A semiconductor laser diode pumped solid state laser module

Abstract

The utility model relates to the field of optoelectronic technology especially relates to a kind of semiconductor laser diode pumped solid laser module.The semiconductor laser diode pumped solid laser module includes substrate, semiconductor laser diode chip, column lens and crystal;Surface metallization plate, column lens slot and crystal slot are equipped on the substrate;The semiconductor laser diode chip is welded on the surface metallization plate, and its electrode is led out.The semiconductor laser diode pumped solid laser module provided by the utility model is accurately designed through substrate upper surface metal plate, column lens slot and crystal slot, so that semiconductor laser diode chip, column lens and crystal are directly in the relative position of the highest pumping efficiency, column lens effectively compresses and collimates the fast-axis beam output by chip, reduces energy loss, improves the absorption efficiency of crystal to beam;Concave groove constitutes unobstructed light path channel, further guarantees beam transmission efficiency.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic technology, and in particular to a semiconductor laser diode-pumped solid-state laser module. Background Technology

[0002] In existing technologies, semiconductor laser diode-pumped solid-state lasers mostly use pre-packaged semiconductor laser diodes in TO or C-mount packages as pump sources. While these packaging structures protect the chip, they increase the size and cost of the laser module. Furthermore, the output beam of a semiconductor laser diode has a large divergence angle along the fast axis, resulting in low conversion efficiency when directly pumping the crystal. Although efficiency can be improved by compressing and collimating the fast-axis beam using micro-cylindrical lenses such as glass filament rods or optical fibers, this requires sophisticated fixtures, nickel tubes, and other auxiliary components to fix the semiconductor laser diode, cylindrical lens, and crystal on a fine-tuning frame. The relative positions of the three components are then determined through five-dimensional fine-tuning before being fixed to the base or housing. This approach has significant drawbacks: firstly, the packaging structure and auxiliary components increase the module size and cost; secondly, the fine-tuning process relies on manual labor or precision equipment, resulting in complex processes, low production efficiency, and difficulty in meeting mass production needs. Moreover, the stability of the adjusted position is easily affected by the environment, leading to fluctuations in pump efficiency.

[0003] Therefore, it is necessary to provide a new semiconductor laser diode-pumped solid-state laser module to solve the above-mentioned technical problems. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, a semiconductor laser diode-pumped solid-state laser module is provided to solve the above-mentioned problems.

[0005] The semiconductor laser diode-pumped solid-state laser module provided by this utility model includes: a substrate, a semiconductor laser diode chip, a cylindrical lens, and a crystal; the substrate is provided with a surface metallization plate, a cylindrical lens slot, and a crystal slot; the semiconductor laser diode chip is soldered to the surface metallization plate, and its electrodes are led out; the cylindrical lens is snapped into the cylindrical lens slot and fixed by UV adhesive; the crystal is snapped into the crystal slot and fixed by UV adhesive.

[0006] Preferably, the front cavity surface of the semiconductor laser diode chip is aligned with the edge line of the surface metallization plate.

[0007] Preferably, both the cylindrical lens slot and the crystal slot are U-shaped slots.

[0008] Preferably, the distance between the edge of the surface metallization plate and the center line of the cylindrical lens slot is equal to the distance between the front cavity surface of the semiconductor laser diode chip and the central axis of the cylindrical lens when the pumping efficiency is at its highest.

[0009] Preferably, the substrate is provided with a concave groove, which forms the optical path channel for the output beam of the semiconductor laser diode chip, so that the beam reaches the cylindrical lens without obstruction and is absorbed by the crystal after compression and collimation.

[0010] Preferably, the hollow portion of the concave groove is smaller than the U-shaped hollow portion of the crystal slot; when the crystal is engaged in the crystal slot, the edge of the concave groove abuts against the crystal at the boundary of the crystal slot, thereby positioning the crystal in the optical path direction.

[0011] Compared with related technologies, the semiconductor laser diode-pumped solid-state laser module provided by this utility model has the following advantages: This invention, through the precise design of the metal plate on the upper surface of the substrate, the cylindrical lens slot, and the crystal slot, places the semiconductor laser diode chip, the cylindrical lens, and the crystal directly in the relative position with the highest pumping efficiency. The cylindrical lens effectively compresses and collimates the fast-axis beam output by the chip, reducing energy loss and improving the absorption efficiency of the crystal for the beam. The concave slot forms an unobstructed optical path channel, further ensuring the beam transmission efficiency. Attached Figure Description

[0012] Figure 1 A schematic diagram of a preferred embodiment of the semiconductor laser diode-pumped solid-state laser module provided by this utility model; Figure 2 This is a schematic diagram showing the relative positions of the semiconductor laser diode chip, the cylindrical lens, and the crystal. Figure 3 for Figure 1 The diagram shows the structure of the substrate. Figure 4 This is a schematic diagram showing the fit between the cylindrical lens and the cylindrical lens slot; Figure 5 This is a schematic diagram showing the fit between the crystal and the crystal slot.

[0013] The diagram is labeled as follows: 1. Semiconductor laser diode chip; 11. Surface metallization plate; 2. Cylindrical lens; 21. Cylindrical lens slot; 22. Concave groove; 3. Crystal; 31. Crystal slot. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0015] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0016] This utility model provides a semiconductor laser diode-pumped solid-state laser module, which includes: a substrate 4, a semiconductor laser diode chip 1, a cylindrical lens 2, and a crystal 3; the substrate 4 is provided with a surface metallization plate 11, a cylindrical lens slot 21, and a crystal slot 31; the semiconductor laser diode chip 1 is soldered onto the surface metallization plate 11, and its electrodes are led out; the cylindrical lens 2 is snapped into the cylindrical lens slot 21 and fixed by UV adhesive; the crystal 3 is snapped into the crystal slot 31 and fixed by UV adhesive, the front cavity surface of the semiconductor laser diode chip 1 is aligned with the edge line of the surface metallization plate 11, and both the cylindrical lens slot 21 and the crystal slot 31 are U-shaped slots.

[0017] It should be noted that: the substrate 4 serves as the supporting base, and the surface metallization plate 11 on it is used to weld and fix the semiconductor laser diode chip 1, and to meet the chip's welding, electrode connection, and power supply requirements. The front cavity surface of the semiconductor laser diode chip 1 is aligned with the edge line of the surface metallization plate 11, which can serve as a positioning reference for the optical path, ensuring the accuracy of the initial direction of the chip's output beam. The semiconductor laser diode chip 1 serves as the pump source, and the bare chip design reduces the module size and lowers the cost. Its outgoing electrodes are used to supply power to generate a laser beam. The cylindrical lens slot 21 is a U-shaped slot used to clamp and position the cylindrical lens 2, and its slot width is determined by the chip's... The optical zone height is precisely controlled to ensure the positional accuracy of the cylindrical lens 2. The cylindrical lens 2 is used to compress the fast-axis beam output by the collimating chip, thereby improving the pumping efficiency. Its position is also ensured by UV adhesive bonding. The crystal slot 31 is also a U-shaped slot, used to hold and position the crystal 3. Its distance from the surface metallization plate 11 is set to ensure that the crystal 3 is in the position with the highest pumping efficiency. The crystal 3 is used to absorb the beam processed by the cylindrical lens 2 to achieve laser conversion. Its position is also ensured by UV adhesive bonding. Finally, the precise cooperation of each component achieves the characteristics of high pumping efficiency, small size, low cost and easy mass production of the module.

[0018] In an embodiment of this utility model, the distance between the edge of the surface metallization plate 11 and the center line of the cylindrical lens slot 21 is equal to the distance between the front cavity surface of the semiconductor laser diode chip 1 and the central axis of the cylindrical lens 2 when the pumping efficiency is at its highest.

[0019] It should be noted that the distance between the edge of the surface metal plate 11 and the center line of the cylindrical lens slot 21 is equal to the distance between the front cavity surface of the semiconductor laser diode chip 1 and the central axis of the cylindrical lens 2 when the pumping efficiency is at its highest. This distance setting is based on the characteristics of the U-shaped groove processed by a laser scribing machine or a diamond wheel scribing machine. By precisely corresponding the structural distance on the substrate with the relative distance of the components when the pumping efficiency is optimal, the cylindrical lens 2 can be directly positioned at the position that achieves the highest pumping efficiency. Without the need for auxiliary components such as fixtures and fine-tuning frames for position fine-tuning, it can be ensured that the beam output from the semiconductor laser diode chip 1 is compressed and collimated by the cylindrical lens 2 and acts efficiently on the crystal 3. This simplifies the process and ensures the consistency of the performance of each module during mass production. It is one of the key designs for achieving high pumping efficiency, low cost, and suitability for mass production of the module.

[0020] In an embodiment of this utility model, a concave groove 22 is provided on the substrate 4. The concave groove 22 forms the optical path channel for the output beam of the semiconductor laser diode chip 1, so that the beam reaches the cylindrical lens 2 without obstruction and is absorbed by the crystal 3 after compression and collimation.

[0021] It should be noted that: the substrate 4 is provided with a concave groove 22, which constitutes the optical path channel for the output beam of the semiconductor laser diode chip 1, ensuring that the output beam of the chip is transmitted to the cylindrical lens 2 without obstruction, and is successfully absorbed by the crystal 3 after being compressed and collimated by the cylindrical lens 2; at the same time, the hollow part of the concave groove 22 is smaller than the U-shaped hollow part of the crystal slot 31. When the crystal 3 is engaged with the crystal slot 31, the edge of the concave groove 22 will abut against the crystal 3 at the boundary of the crystal slot, thereby forming a precise positioning of the crystal 3 in the optical path direction, further ensuring the interaction efficiency between the beam and the crystal 3. This is an important structural design for achieving the stability of the module's optical path and high pumping efficiency.

[0022] In an embodiment of this utility model, the hollow portion of the concave groove 22 is smaller than the U-shaped hollow portion of the crystal slot 31; when the crystal 3 is engaged in the crystal slot 31, the edge of the concave groove 22 abuts against the crystal 3 at the boundary of the crystal slot 31, thereby achieving the positioning of the crystal 3 in the optical path direction.

[0023] It should be noted that the hollow portion of the concave groove 22 on the substrate 4 is smaller than the U-shaped hollow portion of the crystal slot 31. When the crystal 3 is engaged with the crystal slot 31, the edge of the concave groove 22 will abut against the crystal 3 at the boundary of the crystal slot 31, thereby achieving precise positioning of the crystal 3 in the optical path direction. This design ensures that the beam output from the semiconductor laser diode chip 1 can reach the cylindrical lens 2 without obstruction through the optical path channel formed by the concave groove 22, and be efficiently absorbed by the crystal 3 after compression and collimation. Furthermore, the size matching between the concave groove 22 and the crystal slot 31, along with the edge abutment, fixes the crystal 3 in the optical path direction, avoiding the use of additional positioning elements. This further simplifies the structure and ensures positional consistency during mass production, making it one of the key designs for improving module pumping efficiency and structural stability.

[0024] The working principle of the semiconductor laser diode-pumped solid-state laser module provided by this utility model is as follows: The semiconductor laser diode chip 1 is connected to the power supply through the surface metallization plate 11. After being powered on, its light-emitting area generates a laser beam. The beam is transmitted unobstructed along the optical path channel formed by the concave groove 22 on the substrate 4, avoiding the obstruction and loss of the beam by the substrate structure. When it is transmitted to the cylindrical lens 2, the cylindrical lens 2 accurately positions the distance between its central axis and the front cavity surface of the chip to the preset value with the highest pumping efficiency through the cylindrical lens slot 21, compressing and collimating the diverging beam in the fast axis direction output by the chip, making the beam energy more concentrated. The compressed and collimated beam continues to be transmitted to the crystal 3. The crystal 3 accurately positions the distance between its front end surface and the front cavity surface of the chip to the preset value with the highest pumping efficiency through the cooperation of the crystal slot 31 and the edge of the concave groove 22, efficiently absorbing the beam energy and completing the laser conversion, and finally outputting a stable laser. Throughout the process, the coordinated design of the surface metallization plate 11, the cylindrical lens slot 21, the crystal slot 31, and the concave groove 22 ensures that the chip, the cylindrical lens 2, and the crystal 3 are always in the optimal relative position, achieving efficient pumping without additional fine-tuning, and guaranteeing the stability and reliability of the module operation.

[0025] The circuits and controls involved in this utility model are all existing technologies and will not be described in detail here.

[0026] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A semiconductor laser diode-pumped solid-state laser module, characterized in that, include: Substrate (4), semiconductor laser diode chip (1), cylindrical lens (2) and crystal (3); The substrate (4) is provided with a surface metallization plate (11), a cylindrical lens slot (21) and a crystal slot (31). The semiconductor laser diode chip (1) is soldered onto the surface metallization plate (11), and its electrodes are led out. The cylindrical lens (2) is snapped into the cylindrical lens slot (21) and fixed by UV adhesive; The crystal (3) is snapped into the crystal slot (31) and fixed by UV adhesive.

2. The semiconductor laser diode-pumped solid-state laser module according to claim 1, characterized in that, The front cavity surface of the semiconductor laser diode chip (1) is aligned with the edge of the surface metallization plate (11).

3. The semiconductor laser diode-pumped solid-state laser module according to claim 2, characterized in that, Both the cylindrical lens slot (21) and the crystal slot (31) are U-shaped slots.

4. The semiconductor laser diode-pumped solid-state laser module according to claim 3, characterized in that, The distance between the edge of the surface metallization plate (11) and the center line of the cylindrical lens slot (21) is equal to the distance between the front cavity surface of the semiconductor laser diode chip (1) and the central axis of the cylindrical lens (2) when the pumping efficiency is at its highest.

5. The semiconductor laser diode-pumped solid-state laser module according to claim 4, characterized in that, The substrate (4) is provided with a concave groove (22), which constitutes the optical path channel for the output beam of the semiconductor laser diode chip (1) so that the beam reaches the cylindrical lens (2) without obstruction and is absorbed by the crystal (3) after compression and collimation.

6. The semiconductor laser diode-pumped solid-state laser module according to claim 5, characterized in that, The hollow portion of the concave groove (22) is smaller than the U-shaped hollow portion of the crystal slot (31); when the crystal (3) is engaged in the crystal slot (31), the edge of the concave groove (22) abuts against the crystal (3) at the boundary of the crystal slot (31), thereby achieving the positioning of the crystal (3) in the optical path direction.

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