A miniature network filter

Abstract

The utility model relates to the technical field of magnet, inductor, transformer, concretely is a kind of micro network filter, including circuit board, top cover and coil assembly, the top surface of circuit board is equipped with multiple top surface weld spots, the bottom surface of circuit board is equipped with multiple bottom surface weld spots, coil assembly is electrically connected with top surface weld spot, top surface weld spot is electrically connected with bottom surface weld spot, the bottom surface of top cover is equipped with the first device slot for accommodating coil assembly top, the top surface of circuit board is equipped with the second device slot for accommodating coil assembly bottom, first device slot and second device slot are oppositely arranged, the bottom surface of top cover is also equipped with two glue containing grooves for accommodating anti-oxidant, two glue containing grooves are located first device slot both sides, the slot mouth of glue containing groove is all communicated with the slot mouth of first device slot, glue containing groove is opposite top surface weld spot, circuit board is used to close first device slot and glue containing groove.Using the scheme, a small volume, high quality micro network filter can be provided, and the production cost of product can be reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of magnets, inductors, and transformers, specifically to a miniature network filter. Background Technology

[0002] A network filter is an electronic component used for signal processing. Its main function is to filter signals by suppressing or enhancing specific frequency components. It is widely used in communications, electromagnetic compatibility design, and the Internet of Things (IoT). Its structure mainly includes a circuit board, a top cover, and an internal coil assembly. The coil assembly includes a magnetic ring and a coil wound around the magnetic ring, with the coil electrically connected to the circuit board. With the miniaturization and micro-miniaturization of electronic devices, the size of electronic components is also trending towards miniaturization.

[0003] Meanwhile, in the actual use of network filters, since the coil uses enameled wire, in order to ensure the soldering quality between the enameled wire and the circuit board, the insulation layer at the end of the enameled wire needs to be removed before soldering the end of the enameled wire to the circuit board. After soldering, the solder joint is in an exposed state. During storage and use, the solder joint of the enameled wire will oxidize, causing the network filter to malfunction and affecting product quality. Utility Model Content

[0004] The present invention aims to provide a small-sized, high-quality miniature network filter that can reduce the production cost of the product.

[0005] This utility model provides the following basic solution: A miniature network filter includes a circuit board, a top cover, and a coil assembly. The top surface of the circuit board has multiple top surface solder points, and the bottom surface of the circuit board has multiple bottom surface solder points. The coil assembly is electrically connected to the top surface solder points, and the top surface solder points are electrically connected to the bottom surface solder points. The bottom surface of the top cover has a first device slot for accommodating the top of the coil assembly, and the top surface of the circuit board has a second device slot for accommodating the bottom of the coil assembly. The first device slot and the second device slot are arranged opposite to each other. The bottom surface of the top cover also has two adhesive grooves for accommodating anti-oxide, which are located on both sides of the first device slot. The openings of the adhesive grooves are connected to the openings of the first device slots, and the adhesive grooves are directly opposite the top surface solder points. The circuit board is used to seal the first device slot and the adhesive grooves.

[0006] Furthermore, a connecting groove is provided on the bottom surface of the top cover, and the two sides of the connecting groove are respectively connected to the side walls of the first device groove and the adhesive groove.

[0007] Furthermore, the distance from the bottom of the first component slot, the adhesive slot, and the connecting slot to the top surface of the circuit board gradually decreases.

[0008] Furthermore, the top surface solder joints are covered with anti-oxide coating.

[0009] Furthermore, the circuit board has copper plating vias that connect the top solder joints and the bottom solder joints. The walls of the copper plating vias are provided with a first conductive layer that electrically connects the top solder joints and the bottom solder joints.

[0010] Furthermore, multiple observation slots are provided on both sides of the circuit board. The walls of the observation slots are provided with a second conductive layer. The second conductive layer is electrically connected to the bottom solder joints. The second conductive layer is separated from the top solder joints.

[0011] Furthermore, a notch is provided on the circuit board, and a locking block is provided on the bottom surface of the top cover. The locking block is positioned opposite to the notch and works in conjunction with it.

[0012] Furthermore, a guide section is provided at the end of the card block away from the top cover.

[0013] Furthermore, the anti-oxidant is used as an adhesive.

[0014] Beneficial effects: 1. Existing electronic components only have slots on the top cover to accommodate the coil assembly. Compared to existing technologies, this solution is applied to network filters. Network filters have a simple structure, with no circuit design on the circuit board; only the electrical connection between the internal coil assembly and the external circuit is required. Therefore, this solution creates a second component slot on the circuit board. The cavity formed by the first and second component slots accommodates the coil assembly. Compared to existing technologies, by shifting the space for the coil assembly to the circuit board, the thickness of the top cover is reduced, thereby reducing the overall thickness of the network filter, shrinking its size, and lowering production costs.

[0015] 2. In this solution, the adhesive tank is designed so that during the production process, anti-oxide is added to the adhesive tank to cover the top solder joints, thereby reducing oxidation of the top solder joints and decreasing the probability of network filter malfunction. Simultaneously, the connection between the adhesive tank and the first device tank allows the anti-oxide to overflow into the first device tank when there is excessive anti-oxide, preventing adhesive overflow from affecting the appearance of electronic components, thus improving the production yield of electronic components and reducing production costs.

[0016] 3. In existing technologies, enameled wires are welded to solder joints using resistance welding. However, in actual production, the enameled wire may come into contact with the solder joint in multiple places. Because resistance welding is used, the weld extension causes the wire to connect to the solder joint at all contact points. After cutting off the excess wire ends, the ends may still stick to the solder joint and cannot be removed. If the ends are forcibly pulled out, the solder joint may be pulled out, rendering the entire electronic component unusable. Therefore, in this solution, the top solder joint and the second conductive layer of the observation slot are separated. This separation reduces the number of welds between the enameled wire and the solder joint, as well as the number of welds between the enameled wire and the copper sheet. This reduces the number of wire ends welding to the solder joint, effectively removing wire ends while avoiding damage to the circuit board. This improves the product quality and production yield of electronic components, further reducing production costs. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of a miniature network filter according to the present invention; Figure 2 This is a bottom view of an embodiment of a miniature network filter according to the present invention; Figure 3 This is a schematic diagram of the top cover of an embodiment of the miniature network filter of this utility model; Figure 4 This utility model relates to a miniature network filter. Figure 2 Cross-sectional view along the AA direction; Figure 5 This utility model relates to a miniature network filter. Figure 1 Enlarged diagram of point B in the middle. Detailed Implementation

[0018] The following detailed description illustrates the specific implementation method: The reference numerals in the accompanying drawings include: circuit board 1, top cover 2, top surface solder joint 3, first copper hole segment 301, first transition segment 302, first connecting segment 303, bottom surface solder joint 4, copper plating hole 5, first device slot 6, adhesive slot 7, second device slot 8, second conductive layer 9, notch 10, locking block 11, guide part 12.

[0019] Example A miniature network filter, as shown in the attached image Figure 1 As shown, it includes a circuit board 1, a top cover 2, and a coil assembly (not shown in the figure), as attached. Figure 2As shown, the top surface of circuit board 1 has multiple top surface solder points 3, and the bottom surface of circuit board 1 has multiple bottom surface solder points 4. The top surface solder points 3 are located on both sides of the top surface of circuit board 1, and the bottom surface solder points 4 are arranged opposite to the top surface solder points 3. In this embodiment, there are twenty-four top surface solder points 3, with twelve on each side. The top surface solder points 3 are evenly distributed on each side. The top surface solder points 3 and bottom surface solder points 4 are fixedly connected to circuit board 1 using the copper-clad laminate etching process commonly used in the prior art. The material of the top surface solder points 3 and bottom surface solder points 4 is copper. This application does not involve any improvement to the process, so it will not be described in detail here.

[0020] The coil assembly is electrically connected to the top surface solder point 3. The coil assembly includes a magnetic ring and enameled wire wound on the magnetic ring. The enameled wire is fixedly connected to the top surface solder point 3 by resistance welding. The number of coil assemblies can be set by those skilled in the art according to the actual situation. In this embodiment, there are four coil assemblies. Each coil assembly includes two magnetic rings. The coil assembly adopts the coil assembly of the network filter in the prior art. The structure of the coil assembly and the connection with the top surface solder point 3 are all prior art. Moreover, this application does not involve any improvement to it, so it will not be described in detail.

[0021] The top solder joint 3 and the bottom solder joint 4 are electrically connected. Specifically, a copper plating hole 5 is provided on the circuit board 1, which connects the top solder joint 3 and the bottom solder joint 4. The hole wall of the copper plating hole 5 is provided with a first conductive layer, which electrically connects the top solder joint 3 and the bottom solder joint 4. The first conductive layer is fixed on the hole wall of the copper plating hole 5 using the copper plating process commonly used in circuit boards 1 in the prior art. The first conductive layer formed during copper plating connects the top solder joint 3 and the bottom solder joint 4. The material of the first conductive layer is copper. This application does not involve any improvement to the process, so it will not be described in detail here.

[0022] As attached Figure 3 As shown, the bottom surface of the top cover 2 has a first device groove 6 for accommodating the top of the coil assembly. The bottom surface of the top cover 2 also has two adhesive grooves 7 for accommodating anti-oxide. The two adhesive grooves 7 are located on both sides of the first device groove 6, directly opposite the top surface solder joint 3. Anti-oxide (not shown in the figure) covers the top surface solder joint 3. In this embodiment, the anti-oxide is adhesive. The edges of adjacent sidewalls of the adhesive grooves 7 are rounded. In this design, the rounded edges of the adhesive grooves 7, compared to right angles, facilitate the filling of the adhesive grooves 7 with adhesive.

[0023] The openings of the adhesive groove 7 are all connected to the openings of the first device groove 6. Specifically, the bottom surface of the top cover 2 is also provided with a connecting groove. There are two connecting grooves. The two sides of the connecting grooves are respectively connected to the side walls of the first device groove 6 and the adhesive groove 7. The distance from the bottom of the first device groove 6, the adhesive groove 7 and the connecting groove to the top surface of the circuit board 1 gradually decreases.

[0024] In practical applications, it has been found that during long-term use, the solder joints where enameled wires are bonded to circuit board 1 will oxidize, leading to functional failure and reduced lifespan of the electronic components. The inventors' research revealed that resistance welding of the enameled wires to the solder joints leaves the joints exposed, making them prone to oxidation during use and causing the aforementioned problems.

[0025] When assembling the network filter in this scheme, the top cover 2 is inverted, with the first device slot 6 facing upwards. Glue is applied to the adhesive groove 7 on the top cover 2, and the coil assembly is placed on the circuit board 1. The enameled wire in the coil assembly is soldered to the top surface solder joint 3 on the circuit board 1 by resistance welding. After welding, the circuit board 1 is fastened to the top cover 2, and the circuit board 1 closes the first device slot 6 on the top cover 2. At this time, the bottom surface of the top cover 2 abuts against the top surface of the circuit board 1, and the glue fills the adhesive groove 7, covering the top surface solder joint 3. After the glue cures, it forms an anti-oxidant.

[0026] In this design, the adhesive reservoir 7 is directly opposite the top surface solder joint 3. The enameled wire passes through the connecting groove and is soldered to the top surface solder joint 3. After the adhesive covers the solder joint, it overflows into the first component reservoir 6 under the guidance of the connecting groove and the enameled wire. This adhesive coverage of the solder joint prevents oxidation of the enameled wire solder joint, thereby improving the service life of the electronic components. Simultaneously, this design prevents adhesive overflow from affecting the appearance of the electronic components, thus improving the production qualification rate and reducing production costs.

[0027] As attached Figure 4 As shown, the top surface of the circuit board 1 has a second component slot 8 for accommodating the bottom of the coil assembly. The first component slot 6 and the second component slot 8 are arranged opposite to each other. The circuit board 1 is used to close the first component slot 6 and the adhesive groove 7. The edges of the adjacent sidewalls of the first component slot 6 and the edges of the adjacent sidewalls of the second component slot 8 are all rounded. The rounded corners reduce the damage caused by collisions with the coil assembly compared to right angles.

[0028] Compared with existing technologies, this solution is applied to network filters. The network filter has a simple structure, and the circuit board 1 has no circuit design; it only needs to realize the electrical connection between the internal coil assembly and the external circuit. Therefore, this solution creates a second component slot 8 on the circuit board 1. The cavity formed by the first component slot 6 and the second component slot 8 together accommodates the coil assembly. Compared with existing technologies, by transferring the space for accommodating the coil assembly to the circuit board 1, the thickness of the top cover 2 is reduced, thereby reducing the overall thickness of the network filter, shrinking its size, and lowering production costs.

[0029] Multiple observation slots are provided on both sides of the circuit board 1. A second conductive layer 9 is provided on the wall of each observation slot. The second conductive layer 9 is electrically connected to the bottom solder joint 4, and is separate from the top solder joint 3. Specifically, the observation slots connect the top and bottom surfaces of the circuit board 1. The observation slots are arc-shaped, and the number of observation slots is the same as the number of top solder joints 3, with their positions corresponding one-to-one. The bottom of the second conductive layer 9 is electrically connected to the bottom solder joint 4, while the top of the second conductive layer 9 is separate from the top solder joint 3. The observation slots facilitate observation of the soldering status when electronic components are soldered to external circuits, thereby determining whether the soldering of electronic components to external circuits is stable.

[0030] By separating the components, firstly, the area of ​​the top surface solder joint 3 can be reduced, thereby reducing the contact points between the enameled wire and the solder joint, and thus reducing the number of welding points between the enameled wire and the top surface solder joint 3 during resistance welding; secondly, the welding extension during resistance welding can be avoided, thereby reducing the welding situation between the enameled wire and the top surface solder joint 3 during resistance welding. By reducing the number of welding points between the enameled wire and the top surface solder joint 3, and reducing the welding situation between the enameled wire end and the top surface solder joint 3, the welding of the enameled wire end is reduced, thereby effectively removing the enameled wire end while avoiding damage to the circuit board 1, and improving the product quality of electronic components.

[0031] As attached Figure 5 As shown, the top surface solder joint 3 includes a first copper hole segment 301, a first transition segment 302, and a first connecting segment 303 connected in sequence. The distribution direction of the first copper hole segment 301, the first transition segment 302, and the first connecting segment 303 is perpendicular to the direction in which the top surface solder joint 3 is evenly distributed. Along the direction in which the top surface solder joint 3 is evenly distributed, that is, parallel to the side of the circuit board 1 where the observation groove is provided, the size of the first connecting segment 303 is larger than the size of the first copper hole segment 301. The first connecting segment 303 is separated from the top of the second conductive layer 9, that is, the two are not connected. In this solution, during automated welding of the enameled wire, the enameled wire is pulled from the coil assembly to the side of the circuit board 1. The top surface solder joint 3 is separated from the top of the second conductive layer 9, and the size of the first connecting segment 303 is larger than the size of the first copper hole segment 301, thereby increasing the width of the top surface solder joint 3. This reduces the number of welding points between the enameled wire and the solder joint while ensuring the welding effect between the enameled wire and the top surface solder joint 3.

[0032] The second conductive layer 9 is fixed to the wall of the observation tank using the plating copper process commonly used in the prior art for circuit boards 1. The second conductive layer 9 formed during plating copper is connected to the bottom solder joint 4. The material of the second conductive layer 9 is copper. This application does not involve any improvement to the process, so it will not be described in detail here.

[0033] The circuit board 1 has a notch 10, and the bottom surface of the top cover 2 has a locking block 11. The locking block 11 is positioned opposite to the notch 10 and works in conjunction with it. The end of the locking block 11 away from the top cover 2 has a guide portion 12. In this embodiment, the locking block 11 and the top cover 2 are integrally formed. There are four notches 10, which are located at the intersection of adjacent sides of the circuit board 1. The notches 10 connect adjacent sides of the circuit board 1. The guide portion 12 is located in the notch 10. The guide portion 12 has inclined surfaces on both sides facing the notch 10. The inclined surfaces are inclined from the side wall of the notch 10 toward the guide portion 12 along the direction from the top cover 2 toward the circuit board 1.

[0034] In this design, the notch 10 and the locking block 11 facilitate the locking block 11's positioning via the notch 10 during engagement, enabling quick and accurate engagement of the top cover 2 and the circuit board 1. The guide portion 12 guides the locking block 11 during engagement. Its beveled shape makes the guide portion 12 smoother, reducing impact damage during engagement and facilitating the sliding of the locking block 11 into the notch 10.

[0035] The above descriptions are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are knowledgeable of all existing technologies in that field, and possess the ability to apply conventional experimental methods prior to that date. Therefore, those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in conjunction with their own capabilities. Typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A miniature network filter, comprising a circuit board, a top cover, and a coil assembly, wherein the top surface of the circuit board has multiple top surface solder points, the bottom surface of the circuit board has multiple bottom surface solder points, the coil assembly is electrically connected to the top surface solder points, and the top surface solder points are electrically connected to the bottom surface solder points, characterized in that: The bottom surface of the top cover has a first component slot for accommodating the top of the coil assembly, and the top surface of the circuit board has a second component slot for accommodating the bottom of the coil assembly. The first component slot and the second component slot are arranged opposite to each other. The bottom surface of the top cover also has two adhesive reservoirs for containing anti-oxidants. The two adhesive reservoirs are located on both sides of the first device reservoir, and the openings of the adhesive reservoirs are connected to the openings of the first device reservoirs. The adhesive reservoirs are directly opposite the solder joints on the top surface. The circuit board is used to enclose the first component slot and the adhesive slot.

2. A miniature network filter according to claim 1, characterized in that: The bottom surface of the top cover is also provided with a connecting groove, and the two sides of the connecting groove are respectively connected to the side walls of the first device groove and the adhesive groove.

3. A miniature network filter according to claim 2, characterized in that: The distance from the bottom of the first component slot, the adhesive slot, and the connecting slot to the top surface of the circuit board gradually decreases.

4. A miniature network filter according to claim 3, characterized in that: Anti-oxide coating on top surface solder joints.

5. A miniature network filter according to any one of claims 1-4, characterized in that: The circuit board has copper plating vias that connect the top and bottom solder joints. The walls of the copper plating vias are provided with a first conductive layer that electrically connects the top and bottom solder joints.

6. A miniature network filter according to claim 5, characterized in that: Multiple observation slots are provided on both sides of the circuit board. The walls of the observation slots are provided with a second conductive layer. The second conductive layer is electrically connected to the bottom solder joints. The second conductive layer is separated from the top solder joints.

7. A miniature network filter according to claim 6, characterized in that: The circuit board has a notch, and the bottom of the top cover has a locking block. The locking block is positioned opposite to the notch and works together.

8. A miniature network filter according to claim 7, characterized in that: The end of the card block furthest from the top cover has a guide section.

9. A miniature network filter according to claim 8, characterized in that: Antioxidants are used in adhesives.

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