Three-phase input high-power water-cooled power supply

Abstract

The utility model belongs to power supply technical field discloses a kind of three-phase input high-power water-cooled power supply, LLC circuit includes capacitor C1 and capacitor C2, one end of capacitor C2 is connected the drain of MOS tube Q1 and the drain of MOS tube Q2, the source of MOS tube Q1 is connected one end of capacitor C4 and the drain of MOS tube Q3, the other end of capacitor C4 is connected one end of inductor L1, the other end of inductor L1 is connected the pin 1 of transformer T1, the source of MOS tube Q2 is connected the drain of MOS tube Q4 and the pin 2 of transformer T1, the other end of capacitor C2 is connected the source of MOS tube Q3, the source of MOS tube Q4, the drain of MOS tube Q7, the drain of MOS tube Q8 and one end of capacitor C1, the other end of capacitor C1 is connected the source of MOS tube Q9 and the source of MOS tube Q10.The utility model has the advantages of: simple structure, stable performance, good heat dissipation, can be applied to multiple scenes.

Description

Technical Field

[0001] This utility model relates to the field of power supply technology, and in particular to a three-phase input high-power water-cooled power supply. Background Technology

[0002] In the current pursuit of high power, high efficiency, and high power density, AD-DC power supplies are becoming increasingly larger. Switching mode power supplies (SMS power supplies), also known as switching converters or switching power supplies, are high-frequency power conversion devices. Their function is to convert a standard voltage into the voltage or current required by the user through different architectures. The development direction of switching power supplies is towards higher frequencies. Higher frequencies enable miniaturization and allow switching power supplies to enter a wider range of applications, especially in high-tech fields. This has driven the development of switching power supplies, with an annual growth rate exceeding double digits, moving towards lighter, smaller, thinner, lower noise, higher reliability, and stronger anti-interference capabilities.

[0003] Therefore, it is necessary to provide a three-phase input high-power water-cooled power supply that is simple in structure, stable in performance, has good heat dissipation, and can be applied to multiple scenarios. Utility Model Content

[0004] This utility model discloses a three-phase input high-power water-cooled power supply, which can effectively solve the technical problems involved in the background art.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows:

[0006] A three-phase input high-power water-cooled power supply includes an input terminal and an output terminal. The input terminal is connected to a PFC circuit, the PFC circuit is connected to an LLC circuit, and the LLC circuit is connected to the output terminal.

[0007] The PFC circuit includes ports VA, VB, and VC. Port VA is connected to one end of inductor L101. The other end of inductor L101 is connected to the positive terminal of diode D11, the drain of MOSFET Q102, and the negative terminal of diode D14. The source of MOSFET Q102 is connected to the source of MOSFET Q101. Port VB is connected to one end of inductor L102. The other end of inductor L102 is connected to the positive terminal of diode D12, the drain of MOSFET Q104, and the negative terminal of diode D15. The source of MOSFET Q104 is connected to the source of MOSFET Q103. Port VC is connected to one end of inductor L103. The other end of inductor L103 is connected to... Connect the positive terminal of diode D13, the drain of MOSFET Q106, and the negative terminal of diode D15. Connect the source of MOSFET Q106 to the source of MOSFET Q105. Connect the negative terminal of diode D11 to the negative terminals of diode D12 and D13, one end of capacitor C102, and port VBUS+. Connect the other end of capacitor C102 to the drains of MOSFETs Q101, Q103, and Q105, and one end of capacitor C101. Connect the positive terminal of diode D14 to the positive terminals of diode D15 and D16, the other end of capacitor C101, and port VBUS-.

[0008] The LLC circuit includes capacitors C1 and C2. One end of capacitor C2 is connected to the drain of MOSFET Q1 and the drain of MOSFET Q2. The source of MOSFET Q1 is connected to one end of capacitor C4 and the drain of MOSFET Q3. The other end of capacitor C4 is connected to one end of inductor L1. The other end of inductor L1 is connected to pin 1 of transformer T1. The source of MOSFET Q2 is connected to the drain of MOSFET Q4 and pin 2 of transformer T1. The other end of capacitor C2 is connected to the source of MOSFET Q3 and the drain of MOSFET Q4. The source of MOSFET Q4, the drain of MOSFET Q7, the drain of MOSFET Q8, and one end of capacitor C1 are connected. The other end of capacitor C1 is connected to the source of MOSFET Q9 and the source of MOSFET Q10. The source of MOSFET Q7 is connected to the drain of MOSFET Q9 and one end of capacitor C6. The other end of capacitor C6 is connected to one end of inductor L2. The other end of inductor L2 is connected to pin 1 of transformer T2. The source of MOSFET Q8 is connected to the drain of MOSFET Q10 and pin 2 of transformer T2.

[0009] Pin 3 of transformer T1 is connected to the drain of MOSFET Q6. Pin 4 of transformer T1 is connected to pin 5 of transformer T1, pin 4 of transformer T2, pin 5 of transformer T2, port VO+, and one end of capacitor C3. Pin 6 of transformer T1 is connected to the drain of MOSFET Q5. Pin 3 of transformer T2 is connected to the drain of MOSFET Q12. Pin 6 of transformer T2 is connected to the drain of MOSFET Q11. The other end of capacitor C3 is connected to the source of MOSFET Q6, the source of MOSFET Q5, the source of MOSFET Q11, the source of MOSFET Q12, and port VO-.

[0010] One end of capacitor C2 is connected to port VBUS+, the other end of capacitor C1 is connected to port VBUS-, and ports VO+ and VO- are connected to the output terminal.

[0011] As a preferred improvement of this utility model, the input terminal is connected to the PFC circuit through an EMI filter.

[0012] As a preferred improvement of this utility model, the input terminal is externally connected to a three-phase power supply.

[0013] As a preferred improvement of this utility model: the power supply further includes a primary-side control MCU and a secondary-side control MCU. The primary-side control MCU is responsible for controlling the PFC circuit and sampling the primary-side voltage of the LLC circuit, and the secondary-side control MCU is responsible for controlling the LLC circuit and sampling the secondary-side voltage of the LLC circuit.

[0014] As a preferred improvement of this utility model: the primary-side control MCU and the secondary-side control MCU are located on the same PCB board and are isolated by an optocoupler.

[0015] As a preferred improvement of this utility model: the inductors L101, L102, L103, L1 and L2 are made of PQ3535 magnetic core.

[0016] As a preferred improvement of this utility model: the MOSFETs Q101, Q102, Q103, Q104, Q105, Q106, Q1, Q2, Q3, Q4, Q7, Q8, Q9, and Q10 are in TO263-7L surface mount packages, and the MOSFETs Q5, Q6, Q11, and Q12 are in DFN5x6 packages.

[0017] As a preferred improvement of this utility model: the power supply includes a chassis, a motherboard is provided on the chassis base plate, the power semiconductor device of the PFC circuit is mounted on an aluminum substrate one, the power semiconductor device of the LLC circuit is mounted on an aluminum substrate two, and the aluminum substrate one and the aluminum substrate two are mounted on the motherboard.

[0018] As a preferred improvement of this utility model: the chassis base plate is provided with a metal cavity with a top opening, the inductor and transformer of the PFC circuit and the LLC circuit are mounted on PCB board one, the PCB board one is upside down on the top of the metal cavity, the inductor and transformer are located in the metal cavity, the metal cavity is filled with thermally conductive glue, and the PCB board one and the motherboard are electrically connected by leads.

[0019] As a preferred improvement of this utility model, the PCB board and the metal cavity are fixed by screws.

[0020] The beneficial effects of this utility model are as follows:

[0021] This solution proposes a 20KW water-cooled power supply solution, including circuit design, structural layout, heat dissipation treatment, etc. The circuit topology adopts a three-phase Vienna PFC + double interleaved LLC topology. After the input is filtered by EMI filter, it is converted into positive and negative DC voltage by three-phase PFC, and then converted into DC output by LLC. By using series and parallel connection, the entire power supply can be made relatively flat, which is convenient for water cooling heat conduction. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0023] Figure 1 This is a schematic diagram of the structure of a three-phase input high-power water-cooled power supply according to the present invention;

[0024] Figure 2 This is a schematic diagram of the PFC circuit structure;

[0025] Figure 3 This is a schematic diagram of an LLC circuit;

[0026] Figure 4 This is a diagram showing the controller connection.

[0027] Figure 5 This is a schematic diagram of the circuit layout;

[0028] Figure 6This is a cross-sectional view of the chassis;

[0029] Figure 7 This is a schematic diagram of a metal cavity. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0031] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0032] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0034] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0035] Please see Figure 1As shown, this utility model provides a three-phase input high-power water-cooled power supply, including an input terminal and an output terminal. The input terminal is connected to a PFC circuit, the PFC circuit is connected to an LLC circuit, and the LLC circuit is connected to the output terminal. Preferably, the input terminal is connected to the PFC circuit through an EMI filter, and the input terminal is externally connected to a three-phase power supply. The circuit topology adopts a three-phase Vienna PFC + double interleaved LLC topology. After the input is filtered by the EMI filter, it is converted into positive and negative DC voltages by the three-phase PFC, and then converted into DC output by the LLC.

[0036] Please see Figure 2 As shown, the PFC circuit includes ports VA, VB, and VC. Port VA is connected to one end of inductor L101, and the other end of inductor L101 is connected to the positive terminal of diode D11, the drain of MOSFET Q102, and the negative terminal of diode D14. The source of MOSFET Q102 is connected to the source of MOSFET Q101. Port VB is connected to one end of inductor L102, and the other end of inductor L102 is connected to the positive terminal of diode D12, the drain of MOSFET Q104, and the negative terminal of diode D15. The source of MOSFET Q104 is connected to the source of MOSFET Q103. Port VC is connected to one end of inductor L103, and the other end of inductor L103... The positive terminal of diode D13 is connected to the drain of MOSFET Q106 and the negative terminal of diode D15. The source of MOSFET Q106 is connected to the source of MOSFET Q105. The negative terminal of diode D11 is connected to the negative terminals of diode D12 and D13, one end of capacitor C102, and port VBUS+. The other end of capacitor C102 is connected to the drains of MOSFET Q101, Q103, and Q105, and one end of capacitor C101. The positive terminal of diode D14 is connected to the positive terminals of diode D15 and D16, the other end of capacitor C101, and port VBUS-.

[0037] Please see Figure 3As shown, the LLC circuit includes capacitors C1 and C2. One end of capacitor C2 is connected to the drain of MOSFET Q1 and the drain of MOSFET Q2. The source of MOSFET Q1 is connected to one end of capacitor C4 and the drain of MOSFET Q3. The other end of capacitor C4 is connected to one end of inductor L1. The other end of inductor L1 is connected to pin 1 of transformer T1. The source of MOSFET Q2 is connected to the drain of MOSFET Q4 and pin 2 of transformer T1. The other end of capacitor C2 is connected to the source of MOSFET Q3, the source of MOSFET Q4, the drain of MOSFET Q7, the drain of MOSFET Q8, and one end of capacitor C1. The other end of capacitor C1 is connected to the source of MOSFET Q9 and the source of MOSFET Q10. The source of MOSFET Q7 is connected to the drain of MOSFET Q9 and one end of capacitor C6. The other end of capacitor C6 is connected to one end of inductor L2. The other end of inductor L2 is connected to the transformer. Pin 1 of transformer T2 is connected to the source of MOSFET Q8 and the drain of MOSFET Q10, and pin 2 of transformer T2. Pin 3 of transformer T1 is connected to the drain of MOSFET Q6. Pin 4 of transformer T1 is connected to pin 5 of transformer T1, pin 4 of transformer T2, pin 5 of transformer T2, port VO+, and one end of capacitor C3. Pin 6 of transformer T1 is connected to the drain of MOSFET Q5. Pin 3 of transformer T2 is connected to the drain of MOSFET Q12. Pin 6 of transformer T2 is connected to the drain of MOSFET Q11. The other end of capacitor C3 is connected to the source of MOSFET Q6, the source of MOSFET Q5, the source of MOSFET Q11, the source of MOSFET Q12, and port VO-. One end of capacitor C2 is connected to port VBUS+, and the other end of capacitor C1 is connected to port VBUS-. Ports VO+ and VO- are connected to the output terminal.

[0038] Please see Figure 4 As shown, the power supply also includes a primary-side control MCU and a secondary-side control MCU. The primary-side control MCU is responsible for controlling the PFC circuit and sampling the primary-side voltage of the LLC circuit. The secondary-side control MCU is responsible for controlling the LLC circuit and sampling the secondary-side voltage of the LLC circuit. The primary-side MCU is responsible for controlling the PFC and sampling the primary-side voltage, current, and temperature. The secondary-side MCU is responsible for controlling the primary and secondary sides of the LLC circuit, sampling the secondary-side voltage, current, and temperature, and I2C communication with the user's host computer. The primary and secondary-side control circuits are on the same PCB and are isolated by optocouplers.

[0039] The inductors L101, L102, L103, L1, and L2 all use PQ3535 magnetic cores. Due to height considerations, the PFC inductor, LLC resonant inductor, and LLC transformer also use PQ3535 magnetic cores, connected in series and parallel. This allows the entire power supply to be made relatively flat, facilitating water cooling and heat conduction.

[0040] MOSFETs Q101, Q102, Q103, Q104, Q105, Q106, Q1, Q2, Q3, Q4, Q7, Q8, Q9, and Q10 are packaged in TO263-7L surface mount packages, while MOSFETs Q5, Q6, Q11, and Q12 are packaged in DFN5x6 packages. The primary-side MOSFETs for the PFC and LLC circuits are packaged in TO263-7L surface mount packages. The secondary-side rectifier FETs for the LLC circuits are packaged in DFN5x6 packages. The PFC device has a separate aluminum substrate, while the LLC device shares a single aluminum substrate for both primary and secondary sides. All power semiconductor devices are soldered to the aluminum substrate and then soldered as a whole to the motherboard. The aluminum substrate is attached to the bottom case for heat dissipation.

[0041] The power supply includes a chassis, with a motherboard mounted on the chassis base plate. The power semiconductor devices of the PFC circuit are mounted on an aluminum substrate one, and the power semiconductor devices of the LLC circuit are mounted on an aluminum substrate two. The aluminum substrate one and the aluminum substrate two are mounted on the motherboard. The total height of the power supply is 44mm, the base plate thickness is 2mm, the PCB thickness is 2mm, the height between the bottom of the PCB and the outer casing is 6mm, the top cover is 1mm, and the usable space on the top of the PCB is 32mm.

[0042] The chassis base plate has a metal cavity with a top opening. The inductors and transformers of the PFC circuit and the LLC circuit are mounted on a PCB board. The PCB board is inverted and placed on top of the metal cavity. The inductors and transformers are located inside the metal cavity, which is filled with thermally conductive adhesive. The PCB board and the main board are electrically connected by leads and fixed to the metal cavity with screws. Specifically, the magnetic components (including the PFC inductor, LLC resonant inductor, and LLC transformer) are soldered to another PCB, inverted and installed in the metal cavity, which is filled with thermally conductive adhesive. The PCB and the cavity are fixed with screws, and the transformer PCB and the main board are electrically connected by leads. It should be further noted that any other components used to achieve the above effects should fall within the inventive concept of this utility model and should be protected within the scope of this utility model.

[0043] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A three-phase input high-power water-cooled power supply, characterized in that: It includes an input terminal and an output terminal, wherein the input terminal is connected to a PFC circuit, the PFC circuit is connected to an LLC circuit, and the LLC circuit is connected to the output terminal; The PFC circuit includes ports VA, VB, and VC. Port VA is connected to one end of inductor L101. The other end of inductor L101 is connected to the positive terminal of diode D11, the drain of MOSFET Q102, and the negative terminal of diode D14. The source of MOSFET Q102 is connected to the source of MOSFET Q101. Port VB is connected to one end of inductor L102. The other end of inductor L102 is connected to the positive terminal of diode D12, the drain of MOSFET Q104, and the negative terminal of diode D15. The source of MOSFET Q104 is connected to the source of MOSFET Q103. Port VC is connected to one end of inductor L103. The other end of inductor L103 is connected to... Connect the positive terminal of diode D13, the drain of MOSFET Q106, and the negative terminal of diode D15. Connect the source of MOSFET Q106 to the source of MOSFET Q105. Connect the negative terminal of diode D11 to the negative terminals of diode D12 and D13, one end of capacitor C102, and port VBUS+. Connect the other end of capacitor C102 to the drains of MOSFETs Q101, Q103, and Q105, and one end of capacitor C101. Connect the positive terminal of diode D14 to the positive terminals of diode D15 and D16, the other end of capacitor C101, and port VBUS-. The LLC circuit includes capacitors C1 and C2. One end of capacitor C2 is connected to the drain of MOSFET Q1 and the drain of MOSFET Q2. The source of MOSFET Q1 is connected to one end of capacitor C4 and the drain of MOSFET Q3. The other end of capacitor C4 is connected to one end of inductor L1. The other end of inductor L1 is connected to pin 1 of transformer T1. The source of MOSFET Q2 is connected to the drain of MOSFET Q4 and pin 2 of transformer T1. The other end of capacitor C2 is connected to the source of MOSFET Q3 and the drain of MOSFET Q4. The source of MOSFET Q4, the drain of MOSFET Q7, the drain of MOSFET Q8, and one end of capacitor C1 are connected. The other end of capacitor C1 is connected to the source of MOSFET Q9 and the source of MOSFET Q10. The source of MOSFET Q7 is connected to the drain of MOSFET Q9 and one end of capacitor C6. The other end of capacitor C6 is connected to one end of inductor L2. The other end of inductor L2 is connected to pin 1 of transformer T2. The source of MOSFET Q8 is connected to the drain of MOSFET Q10 and pin 2 of transformer T2. Pin 3 of transformer T1 is connected to the drain of MOSFET Q6. Pin 4 of transformer T1 is connected to pin 5 of transformer T1, pin 4 of transformer T2, pin 5 of transformer T2, port VO+, and one end of capacitor C3. Pin 6 of transformer T1 is connected to the drain of MOSFET Q5. Pin 3 of transformer T2 is connected to the drain of MOSFET Q12. Pin 6 of transformer T2 is connected to the drain of MOSFET Q11. The other end of capacitor C3 is connected to the source of MOSFET Q6, the source of MOSFET Q5, the source of MOSFET Q11, the source of MOSFET Q12, and port VO-. One end of capacitor C2 is connected to port VBUS+, the other end of capacitor C1 is connected to port VBUS-, and ports VO+ and VO- are connected to the output terminal.

2. A three-phase input high-power water-cooled power supply according to claim 1, characterized in that: The input terminal is connected to the PFC circuit via an EMI filter.

3. The three-phase input high-power water-cooled power supply according to claim 1, characterized in that: The input terminal is connected to a three-phase power supply.

4. The three-phase input high-power water-cooled power supply according to claim 1, characterized in that: The power supply also includes a primary-side control MCU and a secondary-side control MCU. The primary-side control MCU is responsible for controlling the PFC circuit and sampling the primary-side voltage of the LLC circuit, while the secondary-side control MCU is responsible for controlling the LLC circuit and sampling the secondary-side voltage of the LLC circuit.

5. A three-phase input high power water-cooled power supply as claimed in claim 4, characterized in that: The primary-side control MCU and the secondary-side control MCU are located on the same PCB board and are isolated by an optocoupler.

6. A three-phase input high power water-cooled power supply as claimed in claim 1, characterized in that: The inductors L101, L102, L103, L1, and L2 are made of PQ3535 magnetic core.

7. A three-phase input high power water-cooled power supply as claimed in claim 1, characterized in that: MOSFETs Q101, Q102, Q103, Q104, Q105, Q106, Q1, Q2, Q3, Q4, Q7, Q8, Q9, and Q10 are packaged in TO263-7L surface mount packages, while MOSFETs Q5, Q6, Q11, and Q12 are packaged in DFN5x6 packages.

8. A three-phase input high power water-cooled power supply as claimed in claim 1, characterized in that: The power supply includes a chassis, a motherboard is provided on the chassis base plate, the power semiconductor devices of the PFC circuit are mounted on an aluminum substrate one, the power semiconductor devices of the LLC circuit are mounted on an aluminum substrate two, and the aluminum substrate one and the aluminum substrate two are mounted on the motherboard.

9. A three-phase input high power water-cooled power supply as claimed in claim 8, characterized in that: The chassis base plate has a metal cavity with a top opening. The inductors and transformers of the PFC circuit and the LLC circuit are mounted on PCB board one. PCB board one is upside down on the top of the metal cavity. The inductors and transformers are located inside the metal cavity. Thermally conductive adhesive is poured into the metal cavity. PCB board one and the motherboard are electrically connected by leads.

10. A three-phase input high-power water-cooled power supply according to claim 9, characterized in that: The PCB board and the metal cavity are fixed together by screws.

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