waveform oscillation and glitches and improve the test waveform quality.

[0118] In one specific embodiment of this application, such as Figure 8 As shown, a power testing board is also provided, which includes: a capacitor board, a device under test interface board, and an interface busbar; wherein, the first connection terminal of the interface busbar is connected to the capacitor board, and the second connection terminal of the interface busbar is connected to the device under test interface board.

[0119] Specifically, the interface busbar has a connection transition section with a semi-circular arc, triangle or square structure located on both sides of the PCB board, forming a stacked structure. This significantly reduces the parasitic inductance at the connection between the interface busbar and the PCB board, suppressing voltage overshoot. The capacitor board and the device under test (DUT) interface board are directly pluggable to the interface busbar, and the three are highly integrated. The capacitor board and the DUT interface board can be installed vertically or stacked. The same busbar structure can accommodate different DUT interface boards, improving testing efficiency.

[0120] Unless otherwise defined, all technical and scientific terms used throughout this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. In case of any inconsistency, the meaning as stated in this application or derived from the content described herein shall prevail. Furthermore, the terminology used in this description is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0121] Note that the above are merely preferred embodiments and the technical principles employed in this application. Those skilled in the art will understand that this application is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of this application. Therefore, although this application has been described in detail through the above embodiments, this application is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the technical concept of this application, all of which fall within the scope of protection of this application.

[0122] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An interface busbar, characterized in that, include: The first insulating layer, the first pole busbar, the second insulating layer, the second pole busbar, the third insulating layer, the O-terminal busbar, and the fourth insulating layer are arranged sequentially from top to bottom. The main body of the first pole busbar and the second pole busbar form a stacked structure. The first side of the main body of the first pole busbar and the first side of the main body of the second pole busbar are located on the same side, and the two first sides are respectively provided with outwardly extending connecting transition portions. The concave surfaces of the two connecting transition portions are arranged opposite to each other, and the outer ends of the two connecting transition portions are respectively provided with outwardly extending and staggered first connecting terminals. The O-end busbar is a strip structure and is disposed on the outer side of the corresponding position of the stacked structure; the first side of the O-end busbar and the first side of the second pole busbar body are located on the same side and are provided with an outwardly extending first connection terminal.

2. The interface busbar according to claim 1, characterized in that, Also includes: The second side of the first pole busbar body and the second side of the second pole busbar body are located on the same side, and the two second sides are respectively provided with second connecting terminals that extend outward and are staggered.

3. The interface busbar according to claim 1, characterized in that, Also includes: The second side of the first pole busbar body and the second side of the second pole busbar body are located on the same side, and the two second sides are respectively provided with outwardly extending connecting transition portions. The concave surfaces of the two connecting transition portions are arranged opposite to each other, and the outer ends of the two connecting transition portions are respectively provided with outwardly extending and staggered second connecting terminals.

4. The interface busbar according to claim 2 or 3, characterized in that, Also includes: The second side of the O-end busbar and the second side of the second pole busbar body are located on the same side, and the second connection terminal extends outward.

5. The interface busbar according to claim 1, characterized in that, Also includes: The first connection terminals of the first pole busbar, the second pole busbar and the O-terminal busbar extend outward along the extension direction of their respective planes.

6. The interface busbar according to claim 4, characterized in that, Also includes: The second connection terminals of the first pole busbar, the second pole busbar, and the O-terminal busbar extend outward in a manner that bends to the same side along their respective planes.

7. The interface busbar according to claim 2 or 3, characterized in that, Also includes: The first side is positioned opposite to the second side.

8. The interface busbar according to claim 1, characterized in that, Also includes: A pad is provided on the outer side of the main body of the first pole busbar and the second pole busbar, corresponding to the position of the O-end busbar; A pad is provided on the outer side of the O-end busbar, corresponding to the position of the stacked structure.

9. The interface busbar according to claim 4, characterized in that, Also includes: The main body of the O-end busbar has a bent portion near its second side that extends into the corresponding position of the stacked structure, and the bent portion is provided with the second connection terminal of the O-end busbar.

10. A power testing board, characterized in that, include: The capacitor board, the interface board for the device under test, and the interface busbar as described in any one of claims 1-9; The first connection terminal of the interface busbar is connected to the capacitor board, and the second connection terminal of the interface busbar is connected to the interface board of the device under test.

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