Piezoelectric motor, camera module and electronic device

Abstract

This application provides a piezoelectric motor, a camera module, and an electronic device, relating to the field of terminal technology. The piezoelectric motor includes a base, a driven member, a piezoelectric resonator, and a friction plate. The driven member is movably disposed on the base, and the piezoelectric resonator is disposed on the base, including a driving portion protruding towards the driven member. The friction plate is fixedly connected to the side of the driven member near the piezoelectric resonator, and is located between the driving portion and the driven member. The friction plate has a first contact surface located on the side of the friction plate near the piezoelectric resonator, and the driving portion is used to contact the first contact surface. When the piezoelectric resonator is energized, the piezoelectric resonator drives the driven member to move relative to the base through the frictional force between the driving portion and the first contact surface. The surface roughness of the first contact surface is greater than 0.05 μm and less than 0.1 μm. This prevents the piezoelectric motor from generating debris during operation.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a piezoelectric motor, a camera module, and an electronic device. Background Technology

[0002] As a driving component, piezoelectric motors have advantages such as being less prone to magnetic interference and are widely used in electronic devices such as mobile phones and tablets.

[0003] In related technologies, a piezoelectric motor includes a driven member and a piezoelectric resonator, the piezoelectric resonator including a driving part. When the piezoelectric resonator is energized, the piezoelectric resonator drives the driven member to move through the frictional force between the driving part and the surface of the driven member, thereby driving the driven component connected to the driven member to move, so as to realize the driving of the driven component by the piezoelectric motor.

[0004] However, in related technologies, piezoelectric motors are prone to generating debris during operation, and this debris can affect the performance of electronic devices. Utility Model Content

[0005] This application provides a piezoelectric motor, a camera module, and an electronic device that makes it less likely for the piezoelectric motor to generate debris during operation.

[0006] A first aspect of this application provides a piezoelectric motor, which includes a base, a driven member, a piezoelectric resonator, and a friction plate. The driven member is movably disposed on the base, and the piezoelectric resonator is disposed on the base, including a driving portion protruding towards the driven member. The friction plate is fixedly connected to the side of the driven member near the piezoelectric resonator, and is located between the driving portion and the driven member. The friction plate has a first contact surface located on the side of the friction plate near the piezoelectric resonator, and the driving portion is used to contact the first contact surface. When the piezoelectric resonator is energized, the piezoelectric resonator drives the driven member to move relative to the base through the frictional force between the driving portion and the first contact surface. The surface roughness of the first contact surface is greater than 0.05 μm and less than 0.1 μm.

[0007] The piezoelectric motor provided in this application embodiment drives the driven component by providing a friction plate, independent of and fixedly connected to the driven component, between the driven component and the driving unit. The friction between the surface of the friction plate and the driving unit drives the driven component to move. The friction plate is an independent component, and its structure is relatively simple, resulting in fewer restrictions on its molding process and facilitating control of its surface roughness. The surface roughness of the first contact surface of the friction plate, which contacts the driving unit, is greater than 0.05 μm and less than 0.1 μm. This ensures that the friction between the first contact surface and the driving unit generates sufficient friction to drive the driven component while minimizing surface roughness. This reduces the likelihood of debris generation during friction between the driving unit and the first contact surface, thus minimizing the impact of debris on the performance of the electronic device caused by the piezoelectric motor's operation.

[0008] In one possible implementation, the flatness of the first contact surface is less than 0.01 mm.

[0009] In this way, the first contact surface is relatively flat, and the contact area when the first contact surface rubs against the driving part is large. This results in lower contact stress on the first contact surface when it rubs against the driving part, thus making it less likely for the friction plate to generate debris due to friction between the first contact surface and the driving part. In addition, the large contact area when the first contact surface rubs against the driving part is conducive to generating greater frictional force between the first contact surface and the driving part, which in turn facilitates the movement of the driven member by driving the friction plate through the friction between the driving part and the first contact surface.

[0010] In one possible implementation, the hardness of the first contact surface is greater than 1000 HV.

[0011] In this way, the first contact surface has greater hardness and better wear resistance, and the friction plate is less likely to produce debris due to friction on the first contact surface.

[0012] In one possible implementation, the friction pad includes a substrate layer and a hardened layer, with the hardened layer located on the side of the substrate layer closest to the piezoelectric resonator, and a first contact surface situated on the surface of the hardened layer. The hardness of the hardened layer is greater than that of the substrate layer.

[0013] In this way, the hardness of the first contact surface can be increased by forming a hardened layer with higher hardness on a substrate layer with lower hardness, making the first contact surface less prone to generating debris due to friction. At this point, there is a wider variety of materials that can be selected for the friction pad.

[0014] In one possible implementation, the hardened layer is made of nitrides, and the nitrogen content of the hardened layer is higher than that of the base layer.

[0015] In this way, the nitride has a high hardness. By increasing the nitrogen content of the hardened layer where the first contact surface is located, the hardness of the hardened layer where the first contact surface is located can be increased, making it less prone to chipping due to friction. The hardened layer can be formed through a surface nitriding process, making it easier to form a hardened layer with high hardness on the substrate layer.

[0016] In one possible implementation, the hardening layer is made of carbides, and the carbon content of the hardening layer is higher than that of the base layer.

[0017] In this way, the carbides have high hardness. By increasing the carbon content of the hardened layer where the first contact surface is located, the hardness of the hardened layer where the first contact surface is located can be increased, making it less likely for the first contact surface to generate debris due to friction. The hardened layer can be formed through a surface carburizing process, making it easier to form a hardened layer with high hardness on the substrate layer.

[0018] In one possible implementation, the thickness of the hardened layer is greater than or equal to 5 μm.

[0019] In this way, the hardened layer is thicker and has higher strength, making it less prone to damage.

[0020] In one possible implementation, the friction pad includes a ceramic layer, with the first contact surface located on the surface of the ceramic layer.

[0021] In this way, the ceramic layer has a high hardness, which makes it easier to form a first contact surface with a high hardness, so that the first contact surface is not prone to generating debris due to friction.

[0022] In one possible implementation, the drive unit has a second contact surface located on the side of the drive unit closer to the first contact surface, and the drive unit is used to contact the first contact surface through the second contact surface. When the piezoelectric resonator is energized, the piezoelectric resonator is used to drive the driven member to move relative to the base through the frictional force between the second contact surface and the first contact surface. The second contact surface is a plane with a flatness of less than 0.01 mm.

[0023] In this way, compared to designs where the end of the driving part near the driven member is an arc surface or a pointed tip, the contact area between the driving part and the friction plate is larger, resulting in lower contact stress on the driving part during friction. This makes it less likely for the driving part to generate debris due to friction between the driving part and the friction plate. Furthermore, the larger contact area facilitates the generation of greater frictional force between the driving part and the friction plate, which in turn facilitates driving the friction plate to move the driven member.

[0024] In one possible implementation, the surface roughness of the second contact surface is greater than 0.05 μm and less than 0.1 μm.

[0025] In this way, while ensuring that the frictional force that drives the driven component to move can be generated between the first contact surface and the second contact surface, the surface roughness of the second contact surface is small, so that it is not easy to generate debris when the driving part rubs against the first contact surface, and the debris generated by the piezoelectric motor is not likely to affect the performance of the electronic device.

[0026] In one possible implementation, the hardness of the second contact surface is greater than 1000 HV.

[0027] In this way, the second contact surface has greater hardness and better wear resistance, and the drive part is less likely to generate debris due to friction of the second contact surface.

[0028] In one possible implementation, the side of the follower near the piezoelectric resonator includes a first region and a second region, with a friction plate disposed in the first region and a dust-collecting adhesive disposed in the second region.

[0029] In this way, the dust-catching adhesive can use its own adhesion to capture debris generated between the driven component and the piezoelectric resonator, making it less likely that debris will fall off and affect the performance of the electronic equipment. In addition, the dust-catching adhesive and the friction plate are respectively located in different areas on the side of the driven component closest to the piezoelectric resonator, making it less likely that the dust-catching adhesive and the friction plate will interfere with each other.

[0030] In one possible implementation, the dust-collecting adhesive surrounds the friction plate.

[0031] In this way, the dust-catching adhesive can capture the debris generated between the friction plate and the piezoelectric resonator around the friction plate, and the effect of capturing the debris generated between the friction plate and the piezoelectric resonator is good, and the debris generated between the friction plate and the piezoelectric resonator is not easy to fall off.

[0032] A second aspect of this application provides a camera module that includes the piezoelectric motor described in any of the above embodiments.

[0033] A third aspect of this application provides an electronic device, the camera module of which includes a piezoelectric motor as described in any of the above embodiments. Attached Figure Description

[0034] Figure 1 An exploded view of an electronic device provided in an embodiment of this application;

[0035] Figure 2 A cross-sectional schematic diagram of a camera module provided in an embodiment of this application;

[0036] Figure 3 A schematic diagram of another camera module provided in an embodiment of this application;

[0037] Figure 4A schematic diagram of a piezoelectric motor provided in an embodiment of this application;

[0038] Figure 5 for Figure 4 An exploded diagram of a piezoelectric motor provided in the image;

[0039] Figure 6 A schematic diagram of a follower provided in an embodiment of this application;

[0040] Figure 7 A schematic diagram of a base provided for an embodiment of this application;

[0041] Figure 8 A schematic diagram of a pre-compression component provided in an embodiment of this application;

[0042] Figure 9 A schematic diagram of a piezoelectric resonator provided in an embodiment of this application;

[0043] Figure 10 A schematic diagram of the driven component of a piezoelectric motor provided in an embodiment of this application;

[0044] Figure 11 A cross-sectional schematic diagram of a friction pad provided in an embodiment of this application;

[0045] Figure 12 A cross-sectional view of a friction pad provided in an embodiment of this application;

[0046] Figure 13 An elemental content curve of a friction plate provided in an embodiment of this application;

[0047] Figure 14 A cross-sectional schematic diagram of another friction pad provided in an embodiment of this application;

[0048] Figure 15 A schematic diagram of the driven component of another piezoelectric motor provided in an embodiment of this application;

[0049] Figure 16 A schematic diagram from one perspective of a driving unit provided in an embodiment of this application;

[0050] Figure 17 for Figure 16 A schematic diagram of the drive unit from another perspective provided in the diagram.

[0051] Explanation of reference numerals in the attached figures:

[0052] 10. Housing; 11. Mid-frame; 12. Back cover; 20. Display screen; 30. Camera module; 31. Motor system; 31a. Focusing motor; 31b. Optical image stabilization motor; 32. Lens; 33. Image sensor; 34. Module circuit board; 35. Optical path conversion component; 40. Mainboard; 50. Battery; 60. Vibration motor;

[0053] 100. Base; 110. Pressure column;

[0054] 200. Driven component; 210. Driven main body; 211. First sub-part; 212. Second sub-part; 213. Third sub-part; 220. Sliding shaft structure; 230. Magnetic component;

[0055] 300, piezoelectric resonator; 310, driving unit; 311, second contact surface; 320, piezoelectric assembly; 321, elastomer; 322, piezoelectric component;

[0056] 400, Friction pad; 410, First contact surface; 420, Substrate layer; 430, Hardened layer; 440, Ceramic layer;

[0057] 500, Pre-compression assembly; 510, Bracket; 511, First connecting end; 512, Second connecting end; 513, Pre-compression part; 520, Spring;

[0058] 600. Power-on components;

[0059] 700, carrier;

[0060] 800, outer casing;

[0061] 900. Dust-collecting adhesive;

[0062] G1, groove; G2, slide structure; G3, slot. Detailed Implementation

[0063] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0064] This application provides an electronic device, which may include, but is not limited to, mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, point-of-sale (POS) machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, etc. The electronic device may be a foldable device, for example, a foldable mobile phone. The electronic device may also be a non-foldable device, for example, a candybar mobile phone. This application uses a candybar mobile phone as an example for illustration.

[0065] Figure 1 This is an exploded view of an electronic device provided in an embodiment of this application.

[0066] like Figure 1 As shown in the embodiment of this application, the electronic device includes a housing 10, a motherboard 40, and a battery 50. The housing 10 is used to form a device mounting cavity. The motherboard 40 and the battery 50 are disposed in the device mounting cavity. The battery 50 is electrically connected to the motherboard 40. The battery 50 can be used to supply power to the motherboard 40. The housing 10 can serve to support and protect the battery 50, motherboard 40, and other devices disposed in the device mounting cavity.

[0067] In some examples, the electronic device may also include a display screen 20 disposed on a housing 10, the display screen 20 and the housing 10 forming a device mounting cavity, and the battery 50 and the motherboard 40 disposed within the device mounting cavity formed by the display screen 20 and the housing 10.

[0068] In other examples, the electronic device may include a housing 10 but not a display screen 20. The housing 10 may form a device mounting cavity within itself, and the battery 50 and the motherboard 40 are disposed within the device mounting cavity formed by the housing 10 itself.

[0069] The following description uses an electronic device, including a display screen 20 and a housing 10, as an example.

[0070] like Figure 1 As shown, in some examples, the electronic device may also include a camera module 30, which is disposed in the housing 10, at least a portion of which is located within the device mounting cavity. The camera module 30 is electrically connected to the motherboard 40 and is used to capture images.

[0071] In some examples, the electronic device may also include a vibration motor 60, which is disposed in the housing 10 and may be located within the device mounting cavity. The vibration motor 60 is electrically connected to the motherboard 40 and can be used to cause the electronic device to vibrate. The vibration generated by the vibration motor 60 can realize functions such as information reminders.

[0072] In some examples, the electronic device includes a camera module 30 and a vibration motor 60.

[0073] In other examples, the electronic device includes a camera module 30 but does not include a vibration motor 60.

[0074] In some other examples, the electronic device includes a vibration motor 60 but does not include a camera module 30.

[0075] like Figure 1 As shown, for example, the housing 10 may include a middle frame 11 and a rear cover 12. The rear cover 12 and the display screen 20 are respectively covered on both sides of the middle frame 11. The rear cover 12, the middle frame 11 and the display screen 20 surround to form a device mounting cavity. The motherboard 40 and the battery 50 can be fixed to the middle frame 11. The middle frame 11 can serve to support the motherboard 40 and the battery 50.

[0076] In some examples, the middle frame 11 and the back cover 12 can be separate structures, and the middle frame 11 and the back cover 12 can be fixedly connected by means of adhesive, snap-fit, fastener connection, etc.

[0077] In other examples, the middle frame 11 and the back cover 12 can also be a single structure, that is, the middle frame 11 and the back cover 12 can be integrated into a single structural component.

[0078] In some examples of electronic devices including a vibration motor 60, the vibration motor 60 may be fixed to a mid-frame 11, and the vibration motor 60 may be carried by the mid-frame 11.

[0079] In some examples of electronic devices including camera module 30, camera module 30 may be fixed to motherboard 40 or mid-frame 11, and camera module 30 may be carried by motherboard 40 or mid-frame 11.

[0080] The following explanation uses an electronic device, including a camera module 30, as an example.

[0081] Figure 2 This is a cross-sectional schematic diagram of a camera module provided in an embodiment of this application.

[0082] like Figure 2As shown, the camera module 30 may include a lens 32, a module circuit board 34, and a photosensitive element 33. The module circuit board 34 is electrically connected to the main board 40 and may be fixed to the main board 40 or the mid-frame 11. The photosensitive element 33 is disposed on the module circuit board 34 and electrically connected to the module circuit board 34. The photosensitive element 33 is located on the image side of the lens 32. Light from the object side of the lens 32 passes through the lens 32 and is incident on the photosensitive element 33, so that the photosensitive element 33 can collect the light from the object side of the lens 32 to achieve the shooting function.

[0083] The image side of lens 32 refers to the side where the image of the subject is located, with lens 32 as the boundary.

[0084] The object side of lens 32 refers to the side where the subject is located, with lens 32 as the boundary.

[0085] The photosensitive element 33 can also be called an image sensor. The photosensitive element 33 can be a charge-coupled device (CCD), a complementary metal-oxide semiconductor device (CMOS), or other devices that can realize photoelectric conversion function.

[0086] For example, the camera module 30 also includes a motor system 31, which is connected to the module circuit board 34. The lens 32 is disposed on the motor system 31. The camera module 30 is used to realize functions such as auto focus (AF), zoom, and optical image stabilization (OIS) through the motor system 31.

[0087] In some examples, the motor system 31 may include a focusing motor 31a and an optical image stabilization motor 31b. The camera module 30 is used to achieve functions such as autofocus and zoom through the focusing motor 31a, and the camera module 30 is used to achieve optical image stabilization through the optical image stabilization motor 31b.

[0088] like Figure 2 As shown, in some examples, the lens 32 can be mounted on the focusing motor 31a, which is mounted on the module circuit board 34 via the optical image stabilization motor 31b. The focusing motor 31a drives the lens 32 to move relative to the optical image stabilization motor 31b to achieve functions such as autofocus and zoom. The optical image stabilization motor 31b drives the focusing motor 31a to move relative to the module circuit board 34 to achieve optical image stabilization.

[0089] Figure 3 This is a schematic diagram of another camera module provided in an embodiment of this application.

[0090] like Figure 3 As shown, the camera module 30 may also include a light path conversion component 35, which is located in the motor system 31 and can be located on the object side of the lens 32. The light path conversion component 35 can be used to fold and turn the light path. In this way, while the overall light path of the camera module 30 is longer, the size of the camera module 30 in the light incident direction is smaller.

[0091] For example, the optical path conversion component 35 may include, but is not limited to, a prism, a plane mirror, etc.

[0092] like Figure 3 As shown, in some examples, the focusing motor 31a is fixedly mounted on the module circuit board 34, the lens 32 is mounted on the focusing motor 31a, the optical image stabilization motor 31b is fixedly mounted on the focusing motor 31a and mounted on the module circuit board 34 via the focusing motor 31a, and the optical path conversion component 35 is mounted on the optical image stabilization motor 31b. The focusing motor 31a is used to drive the lens 32 to move relative to the module circuit board 34 to achieve functions such as autofocus and zoom. The optical image stabilization motor 31b is used to drive the optical path conversion component 35 to move relative to the focusing motor 31a to achieve optical image stabilization.

[0093] This application provides a piezoelectric motor, which may include, but is not limited to, a focusing motor 31a, an optical image stabilization motor 31b, and a vibration motor 60. That is, at least one of the aforementioned focusing motor 31a, optical image stabilization motor 31b, and vibration motor 60 can be a piezoelectric motor. This application uses a focusing motor 31a as an example for illustration.

[0094] Figure 4 This is a schematic diagram of a piezoelectric motor provided in an embodiment of this application. Figure 5 for Figure 4 The diagram provided shows an exploded image of a piezoelectric motor.

[0095] like Figure 4 , Figure 5As shown, the piezoelectric motor includes a base 100, a follower 200, a piezoelectric resonator 300, a carrier 700, and an energizing assembly 600. The base 100 is disposed on and electrically connected to the module circuit board 34. The carrier 700 is movably disposed within the base 100, and a lens 32 is fixedly connected to the carrier 700, which carries the lens 32. The follower 200 is movably disposed on the base 100 and connected to the carrier 700, and is used to move the carrier 700. The piezoelectric resonator 300 is disposed on the base 100 and includes a driving portion 310 protruding towards the follower 200. When the piezoelectric resonator 300 is energized, it drives the driven member 200 to move relative to the base 100 via the driving unit 310. The driven member 200 then drives the carrier 700 and lens 32 to move relative to the base 100, thereby achieving piezoelectric motor driving the lens 32. One end of the energizing component 600 is electrically connected to the base 100, and the other end is electrically connected to the piezoelectric resonator 300. The energizing component 600 supplies power to the piezoelectric resonator 300.

[0096] For example, the energizing component 600 is a flexible conductive element, such as a flexible circuit board. One end of the energizing component 600 is fixed to and electrically connected to the base 100, and the other end of the energizing component 600 is fixed to and electrically connected to the piezoelectric resonator 300.

[0097] For example, the follower 200 is fixedly connected to the carrier 700.

[0098] In some examples, the base 100 has a guide structure, through which the carrier 700 is slidably connected to the base 100. The guide structure is used to guide the carrier 700 to slide along the length direction of the base 100. The piezoelectric resonator 300 is used to drive the carrier 700 and the lens 32 to move along the length direction of the base 100 via the follower 200.

[0099] For example, the carrier 700 can magnetically engage with the base 100. For instance, the carrier 700 can magnetically engage with a guide structure.

[0100] For example, the piezoelectric motor also includes a preload assembly 500, to which the piezoelectric resonator 300 is fixedly connected. The preload assembly 500 is connected to the base 100. The piezoelectric resonator 300 is disposed on the base 100 through the preload assembly 500. The preload assembly 500 is used to press the driving part 310 of the piezoelectric resonator 300 toward the driven member 200.

[0101] For example, the piezoelectric motor also includes a housing 800, which is disposed outside the base 100 and fixedly connected to the base 100. The follower 200, the piezoelectric resonator 300, the energizing component 600 and the preload component 500 are all located inside the housing 800.

[0102] For example, the piezoelectric resonator 300, the energizing component 600 and the preload component 500 are located between the housing 800 and the base 100, and at least a portion of the follower 200 is located between the housing 800 and the base 100.

[0103] Figure 6 This is a schematic diagram of a follower provided in an embodiment of this application. Figure 7 This is a schematic diagram of a base provided in an embodiment of this application.

[0104] like Figure 6 As shown, the driven member 200 includes a driven main body 210, which includes a first sub-part 211, a second sub-part 212, and a third sub-part 213. The first sub-part 211 is located between the housing 800 and the base 100. Specifically, the first sub-part 211 is located between the base 100 and the piezoelectric resonator 300. The second sub-part 212 is located inside the base 100 and is fixedly connected to the carrier 700. The first sub-part 211 and the second sub-part 212 are connected through the third sub-part 213. When the piezoelectric resonator 300 is energized, the piezoelectric resonator 300 drives the first sub-part 211 to move relative to the base 100 via the driving part 310.

[0105] For example, the preload assembly 500 is used to press the drive portion 310 of the piezoelectric resonator 300 against the first sub-portion 211.

[0106] For example, the driven body 210 can be made of metal, such as stainless steel. That is, the first sub-part 211, the second sub-part 212, and the third sub-part 213 can all be made of metal.

[0107] For example, the first sub-part 211, the second sub-part 212, and the third sub-part 213 are made of the same material, and the first sub-part 211, the second sub-part 212, and the third sub-part 213 are an integral structure. For example, the driven main body 210 can be formed by a stamping process.

[0108] like Figure 6 As shown, in some examples, the follower 200 also includes a magnetic element 230, which is fixedly connected to the second sub-part 212, and the second sub-part 212 is magnetically connected to the carrier 700 through the magnetic element 230.

[0109] Of course, in other examples, the second sub-part 212 can also be connected to the carrier 700 by other means such as bonding or welding.

[0110] like Figure 6As shown, the driven member 200 also includes a sliding shaft structure 220, which protrudes from the driven main body 210 on the side away from the piezoelectric resonator 300. Specifically, the sliding shaft structure 220 protrudes from the first sub-part 211 on the side away from the piezoelectric resonator 300. Figure 7 As shown, the base 100 has a sliding groove structure G2. Both the sliding groove structure G2 and the sliding shaft structure 220 extend along the length direction of the base 100. The driven main body 210 slides with the base 100 through the sliding shaft structure 220 and the sliding groove structure G2. The sliding groove structure G2 is used to guide the sliding shaft structure 220 to slide along the length direction of the base 100.

[0111] In some examples, the sliding shaft structure 220 and the driven body portion 210 can be an integral structure. For example, the sliding shaft structure 220 and the driven body portion 210 can be formed into an integral structure by an insert molding process.

[0112] For example, the sliding shaft structure 220 can be made of plastic so that the sliding shaft structure 220 can be formed on the driven body 210 made of a strong metal.

[0113] For example, the sliding shaft structure 220 may include a first sliding shaft and a second sliding shaft arranged side by side. The sliding groove structure G2 may include a first sliding groove and a second sliding groove arranged side by side, with the first sliding shaft slidably disposed in the first sliding groove and the second sliding shaft slidably disposed in the second sliding groove.

[0114] Figure 8 This is a schematic diagram of a pre-compression component provided in an embodiment of this application.

[0115] like Figure 8 As shown, for example, the pre-compression assembly 500 includes a bracket 510, which includes a first connecting end 511, a second connecting end 512, and a pre-compression part 513. The first connecting end 511 and the second connecting end 512 are respectively fixedly connected to opposite ends of the pre-compression part 513. The first connecting end 511 and the second connecting end 512 are connected to the base 100, and the piezoelectric resonator 300 is fixedly connected to the pre-compression part 513.

[0116] In some examples, the preload assembly 500 also includes a reed 520. For example... Figure 7 As shown, the base 100 is provided with a pressure post 110, and there is an insertion gap between the pressure post 110 and the base 100. The base 100 has a slot G3, a first connecting end 511 is inserted into the slot G3, and a second connecting section is inserted into the insertion gap and abuts against the pressure post 110. The two ends of the spring 520 are fixedly connected to the base 100, and the spring 520 is used to press the first connecting end 511 against the base 100.

[0117] For example, the reed 520 is located on the side of the first connecting end 511 away from the base 100.

[0118] For example, the reed 520 is fixedly connected to the first connecting end 511.

[0119] Figure 9 This is a schematic diagram of a piezoelectric resonator provided in an embodiment of this application.

[0120] like Figure 9 As shown, the piezoelectric resonator 300 also includes a piezoelectric assembly 320. A driving part 310 is fixedly connected to the piezoelectric assembly 320 near the driven member 200, and the driving part 310 protrudes from the piezoelectric assembly 320 near the driven member 200. The piezoelectric assembly 320 is fixedly connected to the preload assembly 500; specifically, the piezoelectric assembly 320 is fixedly connected to the preload part 513 of the support 510. The energizing assembly 600 is electrically connected to the piezoelectric assembly 320. When energized, the piezoelectric assembly 320 deforms, thereby driving the driving part 310 to move.

[0121] For example, the piezoelectric assembly 320 includes a piezoelectric component 322 and an elastomer 321. A drive unit 310 is fixedly connected to the side of the elastomer 321 near the driven member 200, and the drive unit 310 protrudes from the side of the elastomer 321 near the driven member 200. The piezoelectric component 322 is fixedly connected to the side of the elastomer 321 away from the driven member 200. The elastomer 321 is fixedly connected to the preload assembly 500, specifically, the elastomer 321 is fixedly connected to the preload portion 513 of the bracket 510. The energizing assembly 600 is electrically connected to the piezoelectric component 322. When energized, the piezoelectric component 322 deforms, and the elastomer 321 amplifies the deformation of the piezoelectric component 322. The piezoelectric component 322 drives the drive unit 310 to move via the elastomer 321.

[0122] For example, piezoelectric component 322 may include one or more piezoelectric units.

[0123] For example, the piezoelectric unit can be a piezoelectric ceramic.

[0124] In related technologies, the driving unit is used to contact the side of the driven member closest to the piezoelectric resonator. When the piezoelectric resonator is energized, it drives the driven member to move through the friction between the driving unit and the surface of the driven member. In other words, when the piezoelectric motor is working, it relies on the friction between the driving unit and the surface of the driven member to drive the component being driven. However, due to the relatively complex structure of the driven member, its molding process is subject to significant limitations. Limited by the molding process, the surface roughness of the driven member near the piezoelectric resonator is often relatively high. This high surface roughness makes it easy to generate debris during friction between the driving unit and the driven member. When this debris falls onto the piezoelectric motor or other components located at the piezoelectric motor, it can easily affect the performance of the piezoelectric motor or other components located at the piezoelectric motor. For example, debris falling onto the piezoelectric motor can affect the smooth sliding between piezoelectric motor components. Debris falling onto the lens can affect the imaging effect of the camera module.

[0125] Figure 10 This is a schematic diagram of the driven component of a piezoelectric motor provided in an embodiment of this application.

[0126] like Figure 10 As shown, based on this, in this embodiment of the application, the piezoelectric motor further includes a friction plate 400, which is fixedly connected to the side of the driven member 200 near the piezoelectric resonator 300. The friction plate 400 is located between the driving part 310 and the driven member 200. The friction plate 400 has a first contact surface 410, which is located on the side of the friction plate 400 near the piezoelectric resonator 300. The driving part 310 is used to contact the first contact surface 410. When the piezoelectric resonator 300 is energized, the piezoelectric resonator 300 is used to drive the driven member 200 to move relative to the base 100 through the frictional force between the driving part 310 and the first contact surface 410. The surface roughness of the first contact surface 410 is greater than 0.05 μm and less than 0.1 μm.

[0127] Thus, by providing a friction plate 400, independent of and fixedly connected to the driven member 200, between the driven member 200 and the driving unit 310, the driven member 200 is driven to move by the frictional force between the surface of the friction plate 400 and the driving unit 310, thereby achieving the driving of the component to be driven. The friction plate 400 is a component independent of the driven member 200, and its structure is relatively simple, resulting in fewer restrictions on its molding process and facilitating the control of its surface roughness. The friction plate 400 has a surface roughness of the first contact surface 410 that contacts the drive unit 310 that is greater than 0.05 μm and less than 0.1 μm. This allows for the generation of frictional force between the first contact surface 410 and the drive unit 310 to drive the driven member 200 to move, while also minimizing the surface roughness of the first contact surface 410. This prevents the generation of debris during friction between the drive unit 310 and the first contact surface 410, thus minimizing the impact on the performance of electronic equipment caused by debris generated during the operation of the piezoelectric motor.

[0128] For example, the friction plate 400 is fixedly connected to the side of the first sub-part 211 near the piezoelectric resonator 300, and the friction plate 400 is located between the drive part 310 and the first sub-part 211.

[0129] For example, the pre-pressing component 500 is used to press the driving part 310 of the piezoelectric resonator 300 against the first contact surface 410 so that the driving part 310 contacts the first contact surface 410.

[0130] In some examples, the follower 200 has a groove G1 on the side near the piezoelectric resonator 300. Specifically, the first sub-part 211 has a groove G1 on the side near the piezoelectric resonator 300, and the friction plate 400 is fixedly connected to the bottom of the groove G1 to provide space utilization for the piezoelectric motor.

[0131] For example, the groove G1 can be formed by bending the first sub-part 211. Alternatively, the groove G1 can be formed by stamping the first sub-part 211.

[0132] For example, the first contact surface 410 is a plane.

[0133] In some possible implementations, the flatness of the first contact surface 410 is less than 0.01 mm.

[0134] In this way, the first contact surface 410 is relatively flat, and the contact area when the first contact surface 410 rubs against the driving part 310 is large. This results in lower contact stress on the first contact surface 410 when it rubs against the driving part 310, thus making it less likely for the friction plate 400 to generate debris due to friction between the first contact surface 410 and the driving part 310. In addition, the large contact area when the first contact surface 410 rubs against the driving part 310 facilitates the generation of greater frictional force between the first contact surface 410 and the driving part 310, which in turn facilitates the driving of the friction plate 400 to move the driven member 200 through the friction between the driving part 310 and the first contact surface 410.

[0135] In some possible implementations, the hardness of the first contact surface 410 is greater than 1000 HV.

[0136] In this way, the first contact surface 410 has a higher hardness and better wear resistance, and the friction plate 400 is less likely to generate debris due to friction of the first contact surface 410.

[0137] Figure 11 This is a cross-sectional schematic diagram of a friction pad provided in an embodiment of this application.

[0138] like Figure 11 As shown, in some possible embodiments, the friction pad 400 includes a substrate layer 420 and a hardened layer 430. The substrate layer 420 has the hardened layer 430 on the side near the piezoelectric resonator 300, and a first contact surface 410 is located on the surface of the hardened layer 430. That is, at least a portion of the surface of the hardened layer 430 forms the first contact surface 410, and the surface layer of the friction pad 400 near the piezoelectric resonator 300 is the hardened layer 430. The hardness of the hardened layer 430 is greater than the hardness of the substrate layer 420.

[0139] In this way, the hardness of the first contact surface 410 can be increased by forming a hardened layer 430 with higher hardness on the substrate layer 420 with lower hardness, making the first contact surface 410 less prone to generating debris due to friction. At this time, the materials selected for the friction plate 400 are more diverse.

[0140] In some possible implementations, the thickness of the hardened layer 430 is greater than or equal to 5 μm.

[0141] In this way, the hardened layer 430 is thicker and has higher strength, making it less prone to damage.

[0142] For example, the substrate layer 420 can be made of metal, such as stainless steel.

[0143] In some possible implementations, the hardened layer 430 is made of nitride, and the nitrogen content of the hardened layer 430 is higher than that of the substrate layer 420. Here, nitrogen content refers to the content of nitrogen element.

[0144] In this way, the nitride has a high hardness. By increasing the nitrogen content of the hardened layer 430 where the first contact surface 410 is located, the hardness of the hardened layer 430 where the first contact surface 410 is located can be increased, making the first contact surface 410 less prone to generating debris due to friction. The hardened layer 430 can be formed by a surface nitriding process, making it easier to form a hardened layer 430 with high hardness on the substrate layer 420.

[0145] The base layer 420 and the hardened layer 430 can be formed by nitriding the surface of the metal blank. At this time, the hardness of the first contact surface 410 can be several times that of the base layer 420.

[0146] Figure 12 This is a cross-sectional view of a friction pad provided in an embodiment of this application. Figure 13 An elemental content curve of a friction plate provided in an embodiment of this application. Figure 12 and Figure 13 The friction plate 400 in the text is formed by nitriding the surface of a stainless steel blank.

[0147] exist Figure 13 In the graph, the vertical axis represents the electron count of the corresponding element received by the detector per second; a higher value indicates a higher abundance of the element. The origin of the horizontal axis is... Figure 12 Point P0 is located at the first contact surface 410, and the horizontal axis represents the distance along the contact surface. Figure 12 The distance from the white straight line (which is the thickness direction of the friction plate 400) to point P0 is shown in the graph. A higher value indicates a greater distance from point P0 (i.e., a greater distance from the first contact surface 410). L1 represents the chromium (Cr) content curve, L2 the iron (Fe) content curve, L3 the nitrogen (N) content curve, and L4 the carbon (C) content curve. (The last sentence appears to be incomplete and possibly refers to a different graph.) Figure 13 As shown, the nitrogen content of the friction plate 400 within 25 μm of point P0 is significantly higher than the nitrogen content of the friction plate 400 outside 25 μm of point P0. In other words, the hardness of the part of the friction plate 400 within 25 μm of the distance from the first contact surface 410 is greater than the hardness of the part of the friction plate 400 outside 25 μm of the distance from the first contact surface 410. A hardened layer 430 with a high nitrogen content is formed inward from the first contact surface 410 with a thickness of 25 μm.

[0148] In some possible implementations, the hardened layer 430 is made of carbides, and the carbon content of the hardened layer 430 is higher than that of the substrate layer 420. Here, carbon content refers to the amount of carbon element.

[0149] In this way, the carbide has a high hardness. By increasing the carbon content of the hardened layer 430 where the first contact surface 410 is located, the hardness of the hardened layer 430 where the first contact surface 410 is located can be increased, making the first contact surface 410 less prone to generating debris due to friction. The hardened layer 430 can be formed by a surface carburizing process, making it easier to form a hardened layer 430 with high hardness on the substrate layer 420.

[0150] The base layer 420 and the hardened layer 430 can be formed by surface carburizing of the metal blank. At this time, the hardness of the first contact surface 410 can be several times that of the base layer 420.

[0151] Figure 14 This is a cross-sectional schematic diagram of another friction pad provided in an embodiment of this application.

[0152] like Figure 14 As shown, in some possible embodiments, the friction pad 400 includes a ceramic layer 440, with a first contact surface 410 located on the surface of the ceramic layer 440.

[0153] In this way, the ceramic layer 440 has a high hardness, which makes it easier to form a first contact surface 410 with a high hardness, so that the first contact surface 410 is not easy to generate debris due to friction.

[0154] For example, the ceramic layer 440 may be made of zirconium oxide or aluminum oxide.

[0155] In some examples where the friction plate 400 includes a ceramic layer 440, the friction plate 400 may also include other structural layers located on the side of the ceramic layer 440 away from the piezoelectric resonator 300.

[0156] In some other examples where the friction plate 400 includes a ceramic layer 440, the friction plate 400 may be a ceramic plate, that is, the friction plate 400 may not include any other structural layers besides the ceramic layer 440.

[0157] Figure 15 This is a schematic diagram of the driven component of another piezoelectric motor provided in an embodiment of this application.

[0158] like Figure 15 As shown, in some possible embodiments, the side of the follower 200 near the piezoelectric resonator 300 includes a first region and a second region, a friction plate 400 is disposed in the first region, and a dust-collecting adhesive 900 is disposed in the second region.

[0159] In this way, the dust-catching adhesive 900 can use its own adhesion to capture debris generated between the driven member 200 and the piezoelectric resonator 300, making it less likely that the performance of the electronic equipment will be affected by debris falling randomly. In addition, the dust-catching adhesive 900 and the friction plate 400 are respectively provided in different areas on the side of the driven member 200 near the piezoelectric resonator 300, so that the dust-catching adhesive 900 and the friction plate 400 do not easily interfere with each other.

[0160] In some possible implementations, the dust-catching adhesive 900 surrounds the friction pad 400 around its perimeter.

[0161] In this way, the dust-catching adhesive 900 can capture the debris generated between the friction plate 400 and the piezoelectric resonator 300 around the friction plate 400. The effect of capturing the debris generated between the friction plate 400 and the piezoelectric resonator 300 is good, and the debris generated between the friction plate 400 and the piezoelectric resonator 300 is not easy to fall off.

[0162] For example, the second region surrounds the first region.

[0163] Figure 16 This is a schematic diagram from one perspective of a driving unit provided in an embodiment of this application. Figure 17 for Figure 16 A schematic diagram of the drive unit from another perspective provided in the diagram.

[0164] like Figure 16 , Figure 17 As shown, in some possible embodiments, the drive unit 310 has a second contact surface 311, which is located on the side of the drive unit 310 closest to the first contact surface 410. The drive unit 310 is used to contact the first contact surface 410 through the second contact surface 311. When the piezoelectric resonator 300 is energized, the piezoelectric resonator 300 drives the follower 200 to move relative to the base 100 through the frictional force between the second contact surface 311 and the first contact surface 410. The second contact surface 311 is a plane with a flatness of less than 0.01 mm.

[0165] In this way, compared to designs where the end of the drive unit 310 near the driven member 200 is an arc surface or a pointed tip, the contact area between the drive unit 310 and the friction plate 400 is larger. This results in lower contact stress on the drive unit 310 during friction, making it less prone to generating debris due to friction between the drive unit 310 and the friction plate 400. Furthermore, the larger contact area facilitates the generation of greater frictional force between the friction plate 400 and the drive unit 310, thereby enabling the friction plate 400 to drive the driven member 200 to move through this frictional force.

[0166] In some possible implementations, the surface roughness of the second contact surface 311 is greater than 0.05 μm and less than 0.1 μm.

[0167] In this way, while ensuring that the frictional force that drives the driven member 200 to move can be generated between the first contact surface 410 and the second contact surface 311, the surface roughness of the second contact surface 311 is small, so that it is not easy to generate debris when the driving part 310 rubs against the first contact surface 410, and it is not easy to affect the performance of electronic equipment due to debris generated by the operation of the piezoelectric motor.

[0168] In some possible implementations, the hardness of the second contact surface 311 is greater than 1000 HV.

[0169] In this way, the second contact surface 311 has a higher hardness and better wear resistance, and the drive part 310 is less likely to generate debris due to friction of the second contact surface 311.

[0170] For example, the drive unit 310 can be made of metal, such as stainless steel.

[0171] In some possible implementations, the material of the second contact surface 311 may include nitride, and the second contact surface 311 may be hardened by a surface nitriding process so that the second contact surface 311 has high hardness.

[0172] In some possible implementations, the material of the second contact surface 311 may include carbides, and the second contact surface 311 may be hardened by a surface carburizing process to give the second contact surface 311 a high hardness.

[0173] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0174] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0175] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0176] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0177] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. A piezoelectric motor characterized by comprising: It includes a base (100), a follower (200), a piezoelectric resonator (300), and a friction plate (400); The driven member (200) is movably disposed on the base (100), the piezoelectric resonator (300) is disposed on the base (100), and the piezoelectric resonator (300) includes a driving part (310) protruding toward the driven member (200); The friction plate (400) is fixedly connected to the side of the driven member (200) near the piezoelectric resonator (300), and the friction plate (400) is located between the driving part (310) and the driven member (200); The friction plate (400) has a first contact surface (410), which is located on the side of the friction plate (400) close to the piezoelectric resonator (300), and the driving part (310) is used to contact the first contact surface (410). When the piezoelectric resonator (300) is energized, the piezoelectric resonator (300) is used to drive the follower (200) to move relative to the base (100) by the frictional force between the driving part (310) and the first contact surface (410); The surface roughness of the first contact surface (410) is greater than 0.05 μm and less than 0.1 μm.

2. The piezoelectric motor according to claim 1, wherein The flatness of the first contact surface (410) is less than 0.01 mm.

3. The piezoelectric motor according to claim 1, wherein The hardness of the first contact surface (410) is greater than 1000 HV.

4. The piezoelectric motor according to claim 1, wherein The friction pad (400) includes a base layer (420) and a hardening layer (430), wherein the base layer (420) has the hardening layer (430) on the side near the piezoelectric resonator (300), and the first contact surface (410) is located on the surface of the hardening layer (430). The hardness of the hardened layer (430) is greater than that of the base layer (420).

5. The piezoelectric motor according to claim 4, wherein The material of the hardened layer (430) includes nitrides, and the nitrogen content of the hardened layer (430) is higher than the nitrogen content of the substrate layer (420); Alternatively, the hardened layer (430) may be made of carbides and have a higher carbon content than the substrate layer (420).

6. The piezoelectric motor according to claim 4, wherein The thickness of the hardened layer (430) is greater than or equal to 5 μm.

7. The piezoelectric motor according to claim 1, wherein The friction pad (400) includes a ceramic layer (440), and the first contact surface (410) is located on the surface of the ceramic layer (440).

8. The piezoelectric motor according to any one of claims 1 to 7, characterized by The driving unit (310) has a second contact surface (311), which is located on the side of the driving unit (310) close to the first contact surface (410). The driving unit (310) is used to contact the first contact surface (410) through the second contact surface (311). When the piezoelectric resonator (300) is energized, the piezoelectric resonator (300) is used to drive the follower (200) to move relative to the base (100) by the frictional force between the second contact surface (311) and the first contact surface (410); The second contact surface (311) is a plane with a flatness of less than 0.01 mm.

9. The piezoelectric motor of claim 8, wherein The surface roughness of the second contact surface (311) is greater than 0.05 μm and less than 0.1 μm.

10. The piezoelectric motor of claim 8, wherein The hardness of the second contact surface (311) is greater than 1000 HV.

11. The piezoelectric motor according to any one of claims 1 to 7, wherein The side of the follower (200) near the piezoelectric resonator (300) includes a first region and a second region, the friction plate (400) is disposed in the first region, and the second region is provided with dust-collecting adhesive (900).

12. The piezoelectric motor of claim 11, wherein The dust-collecting adhesive (900) surrounds the friction plate (400) around its perimeter.

13. A camera module (30) characterized by: Including the piezoelectric motor as described in any one of claims 1-12.

14. An electronic device, comprising: Including the piezoelectric motor as described in any one of claims 1-12.

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