Multi-cavity positioning mold for micro electronic connector

Abstract

The utility model relates to micro electronic connector mould technical field discloses a kind of multi-cavity positioning mould for micro electronic connector, including mounting bracket, the top of mounting bracket is fixedly connected with positioning rod, the outside of positioning rod is movably connected with movable mould, the inside of mounting bracket is provided with double-station assembly, the double-station assembly includes electric turnover frame, the outer wall of electric turnover frame is rotatably connected to the inner wall of mounting bracket.In the utility model, mounting bracket support, positioning rod guide movable mould closes mould, the electric turnover frame of double-station assembly is alternately worked with first fixed mould, second fixed mould, completes connector efficient production, mounting bracket guarantees component stable, positioning rod and movable mould positioning hole cooperation promote closing mould precision, double-station alternate operation, multi-cavity synchronous production, substantially improve efficiency, ensure product quality and mould life, overall structure is reasonable, adapt to micro connector production demand.

Description

Technical Field

[0001] This utility model relates to the field of micro electronic connector mold technology, and in particular to a multi-cavity positioning mold for micro electronic connectors. Background Technology

[0002] As electronic devices become smaller and more precise, the market demand for micro electronic connectors continues to increase, while the requirements for their dimensional accuracy and appearance integrity are also constantly rising.

[0003] In the field of microelectronic connector manufacturing, positioning molds are core equipment, and their performance directly determines the production efficiency and product quality of connectors. Microelectronic connector positioning molds are specialized molds used for mass production of microelectronic connectors.

[0004] While existing microelectronic connector molding dies can produce connectors, they suffer from several drawbacks. Firstly, their support structures are unstable, often relying on simple frames to fix components. This makes them prone to component displacement during long-term use or mold closing. Secondly, their mold closing guide mechanisms are poorly designed, lacking precise positioning and guiding components. This leads to misalignment when the moving and fixed molds close, resulting in dimensional deviations in the connector molding and compromising product quality. Thirdly, in terms of production efficiency, most existing dies are single-station designs. After one molding cycle, a waiting period is required for demolding and cleaning before the next cycle can begin, resulting in significant waiting time and hindering continuous, efficient production. Even with some dies employing multi-station designs... The cavity design also suffers from a lack of reasonable station switching structure, making it difficult to fully utilize the production advantages of multi-cavity molds. Overall production efficiency is low and cannot meet the market's demand for mass production. Finally, in the demolding process, the demolding structure design of existing molds is unreasonable. Some molds use a single mechanical push demolding method, which is prone to deformation or damage to connectors due to uneven force during the push process. Although some molds have tried to add gas-assisted demolding, the gas delivery path design is not perfect, the gas distribution is uneven, the demolding effect is poor, and the gap between the ejector pin and the cavity is not properly controlled, which can easily lead to material leakage or ejector pin movement jamming, further affecting demolding efficiency and product quality. To address these issues, a multi-cavity positioning mold for micro electronic connectors is proposed. Utility Model Content

[0005] To overcome the above deficiencies, this utility model provides a multi-cavity positioning mold for micro electronic connectors, aiming to solve the problems in the prior art, such as unstable mold support structure that is prone to displacement, imperfect mold closing guidance leading to dimensional deviation, low production efficiency due to lack of reasonable switching structure in single station or multi-cavity molds, and connector damage, material leakage or ejector stick jamming caused by unreasonable demolding structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a multi-cavity positioning mold for micro electronic connectors, including a mounting frame, a positioning rod fixedly connected to the top of the mounting frame, a moving mold movably connected to the outer side of the positioning rod, and a dual-station assembly provided on the inner side of the mounting frame;

[0007] The dual-station assembly includes an electric tilting frame, the outer wall of which is rotatably connected to the inner wall of the mounting frame. A first fixed mold is fixedly connected to the upper surface of the electric tilting frame, and a second fixed mold is fixedly connected to the lower surface of the electric tilting frame. A connector cavity is provided on one side of the surfaces of the first and second fixed molds, and a limit groove is provided on the other side of the surfaces of the first and second fixed molds. A lifting assembly is provided between the electric tilting frame and the limit groove.

[0008] As a further description of the above technical solution:

[0009] One end of the electric tilting frame is fixedly connected to a drive motor through the outer wall of the mounting frame, and the other end of the electric tilting frame is fixedly installed with a bearing between it and the inner wall of the mounting frame.

[0010] As a further description of the above technical solution:

[0011] Two mounting brackets are provided, and the two mounting brackets are mirror images of each other along the central axis of the electric tilting frame.

[0012] As a further description of the above technical solution:

[0013] The connector cavity is provided in multiple ways, and the multiple connector cavities are arranged in a rectangular array.

[0014] As a further description of the above technical solution:

[0015] The lifting assembly includes an electric lifting rod and an air pump. One end of the electric lifting rod and the air pump are fixedly connected to the surface of the electric tilting frame. The other end of the electric lifting rod is fixedly connected to the lifting frame. The other end of the air pump is fixedly connected to the surface of the lifting frame via an air supply pipe.

[0016] As a further description of the above technical solution:

[0017] The outer wall of the lifting frame is movably connected to the inner wall of the limiting groove, and a top rod is fixedly connected to the inner wall of the connector cavity extending from the surface of the lifting frame. The outer wall of the top rod is movably connected to the inner wall of the connector cavity.

[0018] As a further description of the above technical solution:

[0019] The outer surface of the push rod is provided with demolding air holes, and multiple demolding air holes are distributed in a ring at equal intervals.

[0020] As a further description of the above technical solution:

[0021] The positioning rods are provided in four parts, and the upper surface of the moving mold is provided with positioning holes of the appropriate size for mounting the positioning rods, wherein the positioning holes are provided in a one-to-one correspondence with the positioning rods.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this utility model, the mounting frame supports the moving mold and the positioning rod guides the mold closing. The electric flipping frame of the dual-station component carries the first fixed mold and the second fixed mold to work alternately, completing the efficient production of connectors. The mounting frame ensures the stability of the components. The positioning rod and the positioning hole of the moving mold cooperate to improve the mold closing accuracy. The dual-station alternating operation and multi-cavity synchronous production greatly improve efficiency, ensure product quality and mold life. The overall structure is reasonable and adaptable to the production needs of micro connectors.

[0024] 2. In this utility model, by adjusting the lifting assembly, the electric lifting rod drives the lifting frame to rise and fall along the inner wall of the limiting groove, so that the lifting rod pushes the connector. At the same time, the air pump delivers high-pressure air through the air supply pipe and the demolding air hole to assist in the demolding of the cavity and realize automatic demolding. The electric lifting rod precisely controls the height, the limiting groove prevents the lifting frame from shaking, the lifting rod gap design takes into account both movement and material leakage prevention, and multiple demolding air holes provide uniform air supply to avoid damage to the connector, ensure stable demolding, improve product quality and demolding efficiency, and adapt to the production needs of multi-cavity molds. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of a multi-cavity positioning mold for a micro electronic connector proposed in this utility model;

[0026] Figure 2 This is a schematic diagram of the overall cross-sectional structure of a multi-cavity positioning mold for a micro electronic connector proposed in this utility model;

[0027] Figure 3 This is a schematic diagram of a dual-station component flipping structure at the mounting frame of a multi-cavity positioning mold for micro electronic connectors proposed in this utility model.

[0028] Figure 4 This is a schematic diagram of the lifting assembly structure of a multi-cavity positioning mold for micro electronic connectors proposed in this utility model.

[0029] Legend:

[0030] 1. Mounting frame; 2. Positioning rod; 3. Moving mold; 4. Dual-station assembly; 41. Electric tilting frame; 42. First fixed mold; 43. Second fixed mold; 44. Connector cavity; 45. Limiting groove; 5. Lifting assembly; 51. Electric lifting rod; 52. Lifting frame; 53. Ejector rod; 54. Demolding air hole; 55. Air pump; 56. Air supply pipe. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1-3This utility model provides an embodiment of a multi-cavity positioning mold for micro electronic connectors, including a mounting frame 1. The mounting frame 1 serves as the overall support frame for the mold, ensuring the stability of the installation positions of each component. A positioning rod 2 is fixedly connected to the top of the mounting frame 1. The positioning rod 2 is used to precisely guide the movement direction of the moving mold 3, preventing the moving mold 3 from shifting during the mold closing process. The moving mold 3 is movably connected to the outer side of the positioning rod 2, allowing the moving mold 3 to move up and down along the positioning rod 2 to achieve mold closing and opening actions with the fixed mold. There are four positioning rods 2, and the four positioning rods 2 are respectively distributed at the four corners of the top of the mounting frame 1, which can further improve the stability of the movement of the moving mold 3. At the four corners, the stability of the moving mold 3's movement can be further improved. The upper surface of the moving mold 3 has positioning holes of a size adapted to the positioning rod 2. The inner wall of the positioning hole fits tightly against the outer wall of the positioning rod 2 to ensure guiding accuracy. The positioning holes and positioning rods 2 are arranged one-to-one. A dual-station assembly 4 is provided inside the mounting frame 1. The dual-station assembly 4 allows two fixed molds to work alternately, improving mold production efficiency. The dual-station assembly 4 includes an electric tilting frame 41, which can rotate around its own central axis to switch the positions of the first fixed mold 42 and the second fixed mold 43. The outer wall of the electric tilting frame 41 is rotatably connected to the inner wall of the mounting frame 1 to ensure the stability of the electric tilting frame 41 during rotation. Two mounting frames 1 are provided, located at... The electric tilting frame 41 is symmetrically supported on both sides. Two mounting brackets 1 are mirror images of the electric tilting frame 41 along its central axis. One end of the electric tilting frame 41 is fixedly connected to a drive motor through the outer wall of the mounting bracket 1. The drive motor provides power for the rotation of the electric tilting frame 41 and can precisely control the tilting angle. A bearing is fixedly installed between the other end of the electric tilting frame 41 and the inner wall of the mounting bracket 1. The bearing reduces the friction during the rotation of the electric tilting frame 41, reduces component wear, and extends service life. A first fixed mold 42 is fixedly connected to the upper surface of the electric tilting frame 41. After the first fixed mold 42 and the moving mold 3 are closed, a molding space for the connector can be formed. A second fixed mold 43 is fixedly connected to the lower surface of the electric tilting frame 41. The structure of the second fixed mold 43 is the same as that of the first fixed mold 42, and they can alternately perform connector molding operations. A connector cavity 44 is provided on one side of the surface of the first fixed mold 42 and the second fixed mold 43. The shape of the connector cavity 44 matches the shape of the micro electronic connector and is used to contain molten raw materials and cool and shape them. There are multiple connector cavities 44, and the multiple connector cavities 44 are arranged in a rectangular array, which can produce multiple connectors at the same time, greatly improving production efficiency. A limit groove 45 is provided on the other side of the surface of the first fixed mold 42 and the second fixed mold 43. The limit groove 45 is used to limit the lifting frame 52 of the lifting assembly 5, ensuring that the lifting frame 52 can only move in the vertical direction.To avoid deviation during the lifting process.

[0033] Reference Figure 1 , Figure 2 and Figure 4 A lifting assembly 5 is provided between the electric tilting frame 41 and the limiting groove 45. The lifting assembly 5 is used to eject the molded connector from the connector cavity 44, realizing automatic demolding. The lifting assembly 5 includes an electric lifting rod 51 and an air pump 55. The electric lifting rod 51 provides the main power for the lifting of the lifting frame 52 and can precisely control the lifting height. The air pump 55 is used to provide high-pressure gas to assist the demolding operation. One end of the electric lifting rod 51 and the air pump 55 are fixedly connected to the surface of the electric tilting frame 41 to ensure the overall installation of the lifting assembly 5. The other end of the electric lifting rod 51 is fixedly connected to the lifting frame 52. The lifting frame 52 can drive the push rod 53 to lift synchronously, realizing the simultaneous lifting of multiple connectors. The outer wall of the lifting frame 52 is movably connected to the inner wall of the limiting groove 45. The inner wall of the limiting groove 45 and the outer wall of the lifting frame 52 are tightly fitted to prevent the lifting frame 52 from shaking during lifting. The surface of the lifting frame 52 extends to the inner wall of the connector cavity 44 and is fixedly connected to... The ejector pin 53 directly contacts the molded connector and pushes it away from the cavity by moving upward. The outer wall of the ejector pin 53 is movably connected to the inner wall of the connector cavity 44. A small gap is left between the outer wall of the ejector pin 53 and the inner wall of the connector cavity 44 to ensure smooth movement of the ejector pin 53 and prevent material from overflowing from the gap. The outer surface of the ejector pin 53 is provided with demolding air holes 54. The demolding air holes 54 can deliver high-pressure gas provided by the air pump 55 to the space between the connector and the inner wall of the cavity to form a pressure difference, which helps the connector to detach from the cavity and avoids damage to the connector during demolding. Multiple demolding air holes 54 are evenly distributed in a ring to ensure that the high-pressure gas acts evenly on the surface of the connector and ensures a smooth demolding process. The other end of the air pump 55 is fixedly connected to the surface of the lifting frame 52 with an air supply pipe 56. The air supply pipe 56 is used to deliver the high-pressure gas generated by the air pump 55 to the inside of the lifting frame 52 and further discharge it through the demolding air holes 54 of the ejector pin 53.

[0034] Working principle: In the working process of the multi-cavity positioning mold for micro electronic connectors, the mounting frame 1 is used as the overall support frame. The four positioning rods 2 at the top of the mounting frame 1 are distributed at the four corners of the top of the mounting frame 1 to provide precise guidance for the moving mold 3. The moving mold 3 moves downward along the positioning rods 2. The inner wall of the positioning hole corresponding to the positioning rod 2 is tightly fitted with the outer wall of the positioning rod 2 to ensure the mold closing accuracy. Finally, it completes the mold closing with the first fixed mold 42 on the upper surface of the electric flipping frame 41. At this time, the shape of the multiple connector cavities 44 distributed in a rectangular array on the surface of the first fixed mold 42 matches the shape of the micro electronic connector to form a molding space. The molten raw material is injected into the cavity and then cooled and formed.

[0035] While the first fixed mold 42 is performing the molding operation, the electric tilting frame 41 can rotate around its own central axis under the drive of one end of the drive motor fixed to the outer wall of the mounting frame 1. The bearing between the other end and the inner wall of the mounting frame 1 reduces the rotational friction. Since the two mounting frames 1 are mirrored along the central axis of the electric tilting frame 41 and form symmetrical support for it, the electric tilting frame 41 can stably realize the position switching between the first fixed mold 42 and the lower surface second fixed mold 43. After the first fixed mold 42 is formed, the moving mold 3 opens upward along the positioning rod 2. The electric tilting frame 41 rotates to move the second fixed mold 43 to the mold closing position. The above mold closing, material injection and molding steps are repeated to realize the alternating work of the two stations to improve production efficiency.

[0036] After the connector on either the first fixed mold 42 or the second fixed mold 43 is formed, the lifting assembly 5 is activated for demolding: one end of the electric lifting rod 51 is fixed to the surface of the electric tilting frame 41, driving the lifting frame 52 at the other end to rise. The lifting frame 52 moves stably in the vertical direction under the limiting groove 45 that fits tightly on the outer wall and is opened on the other side of the fixed mold surface. The push rod 53 extending to the inner wall of the connector cavity 44 moves upward simultaneously, directly contacting the formed connector and pushing it away from the cavity. At the same time, one end of the air pump 55 is fixed to the electric tilting frame 41. The surface of the rotating frame 41 is connected to the air pump 55 and the lifting frame 52 through the air supply pipe 56. High-pressure gas is delivered to the interior of the lifting frame 52, and then delivered to the space between the connector and the inner wall of the cavity through multiple equally spaced demolding air holes 54 on the outer surface of the ejector rod 53. This creates a pressure difference to assist demolding and prevent damage to the connector. Finally, a complete connector production cycle is completed. The small gap between the ejector rod 53 and the inner wall of the connector cavity 44 ensures smooth movement of the ejector rod 53 and prevents raw materials from overflowing from the gap during the molding process.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-cavity positioning mold for micro electronic connectors, comprising a mounting bracket (1), characterized in that: The top of the mounting frame (1) is fixedly connected to a positioning rod (2), and the outside of the positioning rod (2) is movably connected to a moving mold (3). The inner side of the mounting frame (1) is provided with a dual-station assembly (4). The dual-station assembly (4) includes an electric tilting frame (41), the outer wall of which is rotatably connected to the inner wall of the mounting frame (1). A first fixed mold (42) is fixedly connected to the upper surface of the electric tilting frame (41), and a second fixed mold (43) is fixedly connected to the lower surface of the electric tilting frame (41). A connector cavity (44) is provided on one side of the surface of the first fixed mold (42) and the second fixed mold (43), and a limiting groove (45) is provided on the other side of the surface of the first fixed mold (42) and the second fixed mold (43). A lifting assembly (5) is provided between the electric tilting frame (41) and the limiting groove (45).

2. The multi-cavity positioning mold for micro electronic connectors according to claim 1, characterized in that: One end of the electric tilting frame (41) is fixedly connected to the drive motor through the outer wall of the mounting frame (1), and the other end of the electric tilting frame (41) is fixedly installed with a bearing between it and the inner wall of the mounting frame (1).

3. The multi-cavity positioning mold for micro electronic connectors according to claim 1, characterized in that: Two mounting brackets (1) are provided, and the two mounting brackets (1) are mirrored along the central axis of the electric tilting frame (41).

4. The multi-cavity positioning mold for micro electronic connectors according to claim 1, characterized in that: The connector cavity (44) is provided in multiple ways, and the multiple connector cavities (44) are arranged in a rectangular array.

5. The multi-cavity positioning mold for micro electronic connectors according to claim 1, characterized in that: The lifting assembly (5) includes an electric lifting rod (51) and an air pump (55). One end of the electric lifting rod (51) and the air pump (55) are fixedly connected to the surface of the electric tilting frame (41). The other end of the electric lifting rod (51) is fixedly connected to a lifting frame (52). The other end of the air pump (55) is fixedly connected to the surface of the lifting frame (52) with an air supply pipe (56).

6. A multi-cavity positioning mold for micro electronic connectors according to claim 5, characterized in that: The outer wall of the lifting frame (52) is movably connected to the inner wall of the limiting groove (45). The surface of the lifting frame (52) extends to the inner wall of the connector cavity (44) and is fixedly connected to a top rod (53). The outer wall of the top rod (53) is movably connected to the inner wall of the connector cavity (44).

7. A multi-cavity positioning mold for micro electronic connectors according to claim 6, characterized in that: The outer surface of the push rod (53) is provided with demolding air holes (54), and multiple demolding air holes (54) are provided in a ring at equal intervals.

8. The multi-cavity positioning mold for micro electronic connectors according to claim 1, characterized in that: The positioning rods (2) are provided in four parts, and the upper surface of the moving mold (3) is provided with positioning holes of the size adapted to the positioning rods (2) for installation, wherein the positioning holes are provided in a one-to-one correspondence with the positioning rods (2).

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