Connector, connection structure, and electronic device

Abstract

The present disclosure provides a connector, a connection structure and an electronic device, the connector comprising a base and a plurality of interfaces integrated on the base; the plurality of interfaces comprising at least two storage interfaces for connecting storage devices and at least one network interface for connecting network devices; the base integrates a signal transmission path for communicating with the storage devices connected through the storage interfaces and the network devices connected through the network interface. The connector, the connection structure and the electronic device of the present disclosure integrate at least two storage interfaces and one network interface in the same base, which can reduce the area occupied by the mainboard compared with the traditional scattered layout, thus leaving space for the layout of other functional chips, capacitors and other components, and helping the lightweight design of the electronic device; the integrated design supports simultaneous connection of multiple storage devices and network devices, and users can flexibly configure the storage capacity and network modules according to the needs, without additional occupation of the mainboard space.

Description

Technical Field

[0001] This disclosure relates to the field of connector technology, and more particularly to a connector, connection structure, and electronic device. Background Technology

[0002] In the current development trend of the personal computer industry, thinness and miniaturization have become important directions in product design, which places more stringent requirements on the size of the motherboard. In traditional connector designs, connectors for different functional modules are usually arranged independently or separately. This distributed layout occupies a lot of motherboard space and is not conducive to achieving miniaturization. In addition, the use of multiple independent connectors increases the complexity of wiring and can easily lead to signal interference and other problems, affecting the performance of the device. Utility Model Content

[0003] This disclosure provides a connector, connection structure, and electronic device to at least solve the above-mentioned technical problems existing in the prior art.

[0004] A first aspect of this disclosure provides a connector including a base and a plurality of interfaces integrated on the base; wherein the plurality of interfaces include:

[0005] At least two storage interfaces for connecting storage devices;

[0006] At least one network interface for connecting network devices;

[0007] The base integrates a signal transmission path for communication between a storage device connected via a storage interface and a network device connected via a network interface.

[0008] In one embodiment, at least two of the storage interfaces include a first storage interface and a second storage interface, wherein the second storage interface is disposed above the first storage interface in a vertical direction via a support frame.

[0009] In one possible implementation, the first storage interface and the second storage interface are oriented in the same direction.

[0010] In one possible implementation, the first storage interface and the second storage interface are spaced apart.

[0011] In one possible implementation, the network interface is located next to the first storage interface and faces away from the first storage interface.

[0012] In one embodiment, the base, the support frame, and the plurality of interfaces are integrally formed.

[0013] In one embodiment, the bottom of the base is further provided with an electrical connection part, the signal transmission path is connected to the electrical connection part, and the connector is connected to an external device through the electrical connection part.

[0014] A second aspect of this disclosure provides a connection structure including a motherboard, wherein the motherboard is provided with a connector as described in any of the above-described embodiments.

[0015] In one possible implementation, it further includes:

[0016] At least two storage devices are plugged into the storage interface of the connector, one-to-one;

[0017] At least one network device is inserted into the network interface of the connector;

[0018] A heat dissipation component is disposed between the motherboard and the storage device near the motherboard, for conducting heat from the storage device to the motherboard and dissipating heat.

[0019] A third aspect of this disclosure provides an electronic device having a connection structure as described in the above-described embodiments.

[0020] In this disclosure, because the connector integrates at least two storage interfaces and one network interface into the same base, it reduces the motherboard footprint compared to the traditional distributed layout, freeing up space for other functional chips, capacitors, and other components, thus contributing to the thinner and lighter design of electronic devices. The integrated design supports simultaneous connection of multiple storage and network devices, allowing users to flexibly configure storage capacity and network modules according to their needs without occupying additional motherboard space, meeting the requirements of high-performance computing, multitasking, and other scenarios. In addition, the integrated signal transmission path inside the base replaces the distributed wiring of traditional independent interfaces, reducing the number and complexity of motherboard wiring.

[0021] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0022] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which:

[0023] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0024] Figure 1A schematic diagram of the overall structure of a connector according to an exemplary embodiment of this disclosure is shown;

[0025] Figure 2 A schematic diagram of the bottom structure of a connector according to an exemplary embodiment of the present disclosure is shown;

[0026] Figure 3 A schematic diagram of a connection structure according to an exemplary embodiment of the present disclosure is shown.

[0027] The numbers in the diagram are as follows: 1. Base; 2. Bottom SSD; 3. Top SSD; 4. Motherboard; 5. Heat dissipation assembly; 11. Storage interface; 12. Network interface; 13. Electrical connection; 14. Support frame; 111. First storage interface; 112. Second storage interface. Detailed Implementation

[0028] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0029] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0030] Reference Figure 1 and Figure 2 As shown, this disclosure discloses a connector in an exemplary embodiment, including a base 1 and a plurality of interfaces integrated on the base 1. The plurality of interfaces include at least two storage interfaces 11 for connecting storage devices, and at least one network interface 12 for connecting network devices. The base 1 integrates a signal transmission path for communication using the storage device connected via the storage interface 11 and the network device connected via the network interface 12.

[0031] In this embodiment, the base 1 integrates signal transmission paths. These signal transmission paths employ layered wiring and shielding designs to ensure stable signal transmission between the storage interface 11 and the network interface 12. The number of storage interfaces 11 can be flexibly set according to actual application needs, with a minimum of two, to connect multiple storage devices simultaneously, thereby improving the storage capacity and performance of the devices. The number of network interfaces 12 is at least one, used to connect network devices and realize the network communication function of the devices. The network interface 12 standard should follow common wireless communication standards to ensure compatibility with various network devices. It is understood that the storage devices can be, but are not limited to, solid-state drives (SSDs), hard disk drives (HDDs), or memory cards; the network devices can be network cards, such as WiFi cards, PCIe cards, M.2 interface cards, or USB external network cards. Taking an SSD as an example, the storage interface 11 specification can adopt mainstream M.2 2280 or M.2 2242, etc., to adapt to SSDs of different sizes. The base 1 can be equipped with clips or screw holes on its edge to fit with corresponding structures on external devices such as motherboards and printed circuit boards, thereby enhancing the stability of the connector after installation and preventing poor interface contact due to vibration or other factors.

[0032] In summary, the connector disclosed herein integrates at least two storage interfaces 11 and one network interface 12 into a single base 1. Compared to traditional distributed layouts, this reduces the motherboard footprint, freeing up space for other functional chips, capacitors, and other components, thus contributing to the thinner and lighter design of electronic devices. The integrated design supports simultaneous connection of multiple storage and network devices, allowing users to flexibly configure storage capacity and network modules according to their needs without requiring additional motherboard space, meeting the requirements of high-performance computing, multitasking, and other scenarios. Furthermore, the integrated signal transmission path within the base 1 replaces the distributed wiring of traditional independent interfaces, reducing the number and complexity of motherboard wiring.

[0033] Reference Figure 1 and Figure 3 As shown, in one embodiment, at least two storage interfaces 11 include a first storage interface 111 and a second storage interface 112, with the second storage interface 112 disposed above the first storage interface 111 via a support frame 14 in a vertical direction.

[0034] First, it should be noted that, for ease of understanding, the embodiments disclosed herein all use SSD as the storage device, network card as the network device, and motherboard as the external device as the example.

[0035] In this embodiment, the first storage interface 111 is disposed on the base 1, with its interface direction parallel to the motherboard, and is used to connect the bottom SSD 2. The second storage interface 112 is vertically disposed above the first storage interface 111 via a support frame 14, forming a stacked structure with the first storage interface 111 in the vertical direction. The interface direction of the second storage interface 112 is consistent with that of the first storage interface 111, both being parallel to the motherboard, and is used to connect the top SSD 3. The first storage interface 111 and the second storage interface 112 can be designed with the same or opposite orientation according to actual needs. The support frame 14 is made of high-strength engineering plastic or metal, and its height is determined according to heat dissipation requirements and SSD thickness. The support frame 14 can be hollow to form a heat dissipation channel or integrate a signal shielding layer. The signal transmission path integrated in the base 1 conducts the second storage interface 112 to the motherboard electrical connection part 13 through conductive connectors in the support frame 14, such as flexible circuit boards and metal pins, ensuring that the signal paths of the bottom SSD 2 and the top SSD 3 are independent and stable. The bottom of the support frame 14 is fixedly connected to the base 1, such as by screws or clips. The top of the support frame 14 is rigidly connected to the housing of the second storage interface 112, forming a stable vertical support structure to prevent the interface from shaking or making poor contact due to external forces after stacking.

[0036] In one possible implementation, the first storage interface 111 and the second storage interface 112 are oriented in the same direction.

[0037] In this embodiment, the same orientation of the first storage interface 111 and the second storage interface 112 means that their insertion directions are parallel and consistent, and after the SSD is installed, their data transmission surfaces face upwards or downwards. The signal transmission path inside the base 1 can adopt a layered wiring method, configuring independent signal channels for the first storage interface 111 and the second storage interface 112 respectively, and setting ground shielding layers between layers to reduce signal crosstalk.

[0038] In one embodiment, the first storage interface 111 and the second storage interface 112 are spaced apart.

[0039] In this embodiment, a vertical spacing is maintained between the first storage interface 111 and the second storage interface 112. This distance is determined comprehensively based on the SSD thickness, heat dissipation requirements, and signal shielding requirements. The spacing forms a natural convection channel, which, in conjunction with the internal fan of the device, allows cool air to enter from the bottom, flow over the SSD surface, and exit from the top, avoiding performance degradation due to overheating.

[0040] In one embodiment, the network interface 12 is located next to the first storage interface 111 and faces away from the first storage interface 111.

[0041] In this embodiment, the network interface 12 and the first storage interface 111 are oriented in opposite directions, that is, their insertion directions are opposite. For example, the SSD insertion direction of the first storage interface 111 is from the front end of the connector to the rear end, while the network card insertion direction of the network interface 12 is from the rear end of the connector to the front end.

[0042] In one embodiment, the base 1, the support frame 14, and the multiple interfaces are integrally formed.

[0043] In this embodiment, the connector is made of high-performance engineering plastics such as liquid crystal polymer (LCP) or polyphenylene sulfide (PPS), and the main structure of the base 1, support frame 14, and multiple interfaces is formed in one piece using a precision injection mold. After molding, there are no physical connection interfaces between the components, forming a continuous integral structure. During the injection molding process, pre-processed metal signal lines, pin terminals, and other inserts are implanted into the mold, allowing these metal parts to bond with the plastic matrix and form an electrical connection path.

[0044] In one embodiment, the bottom of the base 1 is also provided with an electrical connection part 13, the signal transmission path is connected to the electrical connection part 13, and the connector is connected to the external device through the electrical connection part 13.

[0045] In this embodiment, the base 1 serves as the main support structure of the connector, and its bottom is provided with an electrical connection part 13, such as gold fingers or solder pads, which are used to physically fix and electrically connect the connector to the motherboard. Specifically, the electrical connection part 13 is provided with contact terminals for connecting to external devices, and the number, spacing, and electrical protocol of the contact terminals are adapted to the preset solder pads on the external devices.

[0046] Reference Figure 3 As shown, this disclosure also provides a connection structure, including a motherboard 4, on which a connector as described in any of the above-described embodiments is provided.

[0047] Specifically, in one embodiment, the connection structure further includes at least two storage devices, at least one network device, and a heat dissipation component 5. The two storage devices are plugged into the storage interfaces 11 of the connector, and the network device is plugged into the network interface 12 of the connector. The heat dissipation component 5 is disposed between the motherboard 4 and the storage devices near the motherboard 4, and is used to conduct heat from the storage devices to the motherboard 4 and dissipate the heat.

[0048] In this embodiment, at least two solid-state drives (SSDs) are plugged into the storage interfaces 11 of the connector, arranged in a stacked layout. A spacing is maintained between adjacent SSDs to ensure sufficient space for heat dissipation. At least one network interface card (NIC) is plugged into the network interface 12 of the connector. The network interface 12 and the storage interface 11 are arranged facing away from each other to reduce signal interference. The heat dissipation component 5 can specifically be a thermal pad, placed between the motherboard 4 and the storage device (i.e., the bottom SSD 2) near the motherboard 4. It has good thermal conductivity, enabling rapid transfer of heat generated by the storage device to the motherboard 4, thereby reducing the temperature of the storage device. A heatsink module, made of metal, can also be installed on the top SSD 3. This heatsink module has a large heat dissipation area, effectively improving the heat dissipation efficiency of the storage device and ensuring its stability and reliability during long-term operation. Therefore, the connection structure, through the coordinated design of the connector and the heat dissipation component 5, reduces the overall size and facilitates optimized internal space layout.

[0049] This disclosure also provides an electronic device having a connection structure as described in the above-described embodiments.

[0050] In this embodiment, the electronic device includes a housing, a connection structure, and other functional modules. The connector in the connection structure is mounted on the motherboard 4, and its bottom has an electrical connection portion 13 that mates with the motherboard 4, integrating a signal transmission path. Multiple storage devices are plugged into the storage interfaces 11 of the connector, and network devices are plugged into the network interfaces 12. A heat dissipation component 5 is located between the motherboard 4 and the storage devices near the motherboard 4 to dissipate heat from the storage devices. In summary, based on the compact layout of the connection structure, the internal space of the electronic device is redesigned, allowing the freed-up space to be used to increase battery capacity, add expansion interfaces, or reduce device size.

[0051] In the description of this disclosure, it should be understood that the orientation or positional relationship indicated by directional terms is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this disclosure; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0052] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," and "above" are used herein to describe the spatial positional relationship between one or more components or features shown in the figures and other components or features. It should be understood that spatial relative terms include not only the orientation of the component as depicted in the figures but also different orientations during use or operation. For example, if the components in the figures are inverted as a whole, "above" or "above other components or features" will include cases where the component is "below" or "under" other components or features. Thus, the exemplary term "above" can include both "above" and "below." Furthermore, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this document intends to include all such cases.

[0053] It should be noted that the terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the exemplary implementations according to this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, parts, components, and / or combinations thereof.

[0054] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in sequences other than those illustrated or described herein.

[0055] This disclosure has been described through the above embodiments; however, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit this disclosure to the described embodiments. Furthermore, those skilled in the art will understand that this disclosure is not limited to the above embodiments, and many more variations and modifications can be made based on the teachings of this disclosure, all of which fall within the scope of protection claimed by this disclosure. The scope of protection of this disclosure is defined by the appended claims and their equivalents.

Claims

1. A connector, characterized in that, Includes a base (1) and multiple interfaces integrated on the base (1); wherein the multiple interfaces include: At least two storage interfaces (11) for connecting storage devices; At least one network interface (12) for connecting network devices; The base (1) integrates a signal transmission path for communication using a storage device connected via a storage interface (11) and a network device connected via a network interface (12).

2. The connector according to claim 1, characterized in that, At least two of the storage interfaces (11) include a first storage interface (111) and a second storage interface (112), the second storage interface (112) being disposed above the first storage interface (111) via a support frame (14) in a vertical direction.

3. The connector according to claim 2, characterized in that, The first storage interface (111) and the second storage interface (112) have the same orientation.

4. The connector according to claim 2, characterized in that, The first storage interface (111) and the second storage interface (112) are spaced apart.

5. The connector according to claim 2, characterized in that, The network interface (12) is located next to the first storage interface (111) and faces away from the first storage interface (111).

6. The connector according to claim 2, characterized in that, The base (1), the support frame (14), and the multiple interfaces are integrally formed.

7. The connector according to claim 1, characterized in that, The bottom of the base (1) is also provided with an electrical connection part (13), the signal transmission path is connected to the electrical connection part (13), and the connector is connected to an external device through the electrical connection part (13).

8. A connection structure, comprising a motherboard (4), characterized in that, The motherboard (4) is provided with a connector as described in any one of claims 1-7.

9. The connection structure according to claim 8, characterized in that, Also includes: At least two storage devices are plugged into the storage interface (11) of the connector, one to one; At least one network device is inserted into the network interface (12) of the connector; A heat dissipation component (5) is disposed between the motherboard (4) and the storage device near the motherboard (4) for conducting heat from the storage device to the motherboard (4) and dissipating heat.

10. An electronic device, characterized in that, It is provided with the connection structure as described in claim 8 or 9.

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